This document contains a student's answers to four questions about computer engineering topics:
1. The student describes the differences between vacuum tubes and transistors, and lists some common semiconductor materials like silicon and germanium.
2. Memory types are discussed, and the key differences between RAM and ROM are outlined, such as RAM being readable/writable and losing data on power off versus ROM.
3. Acronyms related to computer engineering are defined, including CAD, EDA, VHDL, PLA, FPGA, MIPS, and ALU.
4. The student was asked to explain the structure of a PLA with a block diagram, but no block diagram or further
This document contains a student's answers to four questions about computer engineering topics:
1. The student describes the differences between vacuum tubes and transistors, and lists some common semiconductor materials like silicon and germanium.
2. Memory types are discussed, and the key differences between RAM and ROM are outlined, such as RAM being readable/writable and losing data on power off versus ROM.
3. Acronyms related to computer engineering are defined, including CAD, EDA, VHDL, PLA, FPGA, MIPS, and ALU.
4. The student was asked to explain the structure of a PLA with a block diagram, but no block diagram or further
This document contains a student's answers to four questions about computer engineering topics:
1. The student describes the differences between vacuum tubes and transistors, and lists some common semiconductor materials like silicon and germanium.
2. Memory types are discussed, and the key differences between RAM and ROM are outlined, such as RAM being readable/writable and losing data on power off versus ROM.
3. Acronyms related to computer engineering are defined, including CAD, EDA, VHDL, PLA, FPGA, MIPS, and ALU.
4. The student was asked to explain the structure of a PLA with a block diagram, but no block diagram or further
This document contains a student's answers to four questions about computer engineering topics:
1. The student describes the differences between vacuum tubes and transistors, and lists some common semiconductor materials like silicon and germanium.
2. Memory types are discussed, and the key differences between RAM and ROM are outlined, such as RAM being readable/writable and losing data on power off versus ROM.
3. Acronyms related to computer engineering are defined, including CAD, EDA, VHDL, PLA, FPGA, MIPS, and ALU.
4. The student was asked to explain the structure of a PLA with a block diagram, but no block diagram or further
Question 1: Write down the differences between vacuum tube &
transistor. Write some examples of semiconductor materials. Answer 1: Difference:①、The vacuum tube is an electron tube from which all or most of the gas has been removed. However, unlike the vacuum tube, transistor is solid state.Solid state means that it doesn't change its physical form as it switches. There are no moving parts in a transistor. ②、Compared to the vacuum tube, transistors were much smaller, faster and cheaper to manufacture. They were also far more reliable and used much less power. Examples:There are many kinds of semiconductor materials like silicon, Germanium and Gallium arsenide, gallium phosphide and so on. But silicon, germanium is the most widely used.
Question 2: What are the different types of memory devices?
Write the differences between RAM & ROM. Answer2: RAM,SRAM,DRAM,ROM,EEPROM,LP,MAGNETIC DISKS MAGNETIC TAPE,CD Difference: ①、RAM can be read and written at any time and it is fast.Data can only be written and cannot erased. ②、Data in ram is not permanently written when power off, data deleted. ③、RAM requires flow of electricity to retain data. ROM does not requires electricity to retain data. ④、RAM is the memory available for theoperating system programs and process to use when the computer is running. Rom is the memory that comes with your computer that is pre- written to hold the instructions for booting up the computer.
Question 3: Write down the full form:
CAD, EDA, VHDL, PLA, FPGA, MIPS, ALU Answer 3: EDA: Electronic Design Automation; VHDL: VHSIC Hardware Description Language; PLA: Programmable Logic Array; FPGA: Field Programmable Gate Array; MIPS: Million Instructions Per Second; ALU: Arithmetic and Logic Unit Question 4: Explain PLA structure with block diagram. Answer 4: