Design. Build. Ship. Service.

Cross Sectioning Analysis

( Hermes / Demetrius )
Between
Imm Sn & OSP
Introduction

• Cross sectioning was carried out on Hermes & Demetrius PCA to study the solderbility effect on
PCB with Immersion Tin and OSP finishing .

• The locations for cross-section were BGA and through hole components.

Immersion Tin

OSP

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Cross - Section Location- Hermes & Demetrius

VENDOR FINISHING LOCATION

BTI Imm Sn U0 , BT950 , C102 , Y950 , J476 ,
Plato OSP U0 , BT950 , C102 , Y950 , J476 ,
BTI OSP U0 , BT950 , C102 , Y950 , J476 ,
Plato Imm Sn U0 , BT950 , C102 , Y950 , J476 ,

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 Cross Section Result- U0 ( BGA )

• Location U0 ( BTI Imm Sn )

Good solder joint was observed at BGA ball, substrate and

PCB pad for BTI immersion Tin

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 Cross Section Result- U0 ( BGA )

• Location U0 ( Plato OSP )

Good solder joint was observed at BGA ball, substrate and

PCB pad for Plato OSP

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 Cross Section Result- U0 ( BGA )

• Location U0 ( BTI OSP )

Good solder joint was observed at BGA ball, substrate and

PCB pad for BTI OSP

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Cross Section Result- U0 ( BGA )

• Location U0 ( Plato Imm Sn )

Good solder joint was observed at BGA ball, substrate and

PCB pad for Plato Imm Sn

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 Cross Section Result- BT950 ( BATTERY HOLDER)

• Location BT950 ( BTI Imm Sn )

Ground Pin Signal Pin

95% of barrel fill observed at Ground Pin

and Signal pin.

Ground Pin

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 Cross Section Result- BT950 ( BATTERY HOLDER)

• Location BT950 ( Plato OSP )

Ground Pin Signal Pin

100% of barrel fill observed at Ground Pin

and Signal pin.

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 Cross Section Result- BT950 ( BATTERY HOLDER)

• Location BT950 ( BTI OSP )

Ground Pin Signal Pin

100% of barrel fill observed at Ground Pin

and Signal pin.

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 Cross Section Result- BT950 ( BATTERY HOLDER)

• Location BT950 ( Plato Imm Sn )

Ground Pin Signal Pin

100% of barrel fill observed at Ground Pin

and Signal pin.

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 Cross Section Result- C102 ( E-CAP )

• Location C102 ( BTI Imm Sn )

Ground Pin Signal Pin

100% of barrel fill observed at Ground Pin

and Signal pin.

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 Cross Section Result- C102 ( E-CAP )

• Location C102 ( Plato OSP )

Ground Pin Signal Pin

100% of barrel fill observed at Ground Pin

and Signal pin.

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 Cross Section Result- C102 ( E-CAP )

• Location C102 ( BTI OSP )

Ground Pin Signal Pin

100% of barrel fill observed at Ground Pin

and Signal pin.

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 Cross Section Result- C102 ( E-CAP )

• Location C102 ( Plato Imm Sn )

Ground Pin Signal Pin

100% of barrel fill observed at Ground Pin

and Signal pin.

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 Cross Section Result- J476 ( CONNECTOR )

• Location J476 ( BTI Imm Sn )

Signal Pin Ground Pin Signal Pin

100% of barrel fill observed at Ground Pin

and Signal pin.

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 Cross Section Result- J476 ( CONNECTOR )

• Location J476 ( Plato OSP )

Signal Pin Ground Pin Signal Pin

100% of barrel fill observed at Ground Pin

and Signal pin.

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 Cross Section Result- J476 ( CONNECTOR )

• Location J476 ( BTI OSP )

Signal Pin Ground Pin Signal Pin

100% of barrel fill observed at Ground Pin

and Signal pin.

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 Cross Section Result- J476 ( CONNECTOR )

• Location J476 ( Plato Imm Sn )

Signal Pin Ground Pin Signal Pin

100% of barrel fill observed at Ground Pin

and Signal pin.

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 Cross Section Result- Y950 ( CRYSTAL )

• Location Y950 ( BTI Imm Sn )

Ground Pin Signal Pin

100% of barrel fill observed at Ground Pin

and Signal pin.

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 Cross Section Result- Y950 ( CRYSTAL )

• Location Y950 ( Plato OSP )

Ground Pin Signal Pin

50% of barrel fill observed at Ground Pin

75% Barrel Fill at Signal pin.

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 Cross Section Result- Y950 ( CRYSTAL )

• Location Y950 ( BTI OSP )

Ground Pin Signal Pin

50% of barrel fill observed at Ground Pin

80% Barrel Fill at Signal pin.

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 Cross Section Result- Y950 ( CRYSTAL )

• Location Y950 ( Plato Imm Sn )

Ground Pin Signal Pin

100% of barrel fill observed at Ground Pin

and Signal pin.

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Wave Temperature Profile

The same wave temperature profile was used to evaluate Imm Sn and OSP

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 Summary

BTI Plato

FINISHING FINISHING
Locati
Part on Imm OSP Imm OSP
BGA U0 OK OK OK OK

Battery Holder BT950 OK OK OK OK

Capasitor C102 OK OK OK OK
50% Barrel Fill for ground 50% Barrel Fill for ground
Crystal Y950 OK 80% Barrel Fill for Signal OK 75% Barrel Fill for Signal
Connector J476 OK OK OK OK

• Aside from the Y950, with this analysis sample, solderbility on OSP and Immersion Tin is
identical.
• For Y950, suspected the barrel diameter to the lead diameter ratio could have limited the
window for solder to fill on the OSP finishing. Current hole diameter is 0.5mm.
• Proposed to increase the through hole diameter to 0.7mm on the next gerber to monitor its
effectiveness on OSP finishing A

B
Prepared by: Manikandan
Dated: 3rd June 2008

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