ӗ ૱ 㿴 Ṭ Җ

Product Specification

ӗ૱਽〠˖䖖䖭㬍⢉⁑ඇ
Appellation˖Car Kit Bluetooth Module
ӗ૱රਧ˖%70&;
Model˖BT-MC88-1X
ᇒᡧ਽〠˖-9&.(1:22'7HFKQRORJLHV6LQJDSRUH3WH/WG
Customer: JVCKENWOOD Technologies Singapore Pte. Ltd
⡸ ᵜ˖5
Version˖ R1.0

ᇒᡧ᢯䇔
Customer approval

ؑॾ㋮ᵪᴹ䲀‫ޜ‬ਨ
Shinwa Industries(China)Ltd.

ࡦ֌䜘䰘
Preparation Dept. 㩕ъ䜘 ᢩ߶
Sales Dept. Approved By
ࡦ֌ ᇑṨ ⺞䇔
Made By Checked By Confirmed By
㜑᰾⌒
Mingbo Hu
 BT-MC88-1XSpecification

ӗ૱㿴ṬҖਈᴤንশ㺘
Revision History

ᒿਧ ⡸ᵜ ਈᴤ޵ᇩ ᰕᵏ ࡦ֌ ⺞䇔 ᢩ߶

NO. Version Content Date Prepared by Checked by Confirmed by
俆⅑ਁ㹼 㜑᰾⌒
1 1.0 2015-6-8
First Release Mingbo Hu

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 BT-MC88-1XSpecification

ⴞᖅTable of contents
 ӻ㓽Introduction...........................................................................................................................................................4
 ㆰ㾱Overview.......................................................................................................................................................4
 ⢩ᖱFeatures..........................................................................................................................................................4
 ᓄ⭘Applications ..................................................................................................................................................4
 ⁑㓴ᯩṶമ Module Block Diagram ...................................................................................................................5
⁑㓴㿴ṬModule Specification......................................................................................................................................5
䙊⭘㿴ṬGeneral specifications................................................................................................................................5
⑙ᓖ઼⒯ᓖ㿴ṬTemperature and Humidity specification........................................................................................6
࣏㙇Power Consumption...........................................................................................................................................6
ሴ仁㿴ṬRF Specification .........................................................................................................................................6
ਁሴሴ仁⢩ᙗTX Radio Characteristics............................................................................................................6
ሴ仁᧕᭦⢩ᙗRX Radio Characteristics............................................................................................................7
丣仁᧕ਓAudio Interfaces..........................................................................................................................................7
ᆈۘಘൠ൰䇮㖞EEPROM˄Slave˅Address Setting .............................................................................................7
⭥Ⓚ‫༽઼⭥׋‬սᰦᒿPower on and Reset Sequence ...............................................................................................8
䇮䇑ᓄ⭘Design Application .........................................................................................................................................9
㇑㝊䝽㖞Pin Assignment .........................................................................................................................................9
㇑㝊᧿䘠Pin Description .......................................................................................................................................10
ᇎ䱵⁑ඇ৺㇑㝊ቪረമView of the module and Actual PAD dimension............................................................11
⁑ඇ亦ቲᇎ⢙മTop view of the module ........................................................................................................11
⁑ඇᓅቲ㇑㝊✺ⴈቪረമActual PAD dimension of the module ..................................................................11
⁑㓴ཆᖒቪረThe Module Outline And Dimension ..............................................................................................12
⁑㓴ሱ㻵৲㘳Recommended Module Mounting Pattern .......................................................................................13
ᓄ⭘৏⨶മApplication Schematic.........................................................................................................................14
⁑ඇ᭮㖞ᤷᕅThe Module Placement Guide ........................................................................................................15
4. ਟ䶐ᙗ⍻䈅Reliability Test............................................................................................................................................16
ਟ䶐ᙗ⍻䈅㿴ṬReliability Test Specification........................................................................................................16
4.2 ֻ㹼䈅傼㿴ṬRoutine Test Specification.................................................................................................................17
4.3 䶐ᙗ⍻䈅ḷ߶Reliability Test Standard ...................................................................................................................18
5. व㻵ؑ᚟Package Information ......................................................................................................................................19

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 BT-MC88-1XSpecification
ধᑖव㻵Taping Package........................................................................................................................................19
ধⴈቪረReel Dimensions ......................................................................................................................................20
ধᑖቪረCarrier Tape Dimensions .........................................................................................................................20
व㻵㿴ṬPacking Specifications............................................................................................................................21
䍗⢙ḷㆮ㿴ṬShipping Label Specifications ........................................................................................................22
6. എ⍱✺⑙ᓖ৲㘳ᴢ㓯Recommended Reflow Temperature Profile...............................................................................23
7. ⁑ඇⲴ᡻ᐕ✺᧕һ亩The Hand-soldering Information ................................................................................................24
8. ۘᆈᶑԦStorage Condition ...........................................................................................................................................24
9. 䱴ᖅAppendix................................................................................................................................................................25
)&& ,&ᨀ⽪FCC&IC Caution ...............................................................................................................................25

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 BT-MC88-1XSpecification

ӻ㓽Introduction
 ㆰ㾱Overview
ƾ %70&;ᱟаⅮสҾ&65㣟⡷䇮䇑Ⲵ+&,⁑㓴
BT-MC88 -1X is a HC I mo dule based on CSR8811 chip .
ƾ %70&;ᱟ⭡аঅሴ仁઼สᑖ,&㓴ᡀᒦᓄ⭘Ҿ㬍⢉*+]㌫㔏Ⲵ⁑㓴
The BT-MC88 -1X is a mo dule th at In tegrate a sing le -ch ip radio and baseband IC fo r
Bluetoo th 2.4GH z syste ms.

 ⢩ᖱFeatures

ƾ 3&0,6ެᇩᮠᆇ丣仁᧕ਓ
P CM/I2S d ig ital audio interfaces.
ƾ ᭟ᤱ,(((ॿ䇞
Support fo r IEEE 802. 11
ƾ ⁑㓴ቪረ  PPˈ䛞⾘ᆄˈњ㝊ս˄ᑖቿ㭭㖙˅
Module size 23 *16 *3.2 mm, S ta mp -24 (with sh ield ca se )
ƾ ⁑㓴޵㖞3&%ཙ㓯
Built-in pa ttern an tenna on the mod ule
ƾ ḷ߶Ⲵ+&,䙊䇟᧕ਓ
Standa rd HC I sup port
ƾ ᇭ⭥Ⓚ‫঻⭥ˈ⭥׋‬㤳ത˖9
Flex ible voltag e supp ly, supp ly range : 2.8 -3.6 V
ƾ ⧟‫؍‬5R+6
Environ men tal care: RoHS

 ᓄ⭘Applications
ƾ 䖖䖭‫ݽ‬ᨀ
H ands-Fre e Car Kits
ƾ վㄟ᡻ᵪǃ࣏㜭᡻ᵪǃᲪ㜭᡻ᵪ
Low -co st p hones, Fea tu re phone s, S mart-p hones
ƾ ‫ׯ‬ᩪᔿჂփ᫝᭮ಘ
P ortable med ia p la ye rs

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 BT-MC88-1XSpecification

 ⁑㓴ᯩṶമ Module Block Diagram

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⁑㓴㿴ṬModule Specification
䙊⭘㿴ṬGeneral specifications

1 ӗ૱ᡆ亩ⴞ਽〠 Product/ Project Name 䖖䖭㬍⢉⁑㓴 Car kit Bluetooth Module

2 㣟⡷㊫ර Chip set BlueCore CSR8811 A08 0.5mm WLCSP

3 ⌒⢩⦷ Baud Rate 9600bps̚4Mbps

4 仍ᇊ⭥঻ Rated Voltage 3.3V
5 ᐕ֌⭥঻㤳ത Operation Voltage range 2.8V̚3.6V

6 ᐕ֌㤳തOperation Range 10 meters (33 feet)

7 ቪረDimension 23*16*3.2mm ˄L*W*H˅

ƶ1.2 ƶ2.0 ƶ2.0+EDR ƶ2.1

8 Ṩᗳ㿴Ṭ⡸ᵜCore Specification Version
ƶ2.1+EDR Ƶ3.0 ƶ3.0+HS

BT SIG
9 ⍻䈅઼䇔䇱Test and Certification FCC\IC\MIC
CE (Only Report)

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 BT-MC88-1XSpecification

⑙ᓖ઼⒯ᓖ㿴ṬTemperature and Humidity specification

ᐕ֌⑙ᓖ㤳ത Operation Temperature range ̚ć

ۘᆈ⑙ᓖ㤳ത Storage Temperature range ̚ć

⒯ᓖ㤳ത Humidity range ̚

ሴ仁㿴ṬRF Specification

ਁሴሴ仁⢩ᙗTX Radio Characteristics

㿴Ṭ ᶑԦ ᴰሿ ިර ᴰབྷ অս
Specification Condition Min. Typ. Max. Unit

f1 avg 140 175 kHz

䈳ࡦ⢩ᙗ
f2 max 115 kHz
Modulation characteristics
f2avg/f1a 80 %

ࡍ࿻䖭⌒仁⦷ᇩ䲀
Normal -75 75 kHz
Initial carrier-frequency tolerance

DH1 -25 25 kHz

䖭⌒仁⦷┲〫 DH3 -40 40 kHz
Carrier frequency drift
DH5 -40 40 kHz
Drift rate/50us -20 20 kHz
༷⌘˖ᑨ⑙лᱟfć
Remark: Normal Test Condition is 25±5ć

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 BT-MC88-1XSpecification

ሴ仁᧕᭦⢩ᙗRX Radio Characteristics

亩ⴞ ᶑԦ ᴰሿ ᴰབྷ অս

Items Condition Min. Max. Unit
অᰦ䳉⚥᭿ᓖ 3 G%P
NTC NA <0.1 %
Single Sensitivity(P=-70dBm)

ཊᰦ䳉⚥᭿ᓖ 3 G%P
NTC NA <0.1 %
Multi Sensitivity(P=-70dBm)

ᴰབྷ䗃ࠪ⭥ᒣ˄3 G%P˅
NTC NA <0.1 %
Maximum output Level(P=-20 dBm)

༷⌘˖ᑨ⑙лᱟfć
Remark: Normal Test Conditions is 25±5ć

丣仁᧕ਓAudio Interfaces

%70&;Ⲵ丣仁䗃ࠪѪᮠᆇ丣仁ˈਟ䇮㖞Ѫ,6ᡆ3&0䗃ࠪˈє⿽᧕ਓ㝊ս‫⭘ޡ‬DŽ
BT-MC88-1X has a digital audio interface that is configurable as either PCM or I2S.
The I2S interface shares the same pins as PCM interface.

PCM Interface I2S Interface

PCM_OUT SD_OUT
PCM_IN SD_IN
PCM_SYNC WS
PCM_CLK SCK

ᆈۘಘൠ൰䇮㖞EEPROM˄Slave˅Address Setting

Bit 7 6 5 4 3 2 1 0
1 0 1 0 A2 A1 A0 R/W

 ഐ㣟⡷Ⲵ$ˈ$઼$൘⁑ඇ⺜Ԧѝᐢ䘎᧕ࡠൠˈᡰԕ䇮༷ൠ൰൷Ѫ
Since the A0ˈA1 and A2 are connected to GND in the module, So, A0=A1=A2=0

 ᖃս5: ((3520ਚਟԕ䈫˄߉‫؍‬ᣔ˅

When R/W=1, the device becomes read only˄Write Protect˅

 ᖃս5: ((3520ਟԕ↓ᑨ䈫߉

When R/W=0, the normal read and write operations are allowed

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 BT-MC88-1XSpecification

⭥Ⓚ‫༽઼⭥׋‬սᰦᒿPower on and Reset Sequence

⁑㓴Ⲵ⭥Ⓚ‫༽઼⭥׋‬սᰦᒿྲлമᡰ⽪˖
The Power on and reset sequence are shown in the below figure and it explains a series of operation sequence.

In below figure 2:
g T1 ̱0 ms
g T2 ̱10 ms
g T3 ̱5 ms

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⌘᜿⁑ඇሩҾ‫ޣ‬ᵪ⋑ᴹᰦᒿ㾱≲
Note: There are no requirement for the power-off sequence.

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 BT-MC88-1XSpecification

䇮䇑ᓄ⭘Design Application
㇑㝊䝽㖞Pin Assignment

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 BT-MC88-1XSpecification

㇑㝊᧿䘠Pin Description

No. ਽〠Pin Name I/O ㄟਓ㊫රPad Type ᧿䘠Pin Description

1 GND - VSS Ground of supply voltage

Bidirectional, tristate, with weak

2 SPI_CS#/PCM_SYNC
3 SPI_MISO/PCM_OUT
4 SPI_CLK/PCM_CLK
5 SPI_MOSI/PCM_IN
6 SPI_PCM#_SEL
7 RESET#
I/O SPI chip select(active low) or PCM synchronous
internal pull-down
Output, tristate, with weak internal
I/O SPI data output or PCM synchronous data output
pull-down
Bidirectional, tristate, with weak
I/O SPI clock or PCM synchronous data clock
internal pull-down
input, tristate, with weak internal
I/O SPI data input or PCM synchronous data input
pull-down
Control line to select SPI or PCM interface
I Input with weak internal pull-down
H=SPI, L=PCM
Take high to enable interna regulators, also acts
I Input with strong internal pull-down
as active low reset

8 VDD_3V3 I VDD Positive supply for module, Typical 3.3V

9 VDD_PADS I VDD Positive supply for module, Typical 3.3V

10 GND - VSS Ground of supply voltage

11 I2C_SDA I/O Bi-directional with internal pull-up I2C serial data line (Internal 4.7K pull-up)

12 I2C_SCL I Bi-directional with internal pull-up I2C serial clock line (Internal 4.7K pull-up)
I2C bus memory write protect line
13 I2C_WP I Bi-directional with internal pull-up
(Internal 4.7K pull-up)

14 VDD_1V8 I VDD Output from internal high-voltage regulator

15 GND - VSS Ground of supply voltage

Bidirectional, tristate, with weak

16 UART_CTS I UART clear to send, active low
internal pull-up
Bidirectional, tristate, with weak
17 UART_RTS O UART request to send, active low.
internal pull-up
Bidirectional, tristate, with weak UART data input, active high
18 UART_RX I
internal pull-up -Recommended external 10K pull-up resistor.
Bidirectional, tristate, with weak UART data output, active high
19 UART_TX O
internal pull-up -Recommended external 10K pull-up resistor.
20 GND - VSS Ground of supply voltage

21 NC - NC NC

22 NC - NC NC

23 NC - NC NC

24 GND - VSS Ground of supply voltage

༷⌘˖ᔪ䇞3&0,&ԕ৺8$57䜭Ѣ㚄ањ¡.Ⲵཆ㖞⭥䱫
Remark: Recommended external ȍ-1K serial resistor for all the PCM, I2C and UART transfer ports.

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 BT-MC88-1XSpecification

ᇎ䱵⁑ඇ৺㇑㝊ቪረമ9LHZRIWKHPRGXOHDQGActual PAD dimension

⁑ඇ亦ቲᇎ⢙മTop view of the module

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Note: The picture is only for reference, Please make the object as the standard
⁑ඇᓅቲ㇑㝊✺ⴈቪረമActual PAD dimension of the module

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Symbol Dimension(mm) Description
A&D 1.0 Pad length
B &F 1.0 Pad width
C&E 0.8 Inner gap
G 3.0 Module edge to pad edge
H 1.6 Module edge to pad edge
K 1.8 Center pad to center pad
M 6.0 Module edge to pin24 edge
N 5.5 Width of the antenna restricted area
L 23 Total length of the module
W 16 Total width of the module
༷⌘˖䈟ᐞ˖˖fPP Remark: Tolerance: ±0.1mm

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 BT-MC88-1XSpecification

⁑㓴ཆᖒቪረThe Module Outline And Dimension

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 BT-MC88-1XSpecification

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  PP䮯 ᇭ 儈 ‫ޜ‬ᐞfPP
Module Size˖23*16*3.2mm (L*W*H) Tolerance: ±0.1mm

⁑㓴ሱ㻵৲㘳Recommended Module Mounting Pattern

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 "'T
,....;

r ------------------------------------------------------------------------------------------------ T------------------------
r-------------------------------------1 1
1 I
v Pov-.er St.pply(VDD+5V) is from MCU board
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Gi'lJ GND Gi'lJ GND Gi'lJ GNJ

WRESETCortrolbyMCUboard,R11arll C3 coUd not be rn:nrted.

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⁑ඇ᭮㖞ᤷᕅThe Module Placement Guide

⁑ඇ᭮㖞ᰦ䴰㾱㘳㲁5)ཙ㓯Ⲵ⾱オ४䶒〟ˈ䈧৲㘳ԕл⁑ඇ᭮㖞ᯩᔿ
Please consider the RF antenna restricted area and place the module according to the photo showed as below:

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4. ਟ䶐ᙗ⍻䈅Reliability Test

ਟ䶐ᙗ⍻䈅㿴ṬReliability Test Specification

ᒿਧ ⍻䈅亩ⴞ ⍻䈅ᶑԦ

No. Test Item Test Conditions
൘ć⧟ຳл᭮㖞ሿᰦˈ൘ḷ߶⍻䈅ᶑԦлሿᰦ޵䘋㹼⍻䈅ˈ⁑ඇᓄ┑䏣ਟ䶐
儈⑙ᆈۘ ᙗ⍻䈅ḷ߶
1 +85ć, 500 hours, Take measurements within 3 hours in standard test condition, The module
High Temperature (Storage)
should meet the reliability test standard.

վ⑙ᆈۘ ൘fć⧟ຳл᭮㖞ሿᰦˈ൘ḷ߶⍻䈅ᶑԦлሿᰦ޵䘋㹼⍻䈅ˈ⁑ඇᓄ┑䏣
Low Temperature (Storage) ਟ䶐ᙗ⍻䈅ḷ߶
2 -40±3ć, 500 hours, Take measurements within 3 hours in standard test condition,
The module should meet the reliability test standard.

3 儈⒯ᆈۘ ൘40±3ć,90±5%RH ⧟ຳѝ᭮㖞500 ሿᰦˈ൘ḷ߶⍻䈅ᶑԦл3 ሿᰦ޵䘋㹼⍻䈅ˈ⁑

High Humidity (Storage) ඇᓄ┑䏣ਟ䶐ᙗ⍻䈅ḷ߶
40±3ć, 90±5%RH, 500 hours, Take measurements within 3 hours in standard test condition,
The module should meet the reliability test standard.

儈վ⑙ᗚ⧟ ൘+85ć⧟ຳл᭮㖞30 ࠶䫏ˈ❦ਾ⑙ᓖ䱽վࡠࡠ-40ć˄⑙ᓖ䖜ᦒᰦ䰤Ѫ2 њሿᰦ˅᭮

High and low temperature 㖞30 ࠶䫏˗❦ਾ⑙ᓖॷ儈ࡠ85ć᭮㖞30 ࠶䫏˄⑙ᓖ䖜ᦒᰦ䰤Ѫ2 њሿᰦ˅ˈྲ↔䟽
༽ᗚ⧟50 ⅑DŽᇎ傼ᆼᡀਾˈ൘ḷ߶⍻䈅ᶑԦлˈ⁑ඇᓄ┑䏣ਟ䶐ᙗ⍻䈅ḷ߶
cycling test
4 Max 85ć30 minutes, (Temperature shift time: within 2 hours). then Min -40ć30 minutes
50 cycles. After the cycle take measurements in standard test condition, The module should
meet the reliability test standard.

✝ߢࠫ ൘+85ć⧟ຳл᭮㖞20 ࠶䫏ਾˈ⑙ᓖ࠷ᦒࡠ-40ć˄൘5 ࠶䫏ѻ޵˅᭮㖞20 ࠶䫏ˈ❦

Thermal Shock ਾ⑙ᓖ࠷ᦒࡠ85ć˄൘5 ࠶䫏ѻ޵˅᭮㖞20 ࠶䫏ˈྲ↔䟽༽ᗚ⧟50 ⅑ˈᇎ傼ᆼᡀਾˈ
൘ḷ߶⍻䈅ᶑԦлˈ⁑ඇᓄ┑䏣ਟ䶐ᙗ⍻䈅ḷ߶
5 Max 85ć20 minutes, (Temperature shift time: within 5 minutes). Min -40ć20 minutes.
50 cycles, After the thermal shock take measurements in standard test condition, The module
should meet the reliability test standard.

䶉⭥⍻䈅 Ӫփ᧕䀖᭮⭥±2KVˈ3 ⅑ˈ䶉⭥⍻䈅ਾˈ൘ḷ߶⍻䈅ᶑԦлˈ⁑ඇᓄ┑䏣ਟ䶐ᙗ⍻䈅

Electrostatic Resistance ḷ߶
6
Human body model ±2KV, 3 times, After the test, Take measurements in standard test
condition, The module should meet the reliability test standard.
ᥟࣘ⍻䈅 ᥟࣘ仁⦷˖10̚55Hzˈᢛ仁䙏⦷˖0.1 Oct/minˈᴰབྷ࣐䙏ᓖ˖4GDŽX ˈYˈZ йњᯩ
Vibration Resistance ੁ਴6 њሿᰦˈᥟࣘᆼᡀਾˈ൘ḷ߶⍻䈅ᶑԦл3 њሿᰦ޵⍻䈅ˈ⁑ඇᓄ┑䏣ਟ䶐ᙗ
⍻䈅ḷ߶
7 Freq: 10~55Hz, 0.1 Oct/min, max acceleration: 4Grms- Test time: X,Y, Z axis for 6 hours.
After the vibration resistance test, Take measurements within 3 hours in standard test
condition, The module should meet the reliability test standard.

SHINWA PROPRIETARY information CONFIDENTIAL REQUESTED 16

 BT-MC88-1X Specification
ߢࠫ⍻䈅 ߢࠫ⍻䈅˖ߢ࣐ࠫ䙏ᓖ˖50G(m/sec2)˗ߢࠫᰦ䰤˖11 ∛。˗ߢࠫ仁⦷઼ᯩੁ˖6 њᯩ
Impact Resistance ੁ⇿њᯩੁ10 ⅑DŽ൘ḷ߶⍻䈅ᶑԦлйњሿᰦ޵⍻䈅ˈ⁑ඇᓄ┑䏣ਟ䶐ᙗ⍻䈅ḷ߶
䏼㩭⍻䈅˖ሶ⁑ඇӾ100 ৈ㊣Ⲵ儈ᓖ䏼㩭ࡠаඇ10 ∛㊣৊Ⲵ㜦ਸᶯкˈ䟽༽5 ⅑ˈᇎ
傼ᆼᡀਾ൘ḷ߶⍻䈅ᶑԦлˈ⁑ඇᓄ┑䏣ਟ䶐ᙗ⍻䈅ḷ߶
Shock Test: Impact acceleration: 50G(m/sec2), impact time: 11 msec, impact frequency and
8 direction: 10 times each in 6 directions, Take measurements within 3 hours in standard test
condition, The module should meet the reliability test standard.
Drop Test: Test height: 100cm. Frequency: 5 times. Drop the module onto 10mm thickness
plywood. Take measurements within 3 hours in standard test condition, The module should
meet the reliability test standard.

㫨঻⍻䈅 ൘-30ć⧟ຳл᭮㖞1 њሿᰦˈ൘1 ࠶䫏ѻ޵࠷ᦒ㠣25ć,90%RH ⧟ຳлˈ᭮㖞1 њሿ

Pressurizing Vapour ᰦˈᔰ੟15 ࠶䫏ˈ❦ਾ‫ޣ‬䰝15 ࠶䫏DŽ൘ḷ߶⍻䈅ᶑԦл䘋㹼3 њᗚ⧟ˈᇎ傼ᆼᡀਾ
൘ᑨ⑙л᭮㖞2 њሿᰦਾ⍻䈅ˈ⁑ඇᓄ┑䏣⁑ඇᓄ┑䏣ਟ䶐ᙗ⍻䈅ḷ߶
9 -30ć1 hour, shift to 25ć,90% RH within 1 min, stay 25ć,90% RH 1 hour, On:15 minutes
then Off: 15 minutes, 3 cycle In Standard test condition, Take measurements 2 hours after,
The module should meet the reliability test standard.

4.2 ֻ㹼䈅傼㿴ṬRoutine Test Specification

ᒿਧ ⍻䈅亩ⴞ ⍻䈅ᶑԦ

No. Test Item Test Conditions
൘ć⧟ຳл᭮㖞ሿᰦˈ൘ḷ߶⍻䈅ᶑԦлሿᰦ޵䘋㹼⍻䈅ˈ⁑ඇᓄ┑䏣ਟ䶐
儈⑙ᆈۘ ᙗ⍻䈅ḷ߶
1 +85ć, 48 hours, Take measurements within 3 hours in standard test condition, The module
High Temperature (Storage)
should meet the reliability test standard.

վ⑙ᆈۘ ൘fć⧟ຳл᭮㖞ሿᰦˈ൘ḷ߶⍻䈅ᶑԦлሿᰦ޵䘋㹼⍻䈅ˈ⁑ඇᓄ┑䏣ਟ
Low Temperature (Storage) 䶐ᙗ⍻䈅ḷ߶
2 -40±3ć, 48 hours, Take measurements within 3 hours in standard test condition,
The module should meet the reliability test standard.

3 儈⒯ᆈۘ ൘40±3ć,90±5%RH ⧟ຳѝ᭮㖞48 ሿᰦˈ൘ḷ߶⍻䈅ᶑԦл3 ሿᰦ޵䘋㹼⍻䈅ˈ⁑ඇ

High Humidity (Storage) ᓄ┑䏣ਟ䶐ᙗ⍻䈅ḷ߶
40±3ć, 90±5%RH, 48 hours, Take measurements within 3 hours in standard test condition,
The module should meet the reliability test standard.

儈վ⑙ᗚ⧟ ൘+85ć⧟ຳл᭮㖞30 ࠶䫏ˈ❦ਾ⑙ᓖ䱽վࡠࡠ-40ć˄⑙ᓖ䖜ᦒᰦ䰤Ѫ2 њሿᰦ˅᭮

High and low temperature 㖞30 ࠶䫏˗❦ਾ⑙ᓖॷ儈ࡠ85ć᭮㖞30 ࠶䫏˄⑙ᓖ䖜ᦒᰦ䰤Ѫ2 њሿᰦ˅ˈྲ↔䟽
༽ᗚ⧟5 ⅑DŽᇎ傼ᆼᡀਾˈ൘ḷ߶⍻䈅ᶑԦлˈ⁑ඇᓄ┑䏣ਟ䶐ᙗ⍻䈅ḷ߶
cycling test
4 Max 85ć30 minutes, (Temperature shift time: within 2 hours). then Min -40ć30 minutes
5 cycles. After the cycle take measurements in standard test condition, The module should
meet the reliability test standard.

✝ߢࠫ ൘+85ć⧟ຳл᭮㖞20 ࠶䫏ਾˈ⑙ᓖ࠷ᦒࡠ-40ć˄൘5 ࠶䫏ѻ޵˅᭮㖞20 ࠶䫏ˈ❦

Thermal Shock ਾ⑙ᓖ࠷ᦒࡠ85ć˄൘5 ࠶䫏ѻ޵˅᭮㖞20 ࠶䫏ˈྲ↔䟽༽ᗚ⧟5 ⅑ˈᇎ傼ᆼᡀਾˈ
൘ḷ߶⍻䈅ᶑԦлˈ⁑ඇᓄ┑䏣ਟ䶐ᙗ⍻䈅ḷ߶
5 Max 85ć20 minutes, (Temperature shift time: within 5 minutes). Min -40ć20 minutes.
5 cycles, After the thermal shock take measurements in standard test condition, The module
should meet the reliability test standard.

SHINWA PROPRIETARY information CONFIDENTIAL REQUESTED 17

 BT-MC88-1X Specification
䶉⭥⍻䈅 ᭮⭥±2KVˈ3 ⅑ˈ䶉⭥⍻䈅ਾˈ൘ḷ߶⍻䈅ᶑԦлˈ⁑ඇᓄ┑䏣ਟ䶐ᙗ⍻䈅ḷ߶
6 Electrostatic Resistance Human body model ±2KV, 3 times, After the test, Take measurements in standard test
condition, The module should meet the reliability test standard.
ᥟࣘ⍻䈅 ᥟࣘ仁⦷˖10̚55Hzˈᢛ仁䙏⦷˖0.1 Oct/minˈᴰབྷ࣐䙏ᓖ˖4GDŽX ˈYˈZ йњᯩ
Vibration Resistance ੁ਴2 њሿᰦˈᥟࣘᆼᡀਾˈ൘ḷ߶⍻䈅ᶑԦл3 њሿᰦ޵⍻䈅ˈ⁑ඇᓄ┑䏣ਟ䶐ᙗ
⍻䈅ḷ߶
7 Freq: 10~55Hz, 0.1 Oct/min, max acceleration: 4Grms- Test time: X,Y, Z axis for 2 hours.
After the vibration resistance test, Take measurements within 3 hours in standard test
condition, The module should meet the reliability test standard

ߢࠫ⍻䈅 ߢࠫ⍻䈅˖ߢ࣐ࠫ䙏ᓖ˖50G(m/sec2)˗ߢࠫᰦ䰤˖11 ∛。˗ߢࠫ仁⦷઼ᯩੁ˖6 њᯩ

Impact Resistance ੁ⇿њᯩੁ10 ⅑DŽ൘ḷ߶⍻䈅ᶑԦл3 њሿᰦ޵⍻䈅ˈ⁑ඇᓄ┑䏣ਟ䶐ᙗ⍻䈅ḷ߶
䏼㩭⍻䈅˖ሶ⁑ඇӾ100 ৈ㊣Ⲵ儈ᓖ䏼㩭ࡠаඇ10 ∛㊣৊Ⲵ㜦ਸᶯкˈ䟽༽5 ⅑ˈᇎ
傼ᆼᡀਾ൘ḷ߶⍻䈅ᶑԦлˈ⁑ඇᓄ┑䏣ਟ䶐ᙗ⍻䈅ḷ߶
Shock Test: Impact acceleration: 50G(m/sec2), impact time: 11 msec, impact frequency and
8 direction: 10 times each in 3 directions, Take measurements within 3 hours in standard test
condition, The module should meet the reliability test standard.
Drop Test: Test height: 100cm. Frequency: 5 times. Drop the module onto 10mm thickness
plywood. Take measurements within 3 hours in standard test condition, The module should
meet the reliability test standard

㫨঻⍻䈅 ൘-30ć⧟ຳл᭮㖞1 њሿᰦˈ൘1 ࠶䫏ѻ޵࠷ᦒ㠣25ć,90%RH ⧟ຳлˈ᭮㖞1 њሿ

Pressurizing Vapour ᰦˈᔰ੟15 ࠶䫏ˈ❦ਾ‫ޣ‬䰝15 ࠶䫏DŽ൘ḷ߶⍻䈅ᶑԦл䘋㹼3 њᗚ⧟ˈᇎ傼ᆼᡀਾ
൘ᑨ⑙л᭮㖞2 њሿᰦਾ⍻䈅ˈ⁑ඇᓄ┑䏣⁑ඇᓄ┑䏣ਟ䶐ᙗ⍻䈅ḷ߶
9 -30ć1 hour, shift to 25ć,90% RH within 1 min, stay 25ć,90% RH 1 hour, On:15 minutes
then Off: 15 minutes, 3 cycle In Standard test condition, Take measurements 2 hours after,
The module should meet the reliability test standard.

4.3 䶐ᙗ⍻䈅ḷ߶Reliability Test Standard

㿴Ṭ ᶑԦ ᴰሿ ިර ᴰབྷ অս

Specification Condition Min. Typ. Max. Unit
IDYJ   N+]
䈳ࡦ⢩ᙗ
IPD[  N+]
Modulation characteristics
IDYJIDYJ  

ࡍ࿻䖭⌒仁⦷ᇩ䲀
1RUPDO   N+]
Initial carrier-frequency tolerance

'+   N+]

䖭⌒仁⦷┲〫 '+   N+]

Carrier frequency drift '+   N+]

'ULIWUDWHXV   N+]

অ/ཊᰦ䳉⚥᭿ᓖ(P=-70dBm)
NTC <0.1 %
Single/Multi Sensitivity(P=-70dBm)
༷⌘˖ᑨ⑙лᱟfć Remark: Normal Test Condition is 25±5ć

SHINWA PROPRIETARY information CONFIDENTIAL REQUESTED 18

 •
!ih inwa BT-MC88-1X Specification

5. ffi.m Package Information

5. 1 'ffi''E! Taping Package

Sprocke-t Hole

/
\0 0 0 d 0 0 0 0 0 0 0 0 0 0 0 0 0 0\

Pin 1 --+<

Shil?lcl Co.s ·o D
,,

, o 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 01

Cove r Tope
Co.rrier T o.pl?

eel
Direc -ion of' unreeling

Portion equipped
with o.rts

0 00 0 0 0 0000 0 00000 0000 0 0 0 00 0 00000 0 0 0 00 0 0000 0 00 0 0 00 0 0

I
II
II
J\

Dir ection of unreeling EMp-ty coMponent

C oMpo.r-tMent

Figure 11: Taping package

SHINWA PROPRIETARY information CONFIDENTIAL REQUESTED 19

 BT-MC88-1XSpecification

ধⴈቪረReel Dimensions

)LJXUH5HHOGLPHQVLRQV

ধᑖቪረCarrier Tape Dimensions

SHINWA PROPRIETARY information CONFIDENTIAL REQUESTED 20

 !ihinwa BT-MC88-1X Specification
Figure 13: Carrier tape dimensions

5. 4 JU Packing Specifications

Reel

Deslcco.nt

Lobel

TherMo coMpression
bonding ----
Moisture .Barrier bo.g
/
D..
-- Lobel

Po.cklng box/

Lo.loel

Qty o.c goods • Mo.x 630 pes I reel

Figure 14: Packing specifications

SHINWA PROPRIETARY information CONFIDENTIAL REQUESTED 21

 BT-MC88-1XSpecification

䍗⢙ḷㆮ㿴ṬShipping Label Specifications

)LJXUH6KLSSLQJODEHOVSHFLILFDWLRQV

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 BT-MC88-1XSpecification

6. എ⍱✺⑙ᓖ৲㘳ᴢ㓯Recommended Reflow Temperature Profile

ᰐ䫵ᐕ㢪ಘԦ⑙ᓖᴢ㓯
Pb-Free Parts Heat Resist Temperature Profile:

)LJXUH5HFRPPHQGHGUHIORZWHPSHUDWXUHSURILOH

Process Step Lead-Free Solder

亴✝⑙ᓖPre-Heat 150~190ÛC
亴✝ᰦ䰤Pre-Heat Time 60~120 s
ᶱ䲀儈⑙ᰦ䰤Time above limit temperature Above +220ÛC 30~50s
ᴰ儈⑙ᓖPeak temperature MAX +260ÛC
ᴰ儈⑙ᓖ5ÛC ޵ᤱ㔝ᰦ䰤
MAX 3s
Time within 5ÛC of peak temperature

༷⌘Remark:
1. ⁑ඇ‫ݱ‬䇨ᴰཊ2 ⅑䗷എ⚹
Reflow soldering is allowable 2 times maximum
2. Ѫ‫؍‬䇱✺᧕㢟ྭˈ䴰㾱൘䗷എ⚹䗷〻ѝ໎࣐≞≄DŽ
In order to have better SMT solder performance, please add Nitrogen during reflow process

SHINWA PROPRIETARY information CONFIDENTIAL REQUESTED 23

 BT-MC88-1XSpecification

7. ⁑ඇⲴ᡻ᐕ✺᧕һ亩The Hand-soldering Information

⁑ඇⲴ᡻ᐕ✺᧕৲㘳ԕл㾱≲˖
The HCI module can withstand the following hand soldering specification:
1. ✉䫱ཤ⑙ᓖ䴰䇮㖞൘360fć
The soldering iron tip temperature should be set to 360±10ć
2. ⁑ඇⲴ᡻ᐕ✺᧕ᰦ䰤䴰൘3 。ԕ޵
The manual soldering time should be within 3 seconds

8. ۘᆈᶑԦStorage Condition

ѪҶ┑䏣⁑ඇⲴ✺᧕઼ᆈۘ㾱≲ˈ䴰㾱‫؍‬ᤱԕлᶑԦ˖
The following conditions should be kept for soldering and keeping in storage for this module:
1. ൘ᒢ⠕Ⲵ㺻ᆀѝ‫؍‬ᆈᵏ䲀˖൘վҾ40ȗC,90% RH ᶑԦл‫؍‬ᆈ12 њᴸ
Shelf life in dry bag: 12months at <40ÛC and 90% RH
2. व㻵㺻ᔰሱਾˈ⁑ඇᗵ享䘋㹼എ⍱✺᧕ᡆ㘵਼ㅹᶑԦⲴ༴⨶˖
After bag is opened, module shall be subjected to soldering reflow or equivalent processing must be:
a) ൘վҾ3Û& RH ᐕলᶑԦлˈ168 ሿᰦ޵䘋㹼✺᧕
Mounted within 168hrs at factory condition of ”Û&0% RH
b) ൘վҾ10% RH ⧟ຳѝᆈۘ
Stored at <10% RH
3. ྲ᷌н┑䏣ԕлᶑԦˈ⁑ඇ൘✺᧕ࡽ䴰㾱✈✔˖
Modules will be required baking before mounting
a) ᖃᇔ⑙Ѫ23ÛC±ÛCˈ⒯ᓖᤷ⽪ಘᱮ⽪⒯ᓖབྷҾ10%
Humidity indicator shows >10% when read at room temperature 23ÛC±Û&
b) н㜭┑䏣к䶒2.a ᡆ2.b ᶑԦ
Above item 2.a) or 2.b) are not met
4. ྲ᷌䴰㾱✈✔ˈ⁑ඇ䴰᭮㖞൘վ⑙ಘ⳯ѝˈ൘40ÛCÛ&-Û&ˈ<5%RH ᶑԦл✈✔192 ሿᰦ
If baking is required, device may be baked for 192hours at Û&ÛC/-Û& and <5%RH for low temperature
device containers.
5. ✈✔䗷ਾˈ᭮㖞൘ᇔ⑙лањሿᰦˈ❦ਾ֯⭘.
After baking, leave it for 1 hour at room temperature then use it.

SHINWA PROPRIETARY information CONFIDENTIAL REQUESTED 24

 BT-MC88-1XSpecification

9. 䱴ᖅAppendix

)&& ,&ᨀ⽪FCC&IC Caution

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired
operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1)
this device may not cause interference, and (2) this device must accept any interference, including interference that may cause
undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into
which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as
the following : “Contains Transmitter Module FCC ID: ZWY8811X”or“Contains FCC ID: ZWY8811X.”
When the module is installed inside another device,the user manual of this device must contain below warning statements ;
1. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may cause undesired operation.
2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate
the equipment.
The devices must be installed and used in strict accordance with the manufacturer’s instructions as described in the user
documentation that comes with the product.
If the IC identification number is not visible when the module is installed inside another device, then the outside of the device into
which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as
the following: “Contains transmitter module IC: 12033A-8811X” or “Contains IC: 12033A-8811X”
When the module is installed inside another device, the user manual of this device must contain below warning statements ;
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1)
this device may not cause interference, and (2) this device must accept any interference, including interference that may cause
undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
The devices must be installed and used in strict accordance with the manufacturer’s instructions as described in the user
documentation that comes with the product.

SHINWA PROPRIETARY information CONFIDENTIAL REQUESTED 25