1 Acceptability of Electronic Assemblies Foreword (cont.) 1.7 Verification of Dimensions ‘The actual measurements provided in this document (ie., specific part mourting and solder filet mensions and deter- minaton of percentages) are not required except for referee purpeses. All dmensins in this standard are expressed in SI (System Intemational) units (with Imperal English equivalent dimensions provided in brackels) 1.8 Magnification Aids and Lighting For visual inspection, some individual specifications mey call for magnification aids for examihing printed board assemblies. ‘The tolerance for magnifcation aids fs + 18% of the selected magnification power. Magniicetion ald, f used fer inspection Reed to be appropricte with the ftom being inspected. Light: Ing needs to be adequate for the magnification als used. Urlass magnification requirements ara ctherwise specfied by contractual documentation, the magnifications in Table 1.2 and Tab: 1-3 are determined by the item being inspected Referee conditions ate used to venty product rejected at te Inspection magnifecaton power. For assembles wit mbed land wieths, the greater magnification may be used for the centre assembly. Table 1-2 Inspection Magnification (Land Width) Magnification Power Land Wicths or Land [Inspection | Maximura Diameters! Range Referee 51,0 mm [0.0384 in} 1K to 3X x 20.5 01.0 nm 3Kto 7.5K 10K [0.0187 to 0.0394 in} 225 to 50.5 mm TEKto 10K 20K [0.00864 to 0.0197 in) 0.25 mm [0.00864 in] 20K 40% Note A poibr of cox patem used fr he cannesion andor gnificstion Aid App other Ereaniness eeaning Fegnicaton not requreos process) oes Note 7 Cloaninocs (ro-dlean processes per 10.44) Note 1 Encapsusion Notes 1.2 Star Componak ade aor damage, ete Note Vs inspadion nay aque the use of magia, 3, when ne Plc nigh dent asses ae resent, agraten ray be needed Note 2: F magneton isused islted to & minum.” 10 Printed Circuit Boards and Assemblies 10.4.3 Chlorides, Carbonates and White Residues (cont.) Figure 10-68 Figure 10-69 Figure 10-7010 Printed Circuit Boards and Assemblies 10.4.1 Flux Residues ‘The flux classification (see J-STD.CO4) and assembly process, Le, nb.clean, clean, etc., need to be identified and considered when anplying these crtera, ‘Target - Class 1,2,2 + Clean, no discemible residue. ‘Acceptable - Clase 1,2,3 + No alscefniple residue rom cleanable tunes 's allowed, + Flux residues from no-clean processes may be allowed. Figure 10.50 Defect - Class 1,2,3 + Discemible residue from cleanable flutes, or any activated ‘ux residues on electrical contact surfaces, Note 4. Class 1 may be acceptable after qulfication testing. Check also for fix entrapment in and under components Note 2. Flux residue actvty is defined in J-STD-001 and J-STD-004, Note 3. Processes designated “no-clean” need to comply with end-product eleentiness requremerts, Figure 10.5110 Printed Circuit Boards and Assemblies 10.4.3 Chlorides, Carbonates and White Residues Target - Class 1,2,3 + No discemible resitue, Figure 10-66 Defect - Class 1.2.3 + White residue on PCB surface, + White residues on or arcund the soldered termination, + Metalle areas exhibit crystaline white deposit Note: White residues resulting ram no-clean or ether pracesses sare acceptable provided the residues From cherristres used have been qualified and dacumerted as benign, See 10.4.4 Figure 10-67