Professional Documents
Culture Documents
Bhalala Dhruv Emmi Exp-4
Bhalala Dhruv Emmi Exp-4
N:-200280109518
Experiment No: - 4
Simulation:-
Level-1 Measurement:-
NAME:-BHALALA DHRUV M. BATCH:-B3 E.N:-200280109518
Review Question
Que.1) Explain the Effect of the Temperature on strain gauge and means to
reduce the same?
Ans:
Temperature adversely impacts strain measurements in many ways, though
three are of primary concern.
The device or object studied will almost always have a non-zero
coefficient of thermal expansion. Unless compensated for, changes in
temperature will cause the item to which the strain gauge is attached to
expand or contract, which is then indicated as a change in strain.
The materials of the strain gauge itself have a non-zero coefficient of
thermal expansion. Changes in temperature will cause the strain gauge
itself to expand or contract, independent of any strain in the part to which
it is attached.
The wiring and the strain gauge itself will have a non-zero Temperature
Coefficient of Resistance. That is, as the temperature changes, the
resistance of the strain gauge and connecting wires will change
independently of any change in strain. (For example, copper wire
resistance changes at approximately 3,900 ppm per °C (.393% /°C).)
Ans:
Gauge Factor: -
GaugeFactorisdefinedastheratioofperunitchangeinresistancetotheperunitchangei
nlength.Thiscanbemathematicallywrittenas,
Gf=(ΔR/R)/(ΔL/L)
Where
ΔR/R=Perunitchangeinresistance
ΔL/L=Perunitchangeinlength
Gf=Gauge Factor
Significance of Gauge Factor: -
In general, the gauge factor of electrical strain gauges depends on the
material and varies around 2.0
A high gauge factor increases the output signal on the Wheatstone bridge;
a low gauge factor reduces the signal:
Que.3) What is different bonding material that can be used with strain
guage?
Ans:
Bonding materials are also called Adhesives are used to secure the strain gage to
the workpiece.
Select Cyanoacrylate cement (e.g., Eastman 910 SL), if
Applications are needed as soon as possible, ~10 min after bonding. (A
gentle clamping pressure is needed for the first 1 to 2 minute.)
Applications do NOT last a long period of time (months).
One does not know what else to choose.
Select epoxy, if
Higher bond strength is desired.
Higher strains at failure need to be measured.
A clamping pressure, 350 kPa (50 psi) for thin bond lines is used. A
clamping pressure of 35-140 kPa (5-20 psi) in general, can be applied
during the curing process.
Sufficient time is available to complete the curing process. A temperature
of 120°C/250°F is applied for several hours to complete polymerization.
Select ceramic cement (e.g., NBS-x-142, flame-spray BLH-H rod), if
High temperature environment, up to 980°C/1800°F is expected.
Select cellulose nitrate cement (e.g., Duco, SR-4), if
Paper backed strain gages are used.
Temperature of 54°C/130°F, usually by blowing warm air, can be applied
for curing and removing solvents.
The environment is fairly dry i.e., no water or high moisture is present.
4. What are the various problems associated with load measurement using
strain gauge?
Ans:
Low-Quality Manufacturing or Construction
Small mechanical changes within the strain gauge are responsible for
changes in voltage, which creates the reading on the scale.
Temperature Changes
Temperature changes effects the conductivity of metals, which will change
the output of the strain gauge. Once the load cells are built, they need to
be tested at different temperatures in order to ascertain their drift with
temperature. When the traditional strain gauge is needed to measure
particularly small amounts, temperature changes can be especially
problematic. Thermistors installed prior to the final test and calibration
stage will reduce the temperature effect.
Wrong Type of Load Cell
There are many types of load cells using traditional, strain gauge
technology, and certain types are better suited to certain applications.
Capacitive load cells, which use changes in capacitance instead of
NAME:-BHALALA DHRUV M. BATCH:-B3 E.N:-200280109518