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Earthing Systems Design Steps - Pt.6
Earthing Systems Design Steps - Pt.6
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In Article " Earthing Systems Design steps – Part One ", I indicated the following points:
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A grounding system design process has (3) main steps:
1. Data Collection,
2. Data Analysis,
3. Grounding Design Calculations. Related Posts Plugin for WordPress, Blogger...
In the above Article and Article " Earthing Systems Design steps – Part Two ", I explained the first step: Data Collection.
Also, in Article " Earthing Systems Design steps – Part Three ", I explained the second step: Data Analysis.
And in Article " Earthing Systems Design steps – Part Four " I explained What we are going to design for grounding system in any building?
Grounding system in any building can be broken down into several subdivisions:
In this Article, I explained the Building Exterior Grounds and Today I will explain Other Building’s Earthing System Divisions as follows.
In Article " Earthing Systems Design steps – Part Five ", I indicated the five subdivisions of The Building Interior Bonding which were:
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And I explained three subdivisions in this article and today I will continue explaining other subdivisions of The Building Interior Bonding.
4.1 The bonding requirements for electrical circuits which operate at over 250 volts to ground:
NEC Section 250-97 requires that such circuits be bonded to ensure electrical continuity of metal raceways or cable armors or sheaths that contain any conductor
other than service conductors shall be ensured by one or more of the methods specified for services in 250.92(B), except for (B)(1).
The permissible methods which can be used to achieve the required bonding are:
1. Threaded connections,
2. Threadless couplings and connectors,
3. Bonding jumpers,
4. Other approved devices.
Notes:
These methods are the same as those used for service equipment with
the exception of the grounded conductor which is not permitted for over
250 volt applications.
If the box or enclosure has been listed for use with these concentric or
eccentric locknuts it will be identified or labeled as such. If a box or
enclosure is encountered and such identification is not provided, one of
the methods listed above must be used and the exception is not
applicable.
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Fig-1
The permissible methods which can be used to achieve the required bonding
are:
Note:
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Notes
Installers of electrical systems should note that even if for some reason
the metal water piping is not used as part of the grounding electrode
system it is still required to be bonded per Section 250-104.
The purpose of such bonding is to ensure that the metal water piping
throughout the building or structure is at the same potential to ground as
the service ground. Keeping the water piping at the same potential helps
to ensure that an electrical shock hazard could not exist if the metal
piping were to become inadvertently energized.
A separate bonding jumper to the metal water piping system shall not be
required where the metal water piping system is used as the grounding
electrode for the separately derived system and the water piping system
is in the area served.
A separate water piping bonding jumper shall not be required where the
metal frame of a building or structure is used as the grounding electrode
for a separately derived system and is bonded to the metal water piping
in the area served by the separately derived system.
Any interior piping systems, such as, domestic well water, or any piping which
contains a liquid or a gas, and “may become energized,” shall be bonded. Once
again the permissible bonding locations are to the service equipment enclosure, the
grounding electrode conductor, the service grounded conductor or the one or more
grounding electrodes that comprise the grounding electrode system.
If the interior metal piping system contains any electrical devices, such as, solenoids
or mechanized valves, the piping “may become energized” and it should be bonded.
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Notes
This requirement does not apply to isolated steel girders or beams which
may be installed in a building or structure. Such beams or girders are not
“interconnected to form a steel building frame” and need not be bonded.
A separate bonding jumper to the building structure metal shall not be
required where the building structure metal is used as the grounding
electrode for the separately derived system and the water piping system
is in the area served.
A separate bonding jumper to the building structural metal shall not be
required where the water piping of a building or structure is used as the
grounding electrode for a separately derived system and is bonded to the
building structural metal in the area served by the separately derived
system.
In the next Article, I will continue explaining the last Building Interior Bonding Division: Bonding of Interior Metal Columns and Beam. Please, keep following.
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