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Schottky Rectifier Vs-Qa300fa17
Schottky Rectifier Vs-Qa300fa17
Schottky Rectifier Vs-Qa300fa17
www.vishay.com
Vishay Semiconductors
Insulated Gen 2 Schottky Rectifier Module, 300 A
FEATURES
• Max. TJ = 175 °C
• Two fully independent diodes
• Fully insulated package
• Trench MOS Barrier Schottky technology
• Ultra low forward voltage drop
• Optimized for power conversion: welding and industrial
SOT-227 SMPS applications
• Easy to use and parallel
ADDITIONAL RESOURCES • Industry standard outline
A • Designed and qualified for industrial level
Application
Notes
• UL approved file E78996
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
PRIMARY CHARACTERISTICS
IF(AV) per module at TC = 132 °C 300 A DESCRIPTION
VR 170 V
The VS-QA300FA17 insulated modules integrate two state
VFM at 100 A, TC = 25 °C 0.79 V of the art Trench MOS Schottky technology rectifiers in the
Package SOT-227 compact, industry standard SOT-227 package.
Two separate diodes, parallel These devices are thus intended for high frequency
Circuit configuration
pin-out
converters and switching power supplies.
400 1000
IF - Instantaneous Forward Current (A)
TJ = 175 °C
350
100
10 TJ = 150 °C
250
TJ = 125 °C
200 1
TJ = 150 °C
150 TJ = 125 °C
0.1
100
TJ = 25 °C 0.01 TJ = 25 °C
50
0 0.001
0 0.2 0.4 0.6 0.8 1.0 1.2 30 50 70 90 110 130 150 170
Fig. 1 - Typical Forward Voltage Drop vs. Fig. 2 - Typical Reverse Current vs. Reverse Voltage (Per Diode)
Instantaneous Forward Current (Per Diode)
10 000
CT - Junction Capacitance (pF)
1000
TJ = 25 °C
100
10 100 1000
1
ZthJC - Thermal Impedance
Junction to Case (°C/W)
0.01
0.1 0.02
0.05
0.1
0.2
0.5
DC
0.01
0.00001 0.0001 0.001 0.01 0.1 1 10
t1 - Rectangular Pulse Duration (s)
200 700
Allowable Case Temperature (°C)
VR = 100 V
180
600 IF = 50 A
160
140 500
TJ = 125 °C
120
Qrr (nC)
DC 400
100
300
80 TJ = 25 °C
60 Square wave (D = 0.50) 200
40 rated VR applied
100
20
0 0
0 50 100 150 200 250 300 350 400 450 500 550 100 200 300 400 500
Fig. 5 - Maximum Current Rating Capability (Per Diode) Fig. 7 - Typical Reverse Recovery Charge vs dIF/dt (Per Diode)
200 100
180 VR = 100 V
IF = 50 A
Average Power Loss (W)
160 90
140
120 80
trr (ns)
100
80 70
D = 0.20 TJ = 125 °C
60 D = 0.25
D = 0.33
40 D = 0.50 60
20 D = 0.75
DC TJ = 25 °C
0 50
0 25 50 75 100 125 150 175 200 225 100 200 300 400 500
Fig. 6 - Forward Power Loss Characteristics (Per Diode) Fig. 8 - Typical Reverse Recovery Time vs dIF/dt (Per Diode)
16
VR = 100 V
IF = 50 A
14
TJ = 125 °C
12
Irr (A)
10 TJ = 25 °C
4
100 200 300 400 500
dIF/dt (A/μs)
VR = 200 V
0.01 Ω
L = 70 μH
D.U.T.
D
dIF/dt
adjust
G IRFP250
(3)
trr
IF
ta tb
0
(4)
Qrr
(2)
IRRM 0.5 IRRM
di(rec)M/dt (5)
0.75 IRRM
(1) diF/dt
(1) diF/dt - rate of change of current (4) Qrr - area under curve defined by trr
through zero crossing and IRRM
trr x IRRM
(2) IRRM - peak reverse recovery current Qrr =
2
(3) trr - reverse recovery time measured
(5) di(rec)M/dt - peak rate of change of
from zero crossing point of negative
current during tb portion of trr
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
1 2 3 4 5 6 7
CIRCUIT CONFIGURATION
CIRCUIT CIRCUIT CONFIGURATION CODE CIRCUIT DRAWING
Lead Assignment
4 3
4 3
Two separate diodes,
F
parallel pin-out
1 2
1 2
37.80 (1.488)
38.30 (1.508)
Ø 4.10 (0.161) 4 x M4 nuts
-A-
Ø 4.30 (0.169)
6.25 (0.246)
12.50 (0.492) 6.50 (0.256) 24.70 (0.972)
13.00 (0.512) 25.70 (1.012)
31.50 (1.240)
32.10 (1.264)
24.70 (0.972)
25.50 (1.004)
Note
• Controlling dimension: millimeter
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