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LED Bar Design
LED Bar Design
S-35EBMUD-H
◆ Mechanical Specification:
Dimension 2.9
2.9
21
● Chip size: 21mil×34mil (533±25.4μm×864±25.4μm)
● Thickness: 7.9mil (200 ± 15μm)
● P bonding pad: 2.9mil (75 ± 10μm)
● N bonding pad: 2.9mil (75 ± 10μm) P-electrode
P-electrode N-electrode
N-electrode
Metallization
● Topside P electrode: Au
7.9
● Topside N electrode: Au
Reflector
Unit:mil
◆ Electro-optical Characteristics at 22℃:
Note:
● GaN LED chip is an electrostatic sensitive device,so ESD protection during chip handling is
recommended.
● The wavelength span is 2.5nm,the dominant wavelength maintains a tolerance of ±1.0nm.
● All measurements are done with San’an electro-optical testing equipment.
● Radiant flux measurement allows a tolerance of ±10%.
● Customer’s special requirments are also welcome.
◆ Characteristic Curves:
Fig.1-Relative Luminous Intensity vs. Forward Current Fig.2-Forward Current vs. Forward Voltage
Fig.3-Relative Intensity (@120mA) vs. Ambient Temperature Fig.4-Forward Voltage (@120mA) vs. Ambient Temperature
Fig.5-Dominant Wavelength (@120mA) vs. Ambient Fig.6-Maximum Driving Forward DC Current vs. Ambient
Temperature Temperature ( Derating based on Tj max=125℃)