CHAPTER 1

1.0 ABSTRACT

The System designs a mobile rescue robotic Vehicle system based on

Arduino to help the people on time which are trapped in natural calamity like
disaster, earthquake, floods etc. It gives timely & accurately reflect dynamic
situation of human in disaster region like in the underground regions to control
room, so that rescue team of Experts & doctors can be sending to the victim‟s
location for primary treatment and can be sent to the safe place or hospital.

PIR sensor which detects movement of people with the help of changes in
the infrared (heat) levels emitted by surrounding objects. It is received and
manipulated by the PIR sensor to detect human beings. The motion of the
human being can be detected by checking for a sudden change in the
surrounding IR patterns. Obstacle sensor detects the obstacle and sends the
analog signals to the Arduino & the robot automatically depending on the
obstacle detected and to send the human being information to remote control
place through the Bluetooth Receiver. Analyzing the data the Rescue team can
take necessary steps to rescue the trapped human Beings.

1
1.1 BLOCK DIAGRAM

BATTERY MOTOR1

PIR SENSOR MOTOR DRIVER

MICROCONTROLLER

BLUETOOTH MOTOR2

ROBO SETUP

1.2 DESCRIPTION
In this project we are using PIC16F877A microcontroller is used for
control the entire process. It interfaces the input and output devices like sensor,
relays, motor driver etc. The PIR sensor is used to detect the human movements
or body heat whether the human is alive of not. The motor driver is used in this
project for robot setup to control the motor forward and reverse directions. The
detected human aliveness will intimate to tracking persons through Bluetooth.
The battery is used in this project for source of power supply to entire system
and it‟s functionally.

2
2.3 CIRCUIT DIAGRAM

2.4 DESCRIPTION
In this project we are using PIC16F877A microcontroller and it has 5 ports namely
port A, B, C, D, and E. It has inbuilt ADC, interrupts and timers. An input PIR sensors are
connected to the ADC pin of the pic microcontroller that is A0 and A1 and the driver is
connected at the port C of C0, C1, C2, C3 in the pic microcontroller. The motors are
connected in the driver board to move the robo in forward, backward and stop. When the
PIR1 & PIR2 sensors send the signal, the pic microcontroller will command the motor to stop
and LCD display shows the right or left side detection. If there no detection of sensors or
after detection then robo move forward. In power supply the all components like
microcontroller, PIR sensors and leds are 5v in power and it will be step downed by 12v DC
battery. Then it and then 7805 5v regulator to supply to all materials.

3
 CHAPTER 2
2. BATTERY

An electric battery is a device consisting of one or more electrochemical cells that

convert stored chemical energy into electrical energy. Each cell contains a positive terminal,
or cathode, and a negative terminal, or anode. Electrolytes allow ions to move between the
electrodes and terminals, which allows current to flow out of the battery to perform work.

Primary (single-use or "disposable") batteries are used once and discarded; the
electrode materials are irreversibly changed during discharge. Common examples are the
alkaline battery used for flashlights and a multitude of portable devices. Secondary
(rechargeable batteries) can be discharged and recharged multiple times; the original
composition of the electrodes can be restored by reverse current. Examples include the lead-
acid batteries used in vehicles and lithium ion batteries used for portable electronics.

Batteries come in many shapes and sizes, from miniature cells used to power hearing
aids and wristwatches to battery banks the size of rooms that provide standby power for
telephone exchanges and computer data centers.

According to a 2005 estimate, the worldwide battery industry generates US$48 billion in
sales each year, with 6% annual growth.

PRINCIPLE OF OPERATION

A voltaic cell for demonstration purposes. In this example the two half-cells are linked by a
salt bridge separator that permits the transfer of ions.

Batteries convert chemical energy directly to electrical energy. A battery consists of

some number of voltaic cells. Each cell consists of two half-cells connected in series by a
conductive electrolyte containing anions and cations. One half-cell includes electrolyte and

4
the negative electrode, the electrode to which anions (negatively charged ions) migrate; the
other half-cell includes electrolyte and the positive electrode to which cations (positively
charged ions) migrate. Redox reactions power the battery. Cations are reduced (electrons are
added) at the cathode during charging, while anions are oxidized (electrons are removed) at
the anode during discharge. The electrodes do not touch each other, but are electrically
connected by the electrolyte. Some cells use different electrolytes for each half-cell. A
separator allows ions to flow between half-cells, but prevents mixing of the electrolytes.

Each half-cell has an electromotive force (or emf), determined by its ability to drive
electric current from the interior to the exterior of the cell. The net emf of the cell is the
difference between the emfs of its half-cells.[12] Thus, if the electrodes have emfs and ,
then the net emf is ; in other words, the net emf is the difference between the
reduction potentials of the half-reactions.

The electrical driving force or across the terminals of a cell is known as the
terminal voltage (difference) and is measured in volts. The terminal voltage of a cell that is
neither charging nor discharging is called the open-circuit voltage and equals the emf of the
cell. Because of internal resistance, the terminal voltage of a cell that is discharging is smaller
in magnitude than the open-circuit voltage and the terminal voltage of a cell that is charging
exceeds the open-circuit voltage.

CATEGORIES AND TYPES OF BATTERIES

From left to right: a large 4.5-volt (3R12) battery, a D Cell, a C cell, an AA cell, an AAA
cell, an AAAA cell, an A23 battery, a 9-volt PP3 battery, and a pair of button cells (CR2032
and LR44).

Batteries are classified into primary and secondary forms.

5
  Primary batteries irreversibly transform chemical energy to electrical energy. When
the supply of reactants is exhausted, energy cannot be readily restored to the battery.
 Secondary batteries can be recharged; that is, they can have their chemical reactions
reversed by supplying electrical energy to the cell, approximately restoring their
original composition.

Some types of primary batteries used, for example, for telegraph circuits, were restored to
operation by replacing the electrodes.[21] Secondary batteries are not indefinitely rechargeable
due to dissipation of the active materials, loss of electrolyte and internal corrosion.

Primary batteries

Primary batteries, or primary cells, can produce current immediately on assembly.

These are most commonly used in portable devices that have low current drain, are used only
intermittently, or are used well away from an alternative power source, such as in alarm and
communication circuits where other electric power is only intermittently available.
Disposable primary cells cannot be reliably recharged, since the chemical reactions are not
easily reversible and active materials may not return to their original forms. Battery
manufacturers recommend against attempting to recharge primary cells.

In general, these have higher energy densities than rechargeable batteries,[23] but
disposable batteries do not fare well under high-drain applications with loads under 75 ohms
(75 Ω). Common types of disposable batteries include zinc–carbon batteries and alkaline
batteries.

Secondary batteries

Secondary batteries, also known as secondary cells, or rechargeable batteries, must be

charged before first use; they are usually assembled with active materials in the discharged
state. Rechargeable batteries are (re)charged by applying electric current, which reverses the
chemical reactions that occur during discharge/use. Devices to supply the appropriate current
are called chargers.

The oldest form of rechargeable battery is the lead–acid battery. This technology
contains liquid electrolyte in an unsealed container, requiring that the battery be kept upright
and the area be well ventilated to ensure safe dispersal of the hydrogen gas it produces during

6
overcharging. The lead–acid battery is relatively heavy for the amount of electrical energy it
can supply. Its low manufacturing cost and its high surge current levels make it common
where its capacity (over approximately 10 Ah) is more important than weight and handling
issues. A common application is the modern car battery, which can, in general, deliver a peak
current of 450 amperes.

The sealed valve regulated lead–acid battery (VRLA battery) is popular in the automotive
industry as a replacement for the lead–acid wet cell. The VRLA battery uses an immobilized
sulfuric acid electrolyte, reducing the chance of leakage and extending shelf life. VRLA
batteries immobilize the electrolyte. The two types are:

 Gel batteries (or "gel cell") use a semi-solid electrolyte.

 Absorbed Glass Mat (AGM) batteries absorb the electrolyte in a special fiberglass
matting.

Other portable rechargeable batteries include several sealed "dry cell" types, that are
useful in applications such as mobile phones and laptop computers. Cells of this type (in
order of increasing power density and cost) include nickel–cadmium (NiCd), nickel–zinc
(NiZn), nickel metal hydride (NiMH), and lithium-ion (Li-ion) cells. Li-ion has by far the
highest share of the dry cell rechargeable market. NiMH has replaced NiCd in most
applications due to its higher capacity, but NiCd remains in use in power tools, two-way
radios, and medical equipment.

Recent developments include batteries with embedded electronics such as USBCELL,

which allows charging an AA battery through a USB connector, nanoball batteries that allow
for a discharge rate about 100x greater than current batteries, and smart battery packs with
state-of-charge monitors and battery protection circuits that prevent damage on over-
discharge. Low self-discharge (LSD) allows secondary cells to be charged prior to shipping.

Battery cell types

Many types of electrochemical cells have been produced, with varying chemical processes
and designs, including galvanic cells, electrolytic cells, fuel cells, flow cells and voltaic piles.

7
Wet cell

A wet cell battery has a liquid electrolyte. Other names are flooded cell, since the liquid
covers all internal parts, or vented cell, since gases produced during operation can escape to
the air. Wet cells were a precursor to dry cells and are commonly used as a learning tool for
electrochemistry. They can be built with common laboratory supplies, such as beakers, for
demonstrations of how electrochemical cells work. A particular type of wet cell known as a
concentration cell is important in understanding corrosion.

Wet cells may be primary cells (non-rechargeable) or secondary cells (rechargeable).

Originally, all practical primary batteries such as the Daniell cell were built as open-top glass
jar wet cells. Other primary wet cells are the Leclanche cell, Grove cell, Bunsen cell,
Chromic acid cell, Clark cell, and Weston cell. The Leclanche cell chemistry was adapted to
the first dry cells. Wet cells are still used in automobile batteries and in industry for standby
power for switchgear, telecommunication or large uninterruptible power supplies, but in
many places batteries with gel cells have been used instead. These applications commonly
use lead–acid or nickel–cadmium cells.

Dry cell
Further information: Dry cell

Line art drawing of a dry cell:

1. brass cap, 2. plastic seal, 3. expansion space, 4. porous cardboard, 5. zinc can, 6. carbon
rod, 7. chemical mixture.

8
 CHAPTER 3

3.1 PIC MICROCONTROLLER

PIC is a family of Harvard architecture microcontrollers made by Microchip

Technology, derived from the PIC1650 originally developed by General Instrument's
Microelectronics Division. The name PIC initially referred to "Peripheral Interface
Controller".
PICs are popular with both industrial developers and hobbyists alike due to their low cost,
wide availability, large user base, extensive collection of application notes, availability of low
cost or free development tools, and serial programming (and re-programming with flash
memory) capability.

3.1.1 HIGH-PERFORMANCE RISC CPU:

 Only 35-75 single-word instructions to learn

 All single-cycle instructions except for program branches, which are two-cycle
 Operating speed: DC – 20 MHz clock input
 DC – 200 ns instruction cycle
 Up to 8K x 14 words of Flash Program Memory,
 Up to 368 x 8 bytes of Data Memory (RAM),
 Up to 256 x 8 bytes of EEPROM Data Memory
 Pin out compatible to other 28-pin or 40/44-pin PIC16CXXX and PIC16FXXX
microcontrollers

PERIPHERAL FEATURES:

 Timer0: 8-bit timer/counter with 8-bit prescaler

 Timer1: 16-bit timer/counter with prescaler, can be incremented during Sleep
via external crystal/clock
 Timer2: 8-bit timer/counter with 8-bit period register, prescaler and postscaler
 Two Capture, Compare, PWM modules
 Capture is 16-bit, max. Resolution is 12.5 ns
 Compare is 16-bit, max. Resolution is 200 ns
 PWM max. Resolution is 10-bit

9
  Synchronous Serial Port (SSP) with SPI™ (Master mode) and I2C™
(Master/Slave)
 Universal Synchronous Asynchronous Receiver Transmitter (USART/SCI)
with 9-bit address detection
 Parallel Slave Port (PSP) – 8 bits wide with external RD, WR and CS controls
(40/44-pin only)
 Brown-out detection circuitry for Brown-out Reset (BOR)

3.1.2 ANALOG FEATURES:

 10-bit, up to 8-channel Analog-to-Digital Converter (A/D)

 Brown-out Reset (BOR)
 Analog Comparator module with:
- Two analog comparators
- Programmable on-chip voltage reference (VREF) module
- Programmable input multiplexing from device inputs and internal voltage
reference
- Comparator outputs are externally accessible

3.2 SPECIAL MICROCONTROLLER FEATURES:

 100,000 erase/write cycle Enhanced Flash program memory typical

 1,000,000 erase/write cycle Data EEPROM memory typical
 Data EEPROM Retention > 40 years
 Self-reprogrammable under software control
 In-Circuit Serial Programming™ (ICSP™) via two pins
 Single-supply 5V In-Circuit Serial Programming
 Watchdog Timer (WDT) with its own on-chip RC oscillator for reliable operation
 Programmable code protection
 Power saving Sleep mode
 Selectable oscillator options
 In-Circuit Debug (ICD) via two pins

3.3 PIN DIAGRAMS

10
3.4 DEVICE OVERVIEW
This document contains device specific information about the following devices:
PIC16F877A
PIC16F873A/876A devices are available only in 28-pin packages, while PIC16F874A/877A
devices are available in 40-pin and 44-pin packages. All devices in the PIC16F87XA family
share common architecture with the following differences:
• The PIC16F873A and PIC16F874A have one-half of the total on-chip memory of the
PIC16F876A and PIC16F877A
• The 28-pin devices have three I/O ports, while the 40/44-pin devices have five
• The 28-pin devices have fourteen interrupts, while the 40/44-pin devices have fifteen
• The 28-pin devices have five A/D input channels, while the 40/44-pin devices have eight
• The Parallel Slave Port is implemented only on the 40/44-pin devices

11
3.4 PIC16F87XA DEVICE FEATURES

Key Features PIC16F877A

Operating Frequency DC – 20 MHz
Resets (and Delays) POR, BOR
(PWRT, OST)
Flash Program Memory 8K
(14-bit words)
Data Memory (bytes) 368
EEPROM Data Memory (bytes) 256
Interrupts 15
I/O Ports Ports A, B, C, D, E
Timers 3
Capture/Compare/PWM modules 2
Serial Communications MSSP, USART
Parallel Communications PSP
10-bit Analog-to-Digital Module 8 input channels
Analog Comparators 2
Instruction Set 35 Instructions
Packages 40-pin PDIP
44-pin PLCC
44-pin TQFP
44-pin QFN

12
3.5 PIC16F874A/877A BLOCK DIAGRAM

13
3.6 PIC16F877A PINOUT DESCRIPTION

PIN-1 - MCLR/VPP
Master Clear (input) or programming voltage (output).Master Clear (Reset) input. This pin is
an active low Reset to the device. Programming voltage input.
PORT-A (PIN OUT IS 2 TO 7)
PORT-A is a bidirectional I/O port
PIN-2- RA0/AN0
Digital I/O. Analog input 0.
PIN-3-RA1/AN1
Digital I/O. Analog input 1.
PIN-4- RA2/AN2/VREF-/CVREF
Digital I/O. Analog input 2.
A/D reference voltage (Low) input.
Comparator VREF output
PIN-5-RA3/AN3 /VREF+
Digital I/O. Analog input 3.
A/D reference voltage (High) input.
PIN-6- RA4/T0CKI/C1OUT
Digital I/O – Open-drain when configured as output.
Timer0 external clock input. Comparator 1 output.
PIN-7- RA5/AN4/SS/C2OUT
Digital I/O. Analog input 4. SPI slave select input. Comparator 2 output.
PORT-E (PINOUT IS 8 TO 10)
PORT-E is a bidirectional I/O port
PIN-8-RE0/RD/AN5
Digital I/O. Read control for Parallel Slave Port. Analog input 5.
PIN-9- RE1/WR/AN6
Digital I/O. Write control for Parallel Slave Port. Analog input 6.
PIN-10- RE2/CS/AN7
Digital I/O. Chip select control for Parallel Slave Port. Analog input 7.
POWER PIN

14
PIN-11 AND 32-VDD
Positive supply for logic and I/O pins
PIN-12 AND 31-VSS
Ground reference for logic and I/O pins.
PIN-13- OSC1/CLKI
Oscillator crystal or external clock input. Oscillator crystal input or external clock source
input. ST buffer when configured in RC mode; otherwise CMOS. External clock source
input. Always associated with pin function OSC1 (see OSC1/CLKI, OSC2/CLKO pins)
PIN-14- OSC2/CLKO
Oscillator crystal or clock output. Oscillator crystal output. Connects to crystal or resonator in
Crystal Oscillator mode. In RC mode, OSC2 pin outputs CLKO, which has 1/4 the frequency
of OSC1 and denotes the instruction cycle rate.
PORT-C (PIN OUT IS 15 TO 18 & 23 TO 26)
PORTC is a bidirectional I/O port.
PIN-15- RC0/T1OSO/T1CKI
Digital I/O. Timer1 oscillator output. Timer1 external clock input
PIN-16- RC1/T1OSI/CCP2
Digital I/O. Timer1 oscillator input. Capture2 input, Compare2 output, PWM2 output.
PIN-17- RC2/CCP1
Digital I/O. Capture1 input, Compare1 output, PWM1 output
PIN-18- RC3/SCK/SCL
Digital I/O. Synchronous serial clock input/output for SPI mode.
Synchronous serial clock input/output for I2C mode.
PIN-23- RC4/SDI/SDA
Digital I/O. SPI data in. I2C data I/O.
PIN-24- RC5/SDO
Digital I/O. SPI data out.
PIN-25- RC6/TX/CK
Digital I/O. USART asynchronous transmit. USART1 synchronous clock.
PIN-26- RC7/RX/DT
Digital I/O. USART asynchronous receive. USART synchronous data.
PORT-D (PINOUT IS 19 TO 22 & 27 TO 30)
PORTD is a bidirectional I/O port or Parallel Slave Port when interfacing to a microprocessor
bus.

15
PIN-19- RD0/PSP0
Digital I/O. Parallel Slave Port data.
PIN-20- RD1/PSP1
Digital I/O. Parallel Slave Port data.
PIN-21- RD2/PSP2
Digital I/O. Parallel Slave Port data.
PIN-22- RD3/PSP3
Digital I/O. Parallel Slave Port data.
PIN-27- RD4/PSP4
Digital I/O. Parallel Slave Port data.
PIN-28- RD5/PSP5
Digital I/O. Parallel Slave Port data.
PIN-29- RD6/PSP6
Digital I/O. Parallel Slave Port data.
PIN-30- RD7/PSP7
Digital I/O. Parallel Slave Port data.
PORT-B(PIN OUT IS 33 TO 40)
PORTB is a bidirectional I/O port. PORTB can be software programmed for internal weak
pull-up on all inputs.
PIN-33- RB0/INT
Digital I/O. External interrupt
PIN-34- RB1
Digital I/O.
PIN-35- RB2
Digital I/O.
PIN-36- RB3/PGM
Digital I/O. Low-voltage ICSP programming enable pin.
PIN-37- RB4
Digital I/O.
PIN-38- RB5
Digital I/O.
PIN-39- RB6/PGC
Digital I/O. In-circuit debugger and ICSP programming clock.
PIN-40- RB7/PGD

16
Digital I/O. In-circuit debugger and ICSP programming data.

3.7 MEMORY ORGANIZATION

There are three memory blocks in each of the PIC16F87XA devices. The program memory
and data memory have separate buses so that concurrent access can occur and is detailed in
this section. The EEPROM data memory block is detailed in “Data EEPROM and Flash
Program Memory”. Additional information on device memory may be found in the
PICmicro® Mid-Range MCU Family Reference Manual (DS33023).

3.8 Program Memory Organization

The PIC16F87XA devices have a 13-bit program counter capable of addressing an 8K word x
14 bit program memory space. The PIC16F876A/877A devices have 8K words x 14 bits of
Flash program memory. Accessing a location above the physically implemented address will
cause a wraparound.
The Reset vector is at 0000h and the interrupt vector is at 0004h.

3.9 PIC16F877A PROGRAM MEMORY MAP AND STACK

17
Data Memory Organization
The data memory is partitioned into multiple banks which contain the General
Purpose Registers and the Special Function Registers. Bits RP1 (Status<6>) and RP0
(Status<5>) are the bank select bits.

3.10 DATA EEPROM AND FLASH PROGRAM MEMORY

The data EEPROM and Flash program memory is readable and writable during
normal operation (over the full VDD range). This memory is not directly mapped in the
register file space. Instead, it is indirectly addressed through the Special Function Registers.
There are six
SFRs used to read and write this memory:
• EECON1
• EECON2
• EEDATA
• EEDATH
• EEADR
• EEADRH
When interfacing to the data memory block, EEDATA holds the 8-bit data for read/write and
EEADR holds the address of the EEPROM location being accessed. These devices have 128
or 256 bytes of data EEPROM (depending on the device), with an address range from 00h to
FFh. On devices with 128 bytes, addresses from 80h to FFh are unimplemented and will
wraparound to the beginning of data EEPROM memory. When writing to unimplemented
locations, the on-chip charge pump will be turned off. When interfacing the program memory
block, the EEDATA and EEDATH registers form a two-byte word that holds the 14-bit data
for read/write and the EEADR and EEADRH registers form a two-byte word that holds the
13-bit address of the program memory location being accessed. These devices have 4 or 8K
words of program Flash, with an address range from 0000h to 0FFFh for the
PIC16F873A/874A and 0000h to 1FFFh for the PIC16F876A/877A. Addresses above the
range of the respective device will wraparound to the beginning of program memory. The
EEPROM data memory allows single-byte read and write. Program memory write operations
automatically perform an erase-before write on blocks of four words. A byte write in data
EEPROM memory automatically erases the location and writes the new data (erase-before-
write). When code-protected, the device programmer can no longer access data or program
memory; this does NOT inhibit internal reads or writes.

18
 CHAPTER 4

4.1 LCD

A liquid crystal display (LCD) is a flat panel display, electronic visual display, or
video display that uses the light modulating properties of liquid crystals (LCs). LCs does not
emit light directly.

They are used in a wide range of applications, including computer monitors,

television, instrument panels, aircraft cockpit displays, signage, etc. They are common in
consumer devices such as video players, gaming devices, clocks, watches, calculators, and
telephones. LCDs have replaced cathode ray tube (CRT) displays in most applications. They
are available in a wider range of screen sizes than CRT and plasma displays, and since they
do not use phosphors, they cannot suffer image burn-in. LCDs are, however, susceptible to
image persistence.

LCDs are more energy efficient and offer safer disposal than CRTs. Its low electrical
power consumption enables it to be used in battery-powered electronic equipment. It is an
electronically modulated optical device made up of any number of segments filled with liquid
crystals and arrayed in front of a light source (backlight) or reflector to produce images in
color or monochrome. The most flexible ones use an array of small pixels. The earliest
discovery leading to the development of LCD technology, the discovery of liquid crystals,
dates from 1888. By 2008, worldwide sales of televisions with LCD screens had surpassed
the sale of CRT units.

4.2 ILLUMINATION

As LCD panels produce no light of their own, they require an external lighting
mechanism to be easily visible. On most displays, this consists of a cold cathode fluorescent
lamp that is situated behind the LCD panel. For battery-operated units (e.g. laptops) this
requires an inverter to convert DC to AC. Passive-matrix displays are usually not backlit, but
active-matrix displays almost always are, with a few exceptions such as the display in the
original Game boy Advance.

Recently, two types of LED backlit displays have appeared in some televisions as an
alternative to conventional backlit LCDs. In one scheme, the LEDs are used to backlight the

19
entire LCD panel. In another scheme, a set of red, green and blue LEDs is used to illuminate
a small cluster of pixels, which can improve contrast and black level in some situations.

4.3 PASSIVE-MATRIX AND ACTIVE-MATRIX ADDRESSED LCDS

Monochrome passive-matrix LCDs were standard in most early laptops (although a

few used plasma displays) and the original Nintendo Game Boy until the mid-1990s, when
color active-matrix became standard on all laptops. The commercially unsuccessful
Macintosh portable (released in 1989) was one of the first to use an active-matrix display
(though still monochrome).

Passive-matrix LCDs are still used today for applications less demanding than laptops
and TVs. In particular, portable devices with less information content to be displayed, where
lowest power consumption (no backlight), low cost and/or readability in direct sunlight are
needed, use this type of display.

High-resolution color displays, such as modern LCD computer monitors and televisions, use
an active matrix structure. A matrix of thin-film transistors (TFTs) is added to the electrodes
in contact with the LC layer. Each pixel has its own dedicated transistor, allowing each
column line to access one pixel.. The row line is then deactivated and the next row line is
selected. All of the row lines are selected in sequence during a refresh operation. Active-
matrix addressed displays look "brighter" and "sharper" than passive-matrix addressed
displays of the same size, and generally have quicker response times, producing much better
images.

The DV-16100-S2FBLY, dot-matrix LCD unit of a 5 x 7- dot 16-character 1-line dot-matrix

LCD panel, LCD driver, controller LSI and yellow green backlight LED fabricated on a
single PCB. Incorporating mask ROM-based character generator and display data RAM in
the controller LSI, the unit can efficiently display the desired characters under
microprocessor control.

20
4.4 PIN DESCRIPTION

NUMBER SYMBOL FUNCATION

1 VSS 0V Power Supply (GND Level)

2 VCC Power supply for Logic circuit

3 V0 Power Supply for Driving the LCD

4 RS Data / Instruction select

5 R/W Read / Write select

6 EN Enable signal

7-14 DB0-DB7 Data Bus line

15 LED A Power supply for LED

16 LED K Power supply for LED

21
4.5 PIR SENSOR

Passive Infrared sensors (PIRs)

General Description

PIR sensors are passive electronic devices which detect motion by sensing infrared
fluctuations. Once a motion is detected, a high is sent to the signal pin. Because of the
biological characteristic of organisms to emit heat, these sensors work well in detecting
human motion and therefore are commonly implemented in security applications.

Specifications

• Single bit output

• Small size makes it easy to conceal

• Sensitivity: Presettable

• Size: Length 32mm, Width 24mm, Thickness 26mm

Application Ideas

• Alarm Systems

• Halloween Props

• Motion Detection Sensor

Sensor Operation

PIR sensors are composed of a solid-state pyroelectric chip. This chip is the heart of the
device because it generates an electric charge when exposed to infrared radiation. This charge
is then enhanced by an amplifier so the output voltage can be interfaced with other devices.
The sensitivity of this device is enhanced by a translucent Fresnel lens covering this chip.

Connecting a PIR sensor to an board

Connecting a PIR sensor to a board is a simple process. PIR sensors consist of 3 pins, Vcc
(Positive Voltage), Vss (Ground), and Signal. Interfacing it to the board requires Vcc to be

22
connected to the +5, Vss to be connected to ground, and the Signal pin to be connected to any
digital input pin.

Connect the 3-pin header to your circuit so that the minus (-) pin connects to ground or Vss,
the plus (+) pin connects to +5 volts or Vcc and the OUT pin connects to your
microcontroller‟s I/O pin. One easy way to do this would be to use a standard servo/LCD
extension cable, available separately from Parallax (#805-00002). This cable makes it easy to
plug sensor into the servo headers on our Board Of Education or Professional Development
Board. If you use the Board Of Education, be sure the servo voltage jumper (located between
the 2 servo header blocks) is in the Vcc position, not Vin. If you do not have this jumper on
your board you should manually connect to Vcc through the breadboard. You may also plug
the sensor directly into the edge of the breadboard and connect the signals from there.
Remember the position of the pins when you plug the sensor into the breadboard. Once the
sensor warms up (settles) the output will remain low until there is motion, at which time the
output will swing high for a couple of seconds, then return low. If motion continues the
output will cycle in this manner until the sensors line of sight of still again.

Notes concerning PIR sensor operation

Calibration Time

PIR sensors need approximately 10-60 seconds to calibrate. During this time it is important to
make sure that there is no motion in the sensors' visual range.

Sensitivity

PIR Sensors can only detect motion 20 feet away.

Sensing Restrictions

The Parallax PIR sensor goes high for a predetermined amount of time (approximately 2
seconds). During this time, it's sensing capabilities are disabled. This time period extends for
a second after the signal pin goes low again. Presumably, the PIR sensor must recalibrate
during this time.

Inverse Mode

The high and low of the signal pin can be reversed by simply changing the placement of the
bridge on the back of the sensor.

23
Design

Infrared radiation enters through the front of the sensor, known as the sensor face. At the core
of a PIR sensor is a solid state sensor or set of sensors, made from an approximately 1/4 inch
square of natural or artificial pyroelectric materials, usually in the form of a thin film, out of
gallium nitride (GaN), caesium nitrate (CsNO3), polyvinyl fluorides, derivatives of
phenylpyrazine, and cobalt phthalocyanine. (See pyroelectric crystals.) Lithium tantalate
(LiTaO3) is a crystal exhibiting both piezoelectric and pyroelectric properties.

The sensor is often manufactured as part of an integrated circuit and may consist of one (1),
two (2) or four (4) „pixels‟ of equal areas of the pyroelectric material. Pairs of the sensor
pixels may be wired as opposite inputs to a differential amplifier. In such a configuration, the
PIR measurements cancel each other so that the average temperature of the field of view is
removed from the electrical signal; an increase of IR energy across the entire sensor is self-
cancelling and will not trigger the device.

Ceiling-mount-passive-infrared-motion-detector-397090

24
Passive infrared (PIR) sensors detect infrared energy radiating from objects within their field
of vision.

Unlike infrared optical sensors that use an LED transmitter and IR receiver, the PIR emits
nothing. As its “passive” name suggests, it responds only to infrared energy radiated by the
object being sensed. The most common object a PIR sensor detects is the human body, so
these sensors find use in automatic light switches, alarm systems, and door openers.

Passive infrared block diagram

PIR-based motion detector

In a PIR-based motion detector (usually called a PID, for Passive Infrared Detector), the PIR
sensor is typically mounted on a printed circuit board containing the necessary electronics
required to interpret the signals from the pyroelectric sensor chip. The complete assembly is
contained within a housing mounted in a location where the sensor can view the area to be
monitored. Infrared energy is able to reach the pyroelectric sensor through the window
because the plastic used is transparent to infrared radiation (but only translucent to visible
light). This plastic sheet also prevents the intrusion of dust and/or insects from obscuring the
sensor‟s field of view, and in the case of insects, from generating false alarms.

A few mechanisms have been used to focus the distant infrared energy onto the sensor
surface. The window may have multiple Fresnel lenses molded into it.

25
 CHAPTER 5
5.0 L293D MOTOR DRIVER IC

L293D Pin Configuration

Pin Number Pin Name Description

1 Enable 1,2 This pin enables the input pin Input 1(2) and Input 2(7)
2 Input 1 Directly controls the Output 1 pin. Controlled by digital circuits
3 Output 1 Connected to one end of Motor 1
4 Ground Ground pins are connected to ground of circuit (0V)
5 Ground Ground pins are connected to ground of circuit (0V)
6 Output 2 Connected to another end of Motor 1
7 Input 2 Directly controls the Output 2 pin. Controlled by digital circuits
8 Vcc2 (Vs) Connected to Voltage pin for running motors (4.5V to 36V)
9 Enable 3,4 This pin enables the input pin Input 3(10) and Input 4(15)
10 Input 3 Directly controls the Output 3 pin. Controlled by digital circuits
11 Output 3 Connected to one end of Motor 2
12 Ground Ground pins are connected to ground of circuit (0V)
13 Ground Ground pins are connected to ground of circuit (0V)

26
 14 Output 4 Connected to another end of Motor 2
15 Input 4 Directly controls the Output 4 pin. Controlled by digital circuits
16 Vcc2 (Vss) Connected to +5V to enable IC function

Features
 Can be used to run Two DC motors with the same IC.
 Speed and Direction control is possible
 Motor voltage Vcc2 (Vs): 4.5V to 36V
 Maximum Peak motor current: 1.2A
 Maximum Continuous Motor Current: 600mA
 Supply Voltage to Vcc1(vss): 4.5V to 7V
 Transition time: 300ns (at 5Vand 24V)
 Automatic Thermal shutdown is available
 Available in 16-pin DIP, TSSOP, SOIC packages

Where to use L293D IC

The L293D is a popular 16-Pin Motor Driver IC. As the name suggests it is mainly
used to drive motors. A single L293D IC is capable of running two DC motors at the same
time; also the direction of these two motors can be controlled independently. So if you have
motors which has operating voltage less than 36V and operating current less than 600mA,
which are to be controlled by digital circuits like Op-Amp, 555 timers, digital gates or even
Micron rollers like Arduino, PIC, ARM etc.. this IC will be the right choice for you.

How to use a L293D Motor Driver IC

Using this L293D motor driver IC is very simple. The IC works on the principle
of Half H-Bridge, let us not go too deep into what H-Bridge means, but for now just know
that H bridge is a set up which is used to run motors both in clock wise and anti clockwise
direction. As said earlier this IC is capable of running two motors at the any direction at the
same time, the circuit to achieve the same is shown below.

27
 All the Ground pins should be grounded. There are two power pins for this IC, one is
the Vss(Vcc1) which provides the voltage for the IC to work, this must be connected to +5V.
The other is Vs(Vcc2) which provides voltage for the motors to run, based on the
specification of your motor you can connect this pin to anywhere between 4.5V to 36V, here
I have connected to +12V.
The Enable pins (Enable 1,2 and Enable 3,4) are used to Enable Input pins for Motor
1 and Motor 2 respectively. Since in most cases we will be using both the motors both the
pins are held high by default by connecting to +5V supply. The input pins Input 1,2 are used
to control the motor 1 and Input pins 3,4 are used to control the Motor 2. The input pins are
connected to the any Digital circuit or microcontroller to control the speed and direction of
the motor. You can toggle the input pins based on the following table to control your motor.

Input 1 = HIGH(5v) Output 1 = HIGH Motor 1 rotates in Clock wise Direction

Input 2 = LOW(0v) Output 2 = LOW
Input 3 = HIGH(5v) Output 1 = HIGH Motor 2 rotates in Clock wise Direction
Input 4 = LOW(0v) Output 2 = LOW

Input 1 = LOW(0v) Output 1 = LOW Motor 1 rotates in Anti-Clock wise Direction

Input 2 = HIGH(5v) Output 2 = HIGH
Input 3 = LOW(0v) Output 1 = LOW Motor 2 rotates in Anti -Clock wise Direction
Input 4 = HIGH(5v) Output 2 = HIGH
Input 1 = HIGH(5v) Output 1 = HIGH Motor 1 stays still

28
Input 2 = HIGH(5v) Output 2 = HIGH
Input 3 = HIGH(5v) Output 1 = LOW Motor 2 stays still
Input 4 = HIGH(5v) Output 2 = HIGH

Applications

Used to drive high current Motors using Digital Circuits

Can be used to drive Stepper motors

High current LED‟s can be driven

5.1 MOTOR
A DC motor is an electric motor that runs on direct current (DC) electricity. DC
motors were used to run machinery, often eliminating the need for a local steam engine or
internal combustion engine. DC motors can operate directly from rechargeable batteries,
providing the motive power for the first electric vehicles. Today DC motors are still found in
applications as small as toys and disk drives, or in large sizes to operate steel rolling mills and
paper machines. Modern DC motors are nearly always operated in conjunction with power
electronic devices.

MOTOR PRINCIPLES OF OPERATION

In any electric motor, operation is based on simple electromagnetism. A current-

carrying conductor generates a magnetic field; when this is then placed in an external

29
magnetic field, it will experience a force proportional to the current in the conductor, and to
the strength of the external magnetic field. As you are well aware of from playing with
magnets as a kid, opposite (North and South) polarities attract, while like polarities (North
and North, South and South) repel. The internal configuration of a DC motor is designed to
harness the magnetic interaction between a current-carrying conductor and an external
magnetic field to generate rotational motion.

Every DC motor has six basic parts -- axle, rotor (a.k.a., armature), stator,
commutator, field magnet(s), and brushes. In most common DC motors (and all that
Beamers‟ will see), the external magnetic field is produced by high-strength permanent
magnets1. The stator is the stationary part of the motor -- this includes the motor casing, as
well as two or more permanent magnet pole pieces. The rotor (together with the axle and
attached commutator) rotates with respect to the stator. The rotor consists of windings
(generally on a core), the windings being electrically connected to the commutator. The
above diagram shows a common motor layout -- with the rotor inside the stator (field)
magnets.

In real life, though, DC motors will always have more than two poles (three is a very
common number). In particular, this avoids "dead spots" in the commutator. This would be
bad for the power supply, waste energy, and damage motor components as well. Yet another
disadvantage of such a simple motor is that it would exhibit a high amount of torque "ripple"
(the amount of torque it could produce is cyclic with the position of the rotor).

One pole is fully energized at a time (but two others are "partially" energized). As
each brush transitions from one commutator contact to the next, one coil's field will rapidly
collapse, as the next coil's field will rapidly charge up (this occurs within a few microsecond).
We'll see more about the effects of this later, but in the meantime you can see that this is a
direct result of the coil windings' series wiring:

30
 There's probably no better way to see how an average DC motor is put together, than
by just opening one up. Unfortunately this is tedious work, as well as requiring the
destruction of a perfectly good motor. Luckily for you, I've gone ahead and done this in your
stead. The guts of a disassembled Mabuchi FF-030-PN motor (the same model that
Solarbotics sells) are available for you to see here (on 10 lines / cm graph paper). This is a
basic 3-pole DC motor, with 2 brushes and three commutator contacts.

The use of an iron core armature (as in the Mabuchi, above) is quite common, and has
a number of advantages2. First off, the iron core provides a strong, rigid support for the
windings -- a particularly important consideration for high-torque motors. The core also
conducts heat away from the rotor windings, allowing the motor to be driven harder than
might otherwise be the case. Iron core construction is also relatively inexpensive compared
with other construction types.

But iron core construction also has several disadvantages. The iron armature has a
relatively high inertia which limits motor acceleration. This construction also results in high
winding inductances which limit brush and commutator life.

In small motors, an alternative design is often used which features a 'coreless'

armature winding. This design depends upon the coil wire itself for structural integrity. As a
result, the armature is hollow, and the permanent magnet can be mounted inside the rotor
coil. Coreless DC motors have much lower armature inductance than iron-core motors of
comparable size, extending brush and commutator life.

31
DC MOTOR BEHAVIOR

At a simplistic level, using DC motors is pretty straightforward -- you put power in, and get
rotary motion out. Life, of course, is never this simple -- there are a number of subtleties of
DC motor behavior that should be accounted for in BEAM bot design.

High-speed output
This is the simplest trait to understand and treat -- most DC motors run at very high
output speeds (generally thousands or tens of thousands of RPM). While this is fine for some
BEAM bots (say, photo poppers or solar rollers), many BEAM bots (walkers, heads) require
lower speeds -- you must put gears on your DC motor's output for these applications.

Back EMF

Just as putting voltage across a wire in a magnetic field can generate motion, moving
a wire through a magnetic field can generate voltage. This means that as a DC motor's rotor
spins, it generates voltage -- the output voltage is known as back EMF. Because of back
EMF, a spark is created at the commutator as a motor's brushes switch from contact to
contact. Meanwhile, back EMF can damage sensitive circuits when a motor is stopped
suddenly.

Noise (ripple) on power lines

A number of things will cause a DC motor to put noise on its power lines:
commutation noise (a function of brush / commutator design & construction), roughness in
bearings (via back EMF), and gearing roughness (via back EMF, if the motor is part of a gear
motor) are three big contributors.

Even without these avoidable factors, any electric motor will put noise on its power
lines by virtue of the fact that its current draw is not constant throughout its motion. Going
back to our example two-pole motor, its current draw will be a function of the angle between
its rotor coil and field magnets:

Since most small DC motors have 3 coils, the coils' current curves will overlay each other:

32
Added together, this ideal motor's current will then look something like this:

Reality is a bit more complex than this, as even a high-quality motor will display a
current transient at each commutation transition. Since each coil has inductance (by
definition) and some capacitance, there will be a surge of current as the commentator‟s
brushes first touch a coil's contact, and another as the brushes leave the contact (here, there's
a slight spark as the coil's magnetic field collapses).

As a good example, consider an oscilloscope trace of the current through a Mabuchi

FF-030PN motor supplied with 2 V (1ms per horizontal division, 0.05 mA per vertical
division):

In this case, the peak-to-peak current ripple is approximately 0.29 mA, while the
average motor current is just under 31 mA. So under these conditions, the motor puts about
less than 1% of current ripple onto its power lines (and as you can see from the "clean" traces,
it outputs essentially no high-frequency current noise). Note that since this is a 3-pole motor,
and each coil is energized in both directions over the course of a rotor rotation, one revolution
of the rotor will correspond to six of the above curves (here, 6 x 2.4 ms = 0.0144 sec,
corresponding to a motor rotation rate of just under 4200 RPM).

Motor power ripple can wreak havoc in Nv nets by destabilizing them inadvertently.
Fortunately, this can be mitigated by putting a small capacitor across the motor's power lines
(you'll only be able to filter out "spikey" transients this way, though -- you'll always see
curves like the ones above being imposed on your power). On the flip side of this coin, motor
power ripple can be put to good use -- as was shown above, ripple frequency can be used to
measure motor speed, and its destabilizing tendencies can be used to reverse a motor without
the need for discrete "back-up" sensors.

33
5.2 BLUETOOTH

Bluetooth is a wireless technology standard for exchanging data over short distances
(using short-wavelength UHF radio waves in the ISM band from 2.4 to 2.485 GHz[4]) from
fixed and mobile devices, and building personal area networks (PANs). Invented by telecom
vendor Ericsson in 1994, it was originally conceived as a wireless alternative to RS-232 data
cables.

Bluetooth is managed by the Bluetooth Special Interest Group (SIG), which has more
than 30,000 member companies in the areas of telecommunication, computing, networking,
and consumer electronics. The IEEE standardized Bluetooth as IEEE 802.15.1, but no longer
maintains the standard. The Bluetooth SIG oversees development of the specification,
manages the qualification program, and protects the trademarks. A manufacturer must meet
Bluetooth SIG standards to market it as a Bluetooth device. A network of patents apply to the
technology, which are licensed to individual qualifying devices.

Serial Port Bluetooth Module (Master/Slave): HC-05

HC-05 module is an easy to use Bluetooth SPP (Serial Port Protocol) module,
designed for transparent wireless serial connection setup.

Serial port Bluetooth module is fully qualified Bluetooth V2.0+EDR (Enhanced Data
Rate) 3Mbps Modulation with complete 2.4GHz radio transceiver and baseband. It uses CSR
Bluecore 04-External single chip Bluetooth system with CMOS technology and with
AFH(Adaptive Frequency Hopping Feature). It has the footprint as small as 12.7mmx27mm.
Hope it will simplify your overall design/development cycle

34
Specifications

Hardware Features

 Typical -80dBm sensitivity

 Up to +4dBm RF transmit power
 Low Power 1.8V Operation ,1.8 to 3.6V I/O
 PIO control
 UART interface with programmable baud rate
 With integrated antenna
 With edge connector

Software Features

 Default Baud rate: 38400, Data bits:8, Stop bit:1,Parity:No parity, Data control: has.

Supported baud rate: 9600,19200,38400,57600,115200,230400,460800.

 Given a rising pulse in PIO0, device will be disconnected.

 Status instruction port PIO1: low-disconnected, high-connected;
 PIO10 and PIO11 can be connected to red and blue led separately. When master and
slave are paired, red and blue led blinks 1time/2s in interval, while disconnected only
blue led blinks 2times/s.

 Auto-connect to the last device on power as default.

 Permit pairing device to connect as default.
 Auto-pairing PINCODE:”0000” or “1234” as default
 Auto-reconnect in 30 min when disconnected as a result of beyond the range of
connection.

35
 CHAPTER 6

6.0. CODE

sbit LCD_RS at RD6_bit; sbit LCD_D7_Direction at TRISB7_bit;

sbit LCD_EN at RD7_bit; sbit motor1 at RC0_bit;

sbit LCD_D0 at RB0_bit; sbit motor2 at RC1_bit;

sbit LCD_D1 at RB1_bit; sbit motor3 at RC2_bit;

sbit LCD_D2 at RB2_bit; sbit motor4 at RC3_bit;

sbit LCD_D3 at RB3_bit; char receive;

sbit LCD_D4 at RB4_bit; unsigned int value, temp1;

sbit LCD_D5 at RB5_bit; unsigned char car,x,y;

sbit LCD_D6 at RB6_bit; void lcd_puts(char row, char column,

const char *s)
sbit LCD_D7 at RB7_bit;
{
sbit LCD_RS_Direction at TRISD6_bit;
char ii;
sbit LCD_EN_Direction at TRISD7_bit;
switch(row){
sbit LCD_D0_Direction at TRISB0_bit;
case 1: Lcd_Cmd(_LCD_FIRST_ROW);
sbit LCD_D1_Direction at TRISB1_bit;
break;
sbit LCD_D2_Direction at TRISB2_bit;
case2:Lcd_Cmd(_LCD_SECOND_ROW);
sbit LCD_D3_Direction at TRISB3_bit;
break;
sbit LCD_D4_Direction at TRISB4_bit;
}
sbit LCD_D5_Direction at TRISB5_bit;
for(ii=1;ii<column;ii++)Lcd_Cmd(_LCD_

sbit LCD_D6_Direction at TRISB6_bit; MOVE_CURSOR_RIGHT);

36
 while(*s)Lcd_Chr_Cp(*s++); unsigned int i,j;

} ADCON1 = 0b11000010;

void ShowADC(int x, int y, unsigned int ADCON0 = 0b01000000;

adcvalue) {
CMCON = 7;
car = adcvalue / 1000;
TRISA = 0xFF;
LCD_Chr(x,y,48+car);
TRISB = 0;
Delay_ms(3);
TRISC = 0;
adcvalue = adcvalue-1000*car;
TRISD = 0;
car = (adcvalue / 100);
TRISE =0;
LCD_Chr_CP(48+car);
motor1=0;
Delay_ms(3);
motor2=0;
adcvalue = adcvalue-100*car;
motor3=0;
car = (adcvalue / 10);
motor4=0;
LCD_Chr_CP(48+car);
UART1_init(9600);
Delay_ms(3);
Lcd_init();
adcvalue = adcvalue-10*car;
lcd_puts(1,1,"UNDERGROUND");
car = adcvalue;
lcd_puts(2,1,"HUMAN DETECTOR");
LCD_Chr_CP(48+car);
delay_ms(1000);
delay_ms(40);
Lcd_Cmd(_LCD_CLEAR);
}
while(1)
void main() {
{

37
if(adc_read(0)>500){ if(adc_read(1)>200) {

motor1=0; motor1=0;

motor2=0; motor2=0;

motor3=0; motor3=0;

motor4=0; motor4=0;

lcd_cmd(0x01); lcd_cmd(0x01);

lcd_puts(1,1,"HUMAN DETECTED"); lcd_puts(1,1,"HUMAN DETECTED");

lcd_puts(2,1,"LEFT SIDE"); lcd_puts(2,1,"RIGHT SIDE");

delay_ms(2000); delay_ms(2000);

uart1_write_text("HUMAN DETECTED uart1_write_text("HUMAN DETECTED

IN LEFT SIDE"); IN RIGHT SIDE");

uart1_write_text("\n"); uart1_write_text("\n");

delay_ms(2000); delay_ms(2000);

lcd_cmd(0x01); lcd_cmd(0x01);

} }

else if(adc_read(0)<500){ else if(adc_read(1)<200){

motor1=1; motor1=1;

motor2=0; motor2=0;

motor3=1; motor3=1;

motor4=0; motor4=0;

} }}}

38
 CHAPTER 7

7.0. CONCLUSION

This project is very useful in war filed and natural disasters like earth quack, mines
and accidents in underground earth upper surface. This will be modified through latest
technology by using high sensitive night vision camera, thermal cameras and remove access
devices like high range RF transmitter & receivers and high range Bluetooth communication.
We cannot use GSMs or Wi-Fi modules which cannot get the signal in the underground
location because it needs communication network signals.

39
 ENTREPRENEURSHIP

1. What is entrepreneurship? Explain

Entrepreneurship is the practice of starting new organizations and establishing or

revitalizing matured organizations. Entrepreneurship ranges in scale from solo projects to
major undertakings creating many job opportunities. A dictionary definition of
entrepreneurship is “The organizer or promoter of an activity, especially one who assumes
the risks of a business”.

In practice, entrepreneurship can be

 Starting your own business

 Inventing something new techniques of production

A spirit of creative thinking and innovation that embraces an entire organization.

2. Who is a Successful Entrepreneur? Why?

A successful entrepreneur is a person who has possession of an enterprise and

assumes significant accountability for the inherent risks and the outcome. A successful
entrepreneur promotes the vision. A successful entrepreneur is usually a positive thinker and
a decision maker.

3. List the various stages of decision and entrepreneur has to make before reaching the
goal of his project.

The various stages of decisions an entrepreneur has to make before reaching the goal of
his project are

 Converging on the idea

 Business plan

 Business formation

 Growth

 Going public or marketing (making valuable to others).

40
 4. List the types of industries.

Industries can be listed as

 Small Scale Industries -SSI

 Medium Scale Industries - MSI

 Large Scale Industries – LSI

Define – Small Scale Industry.

Small Scale industry in an industry in which the investment in fixed assets in plant
and machinery more than Rs.25 Lakes, but does not exceed Rs.5 Crore.

5. What are the Qualities of an Entrepreneur?

The qualities of an entrepreneur are

 High level confidence.

 Vision and passion in their dreams.

 Surrounded themselves with other like-minded people.

 Highly resourceful, creative and inventive.

 Seize opportunities and create their own whenever possible.

 Know what motivates them.

 Spend a substantial amount of time on introspection.

 Refust to let other people dictate how they should live.

 Take responsibility for their happiness.

6. What are the expectations of Entrepreneurship?

It is expected from the entrepreneurs that they will help to

 Increase number of industries.

 Increase production.

41
  Increase employment opportunities.

 Earn foreign exchange through exports.

 Develop the underdeveloped parts of the country.

 Economic development.

7. What are the various SSI that can flourish in your district?

The various SSI that can flourish in my district are

 Hollow concrete blocks industries

 Coir Industries

 Glass and ceramics

 Wood and wood products

 Textile products

8. Identify the infrastructural needs for an Industry.

The infrastructure needs for an industry are (6 M‟s)

Man Machine

Material Money

Market Management

Land Water

Transport Electricity

10.Identify the natural resources available in your areas for starting a SSI.

The Natural resources available in our area are

 Ground water

 Good Infrastructure

 Power supply availability

 Abundant labour
42
 B)DISASTER MANAGEMENT

1. What is meant by Disaster Management? What are the different stages of Disaster
Management?

Disaster is an event or series of events which seriously disturb normal activities. Disaster
management is a preplanned prevention, preparation, emergency action and recovery from
disaster to save human life and property and restore normal life as quickly as possible.

The different stages of disaster management are,

 Planning,
 Migration,
 Preparedness,
 Response,
 Recovery.

2. Differentiate natural Disasters and manmade disasters with examples.

A) Natural Disasters

Natural disaster is the effect of a natural hazard that affects the environment and leads
to financial, Environmental and/or human losses.

Examples:
 Flood,
 Cyclone,
 Drought,
 Earthquake,
 Tsunami,
 Snow storms,
 Heat waves.

43
B) Manmade disasters

Manmade disaster are events which either intentionally are by accident cause severe
threats to public health and well-being.

Examples:

Setting of fires, epidemic, pollution, wars, accidents, food poisoning, terrorism, etc.,

3. Describe the necessity of risk identification and assessment surveys while planning a
project

Risk identification ascertains which risks have the potential of affecting the project
and documenting the risk's characteristics.

Risk identification begins after the risk management plan is constructed and continues
iteratively throughout the project execution the risk identification process naturally
progresses into the quantitative risk analysis (or) the qualitative risk analysis

The assessment takes into the account of physical, social, geographical and
psychological factors that cause some people to be particularly exposed to various hazards.

4. What is Disasters recovery and what does it mean to an Industry?

Disaster recovery is a process of policies and procedures related to preparing for recovery
and continuation of technology infrastructure critical to an organization after a natural or
manmade disaster.

Disaster recovery in industries includes the following factors,

 Failure due to fire accidents,

 Failure due to sudden high voltage supply,
 Failure of machines and infrastructure due to floods.

5. What are the factors to be considered while planning the rebuilding works after a
major disaster due to flood/cyclone /earthquake?

44
 The factors to be considered while planning the rebuilding works after a major disaster
due to flood/cyclone/earth quake are shown below,

 Land and planning,

 Prevent to rebuild in risk zone,
 Construct disaster resistant building,
 Take possible protective activities to avoid disaster,
 Community awareness and education., etc.,

6. List out the public emergency services available in the state, which could be
approached for help during a natural disaster.

S no. Service Phone numbers

1 Police 100

2 Fire control 101

3 Traffic police 103

4 Ambulance services 104

5 Women help line 1091

6 Child line 1098

7 Lions blood bank 1910

7. Specify the role played by an Engineer in the process of Disaster Management.

Disaster is a threat to environment and the society. Disaster management deals with
preparations to reduce the impact of natural or man-made disasters.

The role of engineer is given below,

 Mitigation: It focuses on avoiding hazards or reducing the impact of disaster.

45
  Preparedness: It involves developing action plans to combat disaster when it
happens.
 Response: It includes mobilization of emergency services for evacuation and rescue
operations.
 Recovery: It is involved in the rebuilding process.

8. What is the cause for Earthquakes? How are they measured? Which parts of India
are more vulnerable for frequent earthquakes?

An earthquake is a sudden motion or trembling of the ground produced by the abrupt

displacement of rock masses. Earthquakes are recorded with a seismometer also known as
seismography in Richter magnitude. The magnitude of 3 or lower earthquakes being mostly
imperceptible and the magnitude 7 or more causing serious damage over large areas. The
modified metric scale is used for measuring intensity of shaking. The following parts in India
are more vulnerable for frequent earthquakes,

 Gujarat,
 Jammu and Kashmir,
 Punjab,
 Assam,
 Manipur.

9) What was the cause for the tsunami 2004 which inflicted heavy loss to life and
property along the coast of Tamil Nadu? Specify its epicenter and magnitude. But what
is a large volume? And how it is displaced?

Tsunami is a series of extremely long waves that are created after a large volume of water
is displaced. Tsunami can be generated by four ways. They are

 An undersea earthquake,
 Landslide,
 Volcanic eruption and
 An extraterrestrial collision.

46
The 2004 Indian Ocean earthquake was undersea mega thrust earthquake that occurred at
00.58.53UTC on 26.12.2004. This tsunami occurred at an epicenter of west cost of Sumatra
with a magnitude of between 9.1 and 9.3 in Richter scale. The 2004 tsunami killed over 3,
00,000 people with many bodies either being lost to the sea or unidentified.

10. Specify the earthquake hazard zones in which the following towns of Tamil Nadu
lie: (a) Chennai (b) Nagapatinnam (c) Coimbatore (d) Madurai (e) Salem.

Earthquake hazards can be categorized into either direct hazards or indirect hazards.

Direct hazards: Ground shaking, floods formation of tidal waves, sea surges and tsunamis,
soil liquefaction etc.,

Indirect hazards: Dam failures, pollution from damage to industrial plants, delayed
landslides etc., Most of the regions of Tamil Nadu fall under low to moderate seismic hazard
zone.

S No. Place Type of zone Rating

1. Madurai Low hazard 0

2. Nagapatinam Low hazard 0

3. Salem Low hazard 0

4. Chennai Low hazard 0.3-0.5

5. Coimbatore Moderate hazard 0.7-0.8

47
 C)ENVIRONMENTAL MANAGEMENT

1.What is the responsibility of an Engineer-in-charge of an industry with respect to

public Health?

The responsibility of an Engineer-in-charge of an industry with respect to public Health are,

a) To control the pollutions from an industry,

b) To provide safe drinking water to the workers,

c) To provide waste water management, arrange suitable drainage and effluent,

d) To provide disposal of solid waste,

e) To provide the industrial area as clean as possible.,etc.,

2. Define Environmental Ethic.

Environmental Ethics is a branch of philosophy concerned with the moral relations

between humans and natural world. If refers to the issues, principles and guide lines relating
to human interactions with their environment.

3. How industries play their role in polluting the environment?

There are a number of forms of industrial pollution. One of the most common is
water pollution caused by dumping of industrial waste into water ways, or improper covering
of waste ,which causes leakage into ground water and waterways. Industrial pollution can
also impact air quality and it can enter the soil, causing widespread environmental problems.
Pollutants can kill animals and plants, imbalance ecosystems, degrade air quality ,damage
buildings ,and generally degrade quality of life.

4. What is the necessity of pollution control? What are all the different organizations
you know; which deal with pollution control?

Pollution is injurious to health. Therefore pollution in any form is to be completely

controlled. The aim of pollution control is to reduce the harmness of pollutant. Different
organizations deal with pollution control are

48
 1. State Pollution Control Board,

2. Central Pollution Control Board,

3. National Environmental Engineering Research Institute., etc.,

5. List out the different types of pollutions caused by a chemical /Textile /Leather/
Automobile /cement factory.

Chemical industry - water pollution , air pollution, Land pollution,

Textile industry - water pollution , air pollution, Leather industry - water pollution, soil
pollution, Automobile industry - air pollution, noise pollution. Cement Factory - air pollution,
water pollution,

6. What is meant by Hazardous waste?

Chemical, biological, flammable ,explosive ,radio active wastes etc., which create
very much danger immediately or over a long period of time is called as Hazardous waste.
They can occur in solid, liquid or gaseous forms.

7. Define Industrial waste management.

Industrial waste management is the collection, transport, processing, recycling or

disposal and monitoring of waste materials.

8. Differentiate between garbage, rubbish, refuse and trash based on their composition
and source.

Garbage: It includes all types of semi solid and solid waste food and products as vegetables,
peelings of fruits, waste meats etc.

Rubbish : It means all various not important solid waste as paper, broken furniture, pottery,
waste building materials., etc.

Refuse: It is all the solid and semi solid waste matters of a community except night
soil(human waste).

It can be broadly divided into,

49
1. Organic matter, 2. In-organic matter.,

The organic matter of the refuse is very danger and creates health problems.

Trash: Things that we thrown away because of useless or worthless or of poor quality.

9. Explain briefly how the quantity of solid waste generated in an industry could be
reduced.

The solid waste which are generated in an industry is to be reduced by the following,

1. Reduction in waste volume by segregation and reuse or recycle the waste,

2. Good housekeeping and prevention of leaks and spills are important steps towards
reduction in the waste volume,

3. Recovery and reuse of process chemicals.

10.what are the objectives of treatments of solid wastes before disposal?

The objectives of treatments of solid wastes before disposal are

1. The disposal of solid waste is done far away from the cities using engineering principles.

2. The wastes are disposed in a smallest possible area to

reduce the volume and prevent them attack from rodents and vermins.

3. separate the non-combustible waste products .

4. separate the organic materials .

5. Remove the toxic products

50