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B99B99M 15
B99B99M 15
B99B99M 15
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TABLE 1 Chemical Requirements 7.3 Acceptance or rejection based upon grain size shall
Composition, % max depend only on the average grain size of test specimens taken
Copper Alloy UNS No. from each of two sample portions and each specimen shall be
C65100 C65500 within the limits prescribed in 7.2 when determined in accor-
Copper (incl silver) remainder remainder dance with Test Methods E112.
Lead 0.05 0.05
Iron 0.8 0.8
Zinc 1.5 1.5 8. Mechanical Property Requirements
Manganese 0.7 0.50–1.3
Silicon 0.8–2.0 2.8–3.8
8.1 Tensile Strength Requirements:
Nickel (incl cobalt) ... 0.6 8.1.1 Product furnished under this specification shall con-
form to the tensile requirements prescribed in Table 2, when
tested in accordance with Test Methods E8/E8M.
5.1.1 These composition limits do not preclude the presence
of other elements. By agreement between the manufacturer and 9. Performance Requirements
the purchaser, limits may be established and analysis required 9.1 Bending Requirements:
for unnamed elements. 9.1.1 Wire in sizes up to 0.250 in. [6 mm] inclusive
5.2 For alloys in which copper is listed as “remainder,” produced to this specification shall be capable of being bent or
copper is the difference between the sum of results for all wrapped one full turn (360°) around its own diameter, or
elements determined and 100 %. distance between parallel faces, without developing cracks or
5.3 When all elements in Table 1 are determined, the sum of other flaws visible to the unaided eye on the outside surface of
results shall be 99.5 % min. the bend.
NOTE 1—Test specimens that include brazed or welded areas shall not
6. Temper be used for bend test purposes.
6.1 The standard tempers for products described in this
specification are given in Table 2. 10. Dimensions, Mass, and Permissible Variations
6.1.1 Product made to H04 (full hard) temper is generally 10.1 The dimensions and tolerances for product described
not available in sizes larger than 0.500 in. [12 mm] in diameter by this specification shall be as specified in Specification
or distance between parallel faces. B250/B250M with particular reference to the following tables
6.1.2 Product made to H08 (spring) temper is generally not and related paragraphs in that specification:
available in sizes larger than 0.250 in. [6 mm] in diameter or 10.1.1 Diameter or Distance Between Parallel Surfaces:
distance between parallel faces. 10.1.1.1 Copper Alloy UNS No. C65100—Table 1.
7. Grain Size for Annealed Temper 10.1.1.2 Copper Alloy UNS No. C65500—Table 2.
10.1.2 Thickness:
7.1 Grain size shall be the standard requirement for all 10.1.2.1 Copper Alloy UNS No. C65100—Table 3.
product in annealed temper. 10.1.2.2 Copper Alloy UNS No. C65500—Table 4.
7.2 The average grain size of O61 (annealed) temper wire 10.1.3 Width:
shall not exceed 0.040 mm, but the wire must be completely 10.1.3.1 Copper Alloy UNS No. C65100—Table 5.
recrystallized. 10.1.3.2 Copper Alloy UNS No. C65500—Table 6.
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11. Test Methods 11.1.2 Test method(s) to be followed for the determination
11.1 Chemical Analysis: of elements resulting from contractual or purchase order
11.1.1 In cases of disagreement, test methods for chemical agreement shall be as agreed upon between the manufacturer or
analysis shall be subject to agreement between the manufac- supplier and the purchaser.
turer or supplier and the purchaser. The following table is a list
of published methods, some of which may no longer be viable, 12. Keywords
which along with others not listed, may be used subject to 12.1 copper-silicon alloy wire; general purpose wire; non-
agreement: electrical wire; UNS C65100 wire; UNS C65500 wire
Element Methods
Copper E478
Silicon E62
Lead E478 (AA)
Iron E478
Zinc E478 (titrametric)
Nickel E478 (photometric)
Manganese E62
SUMMARY OF CHANGES
Committee B05 has identified the principal changes to this specification that have been incorporated since the
2011 issue as follows:
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