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Curing and Thermal Properties of Co-Polymerized Tannin Phenol-Formaldehyde Resin For Bonding Wood Veneers
Curing and Thermal Properties of Co-Polymerized Tannin Phenol-Formaldehyde Resin For Bonding Wood Veneers
Curing and Thermal Properties of Co-Polymerized Tannin Phenol-Formaldehyde Resin For Bonding Wood Veneers
2 0 2 0;9(4):6994–7001
www.jmrt.com.br
Original Article
Nur Liyana Mohamad Hafiz a , Paridah Md Tahir a,∗ , Lee Seng Hua a,∗ ,
Zurina Zainal Abidin b , Fatimah Athiyah Sabaruddin a , Noryuziah Mohd Yunus c ,
Ummi Hani Abdullah d , Abdul Khalil H.P.S. e
a Institute of Tropical Forestry and Forest Product, Universiti Putra Malaysia (UPM), 43400 UPM Serdang, Selangor, Malaysia
b Chemical Engineering Department, Faculty of Engineering, Universiti Putra Malaysia (UPM), 43400 UPM Serdang, Selangor, Malaysia
c Faculty of Applied Science, Universiti Teknologi Mara Pahang, 26400 Jengka, Pahang, Malaysia
d Faculty of Forestry and Environment, Universiti Putra Malaysia (UPM), 43400 UPM Serdang, Selangor, Malaysia
e School of Industrial Technology, University Sains Malaysia, 11800 Penang, Malaysia
a r t i c l e i n f o a b s t r a c t
Article history: The aim of this study is to assess the curing behaviour and thermal properties of
Received 12 March 2020 phenol–formaldehyde (PF) adhesives with different degree of tannin substitution using sev-
Accepted 10 May 2020 eral thermal analysis techniques. Tannin from Acacia mearnsii bark was copolymerized with
Available online 8 June 2020 PF to form a bonding agent for plywood. The resin mixture was heated at 50 ◦ C prior to
adding 40% w/w tannin solution, followed by a continuous stirring for 2 h. The amounts of
Keywords: tannin substitution were 20%, 30% and 40% (w/w of PF solids) and 100% PF were used as con-
Adhesive curing trol. The study shows that the addition of tannin quickened the gel time of the resin notably,
Glass transition temperature parallel with the increase in viscosity of the resin. The dry shear bond strength of the tannin
Rigidity phenol–formaldehyde (TPF) co-polymer ranged between 1.71 and 2.58 MPa as compared to
Bonding shear 3.41 MPa for PF. At higher addition of tannin, the shear bond strength reduced significantly
predominantly the 40% tannin substitution. Formulation containing 20% tannin was found
comparable to that of neat PF. Thermal test revealed that TPF starts to degrade at a lower
temperature than PF resin. All TPF resins started to cure at about 125 ◦ C and peaked at 160 ◦ C
compared to PF that began to cure at 145 ◦ . The DMA of the resin showed an increase in the
resin stiffness with an addition of tannin. These results imply that even though TPF starts
to degrade at lower temperature, the cured TPF is relatively stronger than pure PF.
© 2020 The Author(s). Published by Elsevier B.V. This is an open access article under the
CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
∗
Corresponding authors.
E-mails: parida@upm.edu.my (P.M. Tahir), lee seng@upm.edu.my (L.S. Hua).
https://doi.org/10.1016/j.jmrt.2020.05.029
2238-7854/© 2020 The Author(s). Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://
creativecommons.org/licenses/by-nc-nd/4.0/).
j m a t e r r e s t e c h n o l . 2 0 2 0;9(4):6994–7001 6995
Table 5 – Temperature degradation point and weight loss of PF and TPF resins.
Sample Initial degradation (◦ C) Initial weight loss (%) Final degradation (◦ C) Final weight loss (%) Total residue (%)
Table 6 – Value of dynamic mechanical analysis (DMA) for PF and TPF resins.
Sample Storage modulus (E max) Loss modulus (E max) Tan delta peak (◦ C)
(◦ C) (MPa) (◦ C) (MPa)
Fig. 3 – Storage modulus (E ) of PF and TPF resins. Fig. 5 – Loss modulus (E ) between PF and TPF resins.
set as the gelation point whilst the second peaks for PF resin
refers to glassification.
As observed from Fig. 4, at around 140 ◦ C, the storage mod-
ulus E value increases drastically. Meanwhile, the summary of
dynamic mechanical analysis results is displayed in Table 6.
As mentioned by Kim [35], the active curing reaction can be
decided within the range where the maximum loss modu-
lus E value is shown. Based on the loss modulus E graph
in Fig. 5, a significant peak shifting to the left was observed.
In this case, the addition of tannin decreases the active cur-
ing temperature from 175 ◦ C for 100 PF to 165 ◦ C for 40 TPF.
Additionally, it can be said that the curing for all TPFs starts
Fig. 4 – Tan ı curve for PF and TPF resins.
at 130 ◦ C and reach its peak of curing temperature at around
160 ◦ C. Unlike tannin–phenolic resins, the curing temperature
of 100 PF only starts at around 145 ◦ C. Therefore, the findings
suggesting that addition of tannin fasten the curing rate of
effects, the heat increases the stiffness of polymer due to the PF resin. Corresponding to gelation and curing temperature,
cross-linking or polymerization during curing reaction under addition of tannin shows greater maximum rigidity (E max)
high temperature. This can be explained that from Fig. 3, the at 200 ◦ C when compared to pure PF. Value of E max for 40
heating physical effect overcomes the chemical effect during TPF is significantly higher compared to 100PF by 68%. This
120 ◦ C to 160 ◦ C. After 160 ◦ C, all samples showed increment of value could be attributed to higher degree of crosslinking due
storage modulus indicate fully crosslinking. to tannin larger molecular structure.
In terms of gelation temperature, the gelation point of the
resin starts when tan ı value forms a peak at around 130 ◦ C.
As shown in Fig. 4, the gel temperature decreased when the 4. Conclusions
tannin was added and increased from 20% to 40%. The gelling
point starts at 134 ◦ C for 100PF and decreases to around 120 ◦ C Tannin were extracted from A. mearnsii bark in this study. The
for 40 TPF. The first peak from tan ı found in PF resin can be extracted tannin was copolymerized with PF to form a bonding
7000 j m a t e r r e s t e c h n o l . 2 0 2 0;9(4):6994–7001
agent for plywood. Based on the findings obtained, the addi- hemagglutination: similar properties? Adv Chem Res
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