The document discusses a symptom of no power, service, lock up, or reset in devices where the power management integrated circuit (PMIC) was damaged by external shock, causing a crack in the PMIC. To address this, manufacturers will remove glue under the PMIC starting in late December to improve durability against external shocks.
The document discusses a symptom of no power, service, lock up, or reset in devices where the power management integrated circuit (PMIC) was damaged by external shock, causing a crack in the PMIC. To address this, manufacturers will remove glue under the PMIC starting in late December to improve durability against external shocks.
The document discusses a symptom of no power, service, lock up, or reset in devices where the power management integrated circuit (PMIC) was damaged by external shock, causing a crack in the PMIC. To address this, manufacturers will remove glue under the PMIC starting in late December to improve durability against external shocks.