The document outlines an assignment for a VLSI Design course. It provides details on the submission date, deadline, and instructions. Students are to answer a minimum of 20 questions out of the 25 total questions provided. The questions cover various topics in VLSI design including MOS fabrication procedures, logic gate design, DRAM operations, testability concepts, and more. Maximum marks are provided for each question.
The document outlines an assignment for a VLSI Design course. It provides details on the submission date, deadline, and instructions. Students are to answer a minimum of 20 questions out of the 25 total questions provided. The questions cover various topics in VLSI design including MOS fabrication procedures, logic gate design, DRAM operations, testability concepts, and more. Maximum marks are provided for each question.
The document outlines an assignment for a VLSI Design course. It provides details on the submission date, deadline, and instructions. Students are to answer a minimum of 20 questions out of the 25 total questions provided. The questions cover various topics in VLSI design including MOS fabrication procedures, logic gate design, DRAM operations, testability concepts, and more. Maximum marks are provided for each question.
Answer any 6 questions from 1 to 11 questions and 12 to 25 compulsory MAX:100
Total :Min 20 questions out of 25
S. STEM CO BTL no 1 Describe constructional features and performance characteristic of Pseudo- NMOS logic and 4 4 2 a. Derive pull up to pull down ratio for an NMOS inverter driven by another NMOS inverter. 4 1 b. Derive pull up to pull down ratio for an NMOS inverter driven by one or more pass transistors. 3 Clearly explain about ION-IMPLANTATION step in IC fabrication 3 2 4 Define Chemical Vapor Deposition 3 5 5 Draw circuit diagram of Bi-CMOS 2-input NAND gate 4 4 6 Define charge leakage in DRAM 5 2 5 Explain the NMOS &CMOS fabrication procedure 3 2 6 Design an area efficient layout diagram for the CMOS logic shown below Y = (A + B + C). 4 4 7 Explain various steps involved in photo lithography 5 4 8 Explain the design of MOS inverter with different loads 4 4 9 a) Realize XOR and XNOR circuits using transmission gates. b) transmission gates compared to pass txr 4 5 11 Draw the circuit diagrams and the corresponding stick diagrams for nMOS and CMOS inverters 4 2 12 Explain the Ion Implantation system in detail? 3 4 13 Design a D-FF using Transmission gate logic? 4 3 14 a) Compare SRAM and DRAM , b) Explain read and write operation of 3T DRAM 4 4 15 Explain read and write operations of 6T SRAM cell 5 2 Find the test vector for the following circuit using path sensitization method when path 3 is struck at 0. 5 3
16 Define controllability and observability 5 2
17 Draw the symbolic layout for the CMOS inverter and write the general CMOS logic gate layout 4 2 guidelines 18 Fault models (stuck-at 1 and stuck – at-0)-Path sensitization 5 5 19 What is the need of testability? Explain design for testability 5 4 20 Write a short note MOS layers and symbolic diagram translation to MASK form 3 4 21 A)Explain different forms of pull-ups used as load in CMOS enhancement. 4 2 B) Determine pull-up to pull-down ratio of an NMOS inverter when driven through one or more pass transistors. 4 5 22 A) What is stick diagram and explain about different symbols used for components in Stick diagram. 3 4 Draw the stick and layout for a two input CMOS NAND gate B) Design a stick diagram and layout for two input CMOS NAND gate indicating all the regions and layers 4 5 23 a)Draw and explain the BiCMOS inverter, Bi-Cmos NAND & Bi-CMOS two-input NOR gates 3 2 b) Draw and explain NOR and NAND based ROM memory design 24 a)Draw and explain AND/OR representation of PLA b)Explain the challenges in testing of VLSI design 5 1 25 a)Explain the D-Algorithm with example b) Describe the ASIC and SOC 5 4