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Automotive-Grade N-Channel 650 V, 89 Mω Typ., 32 A Mdmesh Dm6 Half ‑Bridge Topology Power Mosfet In An Acepack Smit Package
Automotive-Grade N-Channel 650 V, 89 Mω Typ., 32 A Mdmesh Dm6 Half ‑Bridge Topology Power Mosfet In An Acepack Smit Package
Datasheet
8
9
Features
7
Order code VDS RDS(on) max. ID
1
3 SH32N65DM6AG 650 V 97 mΩ 32 A
4
6
7
8 • AQG 324 qualified
9
• Half-bridge power module
6 • 650 V blocking voltage
4
3 • Fast recovery body diode
1
ACEPACK SMIT • Very low switching energies
GADG060720221002SA 9 (DC+)
• Low package inductance
• Dice on direct bond copper (DBC) substrate
• Low thermal resistance
1 (GHS) • Isolation rating of 3.4 kVrms/min
2 (KHS)
7 (U)
Applications
3, 4 (NC)
• Switching applications
6 (GLS)
5 (KLS) Description
8 (DC-)
This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT
is a very compact and rugged power module in a surface mount package for easy
assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low
thermal resistance coupled with an isolated top-side thermal pad. The high design
flexibility of the package enables several configurations, including phase legs, boost,
and single switch through different combinations of the internal power switches.
SH32N65DM6AG
Product summary
1 Electrical ratings
Isolation withstand voltage applied between each pin and heat sink plate
VISO 3.4 kVrms
(AC voltage (50/60 Hz, t = 60 s)
TSTG Storage temperature range °C
-55 to 150
TJ Operating junction temperature range °C
2 Electrical characteristics
1. Coss eq is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0
to 80% VDSS.
10 -1 10 -2
tp =1 ms RthJC = 0.6 ℃/W
duty = ton / T
V(BR)DSS Single pulse
10 -2 TJ ≤ 150 °C,
TC = 25 °C, tp =10 ms ton
10 -3 Single pulse 10 -3
T
ID GADG020820221211OCH ID GADG020820221212TCH
(A) (A)
VGS= 9, 10 V
120 VDS =20 V
120
100
VGS= 8 V
90
80
VGS= 7 V
60 60
40
30
20 VGS= 6 V
0 0
0 5 10 15 VDS (V) 5 6 7 8 VGS (V)
90 300 6
200 4
88
VDS (V)
100 2
86 0 0
0 10 20 30 ID (A) 0 10 20 30 40 50 Qg (nC)
10 0 0.7
10 -1 0.6
10 -1 10 0 10 1 10 2 VDS (V) -75 -25 25 75 125 TJ (°C)
Figure 9. Normalized on-resistance vs temperature Figure 10. Normalized breakdown voltage vs temperature
1.5 1.05
1.0 1.00
0.5 0.95
0.0 0.90
-75 -25 25 75 125 TJ (°C) -75 -25 25 75 125 TJ (°C)
VSD GADG020820221215SDF
(V)
TJ= -40 °C
1.2
1.0
TJ= 25 °C
0.8
TJ= 150 °C
0.6
0.4
0 5 10 15 20 25 30 35 ISD (A)
3 Test circuits
VDD
RL
RL 2200 3.3
µF µF
+ VDD IG= CONST D.U.T.
VD VGS 100 Ω
VGS
RG pulse width +
2.7 kΩ
D.U.T. 2200 VG
μF
PW 47 kΩ
GND1 GND2 1 kΩ
(driver signal) (power)
A A A L
D
FAST L=100µH
G D.U.T. DIODE VD
2200 3.3
S B 3.3 1000 µF µF VDD
B B µF µF +
25Ω D + VDD
ID
G
RG S
D.U.T.
Vi D.U.T.
GND2
Pw
GND1
GND1 GND2 AM15858v1
AM15857v1
Figure 16. Unclamped inductive waveform Figure 17. Switching time waveform
ton toff
V(BR)DSS
td(on) tr td(off) tf
VD
90% 90%
IDM
VDD VDD
VGS 90%
0 10%
AM01472v1 AM01473v1
Figure 18. Turn-off switching time waveform Figure 19. Turn-on switching time waveform
on inductive load on inductive load
ID VDS VDS ID
90%VDS 90%ID 90%ID 90%VDS
AM05540v3 GADG241120211046SWTW
4 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
DM00447519_Rev.6
mm
Dim.
Min. Typ. Max.
2.75 (x4)
4.00 (x9)
9.00 (x2)
4.00 (x2)
2.40 (x3)
1.40 (x6)
30.10 DM00447519_FP_Rev.6
FRONT SIDE
9 7
B
A C D
F G H I J K L
1 6
BACK SIDE
7 9
D A B C
E F G H
6 1
DM00447519_MO_Rev.6
Revision history
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
4 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
4.1 ACEPACK SMIT package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9