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SKD75GAL123D SemiKron
SKD75GAL123D SemiKron
1)
Symbol Conditions Units IGBT Modules
VCES 1200 V SKD 75 GAL 123 D
VCGR RGE = 20 kΩ 1200 V Input bridge B6U with
IC Tcase = 25/80 °C 75 / 50 A brake chopper
ICM Tcase = 25/80 °C; tp = 1 ms 150 / 100 A
VGES ± 20 V
Ptot per IGBT/D1/D8, Tcase=25 °C 390 / 125 / 125 W
Tj, (Tstg) – 40 . . .+150 (125) °C
Visol AC, 1 min. 2 500 V
humidity DIN 40 040 Class F
climate DIN IEC 68 T.1 40/125/56
Diodes 9) D1-6 D7 D8
IF Tcase = 80 °C 9) 15 30 A
IFM= – ICM Tcase = 80 °C; tp = 1 ms 30 60 A
IFSM tp = 10 ms; sin.; Tj = 150 °C 600 200 350 A 7D-Pack = 7 Diodes Pack
I2t tp = 10 ms; Tj = 150 °C 1800 200 600 A2s
Characteristics
Symbol Conditions 1) min. typ. max. Units
V(BR)CES VGE = 0, IC = 1 mA ≥ VCES – – V
VGE(th) VGE = VCE, IC = 2 mA 4,5 5,5 6,5 V
ICES VGE = 0 Tj = 25 °C – 0,8 1 mA
VCE = VCES Tj = 125 °C – 3,5 – mA SKD 75 GAL
IGES VGE = 20 V, VCE = 0 – – 200 nA
VCEsat IC = 50 A VGE = 15 V; – 2,5(3,1) 3(3,7) V
Features
VCEsat IC = 75 A Tj = 25 (125) °C – 3(3,8) – V • Round main terminals (2 mm∅)
gfs VCE = 20 V, IC = 25 A 40 – S • Easy drilling of PCB
CCHC per IGBT – – 350 pF • Input diodes glass passivated
Cies VGE = 0 – 3300 4300 pF • 1400 V PIV, good for 500 VAC
Coes VCE = 25 V – 500 650 pF • High I2t rating (inrush current)
Cres f = 1 MHz – 220 300 pF • IGBT is latch-up free, homoge-
neous NPT silicon-structure
td(on) VCC = 600 V – 44 100 ns
• High short circuit capability,
tr VGE = + 15 V / - 15 V 3) – 56 100 ns
IC = 50 A, ind. load self limiting to 6 * Icnom
td(off) – 380 500 ns
• Fast & soft CAL diodes8)
tf RGon = RGoff = 22 Ω – 70 100 ns
T = 125 °C • Isolated copper baseplate
Eon j – 8 – mWs
using DCB Direct Copper Bon-
Eoff – 5 – mWs
ding Technology
Inverse Diode D78) of brake chopper • Large clearance (9 mm) and
VF = VEC IF = 15 A VGE = 0 V; – 2,0(1,8) 2,5 V creepage distances (13 mm).
VF = VEC IF = 25 A Tj = 25 (125) °C – 2,3(2,1) – V
VTO Tj = 125 °C – 1,1 1,2 V Typical Applications:
rT Tj = 125 °C – 45 70 mΩ Input rectifier bridge (B6U) with
IRRM IF = 15 A; Tj = 25 (125) °C2) – 12(16) – A brake chopper for PWM inverter
Qrr IF = 15 A; Tj = 25 (125) °C2) – 1(2,7) – µC drives using SEMITRANS
FWD D8 of "GAL" brake chopper 8) SKM 75GD123D
VF = VEC IF = 25 A VGE = 0 V; – 2,0 (1,8) 2,5 V
VF = VEC IF = 40 A Tj = 25 (125) °C – 2,3 (2,1) – V 1)
Tcase = 25 °C, unless otherwise
VTO Tj = 125 °C – – 1,2 V specified
2)
rT Tj = 125 °C – 25 44 mΩ IF = – IC, VR = 600 V,
IRRM IF = 25 A; Tj = 25 (125) °C2) – 19(25) – A – diF/dt = 500 A/µs, VGE = 0 V
3)
Qrr IF = 25 A; Tj = 25 (125) °C2) – 1,5(4,5) – µC Use VGEoff = -5 ... - 15 V
8)
CAL = Controlled Axial Lifetime
Thermal Characteristics
Technology.
Rthjc per IGBT / diode D1..6 9) – – 0,32 / 1,0 °C/W 9)
Data D1 - D6, case and
Rthjc per diode D7 / D8 – – 1,5 / 1,0 °C/W
mech. data → B6 - 230
Rthch per module – – 0,05 °C/W
Tj = 125 °C
VCE = 600 V
VGE = + 15 V
RG = 22 Ω
Fig. 1 Rated power dissipation Ptot = f (TC) Fig. 2 Turn-on /-off energy = f (IC)
1 pulse
Tj = 125 °C WS
TC = 25 °C
VCE = 600 V XV
Tj < 150 °C
VGE = + 15 V
IC = 50 A
XV
PV
P s
9&( >9@
linear use
Fig. 3 Turn-on /-off energy = f (RG) Fig. 4 Maximum safe operating area (SOA) IC = f (VCE)
ICSC/ICN 502soas.vpo
ICpuls /I C 502rso.vpo Tj < 150 °C
2,5 Tj < 150 °C 12
VGE = + 15 V
VGE = 15 V
tsc < 10 µs
RGoff = 22 Ω 10
2 L < 25 nH
IC = 50 A
ICN = 50 A
8
Note:
1,5 *Allowed numbers of
short circuit:<1000
6
*Time between short
circuit:>1s
1
4
0,5
2
0 0
0 500 1000 1500 0 500 1000 1500
VCE [V] VCE [V]
Fig. 5 Turn-off safe operating area (RBSOA) Fig. 6 Safe operating area at short circuit IC = f (VCE)
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Tj = 150 °C
VGE > 15 V
17V 17V
80 80
15V 15V
13V 13V
60 11V 60
11V
9V 9V
40 7V 40 7V
20 20
0 0
0 1 2 3 4 5 0 1 2 3 4 5
VCE [V] VCE [V]
Fig. 9 Typ. output characteristic, tp = 80 µs; 25 °C Fig. 10 Typ. output characteristic, tp = 80 µs; 125 °C
VCEsat(t) = VCE(TO)(Tj) + rCE(Tj) . IC(t)
VCE(TO)(Tj) ≤ 1,5 + 0,002 (Tj - 25) [V]
max.: rCE(Tj) = 0,030 + 0,00010 (Tj - 25) [Ω]
+2
valid for VGE = + 15 [V]; IC ≥ 0,3 ICnom
−1
9 *( >9@
Fig. 11 Saturation characteristic (IGBT)
Calculation elements and equations Fig. 12 Typ. transfer characteristic, tp = 80 µs; VCE = 20 V
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SKD 75 GAL 123 D
18 600V 800V
ICpuls = 50 A VGE = 0 V
16
f = 1 MHZ
14
10
12
Ciss
10
8
1
6
Coss
4
Crss
2
0 0,1
0 100 200 300 400 0 10 20 30 40
QG [nC] VCE [V]
1000
WGRII
Tj = 125 °C Tj = 125 °C
VCE = 600 V VCE = 600 V
tdoff VGE = + 15 V VGE = + 15 V
RGon = 22 Ω IC = 50 A
RGoff = 22 Ω WU
induct. load
tr induct. load WGRQ
100
tf WI
tdon
10
20 40 60 80 100 120
IC [A] 5* >:@
Fig. 15 Typ. switching times vs. IC Fig. 16 Typ. switching times vs. gate resistor RG
M040GD12.X LS -18
9 && 9 5*
P-
7M & Ω
9 *( 9
Ω
Ω
Ω
100 Ω
( RII'
,) $
Fig. 17 Typ. CAL diode forward characteristic Fig. 18 Diode D8 turn-off energy dissipation per pulse
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© by SEMIKRON 0898 B 6 – 229
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SKD 75 GAL 123 D
SEMITRANS
Sixpack modified
Case D 69 A
UL recognition
File E63 532
*)
Dimensions in mm
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