1-1. What term is used to describe electronic 1-5.

Point to point wiring in a vacuum tube

systems that are made up of extremely circuit often caused which of the following
small parts or elements? unwanted conditions?

a. Microelectronics a. Heat interactions

b. Modular packages b. Inductive interactions
c. Integrated circuits c. Capacitive interactions
d. Solid-state technology d. Both 2 and 3 above

1-2. During World War II, which of the 1-6. Functional blocks of a system that can
following limitations were considered easily be removed for troubleshooting
unacceptable for military electronics and repair are called
systems?
a. sets
a. Large size, heavy weight, and wide b. chassis
bandwidth c. modules
b. Excessive power requirements, large d. vacuum tubes
size, and complex manning
requirements 1-7. Which of the following characteristics
c. Large size, heavy weight, and of a printed circuit board (pcb) is NOT
excessive power requirements an advantage over a point-to-point wired
d. Heavy weight, complex circuits and tube circuit?
limited communications range
a. The pcb weighs less
1-3. The development of which of the b. The pcb eliminates the need for
following types of components had the point-to-point wiring
greatest impact on the technology of c. The pcb eliminates the need for a
microelectronics? heavy metal chassis
d. The pcb contains a limited number of
a. Vacuum tubes and resistors components
b. Transformers and capacitors
c. Vacuum tubes and transistors 1-8. A module in which the components are
d. Transistors and solid-state diodes supported by end plates is referred to as

1-4. For a vacuum tube to operate properly a. a pcb

in b. cordwood
a variety of different circuit applications, c. a substrate
additional components are often required to d. encapsulated
"adjust" circuit values.
This is because of which of the 1-9. A module which is difficult to repair
following variations within the vacuum because it is completely imbedded in
tube? solid material is one which has been

a. Element size a. balanced

b. Warm-up times b. enveloped
c. Plug-in mountings c. integrated
d. Output characteristics d. encapsulated
1-10. All components and interconnections a. hybrid integration
are formed on or within a single b. large-scale integration
substrate in which of the following c. small-scale integration
units? d. very large-scale integration

1. Cordwood 1-16. Which of the following pieces of

2. Integrated circuit equipment is used to prepare component
3. Equivalent circuit layout in complex ICs?
4. Printed circuit board
1-11. Monolithic integrated circuits are a. A mask
usually referred to as b. A camera
c. A computer
a. hybrids d. A microscope
b. substrates
c. silicon chips 1-17. A device that allows the depositing of
d. selenium rectifiers material in selected areas of a
semiconductor substrate, but not in
1-12. In integrated circuits, a conductive or others, is known as a
nonconductive film is used for which of
the following types of components? a. blind
b. screen
a. Capacitors and diodes c. filter
b. Transistors and diodes d. wafer mask
c. Resistors and capacitors
d. Resistors and transistors 1-18. Which of the following types of
material
1-13. Which of the following types of is preferred for film circuit substrates?
electronic circuits is NOT a hybrid
integrated circuit? a. Silicon
b. Ceramic
a. Thick film and transistors c. Germanium
b. Thin film and silicon chips d. Fiberglass
c. Transistors and vacuum tubes
d. Silicon chips and transistors 1-19. A typical silicon wafer has
approximately (a) what diameter and (b)
1-14. What maximum number of logic gates what thickness?
should be expected in a large-scale
integration circuit? a. (a) 2 inches (b) 0.01 to 0.02 inches
b. (a) 2 inches (b) 0.21 to 0.40 inches
a. 20 c. (a) 3 inches (b) 0.21 to 0.40 inches
b. 200 d. (a) 3 inches (b) 0.01 to 0.20 inches
c. 2,000
d. 20,000 1-20. Artificially grown silicon or
germanium
1-15. Integrated circuits containing more crystals are used to produce substrates
than for which of the following types of
64,000 bits of memory are referred to as integrated circuits?
 a. Hybrid substrate, which of the following
b. Thin-film methods is used?
c. Thick-film
d. Monolithic a. Photoetching
b. Photolithography
1-21. Elements penetrate the semiconductor c. Cathode sputtering
substrate in (a) what type of IC but (b) d. Vacuum evaporation
do NOT penetrate the substrate in what
type of IC? 1-26. To produce thin film resistors, which
of
a. (a) Diffused (b) thin-film the following materials is/are used?
b. (a) Diffused (b) epitaxial
c. (a) Thick-film (b) epitaxial a. Nichrome
d. (a) Thick-film (b) thin-film b. Tantalum
c. Titanium
1-22. Pn junctions are protected from d. Each of the above
contamination during the fabrication
process by which of the following 1-27. Which of the following is a major
materials? advantage of hybrid ICs?

a. Oxide a. Ease of manufacture

b. Silicon b. Ease of replacement
c. Germanium c. Design flexibility
d. Photoetch d. Easy availability

1-23. The prevention of unwanted 1-28. IC packaging is required for which of

interaction the following reasons?
or leakage between components is
accomplished by which of the following a. To dissipate heat
techniques? b. For ease of handling
c. To increase shelf life
a. Isolation d. To meet stowage requirements
b. Insulation
c. Integration 1-31. Which of the following types of DIPs
d. Differentiation are most commonly used in the Navy's
microelectronics systems?
1-24. Vacuum evaporation and cathode
sputtering are two methods used to a. Glass
produce which of the following types of b. Metal
components? c. Ceramic
d. Plastic
a. Diodes
b. Thin-film 1-32. In IC production, gold or aluminum
c. Thick-film bonding wires are used for which of the
d. Transistors following purposes?

1-25. To deposit highly reactive materials on a. To bond the chip to the package
a b. To provide component isolation
 c. To connect the package to the circuit a. vacuum-tube circuits
board b. microcircuit modules
d. To connect the chip to the package c. hybrid microcircuits
leads d. miniature electronics circuits

1-33. IC packages that may be easily 1-41. An assembly of microcircuits or a

installed combination of microcircuits and discrete
by hand or machine on mounting boards components is referred to as a
fall into which of the following
categories? a. mother board
b. microprocessor
a. TO c. miniature module
b. DIP d. microcircuit module
c. Flatpack
d. Each of the above 1-42. A technician has isolated a problem to
a
1-34. The need for bonding wires has been plug-in module on a printed circuit board.
eliminated by which of the following What is this level of system packaging?
production techniques?
a. Level O- transistor
a. LSI b. Level I - module
b. Beam lead c. Level II
c. Flip chip d. Level III- radar
d. Both 2 and 3 above
1-43. A faulty transistor would be identified
as what level of packaging?
1-38. Letters and numbers stamped on the
body of an IC serve to provide which of a. Level O
the following types of information? b. Level I
c. Level II
a. Use d. Level III
b. Serial number
c. Date of manufacture 1-44. A chassis located in a radar antenna
d. Applicable equipment pedestal would be identified as what
level of system packaging?
1-39. Descriptive information about a
particular type of IC may be found in a. Level I
which of the following documents? b. Level II
c. Level III
a. The manufacturer's data sheet d. Level IV
b. The equipment Allowance Part List
(APL) 1-45. Which of the following characteristics
c. The National Stock Number (NSN) is
d. The IC identification number list NOT an advantage of multilayer printed
circuit boards?
1-40. Assemblies made up EXCLUSIVELY
of discrete electronic parts are classified as a. Allows greater wiring density
on boards
 b. Provides shielding for a large
number of conductors
c. Eliminates complicated
wiring harnesses
d. Reduces the number of
components per board
1-46. Which of the following circuit
connection methods is NOT used in
making interconnections on a multilayer
printed circuit board interconnection?
a. Terminal lug
b. Clearance hole
c. Layer build-up
d. Plated-through hole
1-47. The most complex to produce and
difficult to repair printed circuit boards
are those made using which of the
following methods?
a. Layer-buildup
b. Clearance-hole
c. Step-down-hole
d. Plated-through-hole
1-48. Environmental performance
requirements for ICs are set forth in
which of the following publications?
a. 2M repair manual
b. Military Standards
c. System maintenance manuals
d. Manufacturer's data sheet
1-49. Ground planes and shielding are used
to
prevent which of the following electrical
interactions?
a. Cross talk
b. External interference
c. The generation of rf within
the system
d. All of the above
1-50. Training requirements for miniature
and
microminiature (2M) repair personnel
was established by which of the
following authorities?
a. Chief of Naval Education and
Training
b. Chief of Naval Technical
Training
c. Chief of Naval Operations
d. Commander, Naval Sea
Systems Command
1-51. The standards of workmanship and
guidelines for specific repairs to
equipment are contained in which of the
following Navy publications?
a. Introduction to
Microelectronics
b. NAVSHIPS Technical
Manual
c. Electronics Installation and
Maintenance Books (EIMB)
d. Miniature/Microminiature
(2M) Electronic Repair
Program
1-52. A technician is authorized to perform
2M repairs upon satisfactory completion of
which of the following types of training?
a. A 2M training class
b. On-the-job training
c. NEETS, Module 14
d. Any electronics class "A"
school
1-53. Repairs that are limited to discrete
components and single- and doublesided
boards are classified as what level
of repairs?
a. Intermediate
b. Organizational
c. Miniature component
d. Microminiature component

1-54. To ensure that a 2M technician
maintains the minimum standards of
workmanship, the Navy requires that the
technician meet which of the following
requirements?
c. Intermediate
d. Organizational
1-59. Inspecting, servicing, and adjusting
equipment is the function of which of the
following SM & R code maintenance levels?

a. Be licensed a. Depot
b. Be certified b. Operational
c. Be experienced c. Intermediate
d. Be retrained d. Organizational(I-S-A-OR)

1-55. If a technician should fail to maintain 1-60. The maintenance level at which
the required standards of workmanship, normal
the technician's certification is subject to 2M repairs are performed is set forth in
what action? the maintenance plan and specified by
the
a. Cancellation
b. Recertification a. NAVSEA 2M Repair
c. Reduction to next lower level Program
d. Withholding pending b. Source, Maintenance, and
requalification Recoverability (SM & R)
code
1-56. The most extensive shop facilities and c. Chief of Naval Operations
highly skilled technicians are located at d. Equipment manufacturers'
what SM & R level of maintenance? documentation

a. Depot 1-61. Boards or modules that are SM & R

b. Operational code D may be repaired at the organizational
c. Intermediate level under which of the following
d. Organizational conditions?

1-57. SM & R code D maintenance facilities a. On a routine basis

are usually located at which of the
following activities?
a. Shipyards
b. Contractor maintenance
organizations
c. Shore-based facilities
d. All of the above
1-58. Direct support to user organizations is
provided by which of the following SM& R
code maintenance levels?
b. When parts are available
c. To meet an urgent
operational commitment
d. When code D repair will take
six weeks or longer
1-62. Source, Maintenance, and Recovery
(SM & R) codes that list where repair parts
may be obtained, who is authorized to make
the repair, and the maintenance level for the
item are found
in which of the following documents?

a. Depot a. Allowance Equipage Lists

b. Operational (AEL)
 b. Allowance Parts Lists
(APL)
c. Manufacturer's Parts List
d. Navy Stock System
1-63. Test equipment that continuously
monitors performance and automatically
isolates faults to removable assemblies
is what category of equipment?
a. On-line
b. Off-line
c. General purpose
d. Fault isolating
1-64. A dc voltmeter that is permanently
attached to a power supply for the
purpose of monitoring the output is an
example of what type test equipment?
a. General Purpose Electronic
Test Equipment (GPETE)
b. Built in Test Equipment
(BITE)
c. Off-line test equipment
d. Specialized test equipment
1-65. Which of the following types of test
equipment is classified as off-line
automatic test equipment?
a. Centralized Automatic Test
System (CATS)
b. Versatile Avionic Shop Test
System (VAST)
c. General Purpose Electronic
Test Equipment (GPETE)
d. Test Evaluation and
Monitoring System
(TEAMS)
1-66. Fault diagnosis using GPETE should
only be attempted by which of the following
personnel?
a. Officers
b. Technician strikers
c. Experienced technicians
d. Basic Electricity and
Electronics school graduates
1-67. During fault isolation procedures, a
device or component should be
desoldered and removed from the circuit
only at which of the following times?
a. After defect verification
b. For out-of-circuit testing
c. During static resistance
checks
d. At any time the technician
desires
1-68. 2M repair stations are equipped
according to the types of repairs to be
accomplished. The use of microscopes
and precisions drill presses would be
required in which of the following types
of repair?
a. Miniature
b. Microminiature
c. Both 1 and 2 above
d. Emergency
1-69. In the selection of a soldering iron tip,
which of the following factors should be
considered?
a. The complexity of the pcb
b. The composition of the pcb
c. The area and mass being
soldered
d. The type of component being
Soldered
1-70. The handpiece that can be used for the
greatest variety of operations is the
a. solder extractor
b. rotary-drive tool
c. resistive tweezers
d. lapflow and thermal scraper
Handtool
1-71. Regardless of location, 2M repair 2-1. Which of the following requirements
stations require adequate work surface must
area, lighting, power, and what other be met by a 2M technician to be authorized
minimum requirement? to perform repairs at a particular level?

a. Heat source a. Have knowledge of that level

b. Ventilation b. Be certified at that level
c. Illumination c. Be experienced at that level
d. Dust-free space d. Be licensed at the next higher
level
1-72. Solder used in electronics is an alloy
composed of which of the following 2-2. Protective materials applied to
metals? electronic
assemblies to prevent damage caused by
a. Tin and zinc corrosion, moisture, and stress are called
b. Tin and lead
c. Lead and zinc a. conformal coatings
d. Lead and copper b. isolation materials
c. electrical insulation
1-73. A roll of solder is marked 60/40. What d. encapsulation coatings
do these numbers indicate?
2-3. Before working on a pcb, the conformal
a. 60% tin, 40% lead coating should be removed from what part
b. 60% tin, 40% copper of the board?
c. 60% lead, 40% tin
d. 60% lead, 40% copper a. The entire board
b. The component side
1-74. Which of the following alloys will c. The area of the repair
melt d. The side opposite the
directly into a liquid and have no plastic component side
or semiliquid state?
2-4. What are the approved methods of
a. Metallic alloy conformal coating removal?
b. Eutectic alloy
c. Zinc-lead alloy a. Peeling and abrading
d. Copper-zinc alloy b. Stripping and heating
c. Mechanical and thermal only
1-75. The PREFERRED solder alloy ratio d. Mechanical, thermal, and
for chemical
electronic repair is 63/37. Which of the
following alloy ratios is also 2-5. Most methods of conformal coating
ACCEPTABLE for this type of repair? removal are variations of which of the
following types of removal?
a. 30/70
b. 50/50 a. Thermal
c. 60/40 b. Chemical
d. 70/30 c. Mechanical
d. Electrical
 2-11. When applying an application of
2-6. What is the preferred method of conformal coating, which of the following
removing conditions is true?
epoxy conformal coatings?
a. The board should be clean
a. Solvent and moist
b. Ball mill b. The coating should be
c. Hot-air jet applied only to the
d. Thermal parting tool component replaced
c. The coating should be the
2-7. A conformal coating is considered to be same type as that used by
thin if it is less than what thickness? the manufacturer
d. The coating should be
a. 0.025 inches applied only to the solder
b. 0.040 inches joints
c. 0.050 inches
d. 0.250 inches 2-12. The procedure of connecting circuitry
on
2-8. Of the various mechanical methods of one side of a board with the circuitry on
conformal coating removal, physical the other side is known as
contact with the work piece is NOT
required using which of the following a. mounting
methods? b. termination
c. hole reinforcement
a. Cutting d. interfacial connections
b. Grinding
c. Hot-air jet 2-13. Reinforcement for circuit pads on both
d. Thermal parting sides of the board is provided by which of
the following types of eyelets?
2-9. Cutting and peeling is an easy method
of a. Flat-set
removing which of the following types of b. Roll-set
coatings? c. Funnel-set

a. Epox 2-14. The manner in which wires and leads

b. Varnish are
c. Parylene attached to an assembly is described by
d. Silicone which of the following terms?

2-10. Thin acrylic coatings are readily a. Termination

removed b. Solder joints
in which of the following ways? c. Lead formation
d. Interfacial connections
a. Routing
b. Hot-air jet 2-15. Clinched leads, straight-through leads,
c. Cut and peel and
d. Mild solvents offset pads are variations of what type of
termination?
 a. Off-set
a. Solder cup b. On-the-board
b. On-the-board c. Above-the-board
c. Above-the-board d. Through-the-board
d. Through-hole
2-21. When a lead is soldered to a pad
2-16. What total number of degrees of bend without
are passing it through the board, what type of
(a) fully clinched leads and (b) semiclinched termination has been made?
leads?
a. Lap-flow
a. (a) 45 (b) 90 b. Off-set pad
b. (a) 45 (b) 45 c. Clinched lead
c. (a) 90 (b) 45 d. Straight-through lead
d. (a) 90 (b) 90
2-22. Most damage to printed circuit boards
2-17. Which of the following types of occurs at which of the following times?
terminals
are used as tie points for interconnecting a. During trouble shooting
wiring? b. During component removal
c. During component
a. Pins replacement
b. Hooks d. During normal system
c. Solder cups operations
d. Turrets
2-23. Of the solder removal methods listed
2-18. During assembly, component stability below, which one is most versatile and
is reliable?
provided by which of the following types
of lead termination? a. Wicking
b. Heat and shake
a. Hook terminal c. Motorized solder extractor
b. Clinched lead d. Manually controlled vacuum
c. Turret terminal plunge
d. On-the-board (lap-flow)
2-24. When removing solder with a solder
2-19. Which of the following types of lead wick,
terminations is the easiest to remove and where should the wick be placed in
rework? relation to the solder joint and the iron?

a. Offset-pad a. Below both the joint and the

b. Semiclinched iron
c. Fully clinched b. Between the joint and the
d. Straight-through iron
c. Above the joint and the iron
2-20. Turret, fork, and hook terminals are
examples of what type of termination? 2-25. The motorized solder extractor may be
operated in three different modes. Which
of the following is NOT one of those to be used is determined by which of the
modes? following factors?

a. Hot-air jet a. The type of flux to be used

b. One-shot vacuum b. The type of work to be done
c. Heat and vacuum c. The type of solder to be used
d. Heat and pressure d. The voltage source for the
iron
2-26. Stirring the lead during desoldering
prevents which of the following unwanted 2-33. A thermal shunt is attached to the
results? leads of
a transistor prior to applying solder to the
a. Sweat joints joint. This shunt serves what purpose?
b. Overheating
c. Cold solder joints a. Prevents short circuits
d. Pad delamination b. Retains heat at the joint
c. Conducts heat away from
2-27. Of the following solder removal the component
methods, d. Physically supports the lead
which one is acceptable for removing during Soldering
solder?
2-34. What is the appearance of a good
a. Hot-air jet solder
b. Heat and pull joint?
c. Heat and shake
d. Heat and squeeze a. Dull gray
b. Crystalline
2-29. A 2M technician is repairing a board c. Bright and shiny
that d. Shiny with small pits
is manufactured with semiclinched leads.
What type of termination should the 2-35. What is the most efficient soldering
technician use in replacing components? temperature?

a. Lap flow a. 360 F°

b. Clinched lead b. 440 F°
c. Semiclinched lead c. 550 F°
d. Straight-through-lead d. 800 F°

2-31. What type of heat source is a soldering 2-37. Plug-in DIPs are mounted by using
iron? which
of the following aids/parts?
a. Radiant
b. Resistive a. Insulators
c. Conductive b. Special tools
d. Convective c. Clinched leads
d. Mounting sockets
2-32. The shape and size of the soldering
iron tip
2-38. Plug-in DIPs are susceptible to b. Proper lead formation
loosening c. Proper lead termination
because of which of the following causes? d. Short-circuit protection

a. Heat 2-43. For the removal of imbedded TOs in

b. Stress which all the leads are free, which of the
c. Warpage following methods is recommended?
d. Vibration
a. Push out gently
2-39. Component leads may be clipped to b. Pull out with pliers
aid in c. Pull out with fingers
their removal under which of the following d. Tap out with soft mallet
conditions?
2-44. What is the most critical step in
a. When the component is replacing
conformally coated an imbedded TO?
b. When the component is
known to be defective a. Seating the leads
c. When board damage may b. Forming the leads
result from normal removal c. Soldering the leads
methods d. Seating the body of the TO
d. Both 2 and 3 above
2-45. When a TO or a DIP is replaced on a
2-40. Visual inspection of a completed printed circuit board, what type of
repair is termination is normally used?
conducted to evaluate which of the
following aspects of the repair? a. Lap flow
b. On-the-board
a. Workmanship quality c. Above-the-board
b. Component placement d. Through-the-board
c. In-circuit quality test
d. Conformal coating integrity 2-46. What type of termination is used in the
replacement of a flat pack?
2-41. When speaking of TO mounting
techniques, the term "plug-in" refers to the a. Lap flow
same technique as is used with DIPs. b. Solder cup
c. Solder plug
a. True d. Full fillet
b. False
2-47. Heating the leads and lifting them free
2-42. In addition to heat dissipation and with tweezers is the preferred method of
physical removing which of the following
support, which of the following needs components?
might justify the use of a spacer with a TO
mount? a. TOs
b. DIPs
c. Flat packs
a. Vibration elimination d. Transistors

2-48. Which of the examples shows the
correct
lead formation for a flat pack?
2-49. Use of a skipping pattern when
soldering
multilead components prevents
a. cold solder joints
b. excessive heat buildup
c. the component from moving
d. the need to visually inspect
the piece
2-50. Cards and boards may be damaged
under
which of the following conditions?
a. When unauthorized repairs
are
b. attempted by untrained personnel
a. When technicians use
improper tools
b. When improperly stored
c. Each of the above
2-51. DS3 Spark is preparing to repair a
cracked
conductor on a card. For this type of
damage, which of the following repair
methods is preferred?
a. Solder bridge
b. Clinched staple
c. Install an eyelet at the crack
and solder in place
d. Lap-flow soldered wire
across the break
2-52. To ensure a good mechanical bond
between the board and replacement pad
and to provide good electrical contact for
components, which of the following
procedures is used?
a. Epoxying the pad to the run
b. Electroplating the repair area
c. Installing an eyelet in the pad
d. Lap-flow soldering the repair
area
2-53. Breaks, holes, and cracks in pcbs are
repaired by using a mixture of
a. fiberglass and rosin
b. epoxy and powdered carbon
c. conformal coating and RTV
d. epoxy and powdered
fiberglass
2-54. What is the first step in the repair of
burned or scorched boards?
a. Filling the burned area with
epoxy and fiberglass
b. Removing all discolored
material
c. Removing all delaminated
conductors
d. Cleaning all surfaces with
solvent
2-55. Which of the following statements is
correct concerning the repair of repairable
delaminated conductors?
a. All delaminations are
removed
b. Repairable delaminations
are not removed
c. All delaminations are
epoxied to the board
d. All delaminations are
replaced with insulated wire
2-56. Damage to some electronic
componentscan occur at what minimum
electrostatic
potential?
a. 14 volts
b. 35 volts
c. 350 volts
d. 3,500 volts
2-57. Electrostatic discharge (ESD) has the
greatest effect on which of the following
devices?

a. Silicon diodes
b. Selenium rectifiers
c. Germanium transistors
d. Metal-oxide transistor

2-59. Electrostatic charges may develop as

high
as which of the following voltages?

a. 3,000 volts
b. 15,000 volts
c. 20,000 volts
d. 35,000 volts

2-60. To prevent an electrostatic charge built

up
on the body of the technician from
damaging ESDS devices, the technician
should take which of the following
precautions?

a. Be grounded
b. Wear gloves
c. Ground the device
d. Handle the device with
insulated tools

2-61. The best source of information

concerning
the application, handling, and storage of
any aerosol dispensers may be found in/on
which of the following sources?

a. NAVSEA 2M manual
b. NEETS, Module 14, Topic 3
c. On the aerosol dispenser
d. Applicable military standards