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Nanomaterials and Its Characterization Techniques
Nanomaterials and Its Characterization Techniques
Nanoscience deals with the study of production, properties and possible applications
of nanomaterials
Nanoscale means smaller than 100 nanometer in at least one dimension of an object.
Nanomaterials are the materials which show dramatic change in properties of bulk
material.
Classification of nanomaterials
1) Zero dimensional nanomaterials (0D): These are the material having all the
dimensions within the nanoscale (no dimensions are longer than 100 nm ).
e.g Quantum dot, Nanodot, fullerene
2) One dimensional nanomaterials (1D): These are the material having one
dimension outside the nanoscale (one dimension is longer than 100 nm ).
e.g Nanowire, Nanorod, Nanopiller, Nanotubes, CNT etc.
3) Two dimensional nanomaterials (2D): These are the material having two
dimensions outside the nanoscale (Two dimensions are longer than 100
nm ).e.g Graphene, nanofilms, nanocoatings, nanolayers etc.
4) Three dimensional nanomaterials (3D): These are the material having all the
dimensions outside the nanoscale (All dimensions are longer than 100 nm ).
e.g Bulk powder, diamonds, graphite, dispersion of nanoparticles etc.
There are two general approaches for the synthesis of nanomaterials as shown in
folowing Figure: a) Top- down approach b) Bottom–up approach.
Characterization techniques
There are some strengths and some limitations of X-ray diffraction (XRD):
Strengths X-ray diffraction (XRD):
1. Microelectronics Industry:
The microelectronics industry uses silicon and gallium arsenide single-crystal
substrates in integrated circuit production; there is a need to fully characterize these
materials using XRD. XRD topography can easily detect and image the presence of
defects within a crystal, making it a powerful non-destructive evaluation tool for
characterizing industrially important single-crystal specimens.
The engineering of strained semiconductor materials represents an important aspect of
the enhancement of complementary metal-oxide semiconductor (CMOS) device
performance required for current and future generations of microelectronic
technology. An understanding of the mechanical response of the silicon (Si) channel
regions and their environment is key to the prediction and design of device operation.
Because of the complexity of the composite geometries associated with
microelectronic circuitry, in situ characterization at a submicron resolution is
necessary to verify the predicted strain distributions. Of the measurement techniques
commonly used for strain characterization, synchrotron-based X-ray micro beam
diffraction represents the best non-destructive method to provide spatially resolved
information.
2. Corrosion Analysis: XRD is the only analytical method that readily provides
information about the phase composition of solid materials. The most important,
versatile, and widely used method for corrosion protection of steelwork is by paint or
organic coatings. Information on the microscopic level for a protective coating is
essential to understand the basic determinants of its attributes and improvement
requirements.
3. Pharmaceutical Industry: In the drug design, discovery, development, and
formulation process, X-ray powder diffraction can help to establish a formulation by
discovering the morphology and the degree of crystallinity, providing unique
polymorph identification, and determining the quantity of each in mixture. With XRD,
nonambient analysis can also be performed to study moisture influence on physical
properties of drugs.
4. Forensic Science: Chemical analysis of forensic “specimens” usually means
identification and/or comparison. However, the specimens differ from most of those
encountered in other situations in that they constitute evidence, and as such should be
preserved. Powder diffraction is a non-destructive process, and is therefore well suited
to forensic analysis. It is also versatile and can be used for analyzing organic,
inorganic, and metallic specimens, and, qualitatively and quantitatively, mixtures of
these materials.
Dr.D.J.Sathe, KIT’s College of Engineering (Autonomous), Kolhapur Page 5
5. Glass Industry: The glass is X-ray amorphous and does not it give X-ray
diffraction patterns, there are still various uses of XRD in the glass industry. They
include identification of crystalline particles that cause tiny faults in bulk glass and
measurements of crystalline coatings for texture, crystallite size, and crystallinity.
1. Thin-film analysis
2. Lattice parameter determination
3. Purity/quality control of materials
4. Determination of crystallinity of polycrystalline materials
5. Particle Size Determination
The signals used by an SEM to produce an image result from interactions of the
electron beam with atoms at various depths within the sample. Various types of
signals are produced including secondary electrons (SE), reflected or back-scattered
electrons (BSE), characteristic X-rays and light (cathodoluminescence) (CL),
absorbed current (specimen current) and transmitted electrons. Secondary electron
detectors are standard equipment in all SEMs, but it is rare for a single machine to
have detectors for all other possible signals.
2. Microchip Assembly with SEM: Microchips remain a crucial part of everyday life
the world over, forming the basis of every electronic subsystem at hand. The level of
finite detail and electronic density that manufacturers can achieve with new and
emerging microelectronic systems is incredible, with smaller, lower cost, and more
efficient chipsets spearheading the next generation of networked devices. This comes
with its own unique challenges.
6. Used in the analysis of cosmetic components which are very tiny in size.
The transmission electron microscope is a very powerful tool for material science and
engineering. A high energy beam of electrons is shone through a very thin sample, and
the interactions between the electrons and the atoms can be used to observe features
such as the crystal structure and features in the structure like dislocations and grain
boundaries. Chemical analysis can also be performed. TEM can be used to study the
growth of layers, their composition and defects in semiconductors. High resolution
can be used to analyse the quality, shape, size and density of quantum wells, wires and
dots.
Application of TEM
Advantages of TEM
1. It has a very powerful magnification of about 2 million times that of the Light
microscope.
2. It can be used for a variety of applications ranging from basic Biology to
Nanotechnology, to education and industrial uses.
3. It can be used to acquire vast information on compounds and their structures.
4. It produces very efficient, high-quality images with high clarity.
5. It can produce permanent images.
6. It is easy to train and use the Transmission Electron Microscope
Limitations of TEM
1.Arc discharge CNTs Can be found in the carbon soot of graphite electrodes during
an arc discharge involving high current. This process yields CNTs with lengths up to
50 microns.
2. Laser Ablation In the laser ablation process, a pulsed laser vaporizes a graphite
target in a high-temperature reactor while an inert gas is inserted into the reactor.
Nanotubes develop on the cooler surfaces of the reactor as the vaporized carbon
condenses.
Properties of CNTs
1. Mechanical
2. Electrical
3. Thermal
4. Chemical
5. Mechanical
1. Mechanical (Strength Properties)
• Carbon nanotubes have the strongest tensile strength of any material known.
(50x steel)
2. Electrical Properties
• If the nanotube structure is armchair then the electrical properties are metallic
• If the nanotube structure is zigzag or chiral, then the electrical properties are
semiconducting with moderate or very small band gap.
a) Armchair- parallel to the axis b) Zigzag- oriented in a circle around the axis
3. Thermal Properties
• All nanotubes are expected to be very good thermal conductors along the tube,
but good insulators laterally to the tube axis.
4. Chemical Properties