ReferenceDesignGuide Ref Engcoolfan1kw

Z 8 F6 9 4 5 0 6 6 5
1 kW engine cooling fan reference design for

12 V application
OptiMOS-6™ 40 V sTOLL MOSFET, TLE9879QXW40 Embedded Power IC
Design Overview Highlighted Components
This Reference Design Guide describes a detailed • TLE9879QXW40

implementation of an automotive engine cooling
• IAUA250N04S6N007
fan application. The system is controlled by a
system on chip microcontroller with integrated
Target Application
MOSFET driver in combination with OptiMOSTM-6
leadless MOSFETs. • Engine Cooling Fan
The design is capable to drive loads up to 1 kW at a • Radiator Fan
battery voltage of 12 V.
• 1 kW BLDC Motor for 12 V application
This design guide contains a description of the
design, schematics and measurement reports. Highlighted Design Aspects
EMC is tested according to the CISPR25 standard.
Thermal performance information is given and
discussed.
1 kW EMC Thermally
functional optimized optimized
Reference Design and Block Diagram
Reference Design Guide Please read the Important Notice and Warnings at the end of this document Version 1.1
www.infineon.com/ref_engcoolfan1kw page 1 of 36 2021- 02-23
1 kW engine cooling fan reference design for 12 V application
Table of contents
Table of contents
Table of contents ............................................................................................................................ 2
Important Notice ............................................................................................................................ 4
1 System Description ................................................................................................................ 5
1.1 Design Specifications .............................................................................................................................. 5
1.2 Overview .................................................................................................................................................. 6
1.3 Highlighted Products .............................................................................................................................. 7
1.3.1 OptiMOS-6TM 40 V sTOLL(HSOF-5) MOSFET ....................................................................................... 7
1.3.2 3-Phase Bridge Driver IC with Integrated Arm® Cortex®-M3 ............................................................. 7
2 Getting Started ...................................................................................................................... 8
2.1 Toolchain Installation ............................................................................................................................. 8
2.1.1 Configuration ..................................................................................................................................... 8
3 System Design ....................................................................................................................... 9
3.1 Electrical Design and Components....................................................................................................... 10
3.1.1 DC-link Electrolytic Capacitor .......................................................................................................... 10
3.1.2 Shunt Resistor .................................................................................................................................. 10
3.1.3 Snubber ............................................................................................................................................ 11
3.1.4 3-terminal Filter Capacitor............................................................................................................... 11
3.1.5 Clearance and Creepage .................................................................................................................. 11
3.2 Thermo-mechanical Design and Components .................................................................................... 11
3.2.1 Layout Pattern Width ....................................................................................................................... 11
3.2.2 PCB Bottom-side .............................................................................................................................. 12
3.2.3 Thermal pad Selection ..................................................................................................................... 12
3.2.4 Bolting Torque.................................................................................................................................. 13
3.2.5 Mounting Hole .................................................................................................................................. 13
3.2.6 Heatsink............................................................................................................................................ 14
3.2.6.1 Heatsink Selection ...................................................................................................................... 14
3.2.6.2 Machining of the Heatsink .......................................................................................................... 14
4 System Performance ............................................................................................................. 15
4.1 Motor-Generator Test Setup ................................................................................................................. 15
4.1.1 Drive-motor Setup............................................................................................................................ 16
4.1.2 Generator Setup ............................................................................................................................... 16
4.1.3 Gate-drive Setup .............................................................................................................................. 16
4.2 Electrical Test Result ............................................................................................................................. 17
4.2.1 Switching Characteristics ................................................................................................................ 17
4.3 Thermal Behavior .................................................................................................................................. 20
4.3.1 Controlled air flow ........................................................................................................................... 20
4.3.2 Thermal Image ................................................................................................................................. 20
4.3.3 Temperature Profile ......................................................................................................................... 21
4.3.4 MOSFET Rth(ja) vs. Air-flow ................................................................................................................. 22
4.4 EMC performance .................................................................................................................................. 25
4.4.1 Measurement Setup ......................................................................................................................... 25
4.4.2 Conducted Emission with Motor Off-State ..................................................................................... 26
4.4.3 Conducted Emission with Motor On-State...................................................................................... 27
5 Project Collaterals................................................................................................................. 29
5.1 Schematics ............................................................................................................................................ 29
5.2 Bill of Material........................................................................................................................................ 31
Reference Design Guide 2 of 36 Version 1.1

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Table of contents
5.3 Layout Printing ...................................................................................................................................... 32

6 Abbreviations and definitions ................................................................................................. 33
7 Reference documents ............................................................................................................ 34
Revision history............................................................................................................................. 35

2021- 02-23
Important Notice
Important Notice
The Evaluation Boards and Reference Boards and the information in this document are solely intended to
support designers of applications to evaluate the use of products of Infineon Technologies in the intended
application.
Environmental conditions have been considered in the design of the Evaluation Boards and Reference Boards
provided by Infineon Technologies. The design of the Evaluation Boards and Reference Boards is tested by
Infineon Technologies only as described in this document. The design is not qualified in terms of safety
requirements, manufacturing and operation over the entire operating temperature range or lifetime.
The Evaluation Boards and Reference Boards provided by Infineon Technologies are subject to functional
testing only under typical load conditions. Evaluation Boards and Reference Boards are not subject to the
same procedures as regular products regarding returned material analysis (RMA), process change notification
(PCN) and product discontinuation (PD).
Evaluation Boards and Reference Boards are not commercialized products and are solely intended to be used
for evaluation and testing purposes. They shall in particular not be used for reliability testing or production.
Hence, the Evaluation Boards and Reference Boards may not comply with CE or similar standards (including but
not limited to the EMC Directive 2004/EC/108 and the EMC Act) and may not fulfill other requirements of the
country in which they are operated by the customer. The customer shall ensure that each Evaluation Boards and
Reference Board will be handled in a way which is compliant with all relevant requirements and standards in the
country in which they are operated.
The Evaluation Boards and Reference Boards and any information in this document are addressed only to
qualified and skilled technical staff, for laboratory usage, and shall be used and managed according to the
terms and conditions set forth in this document and in any other related documentation provided with the
respective Evaluation Boards or Reference Board.
It is the responsibility of customer’s technical departments to evaluate the suitability of the Evaluation
Boards and Reference Boards for the intended application and the completeness and correctness of the
information provided in this document with respect to such application.
The customer accepts that the Evaluation Boards and Reference Boards are not intended to be used for life-
endangering applications such as medical, nuclear, military, life-critical or other applications, where failure
of the Evaluation Boards and Reference Boards or any results from the use thereof can reasonably be expected
to result in personal injury.
The Evaluation Boards and Reference Boards and any information in this document is provided "as is" and
Infineon Technologies disclaims any and all warranties, express or implied, including but not limited to
warranties of non-infringement of third party rights and implied warranties of fitness for any purpose, or
for merchantability.
Infineon Technologies shall not be responsible for any damages resulting from the use of the Evaluation
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obliged to defend, indemnify and hold harmless Infineon Technologies from and against any claims or
damages arising out of or resulting from any use thereof.
Infineon Technologies reserves the right to change this document and/or any information provided herein at any
time without further notice.
2021- 02-23
System Description
1 System Description
The reference design describes a solution for an engine cooling fan with a power capability. This solution can
be used for similar applications with smaller or equal power consumption. The circuit contains an integrated
3-phase motor control solution. The SoC microcontroller is a member of the Embedded Power IC family. It
combines an Arm® Cortex®-M3 microcontroller with application specific modules like an integrated 3-phase
MOSFET driver, power supply and LIN-transceiver. In combination with the OptiMOSTM-6 sTOLL MOSFETs the
system is optimized for a minimum of PCB size for this power class. The focus of the reference design is to use
standard PCB materials and processes.
1.1 Design Specifications

The design specifications are related to the used components and design considerations. They shouldn’t differ
from the product datasheet values. In case of misalignment, the datasheet values of the products are valid.
Table 1 Design Specifications

Parameter Symbol Values Unit Comment
Min. Typ. Max.
System Parameters
Input voltage VIN -0.3 12 40 V P_1.1.1 (TLE9879QXW40)
Functional VIN 7 12 18 V Specified for Design
input voltage
Output current IOUT - - 100 A Peak current (<10 s),
peak air cooling attached (>1.3 m/s)
Output current IOUT - 40 80 A Specified for Design
continous
Hall Sensor VHALL -0.3 5 5.5 V Specification related to
Inputs GPIO Port 0,1
LIN interface VLIN -28 12 40 V P_1.1.7 (TLE9879QXW40)
ADC Inputs VADC -0.3 5 5.5 V Specification related to
GPIO Port 2
Phase 1,2,3 VSH -8.0 12 48 V P_1.1.11 (TLE9879QXW40)
Thermal
Operating TA -40 25 105 °C Specified for Design
temperature
Electromagnetic Compatibility
Conducted emissions Class 3 CISPR25, 150 kHz -108 MHz
Mechanical Specification
Dimensions 100 mm x 100 mm x 58 mm (W x D x H)
PCB 62 mil 6-layer 2 oz high temperature FR4 Ø100 mm

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System Description
1.2 Overview
Figure 1 shows the 3D CAD view of the system. The board has seven sTOLL MOSFETs, one 3-phase gate driver,
and 3 shunt resistors in parallel. Each circle in the figure is color-coded, in order to make it easy to locate. All
active components, including the seven MOSFETs and one driver IC, are carefully located on the board to
distribute the heat over the whole area of the PCB. As passive components, the shunt resistors are additional
heat sources. Those are collecting all return current from three legs of the bridge. The board is designed to
dissipate the heat of the shunts effectively through the thermal pad and also through the center bolt. As the
PCB does not have any surface-mounted components, it is possible to attach a simple flat heatsink at the
bottom of the board. Only the lead of the through-hole electrolytic capacitors are sticking out on the bottom
surface and can be accommodated with minimum amount of heatsink machining.
Figure 1 External view of the reference design from top and bottom

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System Description
1.3 Highlighted Products
1.3.1 OptiMOS-6TM 40 V sTOLL(HSOF-5) MOSFET

The sTOLL package offers high current capability of 250 A, more than standard D²PAK (180 A), with a footprint
of 56 mm² that is even smaller than DPAK (65 mm²). In combination with Infineon’s leading OptiMOS-6™ 40 V
and OptiMOS-5™ 40 V power MOS technology, sTOLL offers best in class power density and power efficiency at
Infineon’s well known quality level for robust automotive packages. For more information about the product,
please visit the Infineon web-page linked below.
• www.infineon.com/cms/en/product/promopages/power-mosfet-package-stoll/
Table 2 Automotive sTOLL MOSFET with 40 V OptiMOS-6TM and OptiMOS-5TM

Package Silicon Technology Product Max RDS(on) [mΩ] ID [A]
IAUA250N04S6N006 0.64 250
OptiMOSTM-6
IAUA250N04S6N007 0.70 250
sTOLL
IAUA200N04S5N010 1.00 200
(HSOF-5)
OptiMOS -5
TM
IAUA180N04S5N012 1.20 180
IAUA120N04S5N014 1.40 120
1.3.2 3-Phase Bridge Driver IC with Integrated Arm® Cortex®-M3

The TLE987x family addresses a wide range of smart 3-phase brushless DC motor control applications such as
auxiliary pumps and fans. It provides an unmatched level of integration and system cost to optimize the target
application segments. In addition, it offers scalability in terms of flash memory sizes and MCU system clock
frequency supporting a wide range of motor control algorithms, either sensor-based or sensor-less. For more
information about the product, please visit Infineon web-page linked below.
• www.infineon.com/tle987x
Table 3 Product Family of 3-Phase Bridge Driver IC with Integrated Arm® Cortex®-M3
Grade Product Flash RAM Frequency Interface Tjmax
TLE9873QXW40 48 kByte 3 kByte 40 MHz PWM + LIN 175 °C
Grade-0 TLE9877QXW40 64 kByte 6 kByte 40 MHz PWM + LIN 175 °C
TLE9879QXW40 128 kByte 6 kByte 40 MHz PWM + LIN 175 °C
TLE9871QXA20 36 kByte 3 kByte 24 MHz PWM 150 °C
TLE9877QXA20 64 kByte 6 kByte 24 MHz PWM + LIN 150 °C
Grade-1 TLE9877QXA40 64 kByte 6 kByte 40 MHz PWM + LIN 150 °C
TLE9879-2QXA40 128 kByte 6 kByte 40 MHz PWM + LIN 150 °C
TLE9879QXA40 128 kByte 6 kByte 40 MHz PWM + LIN 150 °C

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Getting Started
2 Getting Started
2.1 Toolchain Installation
In order to get the board ready and running, the software shown in Table 4 shall be installed.
The µVision software is a development tool provided by Arm® Keil®. With code length limitation, the shareware
version of the µVision is still able to edit, compile and debug. The Infineon Config Wizard is a tool for
configuring peripherals of the Embedded Power IC. The tool can be called from the pull-down menu of the
µVision and helps users changing parameters from its user interface and then generates the software code
accordingly. Infineon provides standard motor drive software codes for the Embedded Power IC. It can be
downloaded from the Pack Installer within the µVision.
Table 4 Software Toolchain Installation Guide

Steps Company Description
• Arm® Keil® µVision is an integrated development environment
STEP1
which consists of code editor, compiler and debugger.
Download and Install Arm® Keil®
• To learn how to use Arm® Keil® µVision 5, check out our video
Keil® µVision5
"Get your motor spinning".
• Infineon provides the Config Wizard free of charge, which is
designed for configuration of chip modules. Config Wizard
STEP2
Infineon supports easy configuring of Embedded Power IC peripherals.
Download
Technologies • Config Wizard can be installed via the Infineon Toolbox. If you
Config Wizard
don´t have the Infineon Toolbox yet, please go to Infineon
Toolbox and enjoy the release management for updates.
STEP3
• SEGGER J-Link is a widely used driver for "on-board" or
Download and Install SEGGER
"stand-alone" debugger.
Segger J-Link Driver
STEP4
• The Embedded Power Software Development Kit (SDK) is a
Download the SDK Infineon
low level driver library which can be downloaded within Keil®
via µVision5 Pack Technologies
µVision via the "Pack Installer"
Installer
For the toolchain installation and free motor drive software, please check below link.
www.infineon.com/embedded-power
For more information about the tool chain installation steps, watch our video.
Toolchain Installation for Embedded Power ICs / TLE98xx
2.1.1 Configuration
Open a motor drive code project in µVision5 and go to “Tools” and open “Config Wizard”. From there, setup the
parameters of motor, speed/current controller and the peripherals of TLE987x. As the Embedded Power IC has
a current-source gate driving scheme, the switching speed is not controlled by gate resistors, but by the “Gate
Charge/Discharge” parameters in the BDRV tap of the peripherals. For more details about the configuration,
please visit the Infineon website of Embedded Power ICs.

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System Design
3 System Design
The reference design is an automotive 3-phase motor controller for 12 V automotive applications. Target
application is an engine cooling fan with a power of up to 1 kW with the housing exposed to the air flow
generated by the fan itself. The functional blocks of the system are shown in Figure 1. The two main active
components are:
• 3-Phase Bridge Driver IC with Integrated Arm® Cortex® -M3 (TLE9879QXW40)
• OptiMOS-6TM MOSFET in sTOLL package (IAUA250N04S6N007)
OptiMOS-6TM is Infineon’s most recent generation of low voltage MOSFET silicon technology. Combined with
the new JEDEC-listed sTOLL package, the product provides optimal performance, form factor, and quality for
automotive applications. The TLE987x is an Embedded Power IC, combining a 3-phase bridge driver with a 32-
bit Arm® Cortex® M3 core and peripherals such as timer modules, ADCs, double stage charge pump, voltage
regulators, external sensor supply, RAM, flash memory and LIN communication module. This Embedded Power
IC is equipped with many popular functions, requiring just a few passive components nearby, with the
capability to perform advanced motor control, such as sensorless FOC with current-controlled gate driving.
Figure 2 System block diagram

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System Design
3.1 Electrical Design and Components
3.1.1 DC-link Electrolytic Capacitor

Document [4] shows a simple analytical expression for the current stress on the DC-link capacitor. For the case
where the inverter controls a permanent-magnet AC machine (with near unity power factor), the worst-case
current-stress estimation, used as a basis for the capacitor dimensioning, is given by 𝐼𝐶,𝑟𝑚𝑠 ≈ 1⁄ ∙ 𝐼𝑂𝑢𝑡,𝑟𝑚𝑠 .
√2
Targeting the voltage ripple of the capacitor within 1 V, at 70 A rms output current, a total capacitance of
2500 µF is required. In this design, a 1000 µF electrolytic capacitor is used for each leg of the bridge, totaling
3000 µF.
3.1.2 Shunt Resistor

The resistance, temperature coefficient, wattage, derating, form-factor, stray-inductance and environmental
robustness are the main features to consider when choosing a shunt resistor. As shown in the Table 5, the
maximum value of the differential input voltage of the operational amplifier is given by the expression 1.5 / G,
where G is the selected gain of the currente sense amplifier. Therefore, the value of the shunt resistor can be
determined considering the targeted maximum shunt current. For example, if G = 10, the maximum differential
input voltage is 150mV. If the shunt is 1.5mΩ, the maximum shunt current is equal to:
I_shunt_max = (150 mV/1.5 mΩ) = 100 A.
Table 5 Differential Input Voltage Range of the Operational Amplifier of TLE9879QXW40

Values
Parameter Symbol Unit Note / Test Condition
Min. Typ. Max.
Gain settings GAIN<1:0>
Differental gain G 9.5 10 10.5 00
(uncalibrated) 19 20 21 01
38 30 42 10
57 40 63
11
Differential input operating VIX -1.5 / G - 1.5 / G V G is the gain specified
voltage range OP2 - OP1
When it comes to a compact 1 kW drive, the power dissipation of the shunt resistor matters more than just the
signal magnitude. The reference design implements 3x 10 W / 2 mΩ resistors in parallel. Considering a power
derating down to 18 % of the total 30 W at 155 °C, maximum power of each single shunt resistor at 155 °C is
5.4 W. According the resistor specification, the resistance is expected to rise by 200 ppm/°C, gives a total shunt
resistance equivalent to 0.696 mΩ at 155°C. Thus, the power dissipation at 80 A rms current is:
(80 A)2 x 0.696 mΩ = 4.45 W. The total area of the shunt resistor is 20.5 mm x 9 mm = 184.5 mm2.
In the reference design, the gain can be set to 20, giving a maximum differential input voltage of 75 mV. Then
the maximum current, at 155 °C shunt-temperature, is calculated as: I_shunt_max = 75 mV / 0.696 mΩ = 107.8 A.
Keeping the DC-link loop inductance low is essential to let the system running with low switching losses, low
EMI noise and stable gate driving. Thus, having low stray inductance of the shunt resistors is appreciated for an
application that involves high speed hard switching. Combining all the design features such as low inductance
shunt, small DC-link layout loop and close placement of the DC-link ceramic cap, the stray inductance of the
DC-link to be about 6.5 nH.

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System Design
3.1.3 Snubber
The value of the RC snubber is based on Cornell Dubilier application guide [5], chosen by double pulse
switching test. The 1 Ω, 22 nF RC snubber is combined with 35 V, 100 µF DC-link ceramic capacitor. The 100 µF
capacitor works as a DC-link filter for each leg of the bridge. The power dissipation of the snubber has been
calculated and verified at 18 V / 20 kHz switching frequency. Referring to the waveform in the chapter 4.2.1, any
oscillation is visible neither on the Drain-Source voltage nor on the Drain current of the mosfets.
3.1.4 3-terminal Filter Capacitor

The 1 kW reference design does not include dedicated high-power inductor as EMI input filter. However, the
design implements a capacitor network with a 3-terminal filter element (Figure 3), in order to improve high-
frequency attenuation with minimal area and cost. As the DC input has to carry high current, the filter capacitor
is applied in a shunt method, rather than in series connection. For EMI in the lower frequency range, the test
results show that it is necessary to add an additional filter at the DC input stage.
Figure 3 3-terminal high frequency filter design in a shunt scheme
3.1.5 Clearance and Creepage

Considering the bottom side of the PCB, the solder mask has been removed in order to increase thermal
conductivity between copper area and the thermal pad. As the surface is covered with a dielectric thermal pad,
there is no issue with clearance distance. However, the creepage distance should be considered as “printed
wiring material” condition. According to IEC 60664-1, considering RMS voltage 32 V, Pollution degree 2, Material
group III, the minimum creepage distance is 0.53 mm. For the bottom layer of this design, the rule of 0.7 mm
minimum creepage is observed.
3.2 Thermo-mechanical Design and Components
3.2.1 Layout Pattern Width

From Figure 4, 105 A DC current require about 16.5 mm width of 2 oz copper layer. The design rule of the PCB
layout on the copper power pattern is to fulfil the minimum 16.5 mm width, out of total 6 layers. All the power
patterns have 2~4 layers in parallel. As the external layers have better cooling compared to the inner layers, the
signal traces are routed into the inner layers. In this way, the power pattern is exposed to TOP and BOT layers,
securing maximum cooling.

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System Design
Figure 4 Current versus conductor cross section (IPC-2152)
3.2.2 PCB Bottom-side

The PCB is designed to have no surface mount components at the bottom side. This keeps the PCB bottom flat,
except the through-hole solder pad of the DC-link electrolytic capacitors. Bottom side has 2 oz copper layer
that is 25.4 µm thick. In order to increase the thermal conductivity towards the isolating thermal pad, the
solder mask is mostly removed where the bottom side is interfacing the heatsink. As the solder mask has about
15 µm thickness between the copper traces, over the FR4 laminates, the height of the copper pattern is
compensated by the solder mask thickness. The bending of the PCB and an uneven surface of the heatsink may
add some more gap between the PCB bottom side and heatsink. However, most thermal interface materials
can accommodate to these types of bending and bow. Knowing the range of the gap between the PCB bottom
and the heatsink surface, a thermal pad is chosen to fill up the gap.
[Photo reference] Printed Circuit Board Failures – Cases and Cures, Bob Willis, bobwillis.co.uk.
Figure 5 PCB bottom surface profile without solder mask
3.2.3 Thermal pad Selection

The chosen thermal pad has 230 µm thickness. When the pad is pressed down, it provides 2.56 K·cm2/W at
100 PSI. Its operating temperature ranges from -60 °C to 180 °C. The dielectric withstand voltage defined as
4500 V DC for 30 seconds. As the design is aiming a low-cost machining on the heatsink, the contacting surface
between the PCB bottom side and the milled heatsink surface is made flat. This prevents unwanted PCB
warpage and increases co-planarity. Under this condition, a thermal pad is chosen over a gap-filler material.
The benefit is to have thin TIM (Thermal Interface Material) layer with high compression, giving lower thermal
resistance.

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System Design
3.2.4 Bolting Torque

A bolt with pan-head and self-locking washer is chosen for mounting the PCB. It is essential to let the PCB sit
flat on the heatsink with conformal pressure over the whole area. In this way, the thermal interface sheet is
pressed down evenly providing desired thermal resistance without puncture or damage. Some thermal pad
manufacturers provide a thermal resistance value table at several pressure levels. Out of this, a desired
pressure onto the thermal pad can be obtained. Therefore, it is important to let the PCB press down the
thermal pad evenly onto the heatsink at the targeting pressure level. Thus, estimating the pressure enables to
determine the number and the size of the bolts, as well as to choose the right thermal pad. Knowing the
mechanical tolerance of the surface flatness and roughness, the thermal pad has to be able to cover the gap
between PCB and heatsink. Another important thing to consider is choosing a thermal pad thickness that
should be as thin as possible, but still be able to cover the gap and thick enough to avoid shorts.
The bolting torque can be calculated by the equation: T = K · F · d, where T is the torque, K is the bolt material
and size, F is the axial bolt force, d is the nominal bolt diameter.
Disregarding the torque reduction due to lubrication, fastening M2.5 stainless-steel bolt with 0.4 N·m torque
will give 800 N axial bolt force. Knowing that the total heatsink contact area is about 0.00568 m2, 5 bolts will
apply about 102 PSI pressure. Assuming the local pressure increase due to PCB bending is 20 %, the highest
pressure close to the bolt is estimated as 123 PSI. The lowest pressure between the bolts is estimated as 82 PSI.
3.2.5 Mounting Hole
Figure 6 Five mounting holes (H1, H2, H3, H4 and H5) on the board
M2.5 bolt with locking washer is tightened with 0.4 Nm torque. In order to achieve uniform adherence of the
board on the heatsink, it is recommended to tighten five screws with light torque in the order of “H1 → H2 → H3
→ H4 → H5” and then with full torque in the same sequence. Each mounting hole is used as the passage of heat-
flux. Wide internal copper areas connected to the mounting holes are present, providing additional cooling
path to the heatsink.

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System Design
3.2.6 Heatsink
3.2.6.1 Heatsink Selection

The actual engine cooling fan in a car has a completely sealed metal housing that encapsulates the system
board. The housing is partly exposed to the air flow generated by its own fan. As a real housing has to meet
specific mechanical and thermal requirements, the design of a housing is bigger, thicker and more complex
than a simple reference design kit should have. Thus, for the reference design, one of a ready-made heatsink
was chosen and machined. In order to compensate the smaller mass and surface area, the heatsink has 9 fins.
For the user convenience, the thermal resistance between MOSFET case and the ambient is shown in Error! R
eference source not found..
Figure 7 860ASL 16-85 Heatsink
3.2.6.2 Machining of the Heatsink

The heatsink is 16-sided with 85 mm width and 35 mm height. It is drilled, tapped, anodized and top-surface-
milled. The drill and tap drawing is shown in the picture below. The purpose of the M2.5 tapped hole is to
screw-mount the PCB on the heatsink, while the Ø3mm hole is used to avoid mechanical/electrical contact
between the heatsink and the electrolytic capacitor lead. It is extremely important to keep the surface clean
and flat. All the burrs and scratches must be removed before mounting the PCB.
Heat sink fin orientation
Figure 8 Heatsink Drill/Tap

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System Performance
4 System Performance
This chapter shows the performance and characteristics of the reference desingn, first describing the test
setup, then showing the measured data.
4.1 Motor-Generator Test Setup

The setup is driving a Permanent-Magnet-Synchronous-Motor with a generator load. The generated power is
rectified by the diode bridge rectifier and then dissipated by an electronic load. Infineon’s standard FOC
sensorless control software is downloaded from Keil® Pack Installer. It is available at µVision → Pack Installer
→Device→Infineon→TLE987x Series. Figure 10 shows a photo of the motoring test bench.
Thermal
Motor Generator
Camera
U PMSM PMSM R
Inverter Electronic
7~18V V M G S
W T
Load
Sensing Diode
PC Control
Bridge
Power
Analyzer
Figure 9 Motoring Test Setup Block-diagram
Figure 10 Motoring Test Setup

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System Performance
4.1.1 Drive-motor Setup

The parameters of the drive-motor are entered into the Config Wizard. Then the Config Wizard configures the
relevant software code, which will be compiled into an execution file by µVision. This is an essential step to
read the back-EMF properly, as the feedback of the control.
Figure 11 Motor parameter setting in the Config Wizard tool
4.1.2 Generator Setup

A PMSM servo motor is used as the generator, which is connected to an electronic load via a bridge diode. The
generated power is rectified by the diode bridge and consumed by the electronic load, set in a resistive mode.
In this way, the driving power can be controlled by either the speed of the motor or the resistance of the
electronic load.
4.1.3 Gate-drive Setup

The gate driver stage of TLE987x has sophisticated function sets and protection schemes. It has an overcurrent
detection and a shutdown feature, adjustable cross conduction protection, supply voltage (VSD) monitoring
including adjustable over- and undervoltage shutdown, VDS comparators for short circuit detection in on- and
off-state and open-load detection feature in MOSFET off-state, to name a few. Taking a look at the bridge driver
parameters setup, as shown in Figure 12, the Config Wizard has a ‘TLE987x Peripherals’ tap, where the user can
configure the setting of each function module. Under this, In the BDRV tap, bridge driver parameters such as
charge pump, diagnosis and gate charge/discharge can be configured. The MOSFET switching speed is
determined by the parameters under ‘Gate Charge/Discharge’. Here the user can select the charge/discharge
current range. The pull-down menu offers two different ranges, 0 ~ 150 mA or 0 ~ 300 mA. This range is broken
down to 31 steps, by which the effective charge/discharge current is determined. In case of Figure 12,
0 ~ 300 mA range is chosen and by using 20 th step, the approximate effective charge/discharge current is set to
208.5118 mA. By changing these parameters, the gate driving current capacity can be tuned to have desired
switching speed. Furthermore, the ‘Charge Sequencer’ and the ‘Discharge Sequencer’ enables fine tuning of the
driving current level over four consecutive time periods, DRV_ON_I_1 ~ DRV_ON_I_4 or DRV_OFF_I_1 ~
DRV_OFF_I_4.

2021- 02-23
System Performance
In this way, the dynamic characteristics of the MOSFET switching can be fine tuned to fit the application use.
For more details, please refer to Chapter 5 of ‘TLE986x_TLE987x Bridge Driver Application Note’.
Figure 12 Gate drive parameter setting in the Config Wizard tool
4.2 Electrical Test Result
4.2.1 Switching Characteristics

The switching waveform of U5 (V-phase low-side MOSFET) was measured during the motoring test. Figure 13
shows the Drain-Source voltage (CH2), Gate-Source voltage (CH3) and Phase-output current (CH4) at 12 V, 40 A
DC input condition. The peak of the output sinusoidal current is about 50 A and the RMS current is 35.2 A. The
Vds peak at turn-off reaches 16.5 V.
Figure 13 Motoring waveform
Figure 14, Figure 15 and Figure 16 show the switching waveform of V-phase low-side MOSFET, U5. The
measurements are done on the board during the loaded motoring test. The MOSFET package temperature rises
up to a range of 30°C ~140°C depending on the load current.

2021- 02-23
System Performance
Out of a series of test at 12 V, Figure 17 is plotted as a summarized mosfet switching characteristic. Thus, Figure
17 is just a snapshot of the system in certain motoring condition, but not a generalized characteristic of the
system. The data points at higher current is measured at higher MOSFET temperature. This data is useful in
describing the loaded system behavior, in comparison to data measured at the constant reference
temperature.
Figure 14 Switching waveforms at 7 V supply voltage

2021- 02-23
System Performance
Figure 17 Switching characteristics of IAUA250N04S6N007 at 12 V DC supply

2021- 02-23
System Performance
4.3 Thermal Behavior
4.3.1 Controlled air flow

As shown in Figure 18, an air-duct is used to send the controlled amount of air only to the heat sink fins, but not
to the PCB. Using a separate DC motor fan, the air flow, cooling the heatsink, is controlled. Then the air flow
inside the duct is measured by an anemometer inserted into the channel of the air-out duct. Therefore, while
the PCB is set in the natural convection circumstances, the heat sink is working under forced air-cooling
condition. The air flows only through the heat sink fins, but not over the outer surface of the two external fins.
In this way, the overall cooling is made similar to the real cooling fan condition, which has sealed still air inside
the housing, but has forced air flow at the outside of the housing.
Figure 18 Air duct and air flow sensor used for thermal testing
4.3.2 Thermal Image

Figure 19 is an example of a thermal image from the motoring test setup. The name of each cursor in the image
corresponds to the legend of Figure 20. The image was taken from the test run of IAUA200N04S5N010 at 12 V,
40 A test condition. The purpose of this figure is to show the location of the cursors.
Figure 19 Thermal image showing the temperature reading point

2021- 02-23
System Performance
4.3.3 Temperature Profile

Figure 20 is the temperature profile of the cursors shown in Figure 19. One thing to note is the
“T_air_betwn_fins”, which is the reading of a thermo-couple put in between of two heat sink fins. With an air
flow of 1.7 m/s, this temperature is the same as the ambient temperature. This implies that the benefit of air
flow higher than 1.7 m/s will be limited. In this condition, there has to be the cooling effect of the thermo-
couple itself, because the thermocouple is also heated up by the radiation from the heat sink, even though
there is no direct conduction. The bottleneck of the power delivery is from the RBP MOSFET and the shunt
resistor. In this case, sTOLL is a good choice for the RBP switch up to 500W input power. Above 500 W, the larger
TOLL package could be a better solution under this specific layout and thermal design. The shunt resistors
show marginal thermal performances. This depends on the system ambient temperature and the air flow.
Figure 20 IAUA250N04S6N007, Temperature profiles with different air flow rate.

2021- 02-23
System Performance
4.3.4 MOSFET Rth(ja) vs. Air-flow

The reference design does not have a metal housing. It has an air-cooled heatsink at the bottom side of the
PCB. The efficiency of the cooling is dependent on the air-flow, passing through the heatsink fins. The impact of
the speed and direction of the air-flow on the thermal behavior is reviewed by simulations. Again, the same
type of the air duct that was used for the experiment is implemented in the simulation.
Figure 21 shows thermal simulation results obtained at 25°C ambient with 1.3m/s air-flow, blowing from top to
bottom of the picture. The thermal flux is sweeped downward by the air-flow, resulting in more indirect heating
for the components located at the lower part of the PCB. The square shape, containing the heat is coming from
the air-duct modeling. Picture (a) of the Figure 21 is for 40A DC input current, (b) is for 80A.
(a) 12V, 40Adc, 1.3m/s, Ta=25°C
(b) 12V, 80Adc, 1.3m/s, Ta=25°C
Figure 21 Thermal simulation result with downward air-flow

2021- 02-23
System Performance
As the RBP switch is the component that has the highest power loss at above around 50Adc, it is meaningful to
take care of the max temperature of the RBP switch. Thus, further improvement can be achieved by reversing
the air-flow direction. Having the air-flow from bottom to top of the picture will sweep the heat away from the
RBP switch and reduce indirect heating. As a result, the maximum junction temperature of the whole board
could be lowered. Considering the original project requirement of maximum ambient 105°C, the simulation
result at the 1.3m/s air-flow from bottom to top is shown in Figure 22. Further simulation review indicated Tj
can be further reduced by about 4°C, by increasing the air velocity to 2.0m/s. As the higher power operation
usually generates higher air velocity, it makes sense to apply higher air velocity for the maximum current
operation. There could be some other improvements such as increasing thermal path by placing a power
terminal or a mounting screw near by the MOSFET. In general, as it is mentioned in 4.3.3, it is desired to have
0.6mΩ BIC sTOLL or a TOLL MOSFET for the RBP switch, in order to further relax the thermal constraint of the
system.
(a) Die temperature at Ta=105°C, 12V, 80Adc, 1.3m/s
(b) Case-top temperature at Ta=105°C, 12V, 80Adc, 1.3m/s
Figure 22 Thermal simulation result with air-flow from bottom to top

2021- 02-23
System Performance
Figure 23 is the estimated thermal resistance of the system between the bridge MOSFET’s junction and the
ambient. The plot is derived from the thermal simulation with the downward air-flow shown in Figure 21. With
the air duct implemented, the air-flow does not touch the PCB nor top of the PCB. The direct cooled-down
surface is only between the heatsink fins. All other part of the system is under natural convection with little air
movement. Most of the engine cooling fan applications today have a metal housing partly exposed to the fan
blow, while the PCB is sealed in still air within the housing. The purpose of the setup was to mimic the
application condition, although it cannot exactly represent a real application. Here, the Rth(ja) is provided as
an indication to help users figuring out the thermal characteristics of the system under various fan speed.
Figure 23 Estimated thermal resistance from bridge-MOSFET’s junction to ambient

2021- 02-23
System Performance
4.4 EMC performance
4.4.1 Measurement Setup

The measurement setup is described in Figure 24. The 1 kW design is visible as the DUT in the center. It is
driving an engine cooling fan with a power rating of 400 W. The maximum possible power was limited to the
test equipment. The linear power supply was limited to 20 A that limited the maximum output power of the
module to 240 W. The measurements have been executed in a professional EMC chamber. The EMC level limits
are compliant to CISPR25 class 3.
Figure 24 Measurement chamber with DUT for conducted emission
The limited power supply is visible on the left side of Figure 24. The DUT is connected to a line impedance
stabilization network. It couples the measurement signal from the supply line.
Motor On- and Off-state has been measured. The filter structure has been evaluated on this setup, too.
The 400 W engine cooling fan is running with a constant speed in closed loop.
The sensorless field oriented control demo software has been used for all the tests.

2021- 02-23
System Performance
4.4.2 Conducted Emission with Motor Off-State

In this condition the DUT is supplied with 12 V and the microcontroller of the TLE9878QXW40 is executing the
code, without turning the motor. The MOSFET bridge-driver is disabled. The measurement results are visible in
Figure 25.
Figure 25 Conducted Emission Measurement: Motor Off-State, VBAT-Line
The peak and average level are far below class 3 and class 5 limits. The layout shows a good suppression at the
core frequency (40 MHz) and the first harmonic (80 MHz).

2021- 02-23
System Performance
4.4.3 Conducted Emission with Motor On-State

In this condition the the DUT is powered up and the microcontroller of the TLE9878QXW40 is executing the
code. The Motor is turning with 3000 rpm. The MOSFET bridge-driver is enabled. The measurement results are
visible in Figure 26.
Figure 26 Conducted Emission Measurement: Motor On-State, VBAT-Line
The measured noise is beyond the limits of class 3 and class 5. The CISPR 25 limits can not be fulfilled without a
dedicated EMI in the VBAT supply line.
Therefore, an external filter structure has been implemented. Similar to the TLE9879 evaluation kits, a CLC filter
is used. The filter coil selected for the tests is the Vishay IHXL-2000VZ-5A. It has an inductance of 2.2 µH and an
IRMS of 125 A. The filter structure is implemented on a separate PCB. In the application the coil can be placed on
top of the ECU or it can be mounted into the Motor housing. For test convenience the filter has been placed on
a separate PCB.
The final setup is shown in Figure 27. An additional ferrite is used to suppress the common mode disturbance in
the frequency range 20 - 100 MHz. These disturbancies are related to thermal copper polygons distributed on
the MID TOP layer of the PCB. The grounding of these areas can be improved by RC connections, which will be
considered for next design revisions.

2021- 02-23
System Performance
Figure 27 Conducted Emission Measurement setup with filter PCB
Figure 28 shows the final measurement results. The average level is below the CISPR25 class 3 limit. The peak
level is overshooting the class 3 limit by ~3 dBµV. The high level in the 20-100 MHz frequency range is related to
the thermal copper polygons for thermal distribution.
Figure 28 Conducted emission measurement: Motor On-State, VBAT-Line, CLC-Filter

2021- 02-23
Project Collaterals
5 Project Collaterals
5.1 Schematics

2021- 02-23
Project Collaterals
Figure 29 Circuit schematics

2021- 02-23
Project Collaterals
5.2 Bill of Material

Table 6 Bill of material
Designator Value Description Vendor Part Number Quantity
1 BATTERY1 Green LED, 1206 Stanley Electric PG1111R-TR 1
2 C1, C2, C3, C10, 22nF MLCC 0805 50V 10% TDK CEU4J2X7R1H223K125AE 6
C11, C12
3 C4, C5, C6 100uF MEGA CAP, 35V TDK CAA572X7R1V107M 3
4 C7, C8, C9, C16, 1nF MLCC 50V X7R 0805 10% KEMET C0805C102K5RECAUTO 6
C17, C18
5 C13, C14, C15 1000uF CAP ALUM 50V 20% RADIAL PANASONIC EEUFC1H102 3
6 C19, C20 680pF MLCC 50V X7R 0805 10% KEMET C0805C681K5RACAUTO 2
7 C21, C22, 100nF MLCC 50V X7R 0805 10% TDK CGA4J2X7R1H104K125AE 4
C_VAREF1,
C_VS1
8 C23 1uF MLCC 50V X7R 0805 10% TDK CGA4J3X7R1H105K125AB 1
9 CIN_CER1, 100nF MLCC 50V X7R 0805 10% TDK CGA4J2X7R1H104K125AE 2
CIN_CER2
10 CIN_POL1 10µF CAP ALUM 63V 20% SMD PANASONIC EEE-FK1J100P 1
11 C_CP1, C_CP2 220nF CGA4J2X7R1H224K125AE TDK CGA4J2X7R1H224K125AE 2
12 C_filt1 1.0uF 3-TERM FILTER 1206 20% TDK YFF31AH2A105M 1
13 C_LIN_I1 220pF MLCC 50V X7R 0805 10% KEMET C0805C221K5RACAUTO 1
14 C_VCP1 470nF MLCC 50V X7R 0805 10% TDK CGA4J3X7R1H474K125AE 1
15 C_VS2 10µF MLCC 25V X7S 0805 10% MURATA GRT21BC71E106KE13L 1
ELECTRONICS
16 C_VSD1 10uF MLCC 50V X7R 0805 10% TDK CGA5L1X7R1H106K160AC 1
17 D1, D2, D3, 400V 1A Shottky Diode SMD MICRO COMMERCIAL SM4004PL-TP 5
D_RPP1, D_VS1
18 DEBUGGER1 SWD-JTAG Header SMD 10POS SAMTEC FTSH-105-01-F-DV-K-TR 1
1.27mm
19 H1, H2, H3, H4, Stainless- M2.5x0.45 thread, 8mm McMASTER-CARR PAN HEAD SCREW 5
H5 steel
20 HALL1, P2 Header 6 Header, VERT, 6POS SAMTEC TSW-103-07-F-D 2
2.54mm
21 IC1 TLE987XQX INFINEON TLE9879QXW40 1
TECHNOLOGIES
22 P1 Header 4 Header, VERT, 4POS SAMTEC TSW-104-07-F-S 1
2.54mm
23 R1, R2, R3, R10, 1R0 RES SMD 1206 1% PANASONIC ERJ-8RQF1R0V 6
R11, R12
24 R4, R5, R6, R13, 2R0 RES SMD 0805 1% PANASONIC ERJ-6BQF2R0V 6
R14, R15
25 R7, R8, R9, R16, 100k RES SMD 0805 1% PANASONIC ERJ-U06F1003V 6
R17, R18
26 R19, R20 12R0 RES SMD 0805 1% PANASONIC ERJ-P06F12R0V 2
27 R_HA1, R_HB1, 4K7 RES SMD 0805 1% PANASONIC ERJ-U06F4701V 3
R_HC1
28 R_RP1 3K3 RES SMD 0805 1% PANASONIC ERJ-U06F3301V 1
29 R_RP2 10K RES SMD 0805 1% PANASONIC ERJ-U06F1002V 1
30 R_SUP1 12K RES SMD 0805 1% PANASONIC ERJ-P06F1202V 1
2021- 02-23
Project Collaterals
Designator Value Description Vendor Part Number Quantity

31 R_VDH1 1K RES SMD 0805 1% PANASONIC ERJ-U06F1001V 1
32 R_VSD1 2R RES SMD 0805 1% PANASONIC ERJ-6RQF2R0V 1
33 SHUNT1, 1mR 10W RES SMD 10W 1% Vishay / Dale WSHP28182L000FEA 3
SHUNT2,
SHUNT3
34 T_RPG1 BC818K-40 TRANS NPN 45V SOT-23 INFINEON BC817K25E6327HTSA1 1
TECHNOLOGIES
35 T_RP1, U1, U2, 40V AFET6 40V sTOLL INFINEON IAUA250N04S6N007 7
U3, U4, U5, U6 0.7mOhm TECHNOLOGIES
36 - 0.009" Thermal pad 0.009" Laird Tgard 300, A0 1
37 - 62mil 6 High-temp FR4 Sunrise Electronics PCB 1
layer 2oz
38 - Heatsink Aluminum Anodized Milled Alberko, Inc. 860ASL 85mm 16-sided 1
5.3 Layout Printing
TOP MID TOP SIG TOP
SIG BOT MID BOT BOT

Figure 30 PCB layout printing of 6 Copper layers

2021- 02-23
Abbreviations and definitions
6 Abbreviations and definitions

Table 7 Abbreviations
Abbreviation Definition
ECF Engine Cooling Fan
LIN Local Interconnect Network
FOC Field Oriented Control
MI Modulation Index
RBP Reverse Battery Protection
PSI Pound Force per Square Inch
ECU Electrical Control Unit
PWM Pulse Width Modulation
PCB Printed Circuit Board
EMC Electromagnetic Compatibility
IC Integrated Circuit
DC Direct Current
ESR Equivalent Series Resistance
DUT Device under test
LISN Line Impedance Stabilisation Network
BDRV Bridge Driver Module of Embedded Power IC

2021- 02-23
Reference documents
7 Reference documents
This document should be read in conjunction with the following documents:
[1] TLE9879QXA40 datasheet, Infineon Technologies AG, https://www.infineon.com/dgdl/Infineon-

TLE9879QXW40-DS-v01_01-EN.pdf?fileId=5546d4625b10283a015b248fc7622e4b
[2] TLE986x_TLE987x Bridge Driver Application Note, 2018-12, Infineon Technologies AG, Rev 1.02
https://www.infineon.com/dgdl/Infineon-TLE987x_TLE986x-BDRV-ApplicationNotes-v01_02-
EN.pdf?fileId=5546d46267c74c9a0167cbe1686a191d
[3] IAUA250N04S6N007 datasheet, Infineon Technologies AG, https://www.infineon.com/dgdl/Infineon-
IAUA250N04S6N007-DataSheet-v01_00-EN.pdf?fileId=5546d462712ef9b701717821bea511a7
[4] Analytical calculation of the RMS current stress on the DC-link capacitor of voltage-PWM converter
systems, 2006-07, IEE Proc.-Electr. Power Appl., Vol. 153, No.4.
[5] Snubber Capacitors Application Guide, 2018-01, Cornell Dubilier
[6] IPC-2152, 2003-05, Institute for Interconnecting and Packaging Electronic Circuits
[7] IEC 60664-1, 2007-04, International Electrotechnical Commission

2021- 02-23
Reference documents
Revision history
Major changes since the last revision
Date Version Description
2020-06-18 V1.0 Initial version
2021-02-23 V1.1 Added additional information to chapter 4.3.4
Figure 23 updated

2021- 02-23
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
IMPORTANT NOTICE
Edition 2021- 02-23 THE INFORMATION AND DATA GIVEN IN THIS WITH REGARD TO THE TECHNICAL SPECIFICATIONS OF
Published by DOCUMENT IS PROVIDED BY INFINEON PRODUCTS OF INFINEON TECHNOLIGIES, WE KINDLY
TECHNOLOGIES FOR THE SOLE PURPOSE OF ASK YOU TO REFER TO THE RELEVANT PRODUCT DATA
Infineon Technologies AG
SUPPORTING DESIGNERS OF SYSTEMS TO EVALUATE SHEETS PROVIDED BY US.
81726 Munich, Germany THE USE OF INFINEON PRODUCTS IN THE INTENDED
APPLICATION.
WE RESERVE THE RIGHT TO CHANGE THIS DOCUMENT
© 2021 Infineon Technologies AG. INFINEON TECHNOLOGIES HEREBY DISCLAIMS ALL AND/OR ANY INFORMATION AND DATA GIVEN
All Rights Reserved. WARRANTIES AND LIABILITIES OF ANY KIND WITH HEREIN AT ANY TIME WITHOUT FURTHER NOTICE.
RESPECT TO ANY INFORMATION AND DATA GIVEN IN
Do you have a question about this THIS DOCUMENT, INCLUDING WITHOUT LIMITATION
document? WARRANTIES OF NON-INFRINGEMENT OF
INTELLECTUAL PROPERTY RIGHTS OF ANY THIRD
Email: erratum@infineon.com PARTY OR FITNESS FOR A PARTICULAR PURPOSE.
THE INFORMATION AND DATA CONTAINED IN THIS

Document reference
DOCUMENT IS EXCLUSIVELY INTENDED FOR
TECHNICALLY SKILLED STAFF. IT IS THE DESIGNER’S
RESPONSIBILITY TO EVALUATE THE SUITABILITY OF THE
INFINEON PRODUCTS FOR THE INTENDED
APPLICATION AND THE CORRECTNESS AND
COMPLETENESS OF THE INFORMATION AND DATA
GIVEN IN THIS DOCUMENT WITH RESPECT TO SUCH
APPLICATION.

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1 kW engine cooling fan reference design for

Design Overview Highlighted Components

This Reference Design Guide describes a detailed • TLE9879QXW40

Reference Design and Block Diagram

Reference Design Guide 2 of 36 Version 1.1

5.3 Layout Printing ...................................................................................................................................... 32

Reference Design Guide 3 of 36 Version 1.1

1.1 Design Specifications

Table 1 Design Specifications

Reference Design Guide 5 of 36 Version 1.1

Reference Design Guide 6 of 36 Version 1.1

1.3 Highlighted Products

1.3.1 OptiMOS-6TM 40 V sTOLL(HSOF-5) MOSFET

Table 2 Automotive sTOLL MOSFET with 40 V OptiMOS-6TM and OptiMOS-5TM

1.3.2 3-Phase Bridge Driver IC with Integrated Arm® Cortex®-M3

Reference Design Guide 7 of 36 Version 1.1

Table 4 Software Toolchain Installation Guide

Reference Design Guide 8 of 36 Version 1.1

Figure 2 System block diagram

Reference Design Guide 9 of 36 Version 1.1

3.1 Electrical Design and Components

3.1.1 DC-link Electrolytic Capacitor

3.1.2 Shunt Resistor

Table 5 Differential Input Voltage Range of the Operational Amplifier of TLE9879QXW40

Reference Design Guide 10 of 36 Version 1.1

3.1.4 3-terminal Filter Capacitor

Figure 3 3-terminal high frequency filter design in a shunt scheme

3.1.5 Clearance and Creepage

3.2 Thermo-mechanical Design and Components

3.2.1 Layout Pattern Width

Reference Design Guide 11 of 36 Version 1.1

Figure 4 Current versus conductor cross section (IPC-2152)

3.2.2 PCB Bottom-side

Figure 5 PCB bottom surface profile without solder mask

3.2.3 Thermal pad Selection

Reference Design Guide 12 of 36 Version 1.1

3.2.4 Bolting Torque

3.2.5 Mounting Hole

Reference Design Guide 13 of 36 Version 1.1

3.2.6.1 Heatsink Selection

Figure 7 860ASL 16-85 Heatsink

3.2.6.2 Machining of the Heatsink

Heat sink fin orientation

Figure 8 Heatsink Drill/Tap

Reference Design Guide 14 of 36 Version 1.1

4.1 Motor-Generator Test Setup

Figure 9 Motoring Test Setup Block-diagram

Figure 10 Motoring Test Setup

Reference Design Guide 15 of 36 Version 1.1

4.1.1 Drive-motor Setup

Figure 11 Motor parameter setting in the Config Wizard tool

4.1.2 Generator Setup

4.1.3 Gate-drive Setup

Reference Design Guide 16 of 36 Version 1.1

Figure 12 Gate drive parameter setting in the Config Wizard tool

4.2 Electrical Test Result

4.2.1 Switching Characteristics

Figure 13 Motoring waveform

Reference Design Guide 17 of 36 Version 1.1

Figure 14 Switching waveforms at 7 V supply voltage

Figure 15 Switching waveforms at 12 V supply voltage

Reference Design Guide 18 of 36 Version 1.1