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18N80T Datasheet
18N80T Datasheet
18N80T Datasheet
April 2013
G G G
D D
S S
TO-220 TO-220F
S
Absolute Maximum Ratings
FDPF18N50 /
Symbol Parameter FDP18N50 Unit
FDPF18N50T
VDSS Drain-Source Voltage 500 V
ID Drain Current - Continuous (TC = 25°C) 18 18 * A
- Continuous (TC = 100°C) 10.8 10.8 * A
IDM Drain Current - Pulsed (Note 1) 72 72 * A
VGSS Gate-Source voltage ±30 V
EAS Single Pulsed Avalanche Energy (Note 2) 945 mJ
IAR Avalanche Current (Note 1) 18 A
EAR Repetitive Avalanche Energy (Note 1) 23.5 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 4.5 V/ns
PD Power Dissipation (TC = 25°C) 235 38.5 W
- Derate above 25°C 1.88 0.3 W/°C
TJ, TSTG Operating and Storage Temperature Range -55 to +150 °C
TL Maximum Lead Temperature for Soldering Purpose,
300 °C
1/8” from Case for 5 Seconds
* Drain current limited by maximum junction temperature
Thermal Characteristics
FDPF18N50 /
Symbol Parameter FDP18N50 Unit
FDPF18N50T
RθJC Thermal Resistance, Junction-to-Case, Max. 0.53 3.3 °C/W
RθCS Thermal Resistance, Case-to-Sink, Typ. 0.5 -- °C/W
RθJA Thermal Resistance, Junction-to-Ambient, Max. 62.5 62.5 °C/W
NOTES:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. L = 5.2mH, IAS = 18A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C
3. ISD ≤ 18A, di/dt ≤ 200A/μs, VDD ≤ BVDSS, Starting TJ = 25°C
4. Pulse Test: Pulse width ≤ 300μs, Duty Cycle ≤ 2%
5. Essentially Independent of Operating Temperature Typical Characteristics
2
10
VGS
2
10 Top : 15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
ID, Drain Current [A]
o
10
1
150 C
0 o
10 25 C
o
-55 C
* Notes :
* Notes :
1. 250μs Pulse Test
-1 1. VDS = 40V
10 o
2. TC = 25 C 2. 250μs Pulse Test
0
-1 0 1
10
10 10 10 2 4 6 8 10 12
2
RDS(ON) [Ω], Drain-Source On-Resistance
0.6 10
IDR, Reverse Drain Current [A]
0.5
VGS = 10V
0.4
1
10
0.3
VGS = 20V
150oC
0.2 o * Notes :
25 C
1. VGS = 0V
o
* Note : TJ = 25 C 2. 250μs Pulse Test
0
0.1 10
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
VDS = 250V
Capacitances [pF]
8 VDS = 400V
3000 Ciss
6
2000
4
* Note :
1. VGS = 0 V
1000 Crss 2. f = 1 MHz
2
* Note : ID = 18A
0 0
-1 0 1
10 10 10 0 10 20 30 40 50
1.2 3.0
Drain-Source Breakdown Voltage
2.5
Drain-Source On-Resistance
1.1
BVDSS, (Normalized)
RDS(ON), (Normalized)
2.0
1.0 1.5
1.0
0.9 * Notes :
1. VGS = 0 V
2. ID = 250μA * Notes :
0.5
1. VGS = 10 V
2. ID = 9 A
0.8
-100 -50 0 50 100 150 200 0.0
-100 -50 0 50 100 150 200
o
TJ, Junction Temperature [ C] o
TJ, Junction Temperature [ C]
Figure 9-1. Maximum Safe Operating Area Figure 9-2. Maximum Safe Operating Area
- FDP18N50 -FDPF18N50 / FDPF18N50T
2 2
10 10
10 μs
10 μs
100 μs
100 μs
ID, Drain Current [A]
1 1 ms 1
10 10 1 ms
10 ms
100 ms 10 ms
Operation in This Area DC Operation in This Area 100 ms
0 is Limited by R DS(on) 0 is Limited by R DS(on)
10 10 DC
-1 -1
10 * Notes : 10 * Notes :
o o
1. TC = 25 C 1. TC = 25 C
o o
2. TJ = 150 C 2. TJ = 150 C
3. Single Pulse 3. Single Pulse
-2 -2
10 10
0 1 2 0 1 2
10 10 10 10 10 10
20
15
ID, Drain Current [A]
10
0
25 50 75 100 125 150
o
TC, Case Temperature [ C]
0
10
D = 0 .5
(t), Thermal Response
-1 0 .2
10
0 .1 PDM
0 .0 5 t1
t2
0 .0 2 * N o te s :
o
0 .0 1 1 . Z θ J C ( t) = 0 .5 3 C /W M a x .
θJC
-2
10 2 . D u ty F a c to r , D = t 1 /t 2
Z
s in g le p u ls e 3 . T J M - T C = P D M * Z θ J C ( t)
-5 -4 -3 -2 -1 0 1
10 10 10 10 10 10 10
t 1 , S q u a r e W a v e P u ls e D u r a tio n [s e c ]
D = 0 .5
(t), Thermal Response
0
10
0 .2
0 .1
0 .0 5 PDM
-1
10 0 .0 2 t1
0 .0 1 t2
* N o te s :
o
1 . Z θ J C ( t) = 3 .3 C /W M a x .
θJC
2 . D u ty F a c to r , D = t 1 /t 2
Z
-2 s in g le p u ls e 3 . T J M - T C = P D M * Z θ J C ( t)
10
-5 -4 -3 -2 -1 0 1
10 10 10 10 10 10 10
t 1 , S q u a r e W a v e P u ls e D u r a tio n [s e c ]
TO-220B03
Dimensions in Millimeters
TO-220M03
Dimensions in Millimeters
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