™

Product
Data
Indigo2 Phase Change Metal Alloy (PCMA)
Thermal Interface Material (TIM)
Sheet
Indigo2 is a second-level Thermal Interface Material (TIM2) system for
use between an electronic component (lid, heat spreader, package
case, etc.) and heat sink/heat exchanger. Supplied as a preform,
Indigo2 is a self-contained structure that deploys a Phase Change
Metallic Alloy (PCMA) which reflows and fills surface asperities, forming
a low-defect interface with high thermal contact and bulk conductance.
.
DEPLOYMENT
SPECIFICATIONS
Simply peel and place Indigo2
Bulk Thermal Conductivity ~ 20 W/m-K o n l i d a n d r e f l o w a t 7 0 °C
BENEFITS
• High thermal performance at Continuous Use Temperature Up to 120°C
Indigo2 on Intel TM Duo Core processor
the lowest pressure
before reflow:
• No material migration regard- Application Pressure As low as 5 PSI
less of orientation

• Compatible with copper, alumi-

Melting Temperature ~ 60°C

num and most other materials

Electrical Resistivity Conductive
• Compliant joining of materials

with different CTEs

Bondline Thickness 2 mil, minimum
• ROHS compliant

• Reworkable Size Application specific

After reflow:
• Peel-and-place installation

COMPARATIVE PERFORMANCE

0.2000
0.1661
Enerdyne Solu tions
0.1600 ӨCS (case-to-sink)
www.EnerdyneSolutions.com

info@EnerdyneSolutions.com
0.1200
Performance and Reliability

125 West North Bend Way 0.0693 Testing Details: 50 mm square heat
0.0800
PO Box 2660 exchanger, 25 mm x 40 mm copper lid
0.0358
North Bend WA, 98045 0.0400 with 12.5 mm square 200W heat source.

+1 425 888-1880 Grease (6 W/mK) and PSH (3 W/mK)

0.0000 tested with 3.5 mil shims at 50 PSI.

Polymer-Solder Particle Filled Indigo2
Indigo2 BLT measured at 3.5 mil with 30
Hybrid Grease
P S I . P e r f o r m a n c e v a l u e s g i v e n i n °C / W .
 ™

Indigo2 Phase Change Metal Alloy (PCMA)

Thermal Interface Material (TIM)

RELIABILITY
Indigo2 passes the following environmental test conditions with The following graphs illustrate an increase in thermal performance

negligible performance change over end-of-line (EOL): as Indigo2 reaches a Minimum Bondline Thickness (BLT):
Product
TEMPERATURE CYCLING
Data Qualification Test Condition Indigo2 Results % Change in ΘCS per T/C Cycle
Test (ӨCS rise over EOL)
Sheet 10

Temperature 0-100°C No increase

5
Cycling 1000 Cycles
0
Elevated Temp. 125°C <1% increase
Bake 500 hrs -5

- 10
Temperature 85°C/85% RH No increase 0 200 400 600 800 1000
and 500 hrs
Therm al Cycles
Humidity

Cold Cycle 24°C to -30°C No increase ELEVATED TEMPERATURE BAKE

% Change in ΘCS per Hour @125°C

3 cycles

Shock Mil-Std-810F No increase 10

Method 516.5 5
Procedure I
0

-5
Vibration Mil-Std-810F No increase
Method 514.5 - 10
0 100 200 300 400 500
Procedure I
Hours

TEMPERATURE AND HUMIDITY

% Change in ΘCS per Hour @85°C/85RH

10

0
Enerdyne Solu tions
-5
www.EnerdyneSolutions.com
- 10
info@EnerdyneSolutions.com
0 100 200 300 400 500

Hours
125 West North Bend Way

PO Box 2660 S TO R A G E A N D P A C K A G I N G
North Bend WA, 98045 Indigo2 is packaged with removable liners for pick-
+1 425 888-1880 and-place or manual installation .
S h e l f l i f e i s s i x m o n t h s a t 2 2 °C / 7 2 °F a n d 5 0 % R H .

This product data sheet is provided for general information only. It is not intended, and shall not be construed, to warrant or guarantee the performance of the

product described which is sold subject exclusively to written warranties and limitations thereon included in product packaging and invoices.
Intel and Intel Core Duo are trademarks of the Intel Corporation, USA. Indigo2 is a trademark of Enerdyne Solutions, Inc.