IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, VOL. 38, NO.

2, APRIL 1991

135

Design of a High-Frequency Planar Power Transformer in Multilayer Technology

Dirk van der Linde, Corlex A. M. Boon, and J. Ben Klaassens
Abstract-A high-frequency power transformer in multilayer printed circuit board (ML-PCB) technology is presented for applications in switched-mode power supplies operating at frequencies up to several megahertz. The mechanical configuration of laboratory prototypes is discussed, as well as the electrical, parasitic, and thermal behavior. The presentation is focused on the leakage inductance since the analysis of other aspects is relatively simple. Test results show high efficiency, low leakage inductance, good thermal behavior, and line insulation properties of the transformer. Further, the topology enables the designer to make a tradeoff between leakage inductance and interwinding capacitance. Due to the well-defined geometry, parasitic interwinding capacitance and leakage inductance are reproducable and can be computed relatively easily.

I. INTRODUCTION

N THE NEW generation of power converters, miniaturization has become an important rule of design [ 11, [2], [5], [6], [ 111. Modem semiconductors allow fast switching and can be used to increase switching frequencies up to the megahertz region. Consequently, capacitive and magnetic components can be reduced in weight and size. This miniaturization, however, gives rise to some specific problems:
0

The parasitic components set limitations to the hf cut-off frequency. The parasitic behavior of conventional transformers is not reproducable. Sufficient cooling of compact power devices is often a problem.

Parasitic components play an important role in circuit behavior due to the high switching frequencies. For good hf properties, the leakage inductance and the interwinding capacitance have to be small; they both limit the hf cut-off frequency [4]. Energy stored in the parasitic leakage inductance may result in high-voltage peaks during switching of the vulnerable switching devices. These peaks cause dynamic power loss and excessive stress on components. A small leakage inductance can be achieved by a good inductive coupling between the primary and secondary. In practice, the windings are interleaved with small distances between the windings. This leads, however, to a high interwinding capacity. The requirements for a low leakage inductance and a low interwinding capacitance are contradictory. Therefore, the LC product of a transformer can be used as a figure of trouble. These parasitic effects and the related hf properties in conventionally wound transformers appear to be uncontrollable [7]. The
Manuscript received February 20, 1990; revised December 1990. D. van der Linde and C. A. M. Boon are with Hollandse Signaalapparaten B.V., the Hague, the Netherlands. J . B. Klaassens is with Delft University of Technology, Delft, the Netherlands. IEEE Log Number 9142807.

variables in the manufacturing process cause considerable tolerances in the winding geometry. A high degree of reproducibility is fully related to a strictly defined winding geometry. Only if reproduction can be guaranteed, an attempt is useful to calculate parasitic components. A compact converter module has a relatively small surface area for the conveyance of internally dissipated heat. To keep hot-spot temperature rise under control, a high converter efficiency is required. Additionally, a flat package provides the largest surface area and, therefore, the best heat transfer to the environment. For this reason, there is a tendency towards converter modules in flat-pack housing. The shape of a conventional transformer, however, is not very suitable for use in flat-pack modules. In order to approach the problems mentioned above, the idea was to design a transformer with its windings integrated into a multilayer printed circuit board (ML-PCB). Ferrite core-halves on either side of the multilayer winding package would complete the magnetic circuit (without air gap). This configuration would provide the following advantages. The winding geometry and its related parasitic behavior are defined within the (small) tolerances of PCB manufacturing and are therefore reproducable. Further, the entire transformer can be flat (planar transformer) since the windings consist of thin copper layers. These thin copper layers reduce skin effect losses. The flat configuration provides a relatively large surface area for the transfer of dissipated heat to the environment. The manufacturing process can be fully automated, although multilayer manufacturing requires dedicated facilities and skills. The ML-PCB transformer can be an integrated part of a circuit board with other components. In the following, the configuration of the ML-PCB transformer will be discussed. Then, aspects such as parasitics, line insulation, and thermal behavior will be discussed on the basis of prototypes.

11. MULTILAYER TRANSFORMER

A . Windings
A multilayer is composed of several double-sided printed circuit boards (bilayers) pressed and cemented together with epoxy resin. Each bilayer consists of a standard epoxy base-layer of 76 pm covered on both sides with a 60-pm copper layer. The epoxy resin layer between the bilayers measures 200 pm. In an ML-PCB, several distinct copper layers are available for creating the transformer windings. To connect individual turns in series or in parallel, interconnections between different layers have to be made by via holes. The copper layers intersected by the same via hole are electrically tied together. Fig. 1 shows the interconnection of individual turns in series using via holes. As shown, each copper layer contains one single turn with
01991 IEEE

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Fig. 1 .

Winding arrangement primary.

Fig. 3.

Winding arrangement secondary.

I

Primary Secondary

type 1 Fig. 4. Fig. 2. Alternative winding arrangement primary.

type 2 type 3 Arrangement of windings in prototype.

secondary windings. In type 3-, the primary and secondary windings are interleaved.

two connection flaps. Flaps to be interconnected are placed such that they can be intersected by the same via hole. The amount of turns that can be placed in series is limited by the available space for the connection flaps and is determined by the core type. A reduction in the number of flaps needed is achieved using a slightly different approach, as is depicted in Fig. 2. In this configuration, the two turns on each side of a bilayer are placed in series by a local via hole or buried hole. This requires the special treatment of making via holes in each individual bilayer before multilayer assembly, whereas in the previous configuration, all via holes are made in one run after multilayer assembly. Although more expensive, the limited amount of space for the connection flaps may leave no alternative. On the low side of the transformer, turns are connected in parallel. This can be realized very easily with the standard via holes, as is indicated in Fig. 3. The epoxy layers occupy a considerable part of the transformers winding space; the ML-PCB prototypes have an effective window utilization of 0.3. On the other hand, one should realize that in conventional transformers, for hf power applications, litz wire is mandatory to eliminate the skin effect, resulting in a comparable window utilization. To study the transformers parasitic effects, three types of the ML-PCB transformer were made. Each version differs from the others in winding configuration; thus, each has a different leakage inductance and intenvinding capacitance. These versions are explained with reference to Fig. 4. In type 1, the primary and secondary windings are split up in two separate groups. In type 2, the primary winding is sandwiched between two groups of

B. Ferrite Core
The selection of a suitable core is another point of discussion. The ML-PCB transformers configuration is flat, whereas the window of available standard cores is relatively high. A standard core can be adapted to the ML-PCB winding package by grinding off part of each core half, hence reducing the height of the transformer core. The core should provide openings large enough to enter and leave the winding space with the connection flaps. For the prototypes, the RM-14 core (Philips) is selected. The unmodified RM-14 core parameters are as follows: Effective cross-sectional area effective magnetic path length effective volume of the core mass of the core set relative permeability

A , = 198 mm2 I , = 70 mm V, = 13 900 mm3 m e = 74 gr

/L .

= 2000.

The RM-14 encloses a considerable part of the winding space while sufficient space for the interconnection flaps remains. The RM-14 is also available in Philips new 3F3 femte especially designed for hf power applications.

(B,,

330 mT, T,

> 200 C ;PloSs 150 W/dm3 5

at 400 kHz, 50 mT).

The prototype of the ML-PCB transformer was tested in existing lab model 5-V-25-A converters operating at 1 MHz. This application required a 1:8 transformer turns ratio and a center tap on the secondary side (see Fig. 3). The primary winding consists of eight turns in series, using

VAN DER LINDE et al.: DESIGN OF A PLANAR POWER TRANSFORMER

I37

the buried-hole method as described with reference to Fig. 2. For each secondary tap, eight turns are connected in parallel in order to divide copper losses equally between the primary and secondary. Twelve bilayers appear to be necessary to obtain the 24 distinct copper layers, resulting in a 5-mm-thick ML-PCB winding package. The original RM-14 core has a window height of ca. 20 mm, whereas the ML-transformers winding package is only ca. 5 mm thick. To adapt the core to the ML-PCB transformer package, the cores window height is reduced by grinding off part of each core half. The modified RM-14 core has a window that is just high enough to fit the winding package (ca. 5 mm). The cores weight is reduced by 40 gr and the effective window perimeter by 30 mm. The result is a flat transformer configuration, and with a relatively flat but wide window, providing sufficient space for the amount of copper required in power applications. Next, the parasitic behavior of the prototypes will be discussed.
111. PARASITICS HF-BEHAVIOR AND

a;

4
aA B =--. Y ax
(4)

Fig. 5.

Cross section of the winding area by Roth.

where J is the current density at point ( x , y ) . Within the winding space, J = 0 (outside the copper) or J # 0 (inside the copper). The components B , and B y of the magnetic field can be derived from the magnetic potential A :

A . Leakage Inductance
The leakage inductance is a lumped element, representing the parasitic effect of a nonperfect inductive coupling between the primary and secondary windings. A coupling factor smaller than one results in a magnetic field within the winding space of the transformer. The magnetic energy E, store in this field is directly related to the leakage inductance L , by

=-

aA ay

and

E, = iL,12 (1) where I is the current through the primary winding, and L , is the total leakage inductance transformed at the primary side. To obtain the value of the leakage inductance, one needs to study the magnetic field in the transformers winding space. Once the B components are known, the energy stored in the magnetic field can be obtained simply by volume integration: E, = f p p O j vB 2 d V .
(2)

A diversity of software packages is available solving these equations by finite element methods. Examined packages either required extensive hardware facilities (mainframes) or gave unsatisfactory results. Therefore, we tried to employ calculation methods known from literature. Roth [ 121 presents analytical solutions to the magnetic field components in quasi two-dimensional structures. Roth describes a radial intersection of the winding space enclosed by ferrite, containing rectangular conductors as the windings. Since the multilayer transformers windings consist of rectangular copper layers, Roths method for describing the magnetic field is very suitable in this case. Fig. 5 shows a radial intersection of an arbitrary transformer configuration. Roth describes the magnetic potential A according to the geometrical parameters as given in Fig. 5:
m m

In [8] and [lo], methods describing the magnetic field inside the winding space of transformers have been presented and have resulted in simple formulae for the leakage inductance, e.g., Kapps formula. These methods, however, are known to be imprecise. Several simplifications are the cause of errors up to 100%. First, the configuration is described as being rotation symmetric. In this case, the originally three-dimensional field analysis can be reduced to a two-dimensional model, describing a radial intersection of the winding space. Second, a far-too-simple interpretation of Amperes law leads to the incorrect conclusion that the leakage flux is restricted to the area between the primary and secondary windings and has the same direction and value in every point of that area. In the case of the ML-PCB transformers, the results, obtained with these simplifications, showed considerable differences compared with measured values. Clearly, this approach is insufficient for a satisfactory description of the ML-transformers behavior. In a second attempt to compute the leakage inductance, the configuration was still described as rotation symmetric, but here, precise field calculations were made. In general, a magnetic field can be described by means of a magnetic potential vector A . In the case of a (quasi-) two-dimensional configuration

A
where

= i=l k=l

1 A;,
mi
=

cos ( m i x )cos ( n , y )

( i - l)a/a

n,
16 T A;, = lOab

(k - l)a/b

Ij[sin(mia>)

sin(miaj)][sin(nkbj

sin(nkbj)]

j=1

( a ) - a j ) (b; - b j )mink(m f

+ ni)

(3)

and where q is the number of individual conductors in the winding space, and I j is the current in conductor j . Now that the potential vector has been determined, the components of the magnetic field can be obtained as indicated in formula (4). From the magnetic field components, the leakage inductance can be computed (formulae (1) and (2)). Results obtained by Roths method are verified by a two-dimensional finite element analysis using suitable software. Compared with the outcomes of Kapps formula, Roths results match the results of measurements on prototypes that are considerably better. The remaining errors are attributed to the inaccuracy of describing the configuration as rotation symmetric. Improvement could be

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IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, VOL. 38, NO. 2, APRIL 1991

occur around the windings edges and in the space between the windings and the ferrite.
Secondary

B. Magnetizing Inductance
Fig. 6. Cross-section winding area.

The magnetizing inductance is determined by the core parameters and by the number of primary turns:

where
po p,

permeability of air relative permeability of the ferrite core A , effective core area le effective window perimeter.

The modified RM-14 core, obtained by grinding off 15 mm of its window height, has an effective window perimeter approximately 2 x 15 = 30 mm smaller than the unmodified core. Hence, in this case
p r = 2000 (3F3)

I,

40 mm
=

A,

198 mm2

Le = 633pH (measured: 640 p H )

C. Interwinding Capacitance The parasitic capacitance Cps between the primary and secondary windings strongly affects the transformers hf properties. It is desirable to keep Cps small. In the case of the ML-PCB transformer, Cps can be computed easily since the windings consist of parallel, flat conductors. The capacitance between two windings can be found simply by using the formula for the capacitance between two parallel conductive plates. Table I gives the results with respect to the ML-PCB transformer prototypes. Clearly, the capacitance between the windings is not particularly small. In type 3, the Cps of 589 pF will be unacceptable in most cases. With the configuration of flat conductors at close distances in combination with the epoxys E, = 7, one could hardly expect better results; it is the price one has to pay for the very low leakage inductance. As mentioned before, the requirements for a low leakage inductance and a low interwinding capacity are contradictory. Nevertheless, an exchange between the leakage inductance and interwinding capacity can be achieved simply by changing the winding configuration. The overall hf-properties are determined by the product of L , and Cps. Table I1 shows the parasitics and LC product of a prototype of the planar transformer. This transformer with the winding configuration according to type 2 has the lowest figure of trouble and is the best approximation of the ideal transformer. To complete the picture, in Table 11, this ML-PCB transformer is compared with a conventional 1:8 transformer on an RM-10 core designed for similar applications and with an extrapolation of the transformer designed by Estrov [ 2 ] . According to Table 11, the ML-PCB transformer has a very low leakage inductance and a relatively high magnetizing inductance. In this case, the leakage inductance drops under 0.1 % of the magnetizing inductance. On the other hand, the ML-PCB transformer has a relatively high interwinding capacitance. This can be attributed to the use of flat windings at close interwinding distances in combination with the epoxys E, = 7. Nevertheless,

(C)

Fig. 7. Results of computer simulation of the magnetic field lines in the winding area: (a) Expression following Roth; (b) finite element calculation; (c) first-order approximation.

made by using an accurate three-dimensional (finite-element) analysis, which is, of course, more complicated. To illustrate the basic magnetic field inside the multilayer transformer, a configuration of one primary and one secondary turn is discussed. The winding space is surrounded by high-permeability ferrite. The radial intersection of the winding space is given in Fig. 6. The formulae according to Roths theory are implemented in a straightforward Pascal program for a personal computer (with coprocessor). The intersection is divided into an n x m grid. At every single grid point, the magnetic-field components are computed. The results are displayed as line elements in the winding space in Fig. 7(a). A line element shows the direction of the magnetic field at that point of the winding space, just like a compass needle. The line elements do not provide direct information about the absolute value of the magnetic field. As mentioned, results were verified with finite element software. Fig. 7(b) shows the magnetic lines of force according to the MAGGIE software package (Philips). These lines also provide information related to the direction of the magnetic field at each point of the line but do not give direct information about the absolute value of the magnetic field. In Fig. 7(c), the line elements are shown according to the approximation leading to Kapps formula. As shown, the approximations main errors

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IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS. VOL. 38, NO. 2, APRIL 1991

.... .

0 *P'J 0 rc.in
copper

U0

(f=+=-jq
Fig. 8.

______..-

qq----==(p
L1 E1
Fig. 9.

Fe

P/2

% I

(b) Model heat transfer: (a) Smgle-slded cooling (print-board mounted); (b) double-sided cooling

VII. CONCLUSIONS
A transformer in multilayer printed circuit-board technology is presented, and properties are discussed on the basis of prototypes. The configuration has a low leakage inductance and a high magnetizing inductance; the leakage inductance is less than 0.1 % of the magnetizing inductance. Although the interwinding capacitance is relatively high, the LC product remains low. Further, the designer can trade leakage inductance against interwinding capacitance in a predictable way by changing the arrangement of the windings. The use of a multilayer winding package provides enough copper for power applications up to 200 W for the modified RM-14 core. Fig. 9 shows an experimental transformer that has been tested in a boost converter operating at 1 MHz.

Experimental transformer.

The prototypes of this compact transformer showed good line insulation properties and thermal behavior. Only the tolerance in the epoxy resin layers causes tolerances of 10% in the parasitic leakage inductance and interwinding capacity, setting some limitations to the reproducibility. It may be worthwhile to investigate possibilities to reduce these tolerances in the production process.

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139

TABLE I Type
1 2 3

meas.
1050 nH 450 nH 285 nH

L S

calc .
975 nH 365 nH 130 nH

meas.
640 pH

Le

calc.
633 pH

meas.
117 pF 164 pF 589 pF

CPS

calc.
119 pF 159 pF 517 pF

LSCPS

meas.

1.23 0.74 1.68

s2

s2

the different layers yields

TABLE I1

transformer
RM-10
Rprim, DC R S , , , DC
LS

Estrov design
(1986) 120 mO 1.25 mil 2200 nH 75 pF 445 WH 165 fs2

Planar transformer
41 mO 0.7 mO 450 nH 164 pF 640 pH 74 fs2

Assuming an effective secondary current of 25 A, the secondary winding resistance of 0.7 mQ per tap and the primary resistance Le of 41 mQ result in total copper losses of approximately 0.8 W at ISCDS a frequency of 1 MHz. With an equal amount of core loss, the maximum temperature rise in the configurations according to Fig. 4 are calculated. the LC product remains low due to the low leakage inductance. In the case of heat transfer to one side of the multilayer, the The ML-PCB configuration seems very suitable for hf power insulated side of the multilayer will reach 15C above heatsink applications where a low leakage inductance has priority over a temperature. In the case of heat transfer to both sides of the low interwinding capacity. multilayer, the maximum temperature rise occurs in the middle of the multilayer at 5C above heatsink temperature. As shown, IV. HIGH-VOLTAGE INSULATION temperature rise remains moderate, especially when heat transIf an off-line power supply needs to provide line insulation, fer can be realized in both directions. In practice, however, it the transformer will have to meet certain insulation require- might be difficult to establish a thermal contact between the ments. In the ML-PCB transformer, all copper layers are indi- ferrite and the multilayer on both sides since the thickness of the vidually surrounded by epoxy (base-layer) and epoxy resin multilayer is subject to tolerances due to variations in the (between the bilayers). For this, requirements are within the thickness of the epoxy resin layers. category of distance through insulation, and the requirements Due to the low dc resistance of the windings, in combination for creepage and clearance are simply not applicable. with the good heat transfer to the environment, the ML-PCB In the prototypes, primary and secondary windings are sepa- transformer can handle high secondary currents. In the laborarated by a 200-pm epoxy resin layer. According to manufactur- tory models of a dc-dc converter the ML-PCB transformer ers specifications, the resin can handle 30 V/pm, hence provid- distributes 5 V-35 A without running hot. For this situation, the ing insulation up to 6 kV. After prototypes were exposed to a transformers power dissipation is close to 1% of the total output 90% humidity at 40C during a five-day period, the breakdown power. voltage between primary and secondary still exceeded 4 kV, VI. REPRODUCTION whereas breakdown between windings and core occurred at ca. 2.5 kV. Although these results are very encouraging for a One of the objectives while choosing the ML-PCB configuracompact transformer under these circumstances, the insulation tion was the reproduction of the parasitic effects. Since the between windings and core is less than expected. The multi- layout of all layers has to remain within small tolerances of PCB layers edges probably suffer from very slight damage caused by manufacturing, a high degree of reproduction was expected. the cluttering process. Another explanation could be the pres- Only the thickness of the epoxy resin layers is subject to some ence of small air bubbles in the epoxy resin. tolerance. During multilayer assembly, the distinct bilayers are cemented together under pressure. During this process, control V . THERMAL MANAGEMENT over the thickness of the resin layers is limited. A tolerance of The main mechanism for the disposal of the dissipated heat is 15% can be expected. This tolerance applies to the resin layers the thermal conduction in the axial direction, which is perpen- only. The tolerance on the epoxy base layers and the copper dicular to the layers. Therefore, a worst-case thermal analysis layers can be neglected. This tolerance affects the reproduction of the transformers can be made by assuming that this is the only mechanism for heat transfer. Two situations will be discussed: first, conduction parasitic behavior since the distances between the windings and of all dissipated heat to one side of the multilayer and second, therefore the capacitive and inductive coupling are not precisely conduction to both sides of the multilayer. Both situations can be determined. In the case of the prototypes, the effect on the represented by an equivalent electrical network of current sources leakage inductance and interwinding capacity lies within a tolerrepresenting the heat dissipated in the copper layers and of ance of ca. 10%. resistors representing the thermal resistance of the individual The tolerance in the epoxy resin layers also results in a layers, as is indicated in Fig. 8. The computed node voltages tolerance in the thickness of the entire multilayer winding package. For this reason, it will be difficult to establish a thermal represent the temperatures in each layer. To compute the temperature distribution in the multilayer, one contact between the multilayer and the ferrite on both sides needs the amount of heat dissipated in each layer as well as the unless each core is grinded to fit each winding package individuthermal resistance of each layer. For the thermal resistance of ally.
CPS

10.4 mfl 0.9 mO 1800 nH 50 pF 300 pH 90 fs2

60-pm copper layer 76-pm epoxy layer 200-pm resin layer Ferrite (PCB to heatsink)

0.00034 C/W
0.67 C/W 1.8 C/W 2.9 OC/W

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141

ACKNOWLEDGMENT
The authors wish to thank Hollandse Signaalapparaten B.V. for their permission to publish this material, D. Moezel for indicating the potentials of multilayer technology, C. van Aken for the layout work, F. A . Ros from the multilayer workshop for manufacturing the prototypes, and Philips-Elcoma for grinding the ferrite cores.
161 [7] [8] [9] [lo] [ll]

element analysis of copper loss in 1-10 MHz transformers, in ZEEE Power Electron. Specialists Conf. Rec. (Japan), 1988, pp. 1105-1111. -, Issues related to 1-10-MHz transformer design,ZEEE Trans. Power Electron., vol. 4 , pp.113-123, 1989. P. M. Gradzki and F. C . Lee, Design of high-frequency hybrid power transformer, in Third A n n . ZEEE Power Electron. Conf. Rec., 1988, 319-326. B. Hague, Electromagnetic Problems in Electrical Engineering. Oxford, England: Oxford University Press, 1929. A. L. Morris, Influence of various factors upon leakage reactance of transformers,J. ZEE, no. 86, pp. 485-495, 1940. F. E. Terman, Radio Engineers Handbook. New York: McGraw-Hill, 1943. S . Ohzora and T. Koyashiki, Miniaturization of low-power constant-current converter by applying a height reduced transformer, in IEEE Power Electron. Specialist Conf. Rec. (Kyoto), 1988, pp. 1127-1132. E. Roth,Analytical study of the leakage field of transformers and of the mechanical forces exerted on the windings,Revue GenPrale de IElectricitb, no. 23, pp. 113, 1928.

REFERENCES
[ l ] W. C . Bowman et al., A resonant dc-to-dc converter operating at 22 MHz, in Third Ann. ZEEE Power Electron. Conf. Rec., 1988, pp. 3-11. 121 A. Estrov, Power transformer design for 1 MHz resonant converter, in High Frequency Power Conv. Conf. Rec., 1986, pp. 36-54. [31 -, Planar magnetics for power converters, ZEEE Trans. Power Electron., vol. 31, pp. 46-53, 1989. 141 W. M. Flanagan, Handbook of Transformer Applications. New York: McGraw-Hill, 1986. [5] A. F. Goldberg, J. G. Kassakian, and M. F. Schlecht, Finite

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