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Diode ES3D
Diode ES3D
Diode ES3D
Features
Glass Passivated Die Construction
Super-Fast Recovery Time For High Efficiency
Low Forward Voltage Drop and High Current
Capability B SMB SMC
Surge Overload Rating to 100A Peak Dim Min Max Min Max
Ideally Suited for Automated Assembly
A 3.30 3.94 5.59 6.22
Plastic Material: UL Flammability A C
Classification Rating 94V-0 B 4.06 4.57 6.60 7.11
C 1.96 2.21 2.75 3.18
D 0.15 0.31 0.15 0.31
Mechanical Data
D E 5.00 5.59 7.75 8.13
Case: Molded Plastic G 0.10 0.20 0.10 0.20
J
Terminals: Solder Plated Terminal - Solderable
H 0.76 1.52 0.76 1.52
per MIL-STD-202, Method 208
H G
Polarity: Cathode Band or Cathode Notch E
J 2.00 2.62 2.00 2.62
SMB Weight: 0.093 grams (approx.) All Dimensions in mm
SMC Weight: 0.21 grams (approx.)
AB, BB, CB, DB Suffix Designates SMB Package
Mounting Position: Any A, B, C, D, Suffix Designates SMC Package
Marking: Type Number
Notes: 1. Unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pads as heat sink.
2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
3. Measured with IF = 0.5A, IR = 1.0A, Irr = 0.25A. See Figure 5.
2.0 1.0
1.0 0.1
Tj = 25°C
Pulse Width: 300µs
0 0.01
25 50 75 100 125 150 175 0 0.4 0.8 1.2 1.6
TT, TERMINAL TEMPERATURE (°C) VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 1 Forward Current Derating Curve Fig. 2 Typical Forward Characteristics
IFSM, PEAK FORWARD SURGE CURRENT (A)
120 1000
Tj = 125°C
80 100
60
40 10
Tj = 25°C
20
0 1.0
1 10 100 0 40 80 120
trr
+0.5A
50Ω NI (Non-inductive) 10Ω NI
Device
Under (-)
Test 0A
(+)
50V DC Pulse
Approx Generator -0.25A
(-) (Note 2)
1.0Ω (+)
Oscilloscope
NI (Note 1)
Notes: -1.0A
1. Rise Time = 7.0ns max. Input Impedance = 1.0MΩ, 22pF.
2. Rise Time = 10ns max. Input Impedance = 50Ω. Set time base for 50/100 ns/cm