Professional Documents
Culture Documents
SOC Packaging and Signal Integrity: Corner Analysis
SOC Packaging and Signal Integrity: Corner Analysis
SOC Packaging and Signal Integrity: Corner Analysis
LAB 4
Title:
Corner Analysis
________________________________
LAB ENGINEER SIGNATURE & DATE
Lab Tasks
Figure 2. R-poly current over temperature sweep for different process corners
Spring 2023: SOC EE5004 4/11
Figure 4. R-poly current over temperature sweep for different process corners in ADE XL
Spring 2023: SOC EE5004 5/11
Task1(Inverter)
Task2(Common Source)
Figure 7. Schematic
Spring 2023: SOC EE5004 8/11
Conclusion:
In the lab task, Corner analysis has been performed by checking the circuit
performance at all the process corners with control over temperature at the same
time by adding some model files. We performed the corner analysis on a simple
poly resistor and measure the change in resistance over temperature with different
corners (ss, ff, tt). The same Corner analysis is done with the inverter. In the end,
we perform the corner analysis with a common source amplifier with and without
the effect of temperature. We observed the Gain, Bandwidth, and Noise and drew
the Bar Graph at different values by taking TT as a reference.