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Oe 28 21 32133
Abstract: With the development of industrial lasers and novel glass processing techniques,
which offer high speed, quality and precision, this becomes an attractive alternative to conventional
methods, such as mechanical scribing and cleaving, diamond saw and waterjet cutting, commonly
used in the industry. However, the emerging techniques lack thorough validation with respect
to well-established methods. To this end, we present a detailed comparison of different glass
cutting methods, taking into account surface quality, side-wall roughness, residual stresses and
flexural strength. In addition, samples were examined after fracture, and the flexural strength was
estimated according to the quarter elliptical corner flaws, which were the main reason of glass
failure. Two laser glass processing techniques were investigated – the rear-side glass processing
with tightly focused nanosecond laser pulses and sub-nanosecond laser volumetric scribing
with asymmetrical Bessel beam. Results were compared to mechanical scribing and breaking,
diamond saw and waterjet cutting.
© 2020 Optical Society of America under the terms of the OSA Open Access Publishing Agreement
1. Introduction
The conventional glass cutting techniques, such as a mechanical scribe and break method, are
still widely used in the high-volume industrial production [1]. Although these technologies are
well-established and offer high-speed processing at low cost, they do not meet the ever-growing
demand for the fabrication of complex, miniaturised and high-quality parts. The laser-based
processing has emerged as a very attractive tool, thanks to the precise and confined, both in space
and time, energy deposition into the material, which ensure high processing accuracy together
with low damage of the surrounding material. With the evolution of modern industrial lasers,
laser-based technologies can provide high throughput as well.
The most efficient laser-based kerf-less methods are the controlled fracture technique [1]
and glass scribing by introducing intra-volume voids, followed by the mechanical or thermal
separation step [2]. The former technology generates smooth cutting surface with high flexural
strength, but requires the accurate control of induced thermal stresses and is limited to low-
curvature contours [3,4]. For the predictable separation, the second technique requires the
generation of modifications through the large extent of the sample thickness. For this, the efficient
use of Bessel optical beams, thanks to the large non-diffractive length and constant rebuilding
due to the conical wavefront, has been demonstrated [5]. The Bessel beams allow scribing of
samples up to 10 mm-thickness [6]. However, great efforts are being made to facilitate the
separation of modified glass and to increase the processing efficiency. It was demonstrated that the
#402567 https://doi.org/10.1364/OE.402567
Journal © 2020 Received 14 Jul 2020; revised 2 Sep 2020; accepted 16 Sep 2020; published 9 Oct 2020
Research Article Vol. 28, No. 21 / 12 October 2020 / Optics Express 32134
propagation distances of 0.2 mm and 0.7 mm in air, respectively), after the axicon-generated
Bessel beam was demagnified using the 4F optical system with the reduction factor of 6.5.
Furthermore, the Bessel beam intensity distribution was asymmetrical in the transverse plane and
induced directional intra-volume glass cracks while processing [Fig. 1]. The directional cracks
allowed to increase the processing speed and reduce the required bending stress of the scribed
material during the mechanical separation stage. The samples were mounted on linear stages
ALS25020 (from Aerotech) to change their position relative to the laser beam. The scribing
speed was set to 100 mm/s, resulting in the large distance of 100 µm between laser-induced
modifications and the easiest separation (4 MPa) of glass plates with high quality. More details
about Bessel beam processing could be found in Refs. [7,32].
Single-shot modifications
Scanning strategy
th
n layer
nd
2 layer
st
1 layer
Conventional technologies
In the second technique, samples were entirely cut by the rear-side machining. The second
harmonic (532 nm) radiation of the DPSS nanosecond laser (from Ekspla) was used to conduct
cutting experiments. The pulse duration at FWHM was 12.5 ns, the average laser power was
16 W, the pulse repetition rate was 200 kHz. The position of the focused laser beam was changed
in the XY plane using a galvanometer scanner intelliSCAN 14 (from Scanlab). The laser beam
was focused using a telecentric f-theta lens with the focal length of 80 mm. The diameter of
the focused beam equalled to 10.5 µm at the 1/e2 intensity level. Samples were mounted on the
positioning stage 8MT167-100 (from Standa) with a stepper motor to adjust the vertical position.
The processing was initiated from the rear side of a sample. To increase the cutting kerf, which
Research Article Vol. 28, No. 21 / 12 October 2020 / Optics Express 32136
is required for material removal, the parallel contours were scanned in a layer-by-layer process,
as shown in Fig. 1, while the vertical stage was continuously moving down at the fixed speed
until the sample was cut through. The vertical speed was set to 0.09 mm/s, the scanning speed
was set to 5000 mm/s, the kerf width was 0.075 mm, the intra-distance between the parallel lines
was 0.025 mm. The effective cutting speed, calculated as the perimeter of a cut part, divided by
processing time, was 9 mm/s. More details about the rear-side machining could be found in Refs.
[18,20,33].
Table 1. Sampling lengths used to measure the average roughness of the side-wall [34].
Ra , µm Sampling length, mm Evaluation length, mm
(0.006) < Ra ≤ 0.02 0.08 0.4
(0.02) < Ra ≤ 0.1 0.25 1.25
0.1 < Ra ≤ 2 0.8 4
2 < Ra ≤ 10 2.5 12.5
10 < Ra ≤ 80 8 40
(i − 0.5)
Pi = . (2)
n
The failure probability was fitted by the two-parameter Weibull cumulative distribution function
[37,38]: m
P(σ, σ0 , m) = 1 − e−(σ/σ0 ) , (3)
where m and σ 0 are the shape and scale parameters, respectively. To obtain these parameters, the
Weibull cumulative distribution function was linearised by the double logarithmisation of both
sides of (3):
ln(− ln(1 − P)) = m ln σ − m ln σ0 . (4)
Then ln(-ln(1-P)) was plotted against ln(σ) and fitted linearly. The slope of the distribution
defines the shape parameter m, which describes the variation of the data. Smaller data scattering
is represented by the larger shape parameter or, the steeper slope. The scale parameter σ 0 was
calculated from the intercept mln(σ 0 ). σ 0 describes the bending stress, at which statistically
∼63% of samples will break. This value defines the flexural strength of specimens throughout
the text unless otherwise stated.
Fig. 2. (a) Four-point bending setup with the illustration of a quarter elliptical crack at the
corner of the bent sample. (b) Definition of the parametric angle φ of an elliptical crack.
Because the sign of stresses (compressive or tensile) depends on the glass stripe orientation
relatively to support spans [Fig. 2(a)], both cases were studied, when the front or the rear surface
faced the outer support span and, therefore, was tensioned. 15 samples were broken for each case.
Research Article Vol. 28, No. 21 / 12 October 2020 / Optics Express 32138
Samples after the vibration test were broken using such configuration, which gave the lowest
flexural strength values before the vibration test.
The flexural strength of the material was estimated theoretically by taking into account the
observed flaws in specimens during the post-mortem analysis of collected debris using an optical
microscope. In the linear elastic fracture mechanics, defects (cracks) act as stress concentrators,
characterised by the stress intensity factor, which depends on the load, configuration and size of
the crack and sample. The instantaneous failure of the material is achieved, when the critical
intensity factor or the fracture toughness K Ic value is reached, which is equal to 0.75 MPa m1/2
for soda-lime glass [30,39]. The flexural strength was calculated using the stress intensity
factor equations for a quarter elliptical crack in the flat plate [Fig. 2(a)] under the bending stress
according to Newman and Raju [40]:
r
KIc Q
σb = , (5)
Hc Fc πa
where a is the crack depth, H c is the bending multiplier, F c and Q are the boundary correction
and shape factors. These factors depend on the crack depth a and width c, plate thickness t and
parametric angle of an ellipse φ, which definition is shown in Fig. 2(b). Equation (5) was validated
by Newman and Raju for 0.2 ≤ a/c ≤ 2, a/t < 1, 0 ≤ φ ≤ π/2 and c/b < 0.5. Comprehensive
formulae could be found in [40].
The resistance of samples to the mechanical cyclic load was investigated using the excitation
vibrator 4806 with an amplifier [ Fig. 3(a)]. One side of samples was attached to the platform,
which was excited for several hours by the swept sine signal in the range of 560-620 Hz. The
displacement of samples was measured using U3B and U20B inductive sensors. The resonance
frequency of the samples was in the range of 582-604 Hz, while the maximum oscillation
amplitude of the opposite side of stripes reached 0.24 mm. An example of the measured
displacement of a free end is shown in Fig. 3(b).
Fig. 3. (a) The vibration setup of processed samples. (b) An example of the measured
displacement of a free end of a specimen versus time.
According to the Euler–Bernoulli theory, the stress in a bent beam can be calculated by taking
the second derivative of the displacement w along the Y-axis [41]:
∂2w
σxx = −Eh , (6)
∂x2
where E is Young’s modulus (72 GPa), and h is the distance from the neutral axis. The maximum
stresses are induced at the specimen surfaces (h = t/2 = 0.5 mm). The beam displacement along
X direction was calculated using the free vibration solution for a beam with one end fixed and the
other one free, oscillating at natural frequencies [41]. The displacement was scaled according to
the maximum measured oscillation amplitude ∆y of the free end of a beam.
Research Article Vol. 28, No. 21 / 12 October 2020 / Optics Express 32139
The images of the front and rear surfaces and the measurement of maximum surface
cracks/chipping width perpendicular to the side-wall are presented in Fig. 5. Note that the exact
side could not be identified for samples processed with a diamond saw. Therefore, all data are
included in a single column bar. Other samples had the largest cracks/chipping on the front
surface.
It is evident that glass cracks and chipping on the rear surface of the mechanically scribed
samples occur due to the breaking operation since this side remains undamaged during the
scribing step. In the case of Bessel beam volumetric scribing, the height of the non-damaged zone
close to the front surface is lower in comparison to mechanical scribing [Fig. 4]. The chipping
is also lower due to probably the lower bending load, required to separate sheets. In these
experiments, the modified glass sheets were separated manually. However, lower chipping could
be possibly achieved by using bending setups that provide uniform load or special expansion
tapes, used in the separation stage of stealth-diced semiconductor wafers [42].
The lowest maximum cracks/chipping were generated with the Bessel beam laser scribing and
separation - the average maximum crack/chipping width was 57 µm and 35 µm on the front and
rear surfaces, respectively. The largest cracks/chipping of 187 µm were generated with waterjet
cutting. However, as the occurrence of glass cracking and chipping is a stochastic process, the
Research Article Vol. 28, No. 21 / 12 October 2020 / Optics Express 32140
Fig. 5. (a) The optical microscope images of samples cut using different techniques.
The letters “F” and “R” stand for the front and rear surfaces, respectively. (b) Surface
chipping/cracks width evaluation for different glass cutting methods.
effective crack width, estimated by integrating the damaged area and dividing by the evaluation
length for a single sample, was from 3 to 6 times lower compared to the average maximum
crack/chipping width. Crack examination before and after vibration tests showed that surface
cracks were not affected by the cyclic mechanical load.
Fig. 6. The measured side-wall surface topographies and average roughness. The size of
the topography is 338 µm x 283 µm (width x height).
14 MPa for specimens, cut with the Bessel beam and rear-side machining technique. However,
the maximum stress was reduced to 4.5 MPa after the polishing step, when the damaged layer
was removed. The largest stresses of 19 MPa were measured in the mechanically scribed and
separated samples. The lowest residual stresses among tested technologies were measured for
diamond saw-cut samples and equalled to 7.4 MPa. The residual stresses in waterjet-cut samples
were comparable to laser-based cutting and equalled to 12 MPa.
Fig. 7. (a) The measured residual stresses in glass plates, viewing the specimen surface
close to the processed edge. (b) The average residual stress dependence on the distance to
the edge. The inset graphs represent the residual stresses over the whole width of specimens,
obtained using an optical configuration with a larger field of view.
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The residual stresses, averaged over the 4 mm-distance along the edge for a single sample, are
presented in Fig. 7(b). The maximum values of averaged stresses were reduced by the factor
of 3.6-4, comparing to the largest measured stresses. However, the trend remained the same
with the largest stresses generated in mechanically scribed and separated samples and the lowest
stresses in diamond saw-cut and polished samples.
The inset graphs in Fig. 7(b) show the residual stresses over the full width of specimens,
measured using optics with the larger field of view. The stress profiles are typically U-shaped
with the largest stresses generated up to 50 µm-distance from the edge and the lowest value in
the middle of specimens, except for the rear-side machining with the lowest value at 0.7 mm
distance from the edge. In the middle of the sample, the largest stresses were measured for
the rear-side machining and equalled to 0.2 MPa, but this value decreased below 0.003 MPa
after a polishing step. The similar stress value was obtained only with mechanical scribing and
separation (0.004 MPa). The measured stresses in the middle of the samples, cut using Bessel
beam, diamond-saw and waterjet, were in the range of 0.03-0.06 MPa.
Fig. 8. The failure probability of samples cut using different technologies versus applied
bending stress. Solid and dashed lines represent the Weibull fit of the experimental data
(open dots). The inset graph in the rear-side machining case represents the average flexural
strength dependence on the sample width. The solid dark cyan curve in the inset graph
represents the modelled flexural strength with the corner crack a = c = 60 µm.
Research Article Vol. 28, No. 21 / 12 October 2020 / Optics Express 32144
The lower dependence on the side orientation was observed for the rear-side machining
technique as the measured flexural strength was 101 MPa and 83 MPa for the front and rear
sides, respectively. This assuredly overcomes the waterjet cutting technique, which gives the
flexural strength of 61 MPa and 74 MPa for the front and rear sides, respectively. The flexural
strength of samples, cut using the rear-side technique, was enhanced by 1.6-1.9 times to 161 MPa
after the polishing procedure, which removed a damaged layer from edges. The largest flexural
strength among tested cutting techniques was measured for the rear-side of mechanically scribed
and separated samples, which was equal to 181 MPa. The edge close to the rear-side of scribed
samples is created during the separation stage. Thus, it has a lower density of flaws and the zone
of large median cracks, seen in Fig. 4, is under compression. However, the flexural strength of
the front side is considerably lower and equal to 134 MPa, which is comparable to diamond
saw-cut samples (137 MPa). It is also important to note that these techniques resulted in the
higher scattering of data with the Weibull shape parameter below 10, while laser scribing and
separation, rear-side machining and waterjet cutting ensured more predictable failure with the
shape parameter in the range of 10 to 21. The theoretical strength of glass is ∼30 GPa [30].
Therefore, the strength is reduced by the factor of 166 for the rear side of mechanically scribed
and separated samples and 493 of the front side of waterjet-cut samples.
The overview of the flexural strength of samples cut with different technologies found in the
literature is presented in Table 3. The strength of laser-cut samples, presented in this paper,
is lower in comparison to femtosecond laser-ablated 0.1 mm-thick aluminoborosilicate glass
with the flexural strength of 280 MPa and 240 MPa when the front and rear-sides are tensioned,
respectively, reported by H. Shin and D. Kim [26]. The same authors achieved even higher
flexural strength values of 370 MPa and 400 MPa for the front and rear-sides, respectively, using
femtosecond laser Bessel beam scribing [27]. However, the authors used a three-point bending
setup, which gives higher values in comparison to the four-point bending [43]. Furthermore, the
strength is higher for thinner samples [25,28]. Also, the flexural strength is highly dependent
on the loading rate [39,44,45]. The evident difference between experimental conditions is that
H. Shin and D. Kim reported the flexural strength of 550 MPa of mechanically scribed and
separated mirror-like glass surface [27], which is 3 times larger than measured for samples, cut
with the same technique in this paper. For comparison, J. Li et al. reported the 112.1 MPa flexural
strength of 1 mm-thick soda-lime samples, which were scribed via laser filamentation-induced
volumetric modifications [46]. Authors reported a 16% reduction in the force, required to cleave
modified samples, compared to ground ones. In comparison, asymmetrical Bessel beam scribing,
presented in this paper, reduces the breaking force by the factor of 30 [7].
J. Li et al. reported that the breaking force could be significantly reduced when V-grooves
are formed in addition to volumetric modifications. However, in this case, the flexural strength
decreased to 95-105 MPa [46], which is comparable to rear-side machining, presented in this
paper. Therefore, it can be concluded that the higher quality intra-volume scribing using shorter
pulses results in the higher stress, required to separate modified samples. For instance, Jenne et
al. reported the ∼54 MPa breaking stress of 1 mm-thick sample, scribed with the fs-ps Bessel
beam [14]. Sub-nanosecond asymmetrical Bessel beam, presented in this paper, allows more
than 13 times easier separation (4 MPa) [7].
Table 3. The overview of the flexural strength of samples cut with different technologies.
Mean flexural
strength, MPa
Method λ, nm τ p t, mm Configuration Glass Reference
Front Rear
Laser ablation 800 50 fs 0.1 Three-point Alumina- 280 240 H. Shin and
bending borosilicate D. Kim [26]
Laser Bessel 800 50 fs 0.1 Three-point Alumina- 370 400 H. Shin and
scribing bending borosilicate D. Kim [27]
Mechanical 0.1 Three-point Alumina- 246 550 H. Shin and
scribing and bending borosilicate D. Kim [27]
breaking
Laser 1064 10 ps 1 Four-point Soda-lime 112.1 J. Li et al. [46]
filamentation bending
Laser 1064 10 ps 1 Four-point Soda-lime 98-105 J. Li et al. [46]
filamentation bending
with V groove
Ground samples 1 Four-point Soda-lime 112.9 J. Li et al. [46]
bending
is shown in Fig. 9(g)), depending on which side was tensioned. This occurred mostly for the rear
side of mechanically scribed and separated samples (5 of 11) and samples, cut with a diamond
saw (4 of 21 samples). One case of cracks, emanating from the surface, was observed for the
front side of mechanically and laser-scribed and separated samples.
Rear
side
Side-wall
(e) Front (f) (g) (h) (i)
side
Front
side
20 µm
Mechanical scribing and separation Diamond saw cutting
Fig. 9. The post-mortal images of broken specimens obtained using scanning electron (b, e,
i) and optical microscopes (a, c, d, f-h). In optical microscope images, the fractured plane
is shown. Red arrows indicate the origin of the failure. Blue arrows show the tilted SEM
image of the corresponding flaw. Scale bars are 100 µm-length unless otherwise stated.
The occurring flaws during manufacturing, processing and inappropriate handling reduce
the flexural strength of the whole sample. The theoretically estimated flexural strength of the
specimen with an idealised quarter elliptical crack on the corner under the bending load is
presented in Fig. 10(a). Sample dimensions were selected according to experimental conditions
(1 mm thickness, 5 mm width). Note that dashed lines enclose the region of the validated crack
aspect ratio 0.2 ≤ a/c ≤ 2 for equations, derived by Newman and Raju [40]. The inset graph in
Fig. 10(a) shows the variation of the stress intensity factor along the crack front for the applied
bending stress of 100 MPa. The largest intensity factor is at the surface or a side-wall, depending
Research Article Vol. 28, No. 21 / 12 October 2020 / Optics Express 32146
on the crack aspect ratio. The largest intensity factor, resulting into the minimal flexural strength,
was taken for calculations, and the dark cyan solid line on the estimated flexural strength 2D map
determines the zone with the parametric angle equal to 0 deg (top) and 90 deg (bottom). Data
suppose that the size of flaws in the case of the quarter circular crack (a = c) should lay in the
range of 13-103 µm since the experimentally measured average flexural strength was between
60-165 MPa for different technologies.
Fig. 10. (a) The estimated flexural strength for glass specimens with a quarter elliptical
corner crack with the depth a and width c. The black dashed lines enclose the 0.2 ≤ a/c ≤ 2
region. The dark cyan solid line determines the zone with the parametric angle equal to 0 deg
(top) and 90 deg (bottom). The inset graph shows the stress intensity factor dependence on the
parametric angle φ for the different crack aspect ratio a/c (depth/width) in micrometres. (b)
The experimentally measured flexural strength versus estimated according to the post-mortal
analysis of quarter elliptical corner flaws in glass specimens, cut using different technologies.
The solid and open dots show that the front or the rear side is under tension, respectively.
In Fig. 10(b), we have compared the experimentally measured and estimated flexural strength,
according to the size of corner flaws, measured during the post-mortem analysis. The calculated
Pearson correlation coefficient was equal to 0.84. The measured mean flaw depth and width of
laser-scribed and separated samples was 162 µm and 39 µm, respectively. Note that the aspect
ratio of cracks in laser-scribed and separated samples was equal to 4.5 and slightly dropped out
from the validation window in Fig. 10(a). The mean flaw size for rear-side-machined samples was
a = 42 µm, c = 45 µm for the front surface and a = 61 µm, c = 105 µm for the rear surface. These
values were considerably lower compared to waterjet cutting with a = 112 µm, c = 95 µm for the
front surface and a = 74 µm, c = 90 µm for the rear surface. The similar flaw size of a = 22 µm,
c = 49 µm was observed for the front-side of mechanically scribed and separated samples, and
samples, cut with a diamond saw (a = 24 µm, c = 31 µm). Not surprisingly, these techniques gave
similar values of the flexural strength. In most cases, the measured flexural strength was higher
than estimated according to the flaw size. This could be explained by the fact that the actual flaws
expand along the specimen edge. Therefore, they are more chips-outs rather than ideally planar
cracks (this could be seen in SEM images in Figs. 9(b), 9(e) and 9(i)). Furthermore, the series of
parallel cracks/chips along the edge also reduces the stress intensity factor due to the shielding
effect, which depends on the ratio of cack size and distance between cracks [47].
The mean width of flaws, measured during the post-mortem analysis, is considerably lower in
comparison to the average maximum crack/chipping width, presented in section 3.1, except for the
rear side of laser-scribed samples. In the case of the rear side of rear-side-machined and diamond
saw-cut samples, the width of flaws was comparable to the effective crack width, while for other
Research Article Vol. 28, No. 21 / 12 October 2020 / Optics Express 32147
techniques, post-mortal flaws were larger. Furthermore, the strength of samples could not be
compared solely in terms of the surface cracks/chipping width, as the depth and shape of cracks
play an essential role as well. The average surface roughness is also not a reliable parameter in
assessing strength. Although the specimens with the best side-wall quality (mechanically scribed,
saw-cut and polished) demonstrated the largest flexural strength, the strength of the waterjet-cut
samples was lower in comparison to the laser-scribed and separated samples, which had 2 times
larger average roughness.
The inset graph in Fig. 8 in the rear-side machining case represents the average flexural strength
for different sample width, which varies from 1 mm to 10 mm when the rear-side of samples
was tensioned. The variation of the measured values was modest as predicted by the theoretical
estimation for specimens, having quarter circular cracks with a = c = 60 µm, shown as the dark
cyan solid curve in the inset graph. Therefore, the generated flaws during glass processing
determine the flexural strength of the whole sample.
Fig. 11. (a) The modelled shapes of the 1st (633 Hz), 2nd (3969 Hz) and 3rd (11112 Hz)
modes of the oscillating beam with one end fixed. (b) The corresponding stresses at the
surface of glass plates. Red dashed vertical lines indicate the support spans at the closest
possible position to the fixed end during four-point bending tests. (c) The dependence of
the induced stress and stress intensity factor on the maximum displacement of a sample,
oscillating in the first mode.
except the mechanical scribing and separation. Therefore, vibrated samples fractured more
predictably, resulting in the steeper cumulative distribution function [Fig. 8].
Our findings are in good correspondence to the reported increase of the flexural strength for
damaged glass samples, which experienced static or dynamic pre-loading [52,53]. The strength
of soda-lime glass could be potentially increased, as long as the stress intensity factor is below the
threshold value and cracks do not further grow. However, the influence of the surface morphology
as an outcome of different cutting techniques, applied maximum stress intensity, loading duration
etc. has to be investigated in more details in the future.
cracks/chipping (188 µm), higher side-wall roughness (1.9 µm) and the lowest flexural strength
(61 MPa and 74 MPa for the front and rear side) among tested techniques. Furthermore, the
polishing procedure of laser-machined samples increased the flexural strength to 161 MPa and
reduced residual stresses to 4.5 MPa. Therefore, the cutting surface finishing is essential.
The post-mortem analysis revealed that in most cases, the fatal fracture originated from the
corner, especially when the side-wall was severely damaged due to the cutting procedure. The
experimentally measured flexural strength of samples coincided well with the estimated values,
according to the corner elliptical crack model, taking into account the size of flaws, which were
measured after the sample fracture. However, the surface cracks/chipping width could not be
solely used to compare the flexural strength of specimens, as the depth and shape of cracks play
an essential role as well.
Acknowledgements
We are grateful to Ilis GmbH for their help with sample stress measurements.
Disclosures
The authors declare that there are no conflicts of interest related to this article.
References
1. S. Nisar, L. Li, and M. A. Sheikh, “Laser glass cutting techniques—A review,” J. Laser Appl. 25(4), 042010 (2013).
2. F. Ahmed, M. S. Lee, H. Sekita, T. Sumiyoshi, and M. Kamata, “Display glass cutting by femtosecond laser induced
single shot periodic void array,” Appl. Phys. A: Mater. Sci. Process. 93(1), 189–192 (2008).
3. C. Zhao, H. Zhang, and Y. Wang, “Semiconductor laser asymmetry cutting glass with laser induced thermal-crack
propagation,” Opt. Lasers Eng. 63, 43–52 (2014).
4. A. B. Zhimalov, V. F. Solinov, V. S. Kondratenko, and T. V. Kaplina, “Laser cutting of float glass during production,”
Glass. Ceram. 63(9-10), 319–321 (2006).
5. A. Marcinkevičius, S. Juodkazis, S. Matsuo, V. Mizeikis, and H. Misawa, “Application of Bessel Beams for
Microfabrication of Dielectrics by Femtosecond Laser,” Jpn. J. Appl. Phys. 40(Part 2, No. 11A), L1197–L1199
(2001).
6. R. Meyer, L. Froehly, R. Giust, J. Del Hoyo, L. Furfaro, C. Billet, and F. Courvoisier, “Extremely high-aspect-ratio
ultrafast Bessel beam generation and stealth dicing of multi-millimeter thick glass,” Appl. Phys. Lett. 114(20), 201105
(2019).
7. J. Dudutis, R. Stonys, G. Račiukaitis, and P. Gečys, “Glass dicing with elliptical Bessel beam,” Opt. Laser Technol.
111(2006), 331–337 (2019).
8. J. Dudutis, P. Gečys, and G. Račiukaitis, “Non-ideal axicon-generated Bessel beam application for intra-volume glass
modification,” Opt. Express 24(25), 28433–28443 (2016).
9. J. Dudutis, P. Gečys, and G. Račiukaitis, “Modification of glass using an axicon-generated non-symmetrical
Bessel-Gaussian beam,” Proc. SPIE 10091, 100910N (2017).
10. J. Dudutis, R. Stonys, G. Račiukaitis, and P. Gečys, “Aberration-controlled Bessel beam processing of glass,” Opt.
Express 26(3), 3627–3637 (2018).
11. J. Dudutis, J. Pipiras, S. Schwarz, S. Rung, R. Hellmann, G. Račiukaitis, and P. Gečys, “Laser-fabricated axicons
challenging the conventional optics in glass processing applications,” Opt. Express 28(4), 5715–5730 (2020).
12. R. Meyer, M. Jacquot, R. Giust, J. Safioui, L. Rapp, L. Furfaro, P.-A. Lacourt, J. M. Dudley, and F. Courvoisier,
“Single-shot ultrafast laser processing of high-aspect-ratio nanochannels using elliptical Bessel beams,” Opt. Lett.
42(21), 4307–4310 (2017).
13. J. Dudutis, R. Stonys, G. Račiukaitis, and P. Gečys, “Generation of asymmetrical Bessel-like laser beams for glass
dicing,” Proc. SPIE 11107, 1110709 (2019).
14. M. Jenne, D. Flamm, K. Chen, M. Schaefer, M. Kumkar, and S. Nolte, “Facilitated glass separation by asymmetric
Bessel-like beams,” Opt. Express 28(5), 6552–6564 (2020).
15. D. P. Guaña and R. A. Guerrero, “A deformable annular slit for generating elliptical Bessel beams,” Jpn. J. Appl.
Phys. 58(6), 062002 (2019).
16. N. M. Bulgakova, V. P. Zhukov, A. R. Collins, D. Rostohar, T. J.-Y. Derrien, and T. Mocek, “How to optimize
ultrashort pulse laser interaction with glass surfaces in cutting regimes?” Appl. Surf. Sci. 336, 364–374 (2015).
17. D. Ashkenasi, T. Kaszemeikat, N. Mueller, A. Lemke, and H. J. Eichler, “Machining of glass and quartz using
nanosecond and picosecond laser pulses,” Proc. SPIE 8243, 82430M (2012).
18. P. Gečys, J. Dudutis, and G. Račiukaitis, “Nanosecond Laser Processing of Soda-Lime Glass,” J. Laser Mi-
cro/Nanoengineering 10(3), 254–258 (2015).
Research Article Vol. 28, No. 21 / 12 October 2020 / Optics Express 32150
19. Z. K. Wang, W. L. Seow, X. C. Wang, and H. Y. Zheng, “Effect of laser beam scanning mode on material removal
efficiency in laser ablation for micromachining of glass,” J. Laser Appl. 27(S2), S28004 (2015).
20. V. Tomkus, V. Girdauskas, J. Dudutis, P. Gečys, V. Stankevič, and G. Račiukaitis, “High-density gas capillary nozzles
manufactured by hybrid 3D laser machining technique from fused silica,” Opt. Express 26(21), 27965–27977 (2018).
21. N. Varkentina, N. Sanner, M. Lebugle, M. Sentis, and O. Utéza, “Absorption of a single 500 fs laser pulse at the
surface of fused silica: Energy balance and ablation efficiency,” J. Appl. Phys. 114(17), 173105 (2013).
22. C. Hermanns and J. Middleton, “Laser separation of flat glass in electronic-, optic-, display-, and bio-industry (Invited
Paper),” Proc. SPIE 5713, 387–396 (2005).
23. A. A. Abramov, M. L. Black, and G. Scott Glaesemann, “Laser separation of chemically strengthened glass,” Phys.
Procedia 5, 285–290 (2010).
24. F. A. Veer and J. Zuidema, “The Strength of Glass, Effect of Edge Quality,” in Proceedings of Glass processing days
(2003), pp. 106–109.
25. H.-C. Cheng, K.-H. Li, C.-Y. Shih, and W.-H. Chen, “Characterization of the Flexural Strength and Fatigue Life of
Ultrathin Glass After Dicing,” IEEE Trans. Compon., Packag. Manufact. Technol. 8(12), 2213–2221 (2018).
26. H. Shin and D. Kim, “Cutting thin glass by femtosecond laser ablation,” Opt. Laser Technol. 102, 1–11 (2018).
27. H. Shin and D. Kim, “Strength of ultra-thin glass cut by internal scribing using a femtosecond Bessel beam,” Opt.
Laser Technol. 129, 106307 (2020).
28. N. I. Min’ko and V. M. Nartsev, “Factors affecting the strength of the glass (review),” Middle East J. Sci. Res. 18(11),
1616–1624 (2013).
29. D. T. Kinsella and K. Persson, “On the applicability of the Weibull distribution to model annealed glass strength and
future research needs,” in Proceedings of Challenging Glass Conference (2016), pp. 593–608.
30. M. Haldimann, A. Luible, and M. Overend, Structural Use of Glass (International Association for Bridge and
Structural Engineering, 2008).
31. F. Dahmani, A. W. Schmid, J. C. Lambropoulos, and S. Burns, “Dependence of birefringence and residual stress
near laser-induced cracks in fused silica on laser fluence and on laser-pulse number,” Appl. Opt. 37(33), 7772–7784
(1998).
32. J. Dudutis, R. Stonys, G. Račiukaitis, and P. Gečys, “Bessel beam asymmetry control for glass dicing applications,”
Procedia CIRP 74, 333–338 (2018).
33. V. Tomkus, V. Girdauskas, J. Dudutis, P. Gečys, V. Stankevič, and G. Račiukaitis, “Impact of the wall roughness on
the quality of micrometric nozzles manufactured from fused silica by different laser processing techniques,” Appl.
Surf. Sci. 483, 205–211 (2019).
34. “Geometrical Product Specifications (GPS) - Surface texture: Profile method - Rules and procedures for the
assessment of surface texture,” ISO 4288:1996.
35. B. Bergman, “On the estimation of the Weibull modulus,” J. Mater. Sci. Lett. 3(8), 689–692 (1984).
36. J. D. Sullivan and P. H. Lauzon, “Experimental probability estimators for Weibull plots,” J. Mater. Sci. Lett. 5(12),
1245–1247 (1986).
37. W. Weibull, “A statistical distribution function of wide applicability,” J. Appl. Mech. 18, 293–297 (1951).
38. K. C. Datsiou and M. Overend, “Weibull parameter estimation and goodness-of-fit for glass strength data,” Struct.
Saf. 73, 29–41 (2018).
39. M. Vandebroek, J. Belis, C. Louter, and G. Van Tendeloo, “Experimental validation of edge strength model for glass
with polished and cut edge finishing,” Eng. Fract. Mech. 96, 480–489 (2012).
40. J. James, C. Newman, and I. S. Raju, “Stress-Intensity Factor Equations for Cracks in Three-Dimensional Finite
Bodies Subjected to Tension and Bending Loads,” NASA Technical Memorandum 85793 (1984).
41. S. S. Rao, Vibration of Continuous Systems (Wiley, 2007).
42. M. Kumagai, N. Uchiyama, E. Ohmura, R. Sugiura, K. Atsumi, and K. Fukumitsu, “Advanced dicing technology for
semiconductor wafer -Stealth Dicing,” IEEE Trans. Semicond. Manufact. 20(3), 259–265 (2007).
43. V. Dietrich, P. Hartmann, and F. Kerz, “Bending strength measurements at different materials used for IR-cut filters
in mobile camera devices,” Proc. SPIE 9359, 93590D (2015).
44. W. Zhen, H. Zhenbiao, S. Tao, Z. Fenghua, L. Yulong, M. Z. Sheikh, W. Xiang, and W. Yinmao, “A comparative
study on the effect of loading speed and surface scratches on the flexural strength of aluminosilicate glass: Annealed
vs. chemically strengthened,” Ceram. Int. 44(10), 11239–11256 (2018).
45. X. Nie, W. W. Chen, A. A. Wereszczak, and D. W. Templeton, “Effect of Loading Rate and Surface Conditions on
the Flexural Strength of Borosilicate Glass,” J. Am. Ceram. Soc. 92(6), 1287–1295 (2009).
46. J. Li, E. Ertorer, and P. R. Herman, “Ultrafast laser burst-train filamentation for non-contact scribing of optical
glasses,” Opt. Express 27(18), 25078–25090 (2019).
47. T. L. Anderson, Fracture Mechanics (CRC, 2005).
48. I. Alejandre and M. Artés, “Method for the evaluation of optical encoders performance under vibration,” Precis. Eng.
31(2), 114–121 (2007).
49. J. López, M. Artés, and I. Alejandre, “Analysis of optical linear encoders’ errors under vibration at different mounting
conditions,” Measurement 44(8), 1367–1380 (2011).
50. E. Gehrke, C. Ullner, and M. Hähnert, “Fatigue limit and crack arrest in alkali-containing silicate glasses,” J. Mater.
Sci. 26(20), 5445–5455 (1991).
51. M. Ciccotti, “Stress-corrosion mechanisms in silicate glasses,” J. Phys. D: Appl. Phys. 42(21), 214006 (2009).
52. A. L. Pranatis, “Coaxing Effect During the Dynamic Fatigue of Glass,” J. Am. Ceram. Soc. 52(6), 340–341 (1969).
Research Article Vol. 28, No. 21 / 12 October 2020 / Optics Express 32151
53. W.-T. Han and M. Tomozawa, “Mechanism of Mechanical Strength Increase of Soda-Lime Glass by Aging,” J. Am.
Ceram. Soc. 72(10), 1837–1843 (1989).