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Ema 09 N 03 An
Ema 09 N 03 An
N‐Channel Logic Level Enhancement Mode Field Effect Transistor
Product Summary:
D
BVDSS 25V
RDSON (MAX.) 9mΩ
ID 50A G
UIS, Rg 100% Tested S
Pb‐Free Lead Plating & Halogen Free
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C Unless Otherwise Noted)
TC = 25 °C 50
Continuous Drain Current ID
TC = 100 °C 35 A
TC = 25 °C 50
Power Dissipation PD W
TC = 100 °C 20
100% UIS testing in condition of VD=15V, L=0.1mH, VG=10V, IL=25A, Rated VDS=25V N‐CH
THERMAL RESISTANCE RATINGS
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EMA09N03AN
ELECTRICAL CHARACTERISTICS (TC = 25 °C, Unless Otherwise Noted)
STATIC
Drain‐Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 250A 25 V
DYNAMIC
Input Capacitance Ciss 830
Output Capacitance Coss VGS = 0V, VDS = 15V, f = 1MHz 270 pF
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EMA09N03AN
2
Independent of operating temperature.
3
Pulse width limited by maximum junction temperature.
Ordering & Marking Information:
Device Name: EMA09N03AN for DPAK (TO‐252)
A09
A09N03N: Device Name
N03N
ABCDEFG ABCDEFG: Date Code
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EMA09N03AN
TYPICAL CHARACTERISTICS
ON‐REGION CHARACTERISTIC ON‐ RESISTANCE VARIATION WITH DRAIN CURRENT AND GATE VOLTAGE
3
100
V = 10V 8V
GS 6V
DRAIN ‐ SOURCE ON ‐ RESISTANCE
7V
I ,DRAIN ‐ SOURCE CURRENT( A )
80
2.5
5V
60 2
R ,NORMALIZED
V = 5V
GS
40
1.5
6V
7V
DS(ON)
8V
10V
20 1
D
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0.5
0 20 40 60 80 100
V ,DRAIN‐ SOURCE VOLTAGE ( V )
DS
I ,DRAIN CURRENT( A )
D
ON‐ RESISTANCE VARIATION WITH TEMPERATURE ON‐RESISTANCE VARIATION WITH GATE‐SOURCE VOLTAGE
1.8 0.030
I = 25A
D
V = 10V
GS
I = 25A
D
1.6 0.025
DRAIN ‐ SOURCE ON ‐ RESISTANCE
R ,NORMALIZED
R ,ON‐RESISTANCE(OHM)
1.4
0.020
DS(ON)
1.2
0.015
1.0
°
T = 125 C
DS(ON)
0.010
0.8
°
T = 25 C
A
0.6 0
‐50 ‐25 0 25 50 75 100 125 150 2 4 6 8 10
T ,JUNCTION TEMPERATURE(°C )
j
V ,GATE‐SOURCE VOLTAGE (V )
GS
BODY DIODE FORWARD VOLTAGE VARIATION WITH SOURCE
TRANSFER CHARACTERISTICS
CURRENT AND TEMPERATURE
50 60
V = 10V
DS
V = 0V
GS
T = ‐55 ° C
I ,REVERSE DRAIN CURRENT( A )
A
T = 125°C
A
10
40
25 ° C
I ,DRAIN CURRENT( A )
125 ° C 1
30
25°C
0.1
20
‐55°C
0.01
D
10
S
0.001
0 0.0001
0 1 2 3 4 5 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
V ,GATE TO SOURCE VOLTAGE
GS
V ,BODY DIODE FORWARD VOLTAGE( V )
SD
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EMA09N03AN
G A T E C H A R G E C H A R A C T E R IS T IC S
12 10 4
C A P A C IT A N C E C H A R A C T E R IS T IC S
ID = 2 5 A
10
VGS ,GATE-SOURCE VOLTAGE( V )
C‐CAPACITANCE ( pF )
8 3
10
10V C is s
V =5V
6
D S 15V
C o ss
4 C rss
2
10
2
f = 1 M H z
V G S= 0 V
0
18 0 5 10 15 20 25 30
0 6 12
Q g ,G A T E C H A R G E ( n C ) V D S ‐ D R A IN ‐ S O U R C E V L T A G E ( V )
MAXIMUM SAFE OPERATING AREA SINGLE PULSE MAXIMUM POWER DISSIPATION
300 3000
200 SINGLE PULSE
°
mi
t 10μ
s
R = 2.5 C/W
θJC
°
) Li T = 25 C
C
50 100μ
s
POWER( W )
2000
20 1m
s
10 1500
10m
s
100
5 m
DC s
1000
D
2
V = 10V GS
500
1 R = 2.5 C/W
SINGLE PULSE
° θJC
°
Tc = 25 C
0.50.5 1 10 100
0
0.01 0.1 1 10 100 1000
V ,DRAIN‐ SOURCE VOLTAGE( V ) SINGLE PULSE TIME ( mSEC )
DS
Transient Thermal Response Curve
1
0.5 Duty Cycle = 0.5
Transient Thermal Resistance
0.3
r(t),Normalized Effective
0.2 0.2
0.1 0.1
0.05
Notes:
0.05
0.02 DM
0.03
0.01 1.Duty Cycle,D =
t1
t2
0.02 2.R =2.5°C/W θ JC
Single Pulse 3.T ‐ T = P * R (t)
4.R (t)=r(t) * R
J C θ JC
0.01
θ JC θ JC
‐2
10 10
‐1
1 10 100 1000
t ,Time ( mSEC )
1
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EMA09N03AN
Outline Drawing
E A
E2 C
L
D2
D
B2
H
L2
B1
D3
L1
P B L3
A1
Dimension A A1 B B1 B2 C D D2 D3 E E2 H L L1 L2 L3 P
Min. 2.10 0.95 0.30 0.40 0.60 0.40 5.30 6.70 2.20 6.40 4.80 9.20 0.89 0.90 0.50 0.00 2.10
Max. 2.50 1.30 0.85 0.94 1.00 0.60 6.20 7.30 3.00 6.70 5.45 10.15 1.70 1.65 1.10 0.30 2.50
Footprint
7.00
7.00
2.00
1.50
2.50
2.3 2.3
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