Professional Documents
Culture Documents
NEMS2014
NEMS2014
net/publication/268209537
CITATIONS READS
2 3,685
5 authors, including:
Some of the authors of this publication are also working on these related projects:
All content following this page was uploaded by Amarendra Kumar on 13 November 2014.
Abstract- Glass nanostructures were fabricated by wet chemical dry etching technique[4]. Nanostructure formation by
etching instead of using the complicated nanolithography and lithography needs a complicated masking process for
expensive dry etching process. Super hydrophilic glass with contact
achievement of nano scale resolution .This essentially includes
angle of 1° was created using this nanostructure with 92%
transparency .Self-assembled monolayer of Perfluorodecyl- coating of antireflection layer. Normal lithography using UV
trichlorosilane (FDTS) was used to further make the glass super light is not suitable for nanostructure fabrication. Interference
hydrophobic with contact angle of 151° without affecting its lithography is one of the common lithography process used but
transparency. Polysilicon layer of 300 nm was deposited on glass this process is complicated and not easily reproducible. Deep
substrate first and nanostructures were fabricated in this layer by reactive etching is required for etching and structure height more
metal assisted wet chemical etching. Thermal oxidation converted than 1 um is difficult to achieve by this fabrication because of
the silicon nanostructure to silicon dioxide nanostructure. This
technology is producible on mass scale and useful in preparation of mask limitation. For mask less lithography also etching is
anti-fogging and self-cleaning glass. required. Mask can be formed by different methods like
annealing of thin metal films [4]. For this thin metal film of few
Keywords- Glass Nanostructure; Mask less lithography; Super nanometer is deposited and annealed .Annealing will turn metal
hydrophilicity; Super hydrophobicity; Wet chemical etching film into nano island. This nano island pattern will act as
lithography mask but non uniformity is a major issue in this case.
Introduction
Experiment
Polysilicon of 300 nm thickness was deposited on glass samples
using LPCVD at 620 °C. Thickness of polysilicon layer
deposited on quartz sample depends on the height of
nanostructure required. Polysilicon nanostructures were
fabricated by immersing silicon samples into 0.1 M AgNO3
solution for 5 minutes. This deposited a thin layer of silver
nanoparticles on polysilicon layer. After that samples were
Fig. 2. (a) Schematic illustration of process steps for fabrication of glass nano
structure using wet chemical etching (b) SEM image for glass nanostructure
formed after wet chemical etching and thermal oxidation Fig. 3. (a) Water droplet for normal glass used in the experiment (b) Image for
water droplet after dropping on super hydrophilic glass. To show the super
hydrophilicity red dye is mixed in water which can be seen as thin film (c) Image
etched in the solution of HF (49%wt) and H2O2 (30%wt) in 3:1 for super hydrophobic glass formed by depositing FDTS self-assembled
ratio [8].Silver nanoparticle present in the solution acted as monolayer on glass nanostructure
catalyst for this reaction. Silicon under the silver nanoparticle
Once we remove the sample from etching solution extra silver
got oxidized and silicon dioxide generated was etched away by
particle will be left in between the nanostructures. Extra silver
HF present in the solution. By this process the silver
114
was removed in mixture of DI water and HNO3 in 5:1 ratio. After has flatter response and better transmittance keeping all other
metal assisted etching, polysilicon nanostructures were parameter same including pitch and density of nanostructure
completely oxidized using thermal oxidation to change silicon (Fig 4(a))
nanostructure into silicon dioxide nanostructure (Fig 2(a)).This Simulation is done for pillar shaped structure first with width of
removed the unnecessary step of mask removal. 100nm and different height structure. (Fig 3(b)) .Width is fixed
since the pitch for metal assisted wet chemical is same for all
etching time. To reproduce the experimental situation with
simulation we have created the nanostructure in unorganized
manner. For future possibilities, cone shaped structures were
also simulated. In simulation, cone shaped structure are better
115
assisted wet chemical etching and thermal oxidation techniques
are matured, comparatively simple and inexpensive processes. .
All the processes involved are batch process and can be accepted
by industry easily.
Acknowledgements
The authors are grateful for the research support from the Sino
American Silicon Products Incorporation and Instrument
Technology Research Center (ITRC). This work was partly
supported by the National Science Council in Taiwan through
Project No NSC 100-2628-E-007-013-MY3 which is gratefully
acknowledged.
REFERENCES
116