Journal Title: Design and investigation on the reliability of a ceramic power package

Speaker/ Author (date): Lifeng Tang, Kun Cao (January 15, 2022)

SUMMARY

Background of the Study

Electronic devices used in a wide variety of applications have grown in vogue in previous years
up until now. As a result, an increasing number of power packages are required. Plastic packages have
numerous issues with storage and long-term use. In this review, a ceramic power package is designed
and investigated, as opposed to a conventional power package. To aid in package design, finite element
simulation is used. Packages are made using a high temperature co-fired ceramic technique. Various
types of reliability tests are performed. Furthermore, the mechanism of crack initiation and propagation
in inaccurate sample outer leads is addressed. The outcomes of the experiments revealed that cracks on
the surfaces of standard outer leads were initiated by stress and propagated along the direction of
crystal boundaries. After optimizing the structure of the outer leads, all packs passed the reliability test
with flying colors.

In subsequent generations, with the advancement of automobile, communication, aerospace, and

artificial intelligence in recent years, a large number of high-quality power semiconductor packages
have been widely used in silicon laterally diffused metal oxide semiconductor-field effect transistor
devices, GaAs high electron mobility devices, wide-band-gap semiconductor field effect transistor
devices, and high frequency monolithic microwave integrated circuits. Conventional packages for the
devices mentioned above are designed and manufactured with plastic due to their low cost, small
volume, and lightweight.

This review may broaden the application of power packages by improving their reliability in
harsh environments. Ceramics have sparked a lot of fascination in recent years. As the most commonly
used packaging material, alumina ceramics, in particular, have many advantages in terms of mechanical
strength and electrical properties. Alumina ceramics can be used in high temperature, moisture, and
chemical corrosion environments due to their superior stability.  Furthermore, alumina ceramics are in
plentiful supply and are free of contamination such that it is a great and commonly used as a high
temperature electrical insulator. As a result, aluminium ceramics are now a viable material for
industrial applications.

Theoretical Background

Establishing a ceramic power package, developing a material for industrial applications. To aid
in package design, finite element simulation analysis was used. Package specimens were created using
a high temperature co-fired ceramic technique. In ensuring the package's reliability, several types of
tests were performed, including temperature cycling tests (TCT) and bending fatigue tests (BFT). In
addition, the mechanism of crack initiation and propagation in failure specimens was investigated. In
contrast to standard power packages, an elastic structural outer lead package was proposed.

As devices evolve, more passive elements and chips are integrated into a single package. The
number of outlets in a confined space is increasing, as is the reliability requirement. However, the cross
section and interval between the outer leads gradually narrow. Packages may exhibit poor board level
reliability due to broken and failed connections caused by the difference in thermal expansion between
the package and the PCB. As a result, the reliability of the power package is becoming increasingly
important.

Methodology

Electronic devices are now widely used, and their popularity has grown dramaticallyPlastic
packaging has numerous issues with long-term use and preservation. This paper designs and
investigates a ceramic power package in contrast to traditional power packages. Using finite element
simulation, packaging design is being aided. Packages are made using a high temperature with the use
of a co-fired ceramic method. There are several reliability tests that are conducted. Also discussed is
the crack start and propagation process in the outer leads of the faulty sample. Results of the
experiment demonstrated that cracks started out on the typical outer leads' surfaces under stress and
spread in the direction of crystal boundaries.

Materials and Equipment

2.1 Materials : Physical Properties

Kovar (for outer lead, frame, and lid)- raw material which composed of AlO, Cu-Mo-Cu, 4J42 & FR4

Metalized Tungsten- used as conductor material

Multilayered Al2O3 Ceramic- 95wt% as ceramic insulator material which is being fabricated

Metallic sheets (for heat sink)- made up of stacked Cu-Mo-Cu

Packages- nickel and gold plated thickness (nickel: 1.0 μm to 8.9 μm, gold:1.0 μm to 5.7 μm.)

2.2 Design

The exterior leads, ceramic insulators, heat sink, frame, and lid are all parts of the planned
package. In addition to having great thermal conductivity, Cu-Mo-Cu heat sinks also have a coefficient
of thermal expansion (CTE) that is comparable to that of ceramic and kovar, making them more
competitive as thermal channels for circuits and modules that are soldered together. Five of the heat
sink's sidewall windows were opened after the frame was built. In order to understand, those windows
were filled with ceramic insulators to ensure the package's hermeticity, and a lid was placed over the
frame. Alumina ceramics are the perfect material for microelectronic packaging because they have
great chemical and thermal stability, excellent mechanical qualities, strong electric properties in
microwave frequency, and minimal moisture absorption.However, Al2O3 ceramic has a poorer
electrical conductivity. Therefore, acting as a conductor is inappropriate. Ceramic insulator was passed
through tungsten metalized pad-conductor line pad for the transfer of electrical power and control
signals. The outside pads of ceramic insulators received outer leads.

2.3 Manufacturing and Testing

In this experiment, a designed power package was created using a high temperature co-fired
ceramic process. Alumina, an organic binder, a solvent, and an additive were combined as raw
materials through the use of ball milling processes. Doctor blading was used to cast a slurry onto a
moving substrate made of a Mylar film. The green ceramic film was blanked into sheets of the desired
dimensions once the cast sheet had dried. Layouts were completed using high temperature co-fired
tungsten paste and mask screen printing.Machine tools were used to create the frame and heat sink. At
the same time, etching and molding were used to complete the exterior leads. The heat sink, frame,
ceramic insulators, and outer leads were soldered together with Ag72Cu28 to form the intended
package after cleaning and heating the component parts.The design package's dependability was
assessed using a variety of methods many tests. Typically, the temperature cycling accelerated testing
was carried out to ensure that the package can withstand sudden changes in the temperature of the
environment without suffering from deterioration or property damage.In this study, packages were
placed within a testing chamber with a programmed cycling load ranging from 65 to 125 degrees
Celsius. A maximum of one minute may pass between a cold to hot or hot to cold cycle, and 500 cycles
were required. The gas leakage rate exceeding 1 103 Pa•cm3/s and the presence of surface cracks are
the TCT's failure criteria. In addition to TCT, the BFT was used to guarantee package reliability. Under
least three times at the stated load, for instance 2.22 N, the outer leads were bent 90 degrees. Fracture,
loose parts, and relative movement between the outer leads and the package should not be seen in a
field of view that is 20 times magnified after the load has been removed.

Results and Discussions

Typically, accelerated testing of BFT was performed to ensure that the package could withstand
changes in stress of the surrounding environment without property damage or deterioration. Fig. Figure
2a depicts a fabricated package sample, and Figure 2b depicts the package specimen following BFT.
Cracks were found on the surfaces of the outer leads, and one of the outer leads had broken off.
 Table 1
Physical properties of materials.

CTE10−6 / Elastic Posisson’s Conductivity Specific heat Density

°C modulus GPa ratio W/(m•K) J/(kg•K) kg/m3

Al2 7.70 304 0.27 17.0 795 3610

O3
Cu-Mo-Cu 6.50 150 0.27 160.0 130 17,500
4J42 6.50 170 0.27 21.0 460 8170
FR4 16.0 22 0.28 0.3 650 1413

Fig.1. Model of designed power package Fig.2. a. photograph of fabricated package

b. photograph of package after BFT testing

The use of a microscope was required to investigate the failure mechanism of outer leads. As
illustrated in Fig. 3, cracks appear on the outer lead surface. Furthermore, angles of 45° are visible on
both sides of the major crack, which is visible around the break area. The mechanical behavior of outer
lead under stress prior to fracture, which is usually divided into four stages.

Fig.3. Micrograph of fractured outer lead Fig.4. Stress analysis model

It has the same behavior as other metallic materials, with elastic, yield, strengthening,
and local deformation stages. When the strain was unloaded in the elastic stage, the distortion vanished.
However, if strain on the specimen is unloaded during the yield stage period, distortion will be partially
resumed and plastic deformation will be reserved. Following that, uniform plastic deformation was
observed during the strengthening stage. With increasing strain, heterogeneous deformation and
necking down appeared in the final stage, followed by fracture between the outer lead and the package.
As shown in the sketch map in Fig. 4, stresses on the outer lead were also measured analyzed. Based on
HOOk's law, for F = 2.22 N and a = 0.6 mm, b = 0.10 mm, =45°, calculated stress on x direction was
10.01 MPa by Eq. (1). According to the three-dimensional equilibrium principle. The stress on the y
axis was calculated to be zero by Eq. (2). While Eq. can be used to calculate stress in the z direction. 3.

Where the moment of inertia was indicated in Eq. (4), and the bending moment of load
was indicated in Eq. (5). For r = 100 mm, the stress on x direction δz was 170 GPa calculated by Eq.
(3) - Eq. (5). However, the elastic modulus of kovar has only 170 GPa. Thus, it was a negative factor
for the reliability of the package.

The outer lead's mechanical characteristics are closely related to its microstructure and
component. This article discusses the chemical makeup via X-ray fluorescence spectrometry analysis.
Results are displayed. Fe and Ni are the two primary constituents in table 2.The cubic crystal lattice in
the iron-nickel alloy has a face-centred structure. The impact of microstructure on mechanical
characteristics is explained by a model. Fig. The sketch map of the crystal lattice is shown in Figure 5.
The index with the highest density in this structure is placed at [111]; the lowest
non-compact index is [110].The atoms in our bodies are encircled by other atoms. Atoms are bound
together by a powerful interatomic force called the metallic bond force. Atoms on the density-arranged
index are much more stable, whereas those on the non-compact index are in a condition where forces
are relatively mild, particularly those on the outer lead surface, where only atoms from inside the body
are able to surround them. Interatomic forces are therefore out of equilibrium, and the atoms on the
surface are in a higher energy state.Under stress, atoms may be more likely to dislocate. Crystal slides
are those that have occurred from one crystal portion to the remainder along a non-compact crystal
index. Fig. Following BFT testing, 6 displays numerous slides on the outer lead. The distances between
slides would grow significantly if the tension on the specimen was increased. The onset and spread of
cracks will be visible once the dimension exceeds the effective interatomic binding force range. Cracks
in the law of weariness. The Paris equation is a useful tool for describing propagation.
 (Paris equation)

Fig. 5 Model of Crystal Structure Fig. 6 Micrograph of Slides on Outer lead

In Eq. (6), dl/dn is the crack propagation rate, Δσ is the stress of crack propagation, l is crack initial
length, θ is the angle between stress and crack, C and m are constants related to materials. Under the
same condition of material constants, crack initial length and stress, it is the angle of 45° that crack
propagation rate has get to the maximum, and which is confirmed by experimentation.Fig. 7 has
demonstrated that there are plenty images taken under a microscope of specimens from several BFT
testing sessions. Figure 1 demonstrated uniform plastic deformation prior to necking. 7a. with further
BFT testing on the specimen, tiny surface cracks, and neck bending will be seen (Fig. 7b). At a later
time, as demonstrated in Fig. 7c, not only huge, necking down, and heterogeneous deformation. On the
examined sample, cracks occurred sharply and at a 45° angle was seen on both sides of the crack.In
order to create and use a ceramic power package with the microstructure and manufacturing process of
the outer leads, which are used, play a significant influence and must be considered. Nowadays, in
research on metals, metallography analysis is frequently used metal construction.

Fig. 7. Pictures from different periods.

a) Early stage, b) Medium-term, c) Later stage.
 Fig. 8. Metallography pictures of different packages.

Fig. 9. Result of Finite element simulation analysis: a. Standard package b. Package Optimized

As illustrated by metallography images of various packages in Fig. 8. On every sample that was
analyzed, a crystal cell was seen. These specimens' crystal cell sizes, however, differed greatly from
one another. The crystal size of sample b was significantly larger than sample a, and sample c's crystal
size was the largest, as a result of the different thermal treatments used throughout the fabrication
process. Each sample had fissures that could be seen clearly, and they spread along the direction of the
crystal border. The directions of fracture propagation were modified, and the body's number of crack
tips was increased, in order to obstruct the crystal cell.For the reasons outlined above, any remaining
tension on the structure can be released, and some of the energy in the fissures was partially absorbed
by the crystal cell. Therefore, in order to be motivated, fracture propagation requires higher residual
stress and energy. The more crystal boundaries, tension, and energy required before outside leads
broke, the smaller the crystal size. As a result, it appears that a package with this kind of exterior lead
would be much more reliable.In recent years, reliability designing and analysis for electronic devices
has seen widespread application of the finite element simulation method.Electronic packaging and
vices [17–19]. In this study, finite element simulation was used to aid in package design, and a three-
dimensional finite element model of a conventional package was created (Fig. 9a). There were thirteen
parts in total, including printed circuit board, heat sink, frame, and exterior leads made of Al2O3
ceramic. Solder and metalized pads were disregarded.

The established model's interior surfaces were immovably fixed rigidly. All parts were regarded
as being stiff and free of plastic deformation. The model was given characteristic properties such the
coefficient of thermal expansion, specific heat, thermal conductivity, and the Young's modulus of
components. The temperature for the loading was programmed to be between 65 °C and 125 °C, with a
transition time of 10 seconds between cold and hot or hot and cold. 500 cycles were required.The
package's structure was later refined against the backdrop of increasing its reliability. Other
components, boundary conditions, and characteristic parameters were the same as in the preceding
model, with the exception of outer leads. This model's outside lead was made to resemble an elastic
framework, as seen in Fig. 9b. The initial section was straight and joined by solder to a ceramic
component that had been metalized. Following that section, there was a camber. The semi-diameter of
camber had various relationships with the construction, dimension, and service environment and was at
least twice as thick as outer lead. Although the end point of camber was on the same plane as the first
segment, its starting point was at the end of the first segment. The final passage was likewise
straightforward. Between each part, there were arcs for smooth transitions. As the findings in Fig. 9b,
the value of stress on the local area prior to welding sites was lowered to 265 MPa, despite the fact that
the greatest stress on the package was still placed at the outer leads. The elastic structure therefore
seems solid.Following structure optimization, specimens were made as well, and Fig. The image of the
package was displayed in 10a. TCT was typically subjected to accelerated testing to make sure that the
package could tolerate abrupt temperature changes without suffering property damage. The
environmental temperatures used in this study were in the range of 65 °C to +125 °C, and the number
of cycles was determined based on prior experience; for instance, 500 cycles were completed.

Fig. 10. a) The photograph of package after optimizing. b) The results of bending fatigue test.

Finally, no breakage was seen, and the experiment results agreed with the scholarly study. We
used the bending fatigue test to gauge the package's dependability. The experiment was carried out
with outer leads bent in a range of 90° under a predetermined load, such as 2.22 N, using a type of
bending fatigue fixture.

Fig. The experiment's findings were shown in Figure 10b. Samples A through J, which were
released from this inquiry, are various packages made from the structure after optimization. By
averaging the testing results of each outside lead in the same package, it was possible to determine the
bending fatigue strength of these packages. The tested packages meet the requirements of the BFT
standard, and the bending fatigue strength indices are improved and even exceeded by at least 18 times.
The created power package therefore seems doable following structural optimization.

Conclusion

Standard power packages struggle to fulfill the demands of high reliability applications in severe
environments as the automotive, telecom, computer, aerospace, and artificial intelligence industries
advance. In this study, finite element simulation was used to aid in the design of a ceramic power
package. The fabrication of the package specimens was based on the high temperature co-fired ceramic
process. For the purpose of assessing the dependability of the package, we have carried out a number of
tests, such as temperature cycle tests, bending fatigue tests, microscope tests, and metallography
analysis methods. Additionally covered were the crack initiation and propagation mechanisms on outer
leads. According to the results of the experiment, cracks started on the lead's outer surface and spread
in the direction of the crystal boundary.

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Author of the Journal: Lifeng Tang and Kun Cao