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HT1620 Holtek Elenota - PL
HT1620 Holtek Elenota - PL
Features
· Logic operating voltage: 2.4V~3.3V · 8 kinds of time base/WDT clock source
· LCD voltage: 3.6V~4.9V · 32´4 LCD driver
· Low operating current <3mA at 3V · Built-in 32´4-bit display RAM
· External 32.768kHz crystal oscillator · 3-wire serial interface
· Selection of 1/2 or 1/3 bias, and selection of · Internal LCD driving frequency source
1/2 or 1/3 or 1/4 duty LCD applications · Software configuration feature
· Internal time base frequency sources · R/W address auto increment
· Two selectable buzzer frequencies · Data mode and command mode
(2kHz/4kHz) instructions
· Built-in capacitor type bias charge pump · Three data accessing modes
· Time base or WDT overflow output
General Description
The HT1620 is a 128 pattern (32´4), memory for the interface between the host controller
mapping, and multi-function LCD driver. The and the HT1620. The HT1620 consumes low
S/W configuration feature of the HT1620 operating current owing to adopting capacitor
makes it suitable for multiple LCD applica- type bias charge pump. The HT162X series
tions including LCD modules and display sub- have many kinds of products that match vari-
systems. Only three or four lines are required ous applications.
Selection Table
HT162X HT1620 HT1621 HT1622 HT16220 HT1623 HT1625 HT1626
COM 4 4 8 8 8 8 16
SEG 32 32 32 32 48 64 48
Built-in Osc. Ö Ö Ö Ö Ö
Crystal Osc. Ö Ö Ö Ö Ö Ö
Block Diagram
D is p la y R A M
O S C O
O S C I
C o n tro l
C S C O M 0
a n d
R D T im in g
C O M 3
C ir c u it L C D D r iv e r /
W R B ia s C ir c u it S E G 0
D A T A
V D D S E G 3 1
V S S C C 1
C C 2
V O 1 5 N
V E E
B Z T o n e F re q u e n c y W a tc h d o g T im e r
G e n e ra to r & IR Q
B Z T im e B a s e G e n e r a to r
Pin Assignment
O S C O
D A T A
O S C I
V D D
C C 1
V S S
IR Q
W R
N C
R D
C S
B Z
B Z
6 4 6 3 6 2 6 1 6 0 5 9 5 8 5 7 5 6 5 5 5 4 5 3 5 2
N C 1 5 1 N C
N C 2 5 0 N C
C C 2 3 4 9 N C
V O 1 5 N 4 4 8 N C
V E E 5 4 7 N C
C O M 0 6 4 6 N C
C O M 1 7 4 5 S E G 3 1
C O M 2 8 4 4 S E G 3 0
C O M 3 9 4 3 S E G 2 9
S E G 0 1 0
H T 1 6 2 0
4 2 S E G 2 8
S E G 1 1 1 6 4 Q F P 4 1 S E G 2 7
S E G 2 1 2 4 0 S E G 2 6
S E G 3 1 3 3 9 S E G 2 5
S E G 4 1 4 3 8 S E G 2 4
S E G 5 1 5 3 7 S E G 2 3
S E G 6 1 6 3 6 S E G 2 2
S E G 7 1 7 3 5 S E G 2 1
S E G 8 1 8 3 4 S E G 2 0
N C 1 9 3 3 N C
2 0 2 1 2 2 2 3 2 4 2 5 2 6 2 7 2 8 2 9 3 0 3 1 3 2
N C
S E
S E
S E
S E
S E
S E
S E
S E
S E
S E
S E
N C
G 9
G 1 0
G 1 1
G 1 2
G 1 3
G 1 4
G 1 5
G 1 6
G 1 7
G 1 8
G 1 9
Pad Assignment
O S C O
D A T A
O S C I
V D D
V S S
C C 1
IR Q
W R
R D
C S
B Z
B Z
C C 2 1 5 1 5 0 4 9 4 8 4 7 4 6 4 5 4 4 4 3 4 2 4 1 4 0
V O 1 5 N 2
V E E 3
C O M 0 4
C O M 1 5
C O M 2 6
C O M 3 7
S E G 0 8 3 9 S E G 3 1
S E G 1 9 (0 ,0 ) 3 8 S E G 3 0
S E G 2 1 0 3 7 S E G 2 9
S E G 3 1 1 3 6 S E G 2 8
S E G 4 1 2 3 5 S E G 2 7
S E G 5 1 3 3 4 S E G 2 6
3 3 S E G 2 5
3 2 S E G 2 4
3 1 S E G 2 3
3 0 S E G 2 2
2 9 S E G 2 1
1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4 2 5 2 6 2 7 2 8 S E G 2 0
S E G 6
S E G 7
S E G 8
S E G 9
S E G 1 0
S E G 1 1
S E G 1 2
S E G 1 3
S E G 1 4
S E G 1 5
S E G 1 6
S E G 1 7
S E G 1 8
S E G 1 9
2
Chip size: 142 ´ 141 (mil)
* The IC substrate should be connected to VDD in the PCB layout artwork.
Pad Description
Pad No. Pad Name I/O Description
2 VO15N O Half voltage circuit output pin
3 VEE ¾ Double voltage circuit output pin
4~7 COM0~COM3 O LCD common outputs
8~39 SEG0~SEG31 O LCD segment outputs
Chip selection input with pull-high resistor
When the CS is logic high, the data and command, read from or
written to the HT1620 are disabled. The serial interface circuit is
40 CS I
also reset. But if the CS is at logic low level and is input to the CS
pad, the data and command transmission between the host con-
troller and the HT1620 are all enabled.
READ clock input with pull-high resistor
Data in the RAM of the HT1620 are clocked out on the falling
41 RD I edge of the RD signal. The clocked out data will appear on the
DATA line. The host controller can use the next raising edge to
latch the clocked out data.
WRITE clock input with pull-high resistor
42 WR I Data on the DATA line are latched into the HT1620 on the rising
edge of the WR signal.
43 DATA I/O Serial data input/output with pull-high resistor
44 VSS ¾ Negative power supply, Ground
45 OSCO O The OSCI and OSCO pads are connected to a 32.768kHz crystal
46 OSCI I in order to generate a system clock.
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maxi-
mum Ratings² may cause substantial damage to the device. Functional operation of this de-
vice at other conditions beyond those listed in the specification is not implied and prolonged
exposure to extreme conditions may affect device reliability.
Test Conditions
Symbol Parameter Min. Typ. Max. Unit
VDD Conditions
VDD Operating Voltage ¾ ¾ 2.4 ¾ 3.3 V
IDD Operating Current 3V No load* ¾ 2 3 mA
ISTB Standby Current 3V No load* ¾ ¾ 1 mA
VIL Input Low Voltage 3V DATA, WR, CS, RD ¾ ¾ 0.6 V
VIH Input High Voltage 3V DATA, WR, CS, RD 2.4 ¾ 3.0 V
IOL1 DATA, BZ, BZ, IRQ 3V VOL=0.3V 0.8 1.6 ¾ mA
IOH1 DATA, BZ, BZ 3V VOH=2.7V -0.6 -1.2 ¾ mA
Test Conditions
Symbol Parameter Min. Typ. Max. Unit
VDD Conditions
fSYS System Clock 3V Crystal 32kHz ¾ 32 ¾ kHz
LCD Frame Frequency ¾ ¾ 64 ¾ Hz
LCD Frame Frequency 1/2 Duty ¾ ¾ 64 ¾ Hz
fLCD Crystal 32kHz
LCD Frame Frequency 1/3 Duty ¾ ¾ 56 ¾ Hz
LCD Frame Frequency 1/4 Duty ¾ ¾ 64 ¾ Hz
tCOM LCD Common Period ¾ n: Number of COM ¾ n/fLCD ¾ s
Write mode ¾ ¾ 150 kHz
fCLK Serial Data Clock 3V
Read mode ¾ ¾ 75 kHz
fTONE Tone Frequency ¾ ¾ ¾ 2 or 4 ¾ kHz
Test Conditions
Symbol Parameter Min. Typ. Max. Unit
VDD Conditions
V A L ID D A T A
V D D
D B 5 0 %
G N D
tf tr ts u th
V D D
W R , R D 9 0 %
C lo c k 5 0 % V D D
1 0 % G N D W R , R D
tC L K tC L K
5 0 %
C lo c k G N D
Figure 1 Figure 2
tC S
V D D
C S 5 0 %
G N D
ts u 1 th 1
V D D
W R , R D 5 0 %
C lo c k G N D
F IR S T L A S T
C lo c k C lo c k
Figure 3
Functional Description
C L R T im e r D Q
W D T
IR Q E N /D IS
/4 C K
R
C L R W D T
Timer and WDT configurations
Timing Diagrams
C S
W R
R D
D A T A 1 1 0 A 5 A 4 A 3 A 2 A 1 A 0 D 0 D 1 D 2 D 3 1 1 0 A 5 A 4 A 3 A 2 A 1 A 0 D 0 D 1 D 2 D 3
M e m o ry A d d re s s 1 (M A 1 ) D a ta (M A 1 ) M e m o ry A d d re s s 2 (M A 2 ) D a ta (M A 2 )
C S
W R
R D
D A T A 1 1 0 A 5 A 4 A 3 A 2 A 1 A 0 D 0 D 1 D 2 D 3 D 0 D 1 D 2 D 3 D 0 D 1 D 2 D 3 D 0 D 1 D 2 D 3 D 0
M e m o ry A d d re s s (M A ) D a ta (M A ) D a ta (M A + 1 ) D a ta (M A + 2 ) D a ta (M A + 3 )
C S
W R
1 0 1 A 5 A 4 A 3 A 2 A 1 A 0 D 0 D 1 D 2 D 3 1 0 1 A 5 A 4 A 3 A 2 A 1 A 0 D 0 D 1 D 2 D 3
D A T A
M e m o ry A d d re s s 1 (M A 1 ) D a ta (M A 1 ) M e m o ry A d d re s s 2 (M A 2 ) D a ta (M A 2 )
C S
W R
1 0 1 A 5 A 4 A 3 A 2 A 1 A 0 D 0 D 1 D 2 D 3 D 0 D 1 D 2 D 3 D 0 D 1 D 2 D 3 D 0 D 1 D 2 D 3 D 0
D A T A
M e m o ry A d d re s s (M A ) D a ta (M A ) D a ta (M A + 1 ) D a ta (M A + 2 ) D a ta (M A + 3 )
Note: It is recommended that the host controller should read with the data from the DATA line
between the raising edge of the RD line and the falling edge of the next RD line.
C S
W R
R D
D A T A 1 0 1 A 5 A 4 A 3 A 2 A 1 A 0 D 0 D 1 D 2 D 3 D 0 D 1 D 2 D 3 1 0 1 A 5 A 4 A 3 A 2 A 1 A 0 D 0 D 1 D 2 D 3
M e m o ry A d d re s s 1 (M A 1 ) D a ta (M A 1 ) D a ta (M A 1 ) M e m o ry A d d re s s 2 (M A 2 ) D a ta (M A 2 )
C S
W R
R D
D A T A 1 0 1 A 5 A 4 A 3 A 2 A 1 A 0 D 0 D 1 D 2 D 3 D 0 D 1 D 2 D 3 D 0 D 1 D 2 D 3 D 0 D 1 D 2 D 3 D 0 D 1 D 2 D 3 D 0
M e m o ry A d d re s s (M A ) D a ta (M A ) D a ta (M A ) D a ta (M A + 1 ) D a ta (M A + 1 ) D a ta (M A + 2 )
C S
W R
D A T A 1 0 0 C 8 C 7 C 6 C 5 C 4 C 3 C 2 C 1 C 0 C 8 C 7 C 6 C 5 C 4 C 3 C 2 C 1 C 0
C o m m a n d 1 C o m m a n d ... C o m m a n d i C o m m a n d
o r
D a ta M o d e
C S
W R
D A T A
C o m m a n d C o m m a n d C o m m a n d
o r A d d re s s a n d D a ta o r A d d re s s a n d D a ta o r A d d re s s a n d D a ta
D a ta M o d e D a ta M o d e D a ta M o d e
R D
Application Circuits
V D D V D D
0 .1 m F
0 .1 m F 3 M W 0 .1 m F
C C 1 C C 2 V O 1 5 N V E E
C S
O S C I C ry s ta l
*
R D 3 2 7 6 8 H z
W R O S C O O s c illa to r
m C D A T A
H T 1 6 2 0
B Z
*
R P ie z o
IR Q
C O M 0 ~ C O M 3 S E G 0 ~ S E G 3 1 B Z
1 /2 o r 1 /3 B ia s ; 1 /2 , 1 /3 o r 1 /4 D u ty
L C D P a n e l
* Note: The connection of the IRQ and RD pin is selectable depending on the requirement of the mC.
VDD=2.4V~3.3V, VEE=-1/2 VDD, VLCD (LCD voltage)=VDD-VEE=3/2 VDD=3.6V~4.9V.
Adjust R (external pull-high resistance) to fit user¢s time base clock.
Command Summary
Name ID Command Code D/C Function Def.
READ 1 1 0 A5A4A3A2A1A0D0D1D2D3 D Read data from the RAM
WRITE 1 0 1 A5A4A3A2A1A0D0D1D2D3 D Write data to the RAM
READ
MODIFY 1 0 1 A5A4A3A2A1A0D0D D2D3 D Read and write to the RAM
WRITE
Turn off both system oscillator
SYS DIS 1 0 0 0000-0000-X C Yes
and LCD bias generator
SYS EN 1 0 0 0000-0001-X C Turn on system oscillator
LCD OFF 1 0 0 0000-0001-X C Turn off LCD bias generator Yes
LCD ON 1 0 0 0000-0011-X C Turn on LCD bias generator
TIMER DIS 1 0 0 0000-0100-X C Disable time base output Yes
Disable WDT time-out flag
WDT DIS 1 0 0 0000-0101-X C Yes
output
TIMER EN 1 0 0 0000-0010-X C Enable time base output
Enable WDT time-out flag
WDT EN 1 0 0 0000-0111-X C
output
TONE OFF 1 0 0 0000-1000-X C Turn off tone outputs Yes
Clear the contents of the time base
CLR TIMER 1 0 0 0000-1101-X C
generator
Clear the contents of the WDT
CLR WDT 1 0 0 0000-111X-X C
stage
LCD 1/2 bias option
ab=00: 2 commons option
BIAS 1/2 1 0 0 0010-abX0-X C
ab=01: 3 commons option
ab=10: 4 commons option
LCD 1/3 bias option
ab=00: 2 commons option
BIAS 1/3 1 0 0 0010-abX1-X C
ab=01: 3 commons option
ab=10: 4 commons option
TONE 4K 1 0 0 010X-XXXX-X C Tone frequency, 4kHz
TONE 2K 1 0 0 0110-XXXX-X C Tone frequency, 2kHz
IRQ DIS 1 0 0 100X-0XXX-X C Disable IRQ output Yes
IRQ EN 1 0 0 100X-1XXX-X C Enable IRQ output