SOC Packaging and Signal Integrity: Corner Analysis

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Spring 2023: SOC EE5004 1/11

SOC Packaging and Signal Integrity


LABORATORY MANUAL
Spring 2023

LAB 4
Title:
Corner Analysis

Dr. Hassan Saif


Engr. Hamza Atiq
Shahid Mehmood 22I-9942

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LAB ENGINEER SIGNATURE & DATE

MARKS AWARDED: /10


________________________________________________________________
NATIONAL UNIVERSITY OF COMPUTER AND EMERGING SCIENCES (NUCES),
ISLAMABAD
Version
Prepared by: Engr. Hamza Atiq 1.0
:
Updated By: 6 Apr 2021 Date: 03 Mar,2023
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Lab Tasks

Figure 1. Poly resistor Schematic for corner analysis


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Figure 2. R-poly current over temperature sweep for different process corners
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Figure 3.Bar Graph of Resistance of device over different process corners

Figure 4. R-poly current over temperature sweep for different process corners in ADE XL
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Task1(Inverter)

Figure 5. Inverter Schematic


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Figure 6. Corner analysis for all the 5 corners


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Task2(Common Source)

Figure 7. Schematic
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Figure 8. Variation in gain and bandwidth

Figure 9. Variation in Noise


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Figure 12. Bar Graph Gain

Figure 13. Bar Graph Bandwidth

Figure 14. Bar Graph Noise


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Figure 10. Variation in gain and bandwidth with Temp


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Figure 11. Variation in Noise with Temp

Conclusion:
In the lab task, Corner analysis has been performed by checking the circuit
performance at all the process corners with control over temperature at the same
time by adding some model files. We performed the corner analysis on a simple
poly resistor and measure the change in resistance over temperature with different
corners (ss, ff, tt). The same Corner analysis is done with the inverter. In the end,
we perform the corner analysis with a common source amplifier with and without
the effect of temperature. We observed the Gain, Bandwidth, and Noise and drew
the Bar Graph at different values by taking TT as a reference.

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