The Institute for

Interconnecting IPC-AC-62A
and Packaging

Electronic Circuits

Aqueous Post Solder

Cleaning Handbook

IPC-AC-62A
January 1996

Supersedes IPC-AC-62 2215 Sanders Road Tel 847 509.9700

Northbrook, Illinois Fax 847 509.9798
60062-6135 URL: http://www.ipc.org
The Principles of In May 1995 the IPC’s Technical Activities Executive Committee adopted Prin-
Standardization ciples of Standardization as a guiding principle of IPC’s standardization efforts.
Standards Should:
• Show relationship to DFM & DFE
• Minimize time to market
• Contain simple (simplified) language
• Just include spec information
• Focus on end product performance
• Include a feed back system on use and problems for future improvement
Standards Should Not:
• Inhibit innovation
• Increase time-to-market
• Keep people out
• Increase cycle time
• Tell you how to make something
• Contain anything that cannot be defended with data
IPC Standards and Publications are designed to serve the public interest through
eliminating misunderstandings between manufacturers and purchasers, facilitat-
ing interchangeability and improvement of products, and assisting the pur-
chaser in selecting and obtaining with minimum delay the proper product for
his particular need. Existence of such Standards and Publications shall not
in any respect preclude any member or nonmember of IPC from manufacturing
or selling products not conforming to such Standards and Publication, nor
shall the existence of such Standards and Publications preclude their voluntary
use by those other than IPC members, whether the standard is to be used
either domestically or internationally.
Recommended Standards and Publications are adopted by IPC without regard to
whether their adoption may involve patents on articles, materials, or processes.
By such action, IPC does not assume any liability to any patent owner, nor
do they assume any obligation whatever to parties adopting the Recommended
Standard or Publication. Users are also wholly responsible for protecting
themselves against all claims of liabilities for patent infringement.
The material in this standard was developed by the Aqueous Cleaning Task
Group (5-31c) of the Cleaning and Coating Committee (5-30) of the Institute
for Interconnecting and Packaging Electronic Circuits.

Copyright © 1996 by the Institute for Interconnecting and Packaging Electronic Circuits. All rights reserved. Published 1996. Printed in the
United States of America.
No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission
of the publisher. 1996
 IPC-AC-62A

THE INSTITUTE FOR

INTERCONNECTING
Aqueous Post Solder
AND PACKAGING Cleaning Handbook
ELECTRONIC CIRCUITS

Developed by the Aqueous Cleaning Task Group of the Cleaning and

Coating Committee of the Institute for Interconnecting and Packaging
Electronic Circuits

Users of this standard are encouraged to participate in the

development of future revisions.

Contact:

IPC
2215 Sanders Road
Northbrook, Illinois
60062-6135
Tel 847.509.9700
Fax 847.509.9798
URL: http://www.ipc.org
IPC-AC-62A
Any Standard involving a complex
technology draws material from a
vast number of sources. While the
principal members of the IPC
Cleaning and Coating
Committee
Chairman
Joe Felty
Texas Instruments
Aqueous Cleaning Task Group
Adams, David, Rockwell
International
Alzua, Bernard, Bernard Alzua &
Associates, Inc.
Amick, Patricia J., McDonnell
Douglas Aerospace
Astbury, Arthur, Altron Incorporated
Banis, Jim, West Tek
Bernier, Dennis, Kester Solder
Division
Breunsbach, Rex, Electronic Controls
Design Inc.
Cala, Frank, Church & Dwight Co.
Inc.
Crane, Lawrence, MacDermid Inc.
Crawford, Timothy, EMPF
Danforth, Christopher, CSL Inc.
ii
Acknowledgment
Aqueous Cleaning Task Group of the
IPC Cleaning and Coating Committee
are shown below, it is not possible to
include all of those who assisted in
Aqueous Cleaning
Task Group
Chairman
Carl Tautscher
Tautscher & Assoc.
Vice Chairman
Brian Ellis
Protonique
Dodgen, David, Multicore Solders
Elliott, Donald, Elliott Technologies
Felty, Joe, Texas Instruments Inc.
Hill, Kenneth, Hughes Aircraft Co.
Hymes, Les, Les Hymes Associates
Johnson, Kathryn, Hexacon Electric
Co.
Kapner, Lorne, P. Kay Metal Supply
Inc.
Kenyon, William G., Global Centre
for Process Change
Kukelhan, Julie, EMPF
Maguire, James, Boeing Defense &
Space Group
Malofsky, Bernard, Loctite
Corporation
Munson, Terry, CSL Inc.
Reynolds, Steve, Accel
January 1996
the evolution of this standard. To
each of them, the members of the
IPC extend their gratitude.
Technical Liaison of the
IPC Board of Directors
Leo Reynolds
Electronic Systems, Inc.
Roos, Leo, MacDermid Inc.
Rosser, Jerald, Hughes Aircraft Co.
Russo, John, Separation
Technologists Inc.
Scheiner, David, Kester Solder
Division
Sellers, Robin, Delco Electronics
Slanina, Joseph, AlliedSignal
Aerospace
Tellefsen, Karen, Alpha Metals Inc.
Tjelle, Phillip, Boeing Defense &
Space Group
Treiber, John, The John Treiber Co.
Wilmot, Lee, Hadco Corp.
Wood, James, Petroferm Inc.
Yaeger, Erin, Ney Ultrasonic Inc.
January 1996 IPC-AC-62A

Table of Contents
1.0 SCOPE ...................................................................... 1 7.4.3 Ultrasonic Agitation .......................................... 8
1.1 Purpose .............................................................. 1 7.5 Rinsing ............................................................... 8
2.0 APPLICABLE IPC DOCUMENTS AND 7.6 Drying ................................................................ 8
REFERENCES.................................................................... 1
8.0 FACTORS THAT INFLUENCE SELECTION OF
2.1 Joint Industry Standards .................................. 1 WASH AND RINSE MEDIA, PROCESS CONDITIONS
AND APPLICATION EQUIPMENT .................................... 8
3.0 TERMS AND DEFINITIONS ..................................... 1
8.1 Environmental, Safety and Health
3.1 ‘‘Aqueous Cleaning’’......................................... 1 Aspects............................................................... 8
3.2 ‘‘Wash’’ or ‘‘Washing’’...................................... 1 8.1.1 Waste Type and Quantity Generated,
3.3 ‘‘Rinse’’ or ‘‘Rinsing’’....................................... 1 Waste Management ........................................... 8
3.4 ‘‘Drying’’ ........................................................... 1 8.1.2 Conservation Efforts and Feasibility................. 9
3.5 ‘‘Gross Drying’’................................................. 1 8.1.3 Hazards and Controls ........................................ 9
3.6 ‘‘Defluxing’’ (‘‘Flux Removal’’ or ‘‘Post 8.2 Type of Flux and Contaminants to be
Solder Cleaning’’) ............................................. 1 Removed .......................................................... 10
3.7 ‘‘Fine Cleaning’’................................................ 2 8.3 Degree of Cleanliness to be Achieved
3.8 ‘‘Screen and Stencil Cleaning’’ ........................ 2 and Volume to be Processed ........................... 10
3.9 ‘‘Semi-Aqueous Cleaning’’ ............................... 2 8.4 Materials and Component Compatibility
with Media and Process .................................. 10
3.10 ‘‘Organic Solvent Cleaning’’ ............................ 2
8.5 Equipment Compatibility with Media ............ 10
3.11 ‘‘Non-Reactive Additives’’................................ 2
8.6 Part Geometry.................................................. 10
3.12 ‘‘Reactive Additives or Reactants’’ .................. 2
8.7 Process Cost..................................................... 11
3.13 ‘‘Organic Solvent Emulsions in Aqueous
Media’’............................................................... 2 8.7.1 Cost Model Elements ...................................... 11
3.14 ‘‘Manual Cleaning’’........................................... 2 9.0 WATER RESOURCES AND QUALITY ................. 11
3.15 ‘‘Batch Cleaning’’.............................................. 2 9.1 Measurement of Water Purity ......................... 11
3.16 ‘‘In-Line Cleaning’’........................................... 2 9.1.1 Non-Ionic ......................................................... 11
4.0 INTRODUCTION ....................................................... 2 9.1.2 Ionic ................................................................. 12
9.2 Water Purity Standards.................................... 12
5.0 OBJECTIVES OF THE CLEANING PROCESS
9.3 Water Purification Methods............................. 13
DESIGN .............................................................................. 3
9.3.1 Mechanical Filtration ...................................... 13
6.0 CONTAMINANT TYPES AND REMOVAL 9.3.2 Water Softening ............................................... 13
CHARACTERISTICS .......................................................... 3
9.3.3 Dissolved Mineral Removal............................ 13
6.1 Polar Residues ................................................... 4
9.3.4 Miscellaneous Methods ................................... 14
6.2 Non-Polar Water Soluble Residues................... 4
6.3 Non-Polar Water Insoluble Residues ................ 6 10.0 WASH AND RINSE MEDIA ................................. 14
6.4 Non-Solubilizable Residues .............................. 6 10.1 Water without Additives.................................. 14
10.2 Surfactants and Other Non Reactive
7.0 MECHANISMS AND EFFECTS OF AQUEOUS Type Additives................................................. 14
CLEANING ......................................................................... 7
10.3 Non Saponifier Reactive Additives................. 15
7.1 Wetting of surfaces............................................ 7
10.4 Saponifiers ....................................................... 15
7.2 Dissolution ......................................................... 7
10.5 Organic Solvent Emulsions in Water.............. 16
7.2.1 Ionic Dissolution ............................................... 7
10.6 Rinse Water Parameters .................................. 16
7.2.2 Non-Ionic Dissolution ....................................... 7
7.2.3 Surface Agent Dissolution, Emulsification....... 7 11.0 THE WASH/RINSE/DRY PROCESS .................... 16
7.2.4 Saponifier Dissolution ....................................... 7 11.1 Application Methods, Wash and Rinse........... 16
7.2.5 Chelation Dissolution ........................................ 7 11.1.1 Brush................................................................ 16
7.3 Solder Ball and Particulate Removal................ 8 11.1.2 Immersion ........................................................ 16
7.4 The Physics of Cleaning ................................... 8 11.1.3 Spray in Air ..................................................... 16
7.4.1 Temperature ....................................................... 8 11.1.4 Spray Under Immersion .................................. 16
7.4.2 Mechanical Agitation ........................................ 8 11.1.5 Centrifugal ....................................................... 17
iii
IPC-AC-62A January 1996

11.1.6 Ultrasonics ....................................................... 17 14.1.2 Testing for Residues (Surface

11.2 Drying .............................................................. 18 Cleanliness)...................................................... 24
11.2.1 Gross and Fine Drying.................................... 18 14.1.3 Electrical/Environmental Testing .................... 25
11.2.2 Air-knife and Forced Air Drying .................... 18 14.2 Optimizing and Controlling Process
Parameters........................................................ 25
11.2.3 Radiation Drying ............................................. 18
14.2.1 Process Controls .............................................. 25
11.2.4 Vacuum Drying................................................ 18
11.2.5 Organic Solvent Drying Agents ...................... 18 15.0 WASTE MANAGEMENT AND REGULATORY
11.2.6 Centrifugal ....................................................... 19 ISSUES ............................................................................. 25
11.3 Solder Flux Removal ...................................... 19 15.1 Environmental Issues ...................................... 25
11.3.1 Water Soluble Organic Acid Flux................... 19 15.1.1 Air Emissions .................................................. 26
11.3.2 Rosin Type Flux .............................................. 19 15.1.2 Wastewater....................................................... 26
11.3.3 SA Type Flux................................................... 19 15.1.3 Solid Waste ...................................................... 27
11.3.4 Low Residue/No-Clean Flux .......................... 19 15.2 Contamination Removal and
Treatment ......................................................... 27
11.3.5 Removal of Other Materials ........................... 19
15.2.1 Air Emissions .................................................. 27
11.3.6 Solder Paste Removal from Stencils .............. 20
15.2.2 Wastewater....................................................... 27
11.4 Fine Cleaning .................................................. 20
15.2.3 Solid Waste ...................................................... 30
12.0 EFFECTS FROM AQUEOUS MEDIA,
APPLICATION AND DRYING METHOD ON Appendix A ................................................................. 32
MATERIALS AND ELECTRICAL COMPONENTS ......... 20
Appendix B ................................................................. 37
12.1 Chemical Effects.............................................. 20
12.1.1 Water without Additives.................................. 20
12.1.2 Water with Additives....................................... 20 Figures
12.2 Thermal Effects ............................................... 20 Figure 4−1 Post Solder Assembly Cleaning Processes ............... 3
12.3 Mechanical Effects from Spray Figure 4−2 Flux/Cleaning Options............................................... 4
Impact .............................................................. 20
Figure 4−3 Cleaning Media Types ............................................... 5
12.4 Effects from Ultrasonic Energy ...................... 20
Figure 15−1 Closed Loop Design without Chelating Agent....... 31
12.5 Effects from Centrifugal Forces...................... 21
Figure 15−2 Closed Loop Design with Chelating Agent ............ 31
12.6 Electrostatic Discharge from Drying
Figure A−1 Basic Steps............................................................... 33
Operations........................................................ 21

13.0 APPLICATION EQUIPMENT ............................... 21

Tables
13.1 Bench Top, Manual ......................................... 21
13.1.1 Open Tank Cleaning........................................ 21 Table 8−1 Ratings for Reactivity.............................................. 10
13.1.2 Non-Immersion Cleaning ................................ 21 Table 8−2 Wash Media, Typical Cleaning Capability ............. 12
13.1.3 Drying .............................................................. 21 Table 15−1 Heavy Metal in Effluent ......................................... 27
13.2 Batch Type....................................................... 21 Table 15−2 Separation Technologies ......................................... 29
13.2.1 Single-Chamber Spray .................................... 21 Appendix A, Table One High Ionics Reading After Cleaning... 34
13.2.2 Multi-Chamber Immersion.............................. 22 Appendix A, Table Two White Residue ...................................... 34
13.2.3 Multi-Chamber Spray .................................... 23 Appendix A, Table Three Incomplete Drying ............................... 35
13.3 In-Line Equipment .......................................... 23 Appendix A, Table Four Water Recycling, short Mechanical
Filter Life ............................................. 35
13.4 Screen and Stencil Cleaners............................ 24
Appendix A, Table Five Water Recycling, Poor Organics
14.0 EVALUATION AND PROCESS Removal ............................................... 35
OPTIMIZATION ................................................................ 24 Appendix A, Table Six Water Recycling, Short Life of Ion
14.1 Evaluation and Data Collection ...................... 24 Exchange Resins .................................. 35
14.1.1 Material and Component Appendix A, Table Seven Miscellaneous Anomalies .................... 36
Compatibility ................................................... 24

iv
January 1996 IPC-AC-62A

Aqueous Post Solder Cleaning Handbook

1.0 SCOPE 2.6.9.1, ‘‘Test to Determine Sensitivity of Electronic

This handbook addresses aqueous cleaning of electrical/ Assemblies to Ultrasonic Energy’’
electronic parts and application tools after soldering. 2.6.13, ‘‘Assessment of Susceptibility to Metallic Dendritic
Growth : Uncoated Printed Wiring’’
1.1 Purpose The content of this text is intended to pro-
vide a basic understanding of the subject and to serve as a 2.6.14, ‘‘Resistance to Electromigration, Polymer Solder-
guide to users or prospective users of aqueous cleaning mask’’
technology, allowing selection or improvement of aqueous
IPC-PE-740 Troubleshooting Guide for Printed Board
cleaning processes.
Manufacture and Assembly
2.0 APPLICABLE DOCUMENTS
2.1 Joint Industry Standards1
IPC-B-24 Surface Insulation Resistance Test Board
J-STD-001 Requirements for Soldered Electrical and Elec-
IPC-B-25 Standard Test Board tronic Assemblies
IPC-B-36 Cleaning Alternatives Test Board NOTE: For additional documents and references related to
general cleaning issues (IPC, DOD, EIA, UL, ASTM and
IPC-T-50 Terms and Definitions
ANSI) the reader is referred to IPC-CH-65).
IPC-SC-60 Post Solder Solvent Cleaning
3.0 TERMS AND DEFINITIONS
IPC-AC-61 Post Solder Semi-Aqueous Cleaning
All terms and definitions used throughout this handbook
IPC-CH-65 Guidelines for Cleaning of Printed Boards and are in compliance with IPC-T-50. Other basic terms and
Assemblies definitions, essential for the discussion of the subject, are
IPC-TP-383 Organic Surface Contamination—Its Identifi- provided below or are defined in appropriate sections of
cation, Characterization, Record Effects on Surface Insula- this handbook.
tion Resistance and Conformal Coating Adhesion
3.1 ‘‘Aqueous Cleaning’’ — a cleaning process that uses
IPC-TM-650 Test Methods Manual an aqueous medium, consisting of more than one half of
2.3.25, ‘‘Resistivity of Solvent Extract (Manual)’’
water for washing, and water for subsequent rinsing.

2.3.26, ‘‘Ionizable Detection of Surface Contaminants
(Dynamic Method)’’
2.3.26.1, ‘‘Ionizable Detection of Surface Contaminants
(Static Method)’’
2.3.27, ‘‘Cleanliness Test - Residual Rosin’’ (UV Method)
2.3.27.1, ‘‘Rosin Flux Residue Analysis, HPLC Method’’
3.2 ‘‘Wash’’ or ‘‘Washing’’ — the primary cleaning
operation that removes undesirable impurities (contami-
nants) from surfaces by chemical and physical effects.
3.3 ‘‘Rinse’’ or ‘‘Rinsing’’ — a cleaning operation (usu-
ally following the wash step) where water replaces - via a
dilution mode - any residual contamination.

2.3.28, ‘‘Ionic Analysis of Circuit Boards, Ion Chromatog-
raphy Method’’
2.3.38, ‘‘Surface Organic Contaminant Detection Test (In-
House Method)’’
2.3.39, ‘‘Surface Organic Contaminant Detection Test
(Infrared Analytical Method)’’
2.6.3.1, ‘‘Moisture and Insulation Resistance - Polymeric
Soldermasks and Conformal Coatings’’
2.6.3.3 ‘‘Corrosivity Testing’’
3.4 ‘‘Drying’’ — the process of removing surface and/or
absorbed water from the washed and rinsed parts.
3.5 ‘‘Gross Drying’’ — the removal of surface water.
3.6 ‘‘Defluxing’’ (‘‘Flux Removal’’ or ‘‘Post Solder Clean-
ing’’) — the cleaning process designed to remove solder
flux and by-products. Other objectives are removal of pro-
cess residues and materials used as production aides, such
as water soluble maskants. Impurities left by board or com-
ponent fabrication processes or other operations may or

1. IPC, 2215 Sanders Road, Northbrook, IL 60062. Phone: 847-509-9700.

1
IPC-AC-62A
may not be removed by this process.
3.7 ‘‘Fine Cleaning’’ — A final cleaning step that
removes contaminants introduced after defluxing and or
which improves the degree of surface cleanliness achieved
by defluxing or other previous cleaning operations and to
improve conformal coating adhesion.
3.8 ‘‘Screen and Stencil Cleaning’’ — the process of
removing unused solder paste/flux from application tools to
maintain them in an acceptable condition for re-use.
3.9 ‘‘Semi-Aqueous Cleaning’’ — is a cleaning process
that uses only organic solvents for washing and water for
rinsing.
3.10 ‘‘Organic Solvent Cleaning’’ — is a cleaning pro-
cess that uses organic solvent for washing and rinsing.
3.11 ‘‘Non-Reactive Additives’’ — compounds which
do not react chemically with solder flux and other process
residues. These additives may serve to lower surface ten-
sion, assist in the removal of water insoluble residues,
exercise foam control, or inhibit wash medium attack on
construction materials.
3.12 ‘‘Reactive Additives or Reactants’’ — water
soluble chemical compounds which react chemically with
the contaminants that are to be removed by the wash
medium. Examples are chelating agents, saponifiers, or
chemical neutralizers, etc.
3.13 ‘‘Organic Solvent Emulsions in Aqueous Media’’
— are uniform dispersions of small amounts of organic
solvents in water.
3.14 ‘‘Manual Cleaning’’ — a cleaning step where parts
are processed manually with process cycle time controlled
by operator.
3.15 ‘‘Batch Cleaning’’ — the cleaning of multiple parts
or ‘‘batches of parts’’ as a group where process cycle times
are controlled.
3.16 ‘‘In-Line Cleaning’’ — the cleaning method where
parts are processed continuously on a conveyor and process
cycle time is controlled by the conveyor speed.
4.0 INTRODUCTION
Aqueous cleaning of electrical/electronic parts and assem-
blies has been in use since the fifties. Evolution with
refinement in wash media, process conditions/techniques
and application equipment yielded a technology that offers
viable options to many cleaning operations previously per-
formed with ozone depleting chemicals (ODCs).
2
January 1996
As any other technology, aqueous cleaning has its limita-
tions and peculiarities, which must be understood before
process selection is made. It must also be clear to the pro-
spective user of this technology, that there is no universal
substitute for ozone depleting cleaning solvents, but aque-
ous cleaning is capable of addressing a broad portion of the
‘‘cleaning spectrum’’ covered previously by ODCs.
Water is a better solvent for polar (ionizable) materials than
organic solvents, but it is a poor solvent for most non-polar
materials, such as greases, fats, oils and rosin. For removal
of most non-polar soils, additives must be used.
Aqueous solutions have been used since the sixties to
remove rosin flux. Their capability to achieve lower ionics
and rosin residue levels than obtained by cleaning with
ODCs has been demonstrated by practical applications and
Phase 2 Testing. The market offers the prospective user a
selection of many different formulations that are effective
in removing rosin flux and other contaminants.
In the assembly process there are five major application
areas:
• removal of rosin solder flux after soldering
• removal of water soluble organic acid solder flux after
soldering
• removal of SA solder flux after soldering
• fine cleaning in preparation for coating, bonding and
sealing
• cleaning of screens, stencils, soldering machine pal-
ettes, and other application tools
Figure 4-1 shows typical applications in the assembly pro-
cess. The solder flux used determines what cleaning pro-
cess should be used. A flux/cleaning decision matrix is
shown in Figure 4-2 and the three basic cleaning media
types with their options are shown in Figure 4-3.
Cost of aqueous cleaning is, in general, lower than the cost
of cleaning with organic solvents, but is influenced by local
variations in water quality, energy cost and discharge regu-
lations.
Aqueous cleaning, as all cleaning processes, may pose air
and/or water pollution challenges. Compared to CFC clean-
ing, aqueous cleaning may have an inherently higher
energy demand as wash water and, in many cases, rinse
water needs to be heated and additional energy is required
for drying the wet parts. The prospective user of aqueous
cleaning should be aware of available means to recycle
rinse water and recapture most of the energy with closed
loop process designs.
The market offers a great array of application equipment
for different aqueous cleaning techniques, including use of
ultrasonics, centrifugal forces, brush, immersion and spray.
A broad selection of equipment design features accommo-
dates the many different requirements for performance,
cost, floor space, waste management and safety and health
issues.
January 1996 IPC-AC-62A

are cleaned to maintain them in an optimum condition for

re-use.
The degree of cleanliness that is required may vary with
Assembly product type and performance needs. Screens and stencils
are usually cleaned to a ‘‘visually clean’’ condition. Part
Cleaning cleaning must be capable of removing invisible and visible
contaminants, such as ionic materials, and residues that
could interfere with wetting and bonding. For assemblies,
a ‘‘visually clean’’ appearance may be satisfactory cosmetic
criteria, but is not satisfactory to assure product perfor-
mance. Hence semi-quantitative and quantitative tests are
typically employed to verify that the cleaning process
objectives are met. While cleaning to a ‘‘set of perfor-
Cleaning After mance requirements’’ is a primary objective, other objec-
Machine tives must also be set and achieved. The cleaning process
Soldering must not damage the parts cleaned and cleaning must be
accomplished in a practical and cost effective way. The
process employed must also be safe to operators and be
environmentally compatible.
Water alone is a very safe material that will not damage
most parts used in electronics assembly processes. Water
Cleaning After does not pose any problems as far as safety and health
aspects are concerned. However, it needs to be removed
Manual
from the parts after cleaning, as presence of moisture may
Soldering interfere with the electrical performance of the parts.
Hence, a drying step must be part of an aqueous cleaning
process. As in all cleaning processes, parts need to be
checked for compatibility and allowance must be made for
appropriate safety and health issues.
When choosing a cleaning process, many variables must be
Screen and considered. Process volume, labor, space requirement,
Stencil wash/rinse media, agitation method, application conditions
Cleaning and equipment features must all be taken into account.
In summary, the objectives for the cleaning process design
are the removal of undesirable materials (process residues)
from part surfaces, by a practical, cost effective, safe and
environmentally friendly method.
6.0 CONTAMINANT TYPES AND REMOVAL CHARAC-
Fine Cleaning TERISTICS
Before Effective cleaning of parts requires that surface residues are
Conf. Coating/ either solubilized or dispersed by the wash medium or are
Bonding forced off the part surfaces by mechanical action, such as
by brushing, impact of spray or ultrasonic cavitation. When
the general nature of the residues is known, an adequate
Figure 4−1 Post Solder Assembly Cleaning Processes cleaning medium and application technique can be
selected.
This handbook discusses presently available aqueous In a simplified view, residues can be typified as either one
cleaning technology and provides guidelines for selecting or a combination of the following:
or improving aqueous cleaning processes.
• water soluble materials, polar and non-polar
5.0 OBJECTIVES OF THE CLEANING PROCESS DESIGN • non-polar materials that are insoluble in water, but
The purpose of cleaning is to remove foreign materials removable with water containing suitable additives
from part surfaces in order to avoid detrimental effects on • materials that cannot be removed practically by clean-
product performance and appearance. Screens and stencils ing media, but some or all of the residues may be

3
IPC-AC-62A
Water Soluble
Resin Type
OA Type
Cleaning with Cleaning with
Organic Aqueous Media
Solvents
Cleaning with
Semi-Aqueous
Media
Cleaning with
Aqueous Media
Figure 4−2 Flux/Cleaning Options
removable by mechanical action
6.1 Polar Residues
Definition: ‘‘Polar Residues’’ — water soluble residues
that form ions when dissolved in water.
Materials that form ions when dissolved in water, are
termed ionizable or polar. For example, when a typical
polar residue,‘‘salt’’ (sodium chloride) in a fingerprint
deposit, dissolves in water, the sodium chloride molecule
dissociates in water into positive sodium ions and negative
chloride ions:
Na+ + Cl− = Na+ + Cl−
In its ionized form, sodium chloride will increase the elec-
trical conductivity of the water. The more ions are formed,
the higher will be the electrical conductivity of the water.
Ionized residues cause signal changes in electrical circuitry,
may initiate electromigration and corrosion, and, as they
are water soluble, will reduce coating adhesion. As polar
residues are soluble in water, they can be removed by a
plain water wash. The surface tension of the water (the
ability to wet the surfaces to be cleaned), temperature and
duration of the wash, agitation and solubility characteristics
of the polar residues (which may vary with chemical
nature), however, must also be considered. Under ‘‘real
world’’ conditions, the polar residues may be partially or
totally embedded in a water-insoluble deposit. A good
4
January 1996
SA Type Low Residue/
No-Clean Type
Cleaning with Cleaning
Organic Tailored to
Solvents Formulation
Cleaning with
Semi-Aqueous No-Cleaning
Media
Cleaning with
Aqueous Media
example is a fingerprint residue, where the salt and perhaps
some water soluble amino acids are covered by skin oil. As
water cannot wet the composite residue and solubilize the
oil film, additives must be used to remove the oil film and
allow dissolution of the embedded polar materials. In most,
but not all cases, increase in wash temperature will also aid
in the removal of these residues. Mechanical agitation of
the wash will also benefit the rate of removal. The amount
of polar residues remaining after cleaning can be measured
with standard solvent extract tests.
Typical Polar Residues:
• plating and etching materials
• chemicals from the substrate or component fabrication
process
• water soluble solder flux constituents
• activators from rosin or SA type solder flux
• flux reaction products
• water soluble soldermask constituents
• deposits from manual handling
6.2 Non-Polar Water Soluble Residues
Definition: ‘‘Non-Polar Water Soluble Residues’’ — resi-
dues of organic compounds that are soluble in water, but do
not form ions when dissolved in water.
Organic materials that are water soluble, but do not ionize
in water, are capable of interfering with wetting and bond-
ing of conformal coatings. If the non-polar materials are
January 1996 IPC-AC-62A

IPC GENERAL
CLEANING
HANDBOOK
CH-65

IPC IPC IPC

AC-62 SA-61 SC-60

TYPE B TYPE C
TYPE A SEMI- ORGANIC
AQUEOUS AQUEOUS SOLVENT
CLEANING CLEANING CLEANING

B1 C1
A1 Polar Org. Polar
Water without Solvent Wash Org. Solv. Wash
Additives Water Rinse and Rinse

A2 B2 C2
Water with Non-Polar Org. Non-Polar
Non-Reactive Solvent Wash, Org. Solv. Wash
Additives Water Rinse and Rinse

A3 C3
Water with Bipolar
React. Additives Org. Solv. Wash
Non-Sap.. and Rinse

C4
A4
Water with Bipolar
React. Additives Org. Solv. Wash
Saponifiers Non-polar
Rinse

A5
Aqueous Org.
Solvent
Emulsions

Figure 4−3 Cleaning Media Types

5
IPC-AC-62A
hygroscopic, formation of surface water films can be
expected with a resulting decrease in surface resistivity
and, under favorable conditions, electromigration may
occur.
Polyglycols, for example, are water soluble but non-
ionizable. They are widely used in water soluble flux for-
mulations and in wave oils. The degree of solubility of
polyglycols varies with compound type used. Absorption
and adsorption of polyglycol by the laminate may also
occur during soldering or hot air leveling.
Non-ionic water soluble materials remaining on the parts
after cleaning cannot be measured with solvent extract
resistivity/conductivity tests. Qualitative and quantitative
instrumental methods can be employed to measure removal
efficiency. Additives to the water, increase in wash tem-
perature, cycle time and mechanical wash action will
increase the efficiency in removing these residues.
6.3 Non-Polar Water Insoluble Residues
Definition: ‘‘Non-Polar Water Insoluble Residues’’— resi-
dues that do not dissolve in water, but can be solubilized by
additives to water.
Most of these materials are effectively removed by water
with suitable additives. The presence of these residues can
interfere with wetting, bonding and coating operations, as
both wetting of surfaces and bond development will be
adversely affected.
Typical Non-Ionic Water Insoluble Residues
• rosin
• synthetic resin
• organic compounds from low residue/no-clean flux
formulations
• plasticizers from core flux
• reaction products
• greases and oils
• finger print oils
• release agents on components
• insoluble inorganic compounds
(oxidation products)
• solder balls
• rheological additives to solder pastes
Rosin can be solubilized by chemical reaction, such as the
process of saponification. Synthetic resins can be removed
by organic solvent emulsions in water, a process where the
small amounts of organic solvent dissolve the resin and the
water portion dissolves water soluble residues. The variety
of organic compounds that may be contained in many of
the new class of low residue/no-clean fluxes, may require a
cleaning process tailored to a specific flux formulation,
unless the removability characteristics of the flux are
known. Plasticizers from core flux can be removed by
water with additives and mechanical action. Some of the
6
January 1996
flux reaction products that form when the active flux con-
stituents react with oxidation products on the surfaces of
metals soldered, may have little to no solubility. Additives
to the wash and mechanical action will aid in the removal
of these residues.
Fats, oils and greases, most of which are effectively
removed by organic solvents, require water with additives.
The mechanisms of removal of these soils by an aqueous
medium, are totally different than the removal mechanism
of organic solvents. While organic solvents dissolve these
residues, water with additives depends on dispersion/
emulsification effects that physically separate the residues
from the part surfaces and mechanical action that carries
the residues away. Some of the fats, oils and greases can be
removed by saponification while others are removed by
dispersion and emulsion effects. An exception is the
organic solvent emulsion in water which yields similar
removal characteristics as obtained with organic solvent.
Mold release agents on components may be either water
soluble or organic solvent soluble. When choosing a clean-
ing process, the mold release used must be compatible.
Water insoluble inorganic materials from the fabrication or
assembly process, may leave residues with little or no solu-
bility. Chemically reactive additives to the wash, such as
complexing agents and acidic constituents, may help to
remove these residues. Employment of ultrasonic agitation
is an efficient method to cope with this type of residue.
Silicone greases and oils, and silicone type mold release
agents are difficult to remove with organic solvent and even
more difficult when aqueous cleaning is employed. Bond-
ing and coating and other subsequent operations can be
detrimentally affected.
6.4 Non-Solubilizable Residues
Definition: ‘‘Non-Solubilizable Residues’’— residues that
require mechanical energy for removal, as they cannot be
removed by solubilization.
Removal of residues that are insoluble in water and organic
solvents, and cannot be solubilized by reactive and non-
reactive additives, requires strong mechanical action.
Examples are forced spray, brushing or ultrasonic cavita-
tion effects. This type of residue is often mixed in a deposit
of solubilizable materials. As one portion of the deposit
becomes dissolved, the insoluble portion ‘‘floats’’ off and is
carried away by the wash action. Ultrasonic agitation is the
most effective method to remove this residue type.
Typical Non-Solubilizable Residues:
• siliceous material from dust and dirt
• hydrolyzed or oxidized rosin
• some flux reaction products (some white residues)
• aged (oxidized) chemical process compounds from
board/component fabrication
January 1996
• silicone greases/oils
• glass fiber from the laminate
• silica and clay type fillers of solder masks (permanent
and water soluble masks)
• solderballs and solder dross
7.0 MECHANISMS AND EFFECTS OF AQUEOUS CLEAN-
ING
Introduction
There are several mechanisms by which contaminants may
be removed from electrical/electronic parts with the help of
water, with or without additives. This chapter catalogues
the main ones and gives a brief description of each.
7.1 Wetting of surfaces A surface is said to be wetted if
a film of water or other liquid remains on it without break-
ing up. It is important to wet the parts in order to achieve
good cleaning. Both the surface tension of the cleaning
media and the surface tension of the parts being cleaned
affect the wetting process. Pure water has a high surface
tension, approximately 72 dynes/cm. This compares with
figures in the range of 16-36 dynes/cm for most organic
solvents and aqueous solutions. Typical part surface ten-
sions can range from 30-70 dynes/cm for plastics, and as
high as 1000 for ceramics or glass. The cleaning medium
used must have a surface tension below that of the part
surface. For cleaning in tight spaces, the surface tension of
the cleaning media, the surface energy of the parts being
cleaned as well as the process agitation energy are impor-
tant.
Note: Users often suppose that the surface is perfectly
smooth and homogeneous, which is rarely the case in prac-
tice. In the case of an etched printed circuit board, the sur-
face is rough, due to the imprint left by the copper treat-
ment. This tends to wet more readily than if the same
surface were glass-smooth. Oxidized surfaces have a much
higher solid surface tension than nonoxidized ones, so wet
more readily. The presence of surfactants may modify the
apparent wetting, whether the surface is oxidized or not.
Water-soluble contaminants are generally wetted by water.
7.2 Dissolution Dissolution is the first step in the three
step cleaning process of washing, rinsing and drying. Dis-
solution consists of removing contaminants. In the rinsing
step, the contaminated wash (dissolution) medium is
replaced with water through a succession of dilution opera-
tions. The drying step consists of removing the remaining
rinse water. In order to ensure that a contaminant dissolves
in water, it is frequently necessary to use an additive. As a
simple illustration, hand washing is easier with the help of
soap.
7.2.1 Ionic Dissolution This method consists of causing
the contaminant to dissociate directly into ions in the water.
As an illustration, let us take salt as a simple example.
IPC-AC-62A
When salt dissociates, the sodium atom ‘‘lends’’ the chlo-
rine atom its outside electron (giving it a positive charge)
and the chlorine atom ‘‘borrows’’ it (giving it a negative
charge). In all cases of ionic dissolution, the electrical con-
ductivity of the water increases.
Typical ionic contaminants on electronics parts are some
flux activators, the reaction products between some flux
activators and metal oxides, salts from fingerprints, incor-
rectly cleaned components and bare boards, and salts from
the prepolymers used in the manufacture of printed circuit
substrates, solder masks etc. This class of contaminants is
the most detrimental as their presence may cause the part
to perform incorrectly in service and to become corroded.
7.2.2 Non-Ionic Dissolution This occurs when a sub-
stance dissolves in water without causing a change of its
electrical conductivity. For example, sugar dissolves
readily in water without forming ions.
Typical non-ionic contaminants on electronics parts are
some flux vehicles, such as polyglycols from HASL fluids,
hand soils, starches from water soluble standoffs and simi-
lar compounds. An important concept is that, while these
materials are not electrically conductive, they are fre-
quently hygroscopic and may adsorb or absorb moisture
and lead to electrical failure.
7.2.3 Surface Agent Dissolution, Emulsification Many
insoluble substances may be solubilized in the presence of
surface agents or surfactants. There are many types of sur-
factants, ranging from simple soaps through a whole range
of synthetic products. Surfactants may themselves be ionic
or non-ionic. Non-ionic ones are usually preferable for
cleaning electronics parts.
7.2.4 Saponifier Dissolution This is a purely chemical
process involving a neutralization reaction (i.e., an acid/
base reaction). Saponification means’’making soap’’. A
similar process is used for saponifying rosin and other car-
boxylic acids into a water-soluble soap which can then be
removed by washing. The commercial saponifiers may
contain some solvents or surfactants to assist in removal of
the non-saponifiable residues. Saponifier formulations,
without proper inhibitors, may attack some metal surfaces
(e.g. aluminum, zinc). Effects can be magnified with higher
temperatures and exposure times. It is recommended that
trials be done to ensure complete compatibility. A weak
saponifier solution has sometimes been advocated to
improve the dissolution of water-soluble flux residues.
7.2.5 Chelation Dissolution Chelation is a process
whereby an insoluble product is dissolved with the aid of a
complexant. EDTA (ethylene diamine tetra acetic acid) and
its sodium salt are typical chelating agents. Chelation is
particularly useful for dissolving heavy metal salts which
7
IPC-AC-62A
are otherwise insoluble in water. There are several mecha-
nisms of chelation. The resultant complex or chelate is
water-soluble. Waste treatment of chelating baths can be
difficult.
7.3 Solder Ball and Particulate Removal Solder ball and
particulate removal is often more difficult than dissolving
residues. Particles may be classified into several categories.
As a general rule, the only reliable removal methods are
mechanical. Aqueous cleaning will remove the majority of
solder balls. Removal efficiency will depend on the amount
of mechanical energy used. Most aqueous machines should
be able to remove dust and fibrous materials, provided they
are not trapped.
7.4 The Physics of Cleaning As important as the chemi-
cal aspects of cleaning, the purely physical mechanisms
also play a role. As a general rule, the higher the thermal
and mechanical energy applied, the better the cleaning will
become. The obvious limits are when the energy becomes
sufficiently great that damage to the part could occur.
7.4.1 Temperature As the temperature of the cleaning
solvent increases, most contaminants dissolve more readily
and the chemical activity of additives increases. Higher
temperatures may soften fluxes and allow easier removal.
Rinse times may be reduced at higher temperatures. Opti-
mal temperature is dependent on cleaning equipment,
cleaning agent, contaminants and components. However
many amino acid compounds found in water soluble fluxes
become less soluble above 50°C.
7.4.2 Mechanical Agitation The most usual way of pro-
viding mechanical agitation is by ‘‘spray in air’’ where the
aqueous cleaner is pumped through nozzles onto the parts
being cleaned. The nozzle design must be made in conjunc-
tion with the hydraulic characteristics of the pump. It has
been shown that similar results can be obtained with high-
volume, low-pressure as with low-volume, high pressure
on condition that the total kinetic energy imparted to the
fluid is the same. The nozzle design and the angle of attack
can be optimized for the job required. Plumbing design can
also contribute to energy losses.
Some equipment employs ‘‘spray under immersion’’ spray-
ing. This technique was evolved to prevent mist formation
from occurring with combustible solvents. Its kinetic effi-
ciency is less than that of ‘‘through-air’’ spraying.
7.4.3 Ultrasonic Agitation One of the most effective
methods of accelerating cleaning is the use of ultrasound to
speed the process. The factors that contribute to ultrasonic
effectiveness include density, surface tension, viscosity and
solution temperature.
Ultrasound creates microscopic voids in the cleaning solu-
tion which are then filled with vapor. This is called cavita-
8
January 1996
tion. If the cavitation is near the surface of the part, the
mechanical energy produced by the collapse of the cavities
helps dissolve contaminants. Pumping then transports fresh
cleaning solution to the part surface and removes contami-
nated solution. Successful ultrasonic cleaning in aqueous
solutions can occur only if the solution has been previously
degassed. The most popular ultrasonic frequencies are 25
kHz and 40 kHz. The 40 kHZ range is most commonly
used in electronic cleaning where a thorough, moderate
energy process is required.
Ultrasonics, while previously prohibited for cleaning by the
military, can now be used with adequate process documen-
tation. IPC TM-650 2.6.9.1 and 2.6.9.2 provide assistance
for qualifying the use of ultrasonics for cleaning electronic
parts.)
7.5 Rinsing An effective wash will have removed practi-
cally all the contaminants, but these will be held in the
wash water. A quantity of this will be captured by capillary
action under the components, even after draining or air-
knifing. The purpose of rinsing is to replace this contami-
nated, captive water with pure, clean water. Rinsing effi-
ciency follows the similar rules as those used for washing.
7.6 Drying Drying is part of the cleaning mechanism.
Essentially, there are two common types, mechanical and
evaporative, but many machines use a combination of
them. Mechanical drying, if it is possible, offers the advan-
tages:
• low energy requirements
• rapid and effective
• removes any residual contaminants with the water
There are two ways commonly used for mechanical drying,
centrifugal and high velocity air. Centrifugal drying is
employed on some small machines for hybrid circuits and
small printed circuit assemblies. In-line conveyorized
machines may have one or two sets of top and bottom
knives. ‘‘High-throughput’’ batch machines may have
rotary air knives. A third, but less frequently used, drying
method is with use of organic solvents via displacement or
adsorption modes.
8.0 FACTORS THAT INFLUENCE SELECTION OF WASH
AND RINSE MEDIA, PROCESS CONDITIONS AND APPLI-
CATION EQUIPMENT
8.1 Environmental, Safety and Health Aspects
8.1.1 Waste Type and Quantity Generated, Waste Man-
agement Waste type and quantity of waste generated var-
ies with process type, especially wash media used, and
with volume processed. Definition of waste and required
waste management may also vary from location to loca-
tion, depending on local environmental regulations. DFE
January 1996
(Design for Environment) efforts should consider a process
design that minimizes waste.
Management of waste must consider VOCs (volatile
organic compounds), discharges into ground and manage-
ment of solid waste, as discussed in greater detail in Sec-
tion 16. Cost of waste management must be considered and
included in the overall cleaning cost.
Laws, regulations and ordinances, that apply to environ-
mental, safety and health issues, vary from country to
country and may also vary within regions and localities of
many countries. These variations and the dynamics that are
inherently associated with these issues make it difficult to
impossible to provide the reader with useful data. The fol-
lowing discussion is presented from a perspective of US
federal regulations as of date of issue of Rev. A of IPC-AC-
62. The reader is well advised to consult with appropriate
regulatory authorities before a cleaning process is imple-
mented.
8.1.2 Conservation Efforts and Feasibility An impor-
tant part of the overall DFE effort is to select a process
design that addresses effectively the conservation of
resources, especially resource water and energy. The over-
all objective is to obtain a process that satisfies the require-
ments for achieved cleanliness of the parts with minimal
use of resources, maximum recovery of used materials and
compliance with imposed regulations. In some cases. com-
promises may be made, as amortization time of conserva-
tion cost may not be within a desirable range. This may
especially be true for locations with relaxed regulations,
low cost energy and low cost water and discharge. In the
long run, however, regulations can be expected to become
tighter and resources more costly. Hence from a deeper
perspective, conservation must not be ignored. More details
on conservation efforts are discussed in Sections 15 and 16.
8.1.3 Hazards and Controls
8.1.3.1 General Considerations It is important to real-
ize that even harmless appearing materials and equipment,
that are designed with safety in mind, can present hazards
to safety and health, when operating personnel is inad-
equately trained. Hence personnel training in regards to
equipment operation and chemical, physical and electrical
hazards is a prime responsibility of the equipment user.
In the USA, operating personnel need to be familiar with
both the physical and health hazards of each aqueous
cleaning material used, as shown in the MSDS (Material
Safety Data Sheet) for each material. Operators should be
able to relate to these hazards from Hazcom ( Hazard Com-
munication) labels on the material containers, such as the
HMIS (Hazard Material Identification System) or NFPA
(National Fire Protection Association). Equivalent docu-
mentation is generally available in nations other than the
USA.
IPC-AC-62A
In the USA, equipment must be UL certified, operating
manuals need to be studied and personnel be trained by
equipment manufacturer or qualified personnel. Repairs
and servicing should preferably be left to the equipment
manufacturer. In the USA, operating personnel need to be
also familiar with applicable MSDSs (Material Safety Data
Sheets) and HMIS (Hazard Materials Identification Sys-
tem). Rules and regulations of OSHA and applicable state
agencies for occupational safety and health issues need to
be complied with.
8.1.3.2 Materials Safety Data Sheets In the USA, it is
a legal requirement of OSHAs Hazcom Standard (HCS)
(29 CFR 1910.1200) to maintain MSDSs for each material
to which a worker is exposed in a ‘‘readily accessible loca-
tion’’. Further, workers must be trained in how to read the
MSDSs, and how to recognize spills and releases of each
material. MSDSs must contain other information on the
material including PPE (personnel protection equipment),
first aid procedures, spill control and clean-up steps, and an
emergency telephone number.
8.1.3.3 Hazardous Materials Labeling Systems The
HCS requires that information concerning both the physi-
cal and health hazards of chemical materials, and proper
PPE be shown on each container. Labels which facilitate
this understanding are used and two of the most common
are the HMIS and NFPA, both of which use a 0 to 4 scale
to rate Health, Flammability and Reactivity of the chemi-
cal material (see Table 8-1). 0 means a minimal chemical
hazard and 4 means a severe hazard. (WARNING! Some
other hazard scales use the reverse order where the lowest
figure represents the greatest hazard: it must never be
assumed that hazard scales go in one direction or the other
and operators should be advised accordingly.) While the
flammability and reactivity of both labels are based on the
NFPA ratings, the health hazard rating is different between
the two. HMIS health hazard rating is based on employee
exposure during normal operation and use, whereas the
NFPA rating is based on exposure to the chemical in a fire
situation.
8.1.3.4 Personnel Exposure It is a legal requirement to
maintain worker exposure to chemical vapors at or below
the Permissible Exposure Limit (PEL) for eight hour expo-
sures, and at or below the Short Term Exposure Limit
(STEL) for shorter time periods (typically 15 minutes) as
published by OSHA in the air contaminant section of 29
CFR 1910.1000 and which should be listed on the MSDS.
It is equally important to maintain worker exposures to
chemicals on which OSHA has not established a PEL or
STEL, at or below the Threshold Limit Value (TLV) for
eight hour exposures, as published by the American Con-
ference of Governmental Industrial Hygienists (ACGIH)
and/or the National Institute of Occupational Safety and
9
IPC-AC-62A
Table 8−1
Health (HMIS)
Rating/Hazard (Eye Rating)
0 Essentially
Minimal Non-Irritating
1 Slightly irritatiang
Slight reversible in 7 days
2 Irritating; persisting more
Moderate than 7 days; sensitizer
3 Corrosive, irreversible
Serious corneal opacity
4 Capable of detonation at room
Severe Not applicable
Health (NIOSH) through proper local ventilation or work
practices, or both.
OSHA requires that engineering controls (i.e. local ventila-
tion) be the primary method of controlling employee expo-
sure, and that requiring employees to wear personal protec-
tive equipment (PPE) in the form of respirators for
respiratory protection be used as a last resort if engineering
controls cannot control exposures. Should wearing of res-
pirators be required to adequately protect workers from
vapors of cleaning chemicals, the user is required to have a
written respiratory protection plan (reference 29 CFR
1910.134).
Users of cleaners must also evaluate other safety factors,
such as fire SAFETY considerations and both the acute and
chronic health effects of the specific cleaning chemicals.
Factory Mutual (FM) and the National Fire Protection
Association (NFPA) regard liquids with a flash point below
140°F to be ‘‘flammable,’’ and liquids whose flashpoint is
above 140°F but below 200°F to be ‘‘combustible.’’ Flam-
mable liquids pose explosion hazards when their vapors are
not properly removed by either local or general ventilation.
Users of flammable liquids must also recognize that instal-
lations where these liquids are to be used must conform to
certain construction standards, such as explosion-proof wir-
ing, switches, motors etc. Reference NFPA 35 and OSHA
29 CFR 1910.106. Users of flammable liquids should also
verify with their local fire department the need for notifica-
tion and permitting of the use of these liquids. Notification
may also be required under EPA’s Community Right to
Know regulations 40 CFR 355.30 (b), 370.21 and 370.25
to report storage and usage of certain chemicals to both the
local fire department and emergency planning commission.
Health effects, besides potential inhalation hazards, include
an evaluation of the need for required eye and or face pro-
tection to prevent the irritation to, or corrosive action on
both eye and skin tissues, Also, skin irritation or corrosive
action may be a potential hazard which can be prevented
by wearing appropriate protective gloves.
It is clear that these foregoing regulations apply uniquely to
the USA. However, similar regulations and legislation exist
10
January 1996
Ratings for Reactivity
Flammability Reactivity
Will not burn in air up to 1500°F
(816°C) for 5 minutes exposure Stable under fire
Must be preheated to burn May become unstable
FP > 300°F (149°C) Elevated temperature
FP 100°F (38°C) Normally unstable and readily reacts
but < 200°F (93°C) but does not detonate
FP > 73°F (23°C) Detonates with a strong ignition
but < 100°F (38°C) source
FP < 73°F (23°C) temp
in most other nations. Outside the USA, it behooves users
of cleaning equipment and materials to determine the regu-
lations relative to their particular conditions of use.
8.2 Type of Flux and Contaminants to be Removed The
solder flux type to be used and other common contami-
nants that can be expected will influence the selection of an
aqueous cleaning medium from Tables 4-3 and 8-2. The
final selection of the wash medium will also take into
account the foregoing discussion of environmental, safety
and health aspects.
8.3 Degree of Cleanliness to be Achieved and Volume to
be Processed Cleanliness requirements and process
capacity must also be considered. Equipment type and fea-
tures, wash medium and application method will determine
the final process.
8.4 Materials and Component Compatibility with Media
and Process Materials of construction, mechanical and
electrical components that are anticipated to be encoun-
tered in the cleaning process, must be checked for compat-
ibility with the cleaning agents and application method
selected.
8.5 Equipment Compatibility with Media The cleaning
equipment manufacturer should be consulted to verify that
the equipment selected is compatible with the chosen
cleaning agents and application method.
8.6 Part Geometry Complex part configurations, such as
narrow stand-offs, fluid entrapping shapes and small size
parts will influence both cleaning agent and equipment/
equipment features selection. Narrow stand-off heights will
require mechanical energy such as pressurized sprays, cen-
trifugal force or ultrasonic agitation to achieve penetration
into crevices to effectively remove trapped residues. Fluid
entrapping configurations require very effective airknifing
and longer drying sections. Small parts that could be tossed
around by the spray from either batch or in-line cleaners
may need to be placed in mesh type cages or otherwise
restrained with jigs.
January 1996
8.7 Process Cost As in any other process, it is very
important to know the true cost per part cleaned. Cost mod-
els can be developed by adding up all the expenses
incurred from cleaning and cleaning related operations per
year of operation and dividing the total cost by the number
of parts or square feet of laminate processed. This allows a
comparison of processes considered.
8.7.1 Cost Model Elements The following cost elements
should be taking into account for modeling:
a. Equipment: Acquisition cost, taxes, shipping and instal-
lation, training, value at end of amortization, total cost
per year amortized (cleaning, drying, monitoring and
waste management)
b. Maintenance: estimated cost of spares and transport,
manufacturers’ maintenance contract, cleaning chemi-
cals for the equipment (descalers etc.), travel expenses
for manufacturers’ representatives, maintenance of floor
due to accidental spills, etc.
c. Cost of Water: Gallons of resource water used per year,
cost per unit, total cost per year
d. Cost of Water Purification: Cost of mechanical and car-
bon filters and ion exchange resins or cost of contracted
services per year
e. Wash Media: Cost of wash media per year, if other than
water
f. Additives Needed: Cost of addition agents, such as foam
control
g. Energy Consumed: Annual cost of energy required for
cleaning, drying and waste management
h. Floor space: Annual cost per square foot of factory
space required for cleaning, drying, monitoring and
waste management (includes rental or building amorti-
zation, utilities and building maintenance)
i. Labor: Total cost of labor (burdened or unburdened,
varying with different management styles) required for
cleaning, drying and waste management and equipment
maintenance
j. Shop supplies: Annual cost of shop supplies used for
cleaning, drying, monitoring and waste management
(include gloves, safety supplies etc.)
k. Process Controls, Monitoring and Other Indirect Costs:
Annual cost of process control testing (wash sump
monitoring, solvent extract resistivity testing and any
other tests performed for process monitoring, qualifica-
tion testing and trouble shooting)
l. In-Process Corrections and Losses from Field Failures:
Annual cost of part re-cleaning and cost from warranty
claims related to inadequate cleaning
m. Waste Management: Annual cost of discharge, solid and
IPC-AC-62A
hazardous waste shipping and disposal, cost of per-
mit(s), waste monitoring, legal fees, fines less credit(s)
for reclaimed material
n. Training: Annual cost of personnel training for cleaning,
drying, monitoring, waste management and safety pro-
grams
o. Miscellaneous: Annual cost of contracted laboratories,
consultants etc.
Initial theoretical models address only those elements that
can be readily assessed by calculations. Full visibility of
total process cost may only be obtained after a few years
of operations and will require good recordkeeping.
9.0 WATER RESOURCES AND QUALITY
9.1 Measurement of Water Purity Depending upon the
application, there are several methods that can be used to
measure the purity of water. For electronics part cleaning,
there are two major categories of contaminants.
• non-ionic
• ionic
The following EPA document can be used as a guide:
‘‘Methods of Chemical Analysis of Water and Wastewater’’
(EPA-600/4-79-020, revised 3/83 P.B.84-128677).
9.1.1 Non-Ionic Non-ionic contaminants most often do
not affect the electrical properties of the water and can be
measured by the following methods:
TSS (total suspended solids) — measures the amount of
suspended particles having sizes greater than 0.45
micrometer generally.
COD (chemical oxygen demand) — measures the amount of
oxygen (oxidation by potassium permanganate) required to
oxidize reducing compounds such as sulfides, salts of met-
als, organic compounds.
BOD (biological oxygen demand) — measures the amount
of oxygen that bacteria need to oxidize biodegradable
organic matter over a given period of time; typical mea-
surement used by municipal sewer districts known as
POTW’s (publicly owned treatment works).
TOC (total organic carbon) — is a measure of the total
amount of oxidizable organic matter in water sample and is
most often used for high purity water applications.
Tap water should be filtered with a nominally rated filter
having a rating from one to 20 micrometer (micron) to
remove the undesired suspended particles from the water.
If a closed-loop recycling system is used, COD and BOD
would give an indication of the need to replace the acti-
vated carbon and/or disinfection of the process equipment.
11
IPC-AC-62A
Table 8−2 Wash Media, Typical Cleaning Capability
Contaminant Water Without
Removed Additives
Water Soluble Flux X X
Rosin Flux No
SAFlux No
LR/NC flux • •
Common Finger Prints No
Fats, Oils and Greases No
Mold Release Agents X(2)
Water Soluble Masks X X
X indicates removal
• depending on formulation
(1) except silicone, fluoro polymers and fluorosilicone types
(2) except silicone, fluoro polymers and fluorosilicone types and depending on formulation
Note: Low solubility contaminants or non-solubilizable contaminants may be removed by mechanical action, such as from ‘‘hard spray’’ or, more effectively, by
ultrasonic agitation
9.1.2 Ionic The ionic-purity of water is a measurement
of the amount of dissolved minerals (ions) in the water.
Usually, dissolved contaminants are ionic and consist of
minerals such as sodium chloride and calcium sulfate.
Their total concentration can be expressed by any of the
following terms:
ppm (parts per million) — an abbreviation used to express
the concentration of a substance within another, usually
water. It is the unit weight of a material in a million units
of weight of water. For example, one ppm means one mil-
ligram (mg.) of material (for example, salt) in a million
milligrams (1 kg) of water. For water calculations, ppm and
mg/l are equivalent expressions of the concentration of a
contaminant in water.
TDS (total dissolved solids) — TDS meters provide an esti-
mate of the amount of minerals in a water sample. Typi-
cally, the measurement is used by water chemists to deter-
mine the approximate capacity of ion-exchange resins and
reject capability of reverse osmosis membranes.
Hardness — is a measure of the amount of minerals (cal-
cium and magnesium carbonates, expressed in mg/l or
grains/gal) in a water sample. The hardness can be
removed by an ion-exchange process called water soften-
ing. It is not a measure of ionic purity. (Note: Softened
water forms a white powdery deposit, while hard water
forms a hard, white, adherent scale. As softening replaces
calcium and magnesium ions with sodium ions, the deposit
is essentially sodium carbonate which is a highly ionic,
aggressive, hygroscopic salt. For this reason, softened
water should never be used without further treatment for
the final rinse in any aqueous process.
Conductivity — an electrical measurement (microsiemens/
cm) that expresses the ability of an electrical current to
pass through water. The meter should be temperature com-
pensated. The higher the dissolved mineral content of the
12
January 1996
Water with Water with Reactive Water With Emulsified
Non-Reactive Additives Additives Organic Solvent
X X
No X X
No No X
• •
X X X
X(1) X(1) X(1)
X(2) X(2) X(2)
X X
water, the higher the conductivity reading. Tap water is
typically from 40 to 1000 microsiemens/cm. Conductivity
is the measurement of choice whenever tap water or high
conductivity water samples are tested that are typically
above about 5 microsiemens/cm. Note that
microsiemens/cm = MHOS/CM.
Resistivity — is the inverse of conductivity and is an elec-
trical measurement (ohm-cm or megohm-cm) that
expresses the resistance to the passage of an electrical cur-
rent through water. It is the preferred way to accurately
measure water with a conductivity below one microsiemen/
cm. The highest purity water has a resistivity of 18.2
megohm-cm at 25°C.
9.2 Water Purity Standards The effectiveness of the
water removal before drying the final rinse water from a
part determines its final cleanliness. The greater the amount
of water that dries on the parts, the greater the effect of
water purity on the final cleanliness. Low mineral content
water will provide the user the widest process window for
both the washing and rinsing operations. Divalent cations
from tap water, such as calcium and magnesium, can react
with rosin, forming insoluble compounds. They can also
reduce the effectiveness and bath life of some washing
chemicals. In addition, the use of low mineral content
water prevents scale buildup and will greatly reduce the
frequency of maintenance, such as descaling. As a rule, one
should use the highest grade water required to give the
appropriate cleanliness results.
For many applications, the use of deionized water, distilled
water or reverse osmosis water, will be required. Much will
depend upon the quality of the incoming water and the
nature of the assemblies to be cleaned. The user should
consult with the flux and cleaning agent vendors for spe-
cific recommendations on water purity specifications. For
January 1996
high cleanliness level applications, such as before confor-
mal coating, a minimum water purity (one megohm/cm
resistivity, one microsiemen/cm), or a TDS of 0.4 mg/l is
recommended.
9.3 Water Purification Methods There are numerous
methods to remove both non-ionic and ionic contaminants.
The following methods are appropriate for electronics
cleaning.
9.3.1 Mechanical Filtration It is a barrier method that
removes particles from water typically greater than one
micrometer (micron). Tap water filters can include:
Cartridge filters — are made from a wide variety of mate-
rials such as plastic or natural fibers (polypropylene, cotton
and others) in a large variety of designs (such as molded,
fiber wound, pleated papers, etc.) designed for lower
capacity contaminant holding applications.
Felt media filters - (bag filters) — are manufactured from
different materials and have the capability of higher con-
taminant loading than cartridge filters, and therefore have a
lower cost per unit weight of particulate matter designed
for higher flow, higher contaminant holding applications.
Granular media filters — are composed of multi-media or
single media (various grades of sand and other minerals).
These are used primarily to remove suspended contami-
nants.
Activated carbon — is an adsorbent medium that is
designed to remove organic molecules primarily from flux
residues, solder mask contaminants etc. Its unique proper-
ties are derived from its extremely large surface area. It is
very effective in dechlorinating a water supply as pretreat-
ment for Reverse Osmoses or ion-exchange resins.
9.3.2 Water Softening It is another method to treat
water, but it does not reduce the total dissolved mineral
(ionic) content of the water. As a guideline, water with a
hardness of greater than 30-60 ppm should be softened in
order to reduce the scaling of nozzles and tank surfaces.
Water softening — a process in which the sodium cations
of the cation ion-exchange resin (water softener) are
exchanged for the hardness mineral cations (e.g. calcium
and magnesium) and other cations such as iron. Even
though one ion is being exchanged for another, there is no
reduction in the total mineral content, therefore conductiv-
ity or the ionic purity of the water essentially do not
change. In other applications softened water, or perhaps tap
water, may suffice depending on the tap water quality used
or the tap water quality that is softened.
9.3.3 Dissolved Mineral Removal The following meth-
ods are used to reduce the total mineral (ionic) content of
the water.
IPC-AC-62A
9.3.3.1 Membranes Membranes are made from a variety
of materials (plastic, ceramic and other) that are formed
into sheets or tubes. They are designed to remove particles,
organic molecules and ions from a liquid stream. Most
membrane produce two streams: one with a high level of
contaminants, and another with a low level of contami-
nants. There are four basic types of membranes. They are
differentiated from each other by their micrometer rating
and materials of construction: (In order of finest to coars-
est)
Reverse Osmosis (RO) — rated from about 200 molecular
weight removal. It is capable of removing all molecules
and many ions from water. Wastewater can be typically
purified to a resistivity from 25,000 to 500,000 ohm-cm. It
is the most commonly used for cleaning.
Nanofiltration (NF) — rated from about 1,000 to 10,000
molecular weight removal. It is used to remove certain dis-
solved minerals, like calcium and magnesium (hardness)
from a water supply.
Ultrafilter (UF) — rated from about 50,000 to 500,000
molecular weight removal. They are primarily designed to
remove organic molecules that are much finer than those
removed by the microfilter. Ions are not removed by ultra-
filters.
Microfilter (MF) — rated from about 0.05 to 0.8 micrometer
for absolute removal. Ratings are based upon the size of
the pores. Ions are not removed by microfilters.
9.3.3.2 Ion-Exchange The following method is used to
remove dissolved minerals (ions) from water. Other types
of ion-exchange resins can be used for a variety of spe-
cialty applications.
Ion-Exchange (Deionization) — A process in which dis-
solved minerals (ions) are removed from water by cation
and anion resins in an exchange process. The cation resin
removes all of the positively charged ions (calcium,
sodium, etc.) and replaces them with hydrogen ions (H+),
and the anion resin removes all of the negatively charged
ions and replaces them with hydroxyls (OH−) anion. When
the H+ and the OH− are combined, they form purified
water. A two-bed deionization method includes a cation
resin tank followed by an anion tank and can produce
water having a resistivity typically from 50,000 to 500,000
ohm-cm. A mixed-bed deionizer containing both cation and
anion resins that are mixed and used in one tank produces
water having a resistivity from 500,000 ohm-cm to 18.2
megohm-cm.
Special ion-exchange resins — special application resins,
for example, chelate or heavy metal selective resin,
designed to remove heavy metals but no other ions (cations
and anions) or organic removal resins.
13
IPC-AC-62A
9.3.3.3 Other Methods These are less often used than
membranes and ion-exchange, but can be of value in very
specific applications. Usually, these processes are used to
remove desirable fluids from a wastewater stream and
reuse them. These methods are applicable to wastewater
streams that contain solvents. The most common method is
distillation.
Distillation — a process that separates contaminants from
tap water or washwater by evaporation and produces high
purity water or purified solvent. In some instances it can be
used to recover water from wash baths. This process is
appropriate for purification, but the energy requirements
make it expensive to run. In some locations, a special
excise license may be needed to run any equipment capable
of distillation.
9.3.4 Miscellaneous Methods There are numerous other
methods to treat water to make it more suitable for use in
part cleaning operations. None of these methods actually
separate contaminants from water, but they enhance the
performance of the other separation technologies and prod-
ucts.
Ultraviolet radiation (UV) — a method of sanitizing water by
deactivation or by killing microorganisms with a specific
wavelength (254 nanometers typically) of light.
Ozonation — a method of treating water and wastewater
with ozone (gas), an extremely powerful oxidant that
degrades organic compounds into smaller molecules and
ions.
Chlorination — a method that uses sodium hypochlorite,
chloramines, chlorine gas or other chlorinated compounds
to disinfect water and surfaces by killing and inhibiting the
growth of microorganisms.
10.0 WASH AND RINSE MEDIA
In aqueous post solder cleaning, the wash media is either
solely water or water plus an additive. By IPC definition
when an additive is employed in aqueous cleaning, at least
50% of the wash system is water. The use of water as the
primary ingredient in defluxing takes advantage of the
ready solubility of ionic species in water. Ionic residues are
the most detrimental contaminants for electronic parts.
Water without additives will not permit the removal of
rosin based flux residues. While water alone is often satis-
factory for removing water soluble fluxes, additives may be
required when white residues, oily soils or tight spacings
are encountered. Excessive foam is a fairly common prob-
lem when using water soluble fluxes. This situation can
often be controlled with the addition of a foam control
agent.
Unlike the wash media, only water without additives
should normally be used for rinsing electronic circuit
14
January 1996
boards. However, the addition of a small percentage of
light alcohols to the final rinse water does often enhance
performance. The role of the rinse water is to remove resi-
dues without leaving a residue of its own. Any additives in
the rinse water would work against this purpose. Similarly,
any hardness ions (i.e. calcium and magnesium) or natu-
rally occurring impurities in the rinse water would likely be
left on the boards after drying. Thus, good quality deion-
ized water is the preferred rinse medium.
10.1 Water without Additives Water without additives is
used for the removal of residues resulting from water
soluble fluxes. These fluxes have been designed for clean-
ing with water alone. However, it is extremely important
that all residues are completely removed. Because of the
very aggressive nature of most of these fluxes, incomplete
removal can result in corrosion in a short period of time.
Every effort must be made to ensure that residues are
removed from areas with close spaces, such as under com-
ponents. The relatively high surface tension of water can
make flux removal challenging for parts with tight spac-
ings.
For many operations, the use of water without additives
yields parts with the required level of cleanliness. Success
depends on the nature of the part itself, the effectiveness of
the equipment and minimization of the period between sol-
dering and cleaning. Wash temperatures used are generally
in the 50° to 65°C (122° to 150°F) range. It is important to
use good quality deionized water to aid in effective rinsing.
10.2 Surfactants and Other Non Reactive Type Addi-
tives Non reactive type additives are defined as those
which do not react chemically with the process residues
being removed. The greater portion of this category is com-
prised of two broad classes of materials, namely surfactants
and solvents. In aqueous defluxing formulations, these
materials can be used with each other or with reactive type
additives. It is likely that all aqueous cleaning formulations
contain some non-reactive type additives.
The term surfactants covers a wide range of functional
materials, from emulsifying agents to defoamers. The basic
commonality is that all surfactants molecules contain both
a hydrophilic or water loving portion and a hydrophobic or
water hating portion. The functional role that surfactants
play depends upon the structure of the hydrophilic and
hydrophobic groups and upon the weight ratio of these
groups to each other.
These materials are broadly classified according to the
nature of the charge on the hydrophilic portion and are thus
identified as being anionic (negative charge), nonionic (no
charge), cationic (positive charge) and zwitterionic (can
carry either a positive or a negative charge depending on
the circumstances). It is the non-ionic type that finds the
widest use in the cleaning of electronics.
January 1996
A distinct advantage of surfactants is their ability to func-
tion effectively at low concentrations. They are very effec-
tive in solubilizing or emulsifying oily and other types of
residues.
Surfactants serve a key function by improving the ability of
water to wet surfaces. Water has a relatively high surface
tension. Water molecules are strongly attracted to one
another and thus tend not to spread on surfaces. Surfactants
function as wetting agents by reducing the surface tension.
This then permits the water to wet or spread on surfaces
and helps water get into tight spaces.
Foam control is another area well served by surfactants.
The ability of a surfactant to defoam is often very tempera-
ture dependent. The defoaming action may only occur
above a certain temperature for a given surfactant. Surfac-
tants which are used to control foam are either used by
themselves or as part of a defluxing formulation. It should
be noted that there is a special class of defoaming agents
known as silicones, which should not be used with circuit
boards. Silicone residues are virtually impossible to
remove and result in adhesion difficulties and soldering
problems.
The other major class of non-reactive materials is the sol-
vent group. Their primarily organic nature helps them pen-
etrate and dissolve organic residues. These materials also
fall into the category of volatile organic compounds
(VOCs). The actual VOC contribution depends on the sub-
stance itself and the amount which is added to the wash
bath.
Organic solvents can be divided into those which are com-
pletely water insoluble and those whose structure permits
varying degrees of water solubility. Except for organic sol-
vent emulsions, it is the water soluble type of solvents
which is used in aqueous post solder cleaning. With the
possible exception of the emulsion approach, organic sol-
vents need to be used at relatively high concentrations.
When solvent levels are sufficiently high, both solubiliza-
tion and surface tension reduction can occur. In addition to
the need to use organic solvents at higher levels than sur-
factants, the functionality for solvents is somewhat more
limited.
There are various water soluble type organic solvents
which are used in aqueous washing. These solvents include
glycol ethers and higher molecular weight alcohols, such as
tetrahydrofurfuryl alcohol. Organic solvents are generally
used in conjunction with a reactive material which supplies
alkalinity. For example, the above mentioned glycol ether
and alcohol solvents in combination with the reactive
monoethanolamine have often been used in aqueous
defluxing.
Corrosion inhibitors and/or agents which help retain solder
joint brightness, are often also used in aqueous cleaning
formulations. With metals that are particularly sensitive to
IPC-AC-62A
alkaline media, such as black anodized or conversion
coated aluminum, the proper choice of an inhibitor is very
important. These materials are either organic or inorganic
in nature and can be very effective.
10.3 Non Saponifier Reactive Additives These are addi-
tives which react with flux residues in a manner other than
by forming a water soluble soap (i.e. saponification). The
continuous addition of an oxidizing agent has been used to
decompose and emulsify rosin flux residues. The typical
oxidizing agent, which is continuously added to the wash
bath, is hydrogen peroxide. With this oxidation system,
deionized water is used in both the wash and the rinse. A
wash temperature of 140 to 160°F (60 to 67°C) is recom-
mended. This system does not contain volatile organic
compounds.
10.4 Saponifiers In the electronics industry, the term
saponification refers to the use of alkaline materials to con-
vert water insoluble rosin flux residues into water soluble
soaps. The alkaline material reacts with rosin’s carboxylic
acid group, forming a soap which can then be removed
with water. It should be noted, however, that saponifier
materials are always formulated with other ingredients,
such as surfactants and/or organic solvents.
The saponifier agents which are used are either organic or
inorganic in nature. The organic type is often composed of
alkaline amines and the one most commonly used is mono-
ethanolamine (MEA). As received, (i.e. the concentrate)
formulations which utilize MEA generally have a pH of 12
to 13 and a bath pH of 11.5 to 12.0. Alkaline amines also
fall into the VOC category.
The defluxing organic saponifiers also generally use higher
levels of organic solvents. MEA based defluxing agents, for
example, are usually formulated with glycol ethers. High
molecular weight alcohol has also been used with MEA
and can be thought of as an alcohol based saponifier.
The inorganic type saponifier is a more recent develop-
ment. Basically, an inorganic buffer salt is formulated with
low levels of surfactants. Solvents (e.g. glycol ethers or
alcohols) are not used. This type of saponifier does not
have VOCs. This lack of VOCs has the additional benefit
of extending bath life because the basic ingredients do not
volatilize at elevated bath temperatures. The inorganic
buffer yields both an as received and a bath pH of approxi-
mately 11. Because of a very low organic loading, this type
of saponifier also has a relatively low BOD (biological
oxygen demand) and COD (chemical oxygen demand) .
Deionized water is preferred for wash water make-up with
all types of saponifiers, but good quality softened water
will often suffice. Calcium and magnesium ions (i.e. hard-
ness ions) can potentially result in the formation of
insoluble flux residues.
15
IPC-AC-62A
It should be noted that saponifier type cleaning formula-
tions can be used with non-rosin fluxes and pastes, such as
water soluble fluxes and at times, with no-clean water
washable fluxes.
10.5 Organic Solvent Emulsions in Water A newer type
of cleaning technology uses relatively small amounts of a
non-miscible organic solvent (2 to 10%, nominal 5%) in
the form of an emulsion in water. This hybrid approach
provides effective bipolar cleaning. As proven by IPC/EPA/
DoD testing, solvent emulsions are capable of removing
rosin and other non-polar materials, while the aqueous por-
tion dissolves water soluble residues.
In this process, controlled amounts of the organic solvent
used are mixed with water in the wash chamber and an
‘‘emulsion’’ of fine dispersed solvent droplets in the water
is formed in the wash reservoir and sprayed onto the parts
to be cleaned. During the wash cycle, the sprayed solvent/
water mixture that drains back into the wash reservoir is
continuously emulsified.
After completion of the wash cycle, the emulsion is broken
and the organic solvent portion that contains the residues,
separates from the water carrier. The collected organic sol-
vent waste floats to the top of the wash tank and is easily
removed. The wash is then followed by routine rinsing
with deionized water.
Overall, this process concept yields the benefits from
organic solvent cleaning combined with the inherent ben-
efits from water cleaning. The relatively higher boiling
points and lower vapor pressures of the organic solvents
used, minimize VOC emissions. The small amounts of
organic solvents in an aqueous medium also do not nor-
mally present a fire or explosion hazard.
10.6 Rinse Water Parameters Good quality deionized
water is the preferred rinse medium. However, this is not
meant to suggest that ultra pure, 18.2 megohm-cm water is
necessary. This grade of deionized water is expensive,
extremely difficult to maintain and can be corrosive to
metal surfaces. Water in the 1 to 5 megohm-cm region will
be satisfactory for most operations. Usually the most eco-
nomical way to achieve this quality water is by a closed
loop rinse system. The temperature of the rinse water
should be as high as possible, but comparative with parts
and process.
11.0 THE WASH/RINSE/DRY PROCESS
The aqueous post solder cleaning process consists of three
basic stages:
• the wash stage (removal of bulk of residues)
• the rinse stage (removal of wash solution)
• the drying stage (removal of surface water and
absorbed water)
16
January 1996
The wash stage may use one or more sub-stages, such as a
prewash which removes the bulk of water soluble residues
and water soluble temporary soldermasks with a plain
water wash. The pre-rinse may use lower purity water from
another rinse stage for conservation.
The rinse may also employ several sub-stages, such as a
pre-rinse which may use water from the final rinse. The
final rinse typically uses deionized water. This rinse water
may be re-used in other rinses.
For in-line equipment, ‘‘airknifing’’ between the various
process stations, i.e., the removal of surface liquid from the
parts by means of forced air, is a recommended practice to
avoid dragging wash and rinse solutions from the previous
process station into the next one.
11.1 Application Methods, Wash and Rinse
11.1.1 Brush Brushing is typically confined to manual
cleaning. Cleaning with batch and in-line equipment uses
spray impact or ultrasonic agitation to obtain the mechani-
cal energy for dislodging more stubborn deposits.
11.1.2 Immersion Effective cleaning within practical
immersion times can only be accomplished when vigorous
agitation, such as from a spray under immersion or from
ultrasonic agitation is provided. Immersion washing and
rinsing without agitation is typically employed in bench top
cleaning for processing individual parts, such as proto-
types.
11.1.3 Spray in Air Both wash and rinse application by
spraying the parts in closed chambers with wash media and
subsequently with rinse water, is a very common approach
used by both in-line and batch cleaning techniques. Spray
energy (pressure and volume) used influences the effi-
ciency in residue removal. Higher spray pressures impart
more mechanical velocity onto the sprayed droplets and the
resulting impact on the targeted surfaces will dislodge
deposits more easily than a low pressure spray of the same
volume. Surfaces that are shielded from the spray, how-
ever, will not benefit from the high impact spray, as the
droplets bounce back. A so called ‘‘soft spray’’ with a mist
of low pressure spray, however, will cause flooding of the
surfaces and allow solubilization of the residues. Capillary
action also draws the wash or rinse into crevices. Hence
some equipment types use both a hard spray (impact prin-
ciple) plus a soft spray (flooding principle) to combine both
advantages. Spray washing and rinsing has limitations in
effectiveness, when narrow component stand-off heights
are encountered. For this reason, many machines use high
velocity solid jets for washing and fine fan-sprays for rins-
ing.
11.1.4 Spray Under Immersion Agitation is crucial for
successful cleaning to occur. There must be some mechani-
cal agitation to force the fluid onto the parts to be cleaned
January 1996
and replenish the chemistry at the fluid/part interface, as it
becomes saturated with contaminants.
Spray under immersion uses jets located under the surface
of the cleaning solution to provide the mechanical agitation
necessary to remove contaminants and replenish the clean-
ing media at the surface of the parts being cleaned. For
batch equipment, nozzles are often conical or fan shaped.
Typical nozzle flow rates are 0.2 to 0.5 gallons per minute
(0.75 to 1.9 liter per minute), with pressures at 60 to 80
pounds per square inch (4.2 to 5.6 kilograms per square
centimeter). Positioning of the nozzles should be offset
from each other on opposing sides to prevent the jets from
interfering with each other. The action is very similar to the
Jacuzzit jets used in whirlpool and hot tubs. For surface
contaminants, high ‘‘stand-offs,’’ and easy to remove
fluxes, the turbulence caused by the jets is often sufficient
for acceptable cleaning. When low ‘‘stand-offs’’ are
present, or the flux has been exposed to very high tempera-
tures and been caramelized, the turbulence alone may not
provide adequate agitation for cleaning to occur. Direct
impingement from the spray jets may become necessary to
remove the tenacious contaminants. Orientation and posi-
tioning of the boards in relation to the nozzles becomes
critical.
Spray under immersion is used in both batch and in-line
equipment but is applied by different methods. Pump sizes,
pressures and fluid volumes may be significantly different.
The open tank design of some of the batch equipment does
not permit use of high pressure sprays. Part orientation on
a conveyor belt allows for a far more direct spray impinge-
ment than the batch process.
Spray under immersion is a useful technique when pump-
ing combustible or foaming solutions. However, flammable
mists may be created when spraying combustible solutions.
11.1.5 Centrifugal This method of application utilizes
centrifugal energy, produced by rotation of the product
while immersed in a bath or subjected to a spray for wash-
ing, then subjected to a spray for rinsing.
The rotating parts transfer centrifugal and coriolis accelera-
tions to the mass of a liquid cleaning agent, which results
in sufficient force to propel the liquid into the spaces con-
taining flux residues and other contaminants. The penetra-
tion effectiveness of this application method is because the
cleaning agent flows parallel to the board surface and under
closely spaced components. Reversing the product’s direc-
tion of rotation every few seconds disrupts the developing
laminar flow pattern of the liquid and produces momentary
random flow as the liquid is propelled into the opposite
direction of rotation. Repetition of the laminar-random/
laminar liquid flow pattern produces thorough washing and
rinsing action from all directions, which overcomes any
shadowing effects. The mechanism of cleaning which pro-
vides benefits to the manufacturer, is the penetration of
IPC-AC-62A
wash and rinse media into tight spaces, tapped holes, blind
vias, cavities, crevices, and all other locations where flux
and other contaminants become entrapped during assembly
processes.
Typical G forces experienced by the product are in the order
of 60 to 100 Gs, compared with military requirements for
varied testing of microelectronic devices in the range of
5,000 to 30,000 Gs. Exposed wire bonds (tested to 0.0007
inch or about 0.02 mm diameter) are centrifugally cleaned
without detrimental effect.
11.1.6 Ultrasonics Ultrasound is all sound above the
human audible level. Ultrasonic cleaning operates from 18
to 300 kHz, with most precision cleaning currently being in
the range of 40 kHz. An ultrasonic system consists of a
generator, which acts as an electrical converter/amplifier,
and transducers, which convert electrical energy from the
generator to mechanical energy in the form of vibrations
(similar to a loud speaker in a stereo system). The trans-
ducer, bonded to a process tank, produces sound waves, in
the form of positive and negative pressure zones, in the
cleaning solution.
Actual cleaning is accomplished by cavitation, the rapid
formation and violent collapse of minute bubbles in the
cleaning liquid. The energy released from a single cavita-
tion is very small, but millions of these bubbles implode
every second, resulting in the intense scrubbing action
characteristic of ultrasonic cleaning. The high temperatures
and pressures of the implosions also improve the effective-
ness of the cleaning chemistry. Because of the minute size
of the cavitations (1 to 50 microns at 40 khz), ultrasonics
is normally not geometry sensitive and is able to penetrate
areas (i.e. under low standoff surface mounted components)
that are difficult for other methods of agitation.
There are several factors that are important to ultrasonic
cleaning. The temperature of the liquid can change the
characteristics of individual cavitations, and cavitation is
most effective between 43°C and 82°C (110°F to 180°F). It
is important that all dissolved gases in the tank be driven
out by ultrasonics and/or heating under vacuum of the solu-
tion before cleaning is attempted. If these gases are not
removed, much of the ultrasonic energy will be used in
compressing these gas bubbles and will not be available for
cleaning. An ultrasonic tank must be as calm as possible
for good propagation of sound waves. Filtration is neces-
sary in cleaning operations, but recirculation should not be
run at rates higher than 20 percent of the tank volume per
minute.
Ultrasonics is used in rinsing as well as in the wash sump.
Agitation in the rinse is often overlooked, but just as it is
required in the cleaning bath, it is also imperative in the
rinse stations to ensure the complete removal of the chem-
istries introduced during cleaning and of residual contami-
nants.
17
IPC-AC-62A
11.2 Drying The term ‘‘drying’’ in context with aqueous
cleaning most often refers to the post aqueous cleaning
removal of residual water from the surface being cleaned.
There are several levels of ‘‘drying’’ to remove water com-
monly encountered in electronics part cleaning.
11.2.1 Gross and Fine Drying The two primary levels of
drying are ‘‘gross’’ and ‘‘fine’’ drying. Gross drying
involves the removal of liquid water from surfaces. The
term ‘‘fine’’ drying is associated with the removal of
absorbed water from the surface or from within the struc-
tural materials. This is often difficult and subsequent pre-
cautions to avoid re-absorption may be necessary (desic-
cant, dry nitrogen purge, etc.).
11.2.2 Air-knife and Forced Air Drying The use of high
volume air knives to blow liquid water from surfaces
before drying, greatly improves drying efficiency. Air-knife
drying consists of blasting air at high velocities. The action
of air-knife drying is to blast off gross water from the parts.
Little evaporation takes place. Forced air (forced convec-
tion) drying involves blowing heated, dry air across the
surfaces of parts to be dried. Forced air drying is very effi-
cient since the barrier layer of air at the surface of the sub-
strates being dried is continually disturbed and replaced
with fresh, hot dry air. Typically the temperature of the
heated air impinging the surfaces to be dried is in the 93 to
121°C (200 to 250°F) range. This temperature range is
usually determined by the temperature sensitivity of the
parts being dried or the material of construction of the
dryer, i.e., metal vs. plastic polymer.
Convection drying consists of placing the wet circuits in an
ordinary industrial oven, without forced circulation.
11.2.3 Radiation Drying Radiant heat drying or conduc-
tion drying can also be used to dry parts. Conduction air
drying is the least efficient since the transfer of heat energy
to the parts is controlled by the low level conductivity of
air. As a result, barrier layers of moist air often develop at
the surface of the wet parts thereby inhibiting thermal
transfer to parts. Radiant heat drying utilizing focused and
unfocused infrared (IR) energy can vary depending on the
composition of the hardware being dried. Some materials
are efficient IR energy adsorbers and heat up rapidly,
thereby vaporizing liquid water and absorbed/adsorbed
water. Those materials that are less effective in absorbing
IR energy will take longer to heat up and dry. In addition,
the user should determine the impact of IR energy adsorp-
tion and subsequent temperature extremes on the parts
being cleaned. Temperature sensitive components can be
adversely affected by radiant IR drying.
11.2.4 Vacuum Drying Vacuum drying, is a viable
option for rapid drying of temperature sensitive hardware.
The vacuum level typically employed is on the order of
18
January 1996
200 to 735 torr (8 to 29 inches of mercury) vacuum gauge.
The efficiency of vacuum drying can be increased if the
vacuum chamber is equipped with heating elements.
Elevated temperature in the 50 to 60°C (122 to 140°F)
range in conjunction with a vacuum provide a low thermal
risk method of drying parts. Again, this is fine evaporative
drying and residual contaminants are left on the parts being
cleaned.
11.2.5 Organic Solvent Drying Agents Organic solvent
drying agents are another option for water removal. There
are two types of systems in use: displacement drying and
absorption drying. Both systems accomplish the drying at
relatively low temperatures in an oxygen free environment.
The key difference is that displacement drying uses a water
insoluble drying agent to remove the water while absorp-
tion drying uses a water soluble organic material for this
purpose.
11.2.5.1 Displacement Drying A typical organic solvent
displacement drying system consists of a water insoluble
(PFC) solvent in conjunction with a surfactant or wetting
agent. Since these systems (PFC, HFC, HCFC) have den-
sities in excess of water, and when introduced to a surface
with liquid water present, simply and preferentially wets
the surface thereby displacing the water. Any residual sur-
factant is rinsed off by immersion of the boards in pure
displacement fluid, followed by evaporative drying in the
displacement fluid vapors. The displaced water phase is
then collected and removed from the system. The use of
organic solvent systems requires specialized application
equipment similar to conventional batch two or three sump
degreasers. One perceived drawback of these systems is the
fact that two drying operations are involved; displacement
drying to remove water is followed by evaporation drying
of the displacing organic solvent. However the total cycle
time for the overall process is quite short. Because perfluo-
rocarbons are expensive, special equipment is essential to
reduce emissions (losses) to a minimum. While the current
machines are designed for denser than water fluorocarbon
systems, there is precedent for using displacement drying
systems that are less dense than water, using flammable
and toxic, but less expensive, aromatic solvents. In this
case, the displaced water phase would be removed from the
bottom of the drying sump.
Note: The use of PFCs, HFCs and HCFCs is already
severely regulated and, in some cases, forbidden in some
European nations. It may be expected that other countries
will follow. In addition, official recommendations have
been published that the UNEP Multilateral Fund Imple-
menting Agencies do not fund PFC displacement drying in
Article 5 (developing) nations. Potential users may there-
fore wish to consider the situation carefully before invest-
ing in such a drying system.
January 1996
11.2.5.2 Organic Solvent Absorption Drying Water mis-
cible solvents are used to absorb the water from the surface
of the part. The most commonly used drying agent is
2-propanol (isopropyl alcohol or IPA). When the alcohol
reaches a maximum practical loading with water, it is then
discarded and replaced with fresh alcohol. The water/
alcohol mixture, as well as the pure alcohol, should be
handled and treated as flammable and toxic waste. Opera-
tors should be alerted to these hazards so they handle the
products and waste stream in accordance with all appli-
cable safety, health and environmental rules.
11.2.6 Centrifugal This method of drying utilizes cen-
trifugal energy to propel the liquid from the parts surfaces.
Rinse material extracted from the parts evaporates as
heated flowing air or nitrogen elevates the temperature of
the process chamber atmosphere and interior surfaces. The
moisture laden atmosphere of the process chamber is
exchanged with incoming dry gas. Centrifugal drying is a
safe and efficient method of drying.
11.3 Solder Flux Removal Table 4-2 shows the cleaning
options for the common solder flux types. When aqueous
cleaning is selected from this menu, the user must then
match the flux type employed to a suitable wash medium
listed for IPC-AC-62, as shown in Table 4-2. It must be
noted that, although aqueous cleaning can be used for most
flux types, specific fluxes may require specific wash media.
11.3.1 Water Soluble Organic Acid Flux This type of
flux can be removed with plain water. So called neutraliz-
ers, or mild concentrations of saponifiers or detergents,
may also be used, yielding a benefit from increased wetting
and cleaning, but at a cost of an increased burden in waste
management. Water soluble organic acid type flux residues
must be removed by post solder cleaning immediately after
soldering, as residues are strongly ionic and corrosive.
Emphasis must be on thorough rinsing. When a recycling
wash sump is used care must be taken that acidic constitu-
ents do not build-up in the wash sump and cause corrosion
of metal surfaces.
11.3.2 Rosin Type Flux Rosin based flux cannot be
removed with plain water, but requires either saponifiers or
emulsified organic solvent. Rosin fluxes exist in the form
of types R, RMA, RA or superactivated RA. The timely
removal of rosin fluxes is not as critical as for water
soluble organic acid type fluxes, but cleaning becomes
more difficult with time and excessive heat exposure. In
most cases, rosin residues remaining are not harmful, as
long as the activators are removed or remain locked in the
rosin matrix. Rosin residues can interfere with subsequent
testing, bonding and coating operations, and may become
reactivated when heated above their melting point.
11.3.3 SA Type Flux Synthetic activated flux cannot be
IPC-AC-62A
removed by most of the aqueous wash media, with the
exception of aqueous solvent emulsions. Its base material
is a mixture of mono and di-iso octyl phosphate. Its activa-
tors are tertiary and quaternary hydrohalides. Both chlo-
rides and bromides are in use for activation. This flux type
is characterized by low ionics and a hydrophobic nature of
its residues. Timely removal of its residues is important
because of the high levels of activators. White residue
problems are rarely encountered with this flux.
11.3.4 Low Residue/No-Clean Flux By design, the low
residue/no clean fluxes are intended not to be cleaned after
soldering. They have low solids content, leaving little resi-
due that is benign in most environments. There are, how-
ever, process anomalies, particular applications, or second-
ary operations, that may demand cleaning. If a facility is
dedicated to no-clean, it is recommended that a cleanable
formulation be selected. Not all no-clean formulations are
cleanable. Cleanable no-clean flux formulations permit
cleaning in the case of process anomalies. Solderballs, loss
of control of the flux application process, and solderpaste
or adhesive misprints, are examples of process anomalies
that require cleaning.
Conformal coating, potting or overmolding, requires good
adhesion and continuity of coverage to carry out its mis-
sion. Data exists from many sources, indicating that many
coating materials are compatible with a wide range of com-
mercially available low residue/no-clean fluxes, when used
on bare substrates or with typical soldermasks. Again, there
are instances where data does not exist for a total materials
system or there is a bias toward using conformal coatings
without cleaning just prior to the coating operation. In
these cases a post-solder cleaning operation is required
before the coating process.
Some cleanable no-clean fluxes may leave a white residue
after cleaning as a result of the preheat and wave soldering
temperature profiles and cleaning process. Tests need to be
performed when matching the soldermask and masking
materials to assure no cosmetic or operational issues exist
with the customer or the end product operation. The rosin/
resin based no-clean fluxes, whether for wave, reflow or
hand soldering, are best cleaned using a saponified aqueous
cleaning system or an organic solvent emulsion.
11.3.5 Removal of Other Materials The major groups of
materials that may be encountered in the post solder part
cleaning process are:
• Temporary soldermask
• Wave oils
• Component stabilizers
• Solder dross
• Solderballs
• Core flux plasticizers
Temporary masks, wave oil and stabilizers, must be water
soluble. Removal is best in a prewash when wash and rinse
19
IPC-AC-62A
are intended to be closed loop. The fine filler particles in
the water soluble temporary masks are difficult to filter.
Some masks also have a high ionic content, causing prema-
ture exhaustion of ion exchange resin and filters. Solder
slivers, solder balls and dross with solder droplets are haz-
ardous waste in some countries, but will typically fall to
the bottom of a tank and can be physically separated.
11.3.6 Solder Paste Removal from Stencils The
requirement for stencil cleaning is derived from the need to
improve print quality, especially as the lead pitch becomes
finer. Stencil cleanliness assures proper paste deposition as
well as stencil release from the board.
Stencil cleaning chemistries must match the paste chemis-
tries. For example, water soluble pastes may be removed
with straight hot water. Rosin and no-clean pastes will
require a wash chemical additive to adequately clean. Sten-
cil cleaning can be accomplished with ultrasonics, immer-
sion or spray in air. Solder paste that has not been reflowed
contains large amounts of fine solder particles and must be
filtered from the cleaning solution and disposed of as haz-
ardous waste.
11.4 Fine Cleaning Application of polymeric materials
for encapsulation of electrical circuitry (coating, potting,
molding) may demand a higher degree of surface cleanli-
ness than needed for parts that are not encapsulated. Fine
cleaning is employed prior to encapsulation when the sol-
der flux removal process does not yield the required level
of cleanliness, or when additional process and handling
residues are introduced after flux removal. Fine cleaning is
an extension of the normal cleaning techniques and
achieves a high level of cleanliness. Thorough drying is
especially important before encapsulation or coating.
12.0 EFFECTS FROM AQUEOUS MEDIA, APPLICATION
AND DRYING METHOD ON MATERIALS AND ELECTRI-
CAL COMPONENTS
12.1 Chemical Effects
12.1.1 Water without Additives In general, effects from
wash and rinse with plain water, are insignificant when
compared to potential effects from organic solvent type
media. High purity water may attack metal surfaces. When
the water cleaned parts are left wet, galvanic corrosion (e.g.
mismatched metals) can occur. It is best to dry the cleaned
parts as soon as possible.
12.1.2 Water with Additives The chemical activity of
aqueous wash media increases when additives are used.
Combined with elevated temperature (chemical activity
doubles for every 10°C of temperature increase) some of
the additives may attack some polymers and metals. Inhibi-
tors are used in some formulations to prevent or minimize
20
January 1996
chemical attack on metals. Water with additives may
remove part markings, attack some soldermask formula-
tions, silicone elastomers, polyimide laminates, lubricants,
and amphoteric metals (zinc, cadmium and aluminum, in
particular).
Sensitivity of electrical components to certain wash media
must also not be overlooked. Non-sealed electrolytic alu-
minum capacitors are inherently very sensitive to chemical
effects from both aqueous and halogenated organic solvent
media. It is important to address compatibility of construc-
tion materials and electrical components with the wash
media.
12.2 Thermal Effects Temperatures of wash, rinse and
drying operations need to be considered for potential dam-
age to parts. Thermoplastics with low melting points, and
electrical components with low temperature rating, such as
polystyrene capacitors, limit the maximum temperature that
can be used.
12.3 Mechanical Effects from Spray Impact Spray
pressure used must also be considered. Higher pressures
are very useful for driving the wash and rinse media
through small stand-off spaces under components. The
mechanical impact from higher pressures, however, com-
bined with chemical activity, may attack polymeric inks
used for identification markings. In general, incompletely
cured or adhered and less chemically resistant materials
may be removed or attacked. The user is well advised to
check material compatibility with process conditions to be
used, prior to full scale implementation.
12.4 Effects from Ultrasonic Energy In the past, the
military community has been reluctant to approve ultrason-
ics for the cleaning of electronic parts. This work was
based on using metal case components. As a result of dam-
age to the components housed in these metal cases, ultra-
sonics were not allowed for cleaning electronics. Since the
era in which this thinking began, there have been extensive
changes both in component durability and in ultrasonic
technology. Components are far more robust than they
were in the 1950s and 1960s, and can tolerate many expo-
sures that were not possible at that time. Most ultrasonics
manufacturers today are supplying higher frequency ultra-
sonics in the 40 kHz range, rather than the 20-25 kHz sys-
tems which were previously prevalent. These higher fre-
quencies are considered to be more appropriate for
precision cleaning applications, and are more gentle on
parts. Some manufacturers are also supplying sweeping
frequency and power control generators, both of which
greatly reduce the probability of damage to electronic com-
ponents.
The most prevalent means of damage by ultrasonics was
resonant damage. This can still be an issue with certain
hybrids and components, such as quartz clock oscillators.
January 1996
Sweeping frequency ultrasonics can reduce this risk by not
staying at a single frequency long enough to set up the
resonant pattern that leads to damage. It also eliminates the
standing waves, or areas of high and low energy, that are
produced in single frequency units, and can cause delicate
parts to be exposed to very high power densities. It is
highly recommended that ultrasonic units have power con-
trols, even with sweeping frequency, to allow the power to
be reduced if necessary for delicate components.
Recently, through extensive research at the GEC Hirst
Research Center and at EMPF, MIL-STD-2000 was revised
(Rev A) to allow the use of ultrasonics on military compo-
nents. Currently, the burden of proof lies on the user to
document that the ultrasonic energy does not cause damage
to the components. The Ultrasonic Energy Task Group of
the IPC has recently published test methods (IPC TM-650,
No 2.6.9.1 and 2.6.9.2) to assist the user in qualifying elec-
tronic parts for Rev A. It is also recommended that this
procedure be used to verify the use of ultrasonics on any
delicate component or hybrid where ultrasonic damage is
considered possible. The US submission to the IEC techni-
cal commission, based on J-STD-001, also allows for the
use of ultrasonics in cleaning soldering applications.
12.5 Effects from Centrifugal Forces The effects of
centrifugal forces upon electronic components and parts
have been studied extensively by the military. For the most
vulnerable items, those incorporating wire bonded connec-
tions, MIL-STD-883 stipulates in Test Method 2001 that
the constant acceleration force which large hybrid circuits
must withstand is 5,000 Gs, and small hybrid devices must
withstand 30,000 Gs.
In centrifugal cleaning, the force of constant acceleration is
a function of RPM and the radius of rotation. Commer-
cially available centrifugal cleaning systems are capable of
subjecting the product to a maximum of 341 Gs, which is
well below acceptable limits.
12.6 Electrostatic Discharge from Drying Operations
Washing and rinsing with aqueous media does not raise
any concerns for potential component damage by static
charges, as both aqueous media used and the humidity in
the process chambers counteract the build-up of static elec-
tricity. Measurement with so called ‘‘Static Meters’’ are
capable of determining if anti-static measures need to be
employed. It is a good practice to electrically ground the
cleaning and drying equipment, including the conveyor belt
of in-line cleaners. If static charges are encountered from
the flow of heated air in the drying section, ionizers may be
used to control static build-up.
13.0 APPLICATION EQUIPMENT
13.1 Bench Top, Manual In very low volume operations,
such as prototype processing or occasional touch-up solder-
IPC-AC-62A
ing, solder flux removal may be accomplished either in
small tanks or by wet brushing. For such operations, puri-
fied or softened water should be used for washing and
deionized water for rinsing. Heating the water above room
temperature up to 50°C will be helpful. Cleaning with
water containing additives should be avoided, as manual
rinsing may not be able to completely remove the addi-
tives. Hence bench top cleaning with aqueous media is
limited to removal of water soluble flux.
13.1.1 Open Tank Cleaning Suitable plastic containers,
glass or stainless steel containers can be used for this pur-
pose. Washing can be accomplished by immersing the parts
in the water and brushing them with an ESD safe, Nylon
bristle brush or applying ultrasonics. After withdrawal from
the wash solution, the parts are rinsed with deionized water
from a spray bottle. The wash solutions should be replaced
routinely.
A multiple tank method may be used where the wash solu-
tion is periodically disposed and replaced with the rinse
solution and fresh solution is added to the final rinse.
13.1.2 Non-Immersion Cleaning The parts are sprayed
with warm water over a suitable container or in a sink and
brushed with an ESD safe, Nylon bristle brush and conse-
quently rinsed with deionized water spray.
13.1.3 Drying Surface water can be removed from the
cleaned parts in a drying oven, with an air hose or heated
airknife. The air used should be free of oil, water and par-
ticulate matter. Shop air may not meet this requirement.
Oven drying time will depend on the part geometry and
degree of water entrapment.
13.2 Batch Type
13.2.1 Single-Chamber Spray Single chamber batch
cleaning systems employ rotating spray arms to distribute
cleaning solutions over boards that are racked on edge.
Most of these systems are similar in function to the home
dishwasher. The cleaning cycle may include prewash, wash
and multiple rinse stages. Wetting agents, detergents or
saponifier solutions may be introduced during any of the
cycle stages. Final rinse stages are normally of deionized or
purified water. The number, type and duration of the wash
and rinse stages are usually quite flexible.
Conventional home dishwashers are not well suited for this
process, as cycle times are fixed, and materials of construc-
tion are not compatible with many of the fluxes and clean-
ing agents used.
a. Advantages. The chief advantages of batch cleaning sys-
tems are their small size, energy efficiency, low cost and
programming versatility. The typical single chamber
batch system requires less than 10 square feet (3 square
21
IPC-AC-62A
meters) of floor space plus space for operator access.
Tank sizes are small and energy is used only when parts
are being processed and is therefore quite small.
Due to the fact that each stage of the washing process is
separately programmable, wash and rinse times and
number of rinses can be programmed over wide ranges.
This is contrasted to in-line systems where wash and
rinse times are fixed by chamber length and conveyor
speed. Capital costs of batch systems are typically lower
than in-line systems. Lower cost of installation is also a
factor.
b. Disadvantages. The principal disadvantages of single
chamber batch are cycle time and loading sensitivity.
Cycle times, depending on dryness level required can
vary from 15 minutes to 45 minutes. As it is difficult to
employ air knife type moisture removal, drying is usu-
ally the longest part of the cycle. How parts are racked
relative to one another and how many are placed in the
wash chamber can also affect cleaning times and effi-
ciencies. Manual loading and unloading of batch sys-
tems is also perceived as a disadvantage, although the
use of extra baskets can minimize this.
c. Typical Cycle. The single chamber batch cleaning cycle
can contain prewash, wash, rinse and drying stages.
• Prewash. The prewash stage is usually employed to
remove any water soluble process soils or fluxes.
Clean water is introduced into the wash chamber and
recirculated over the boards. In the case of water
soluble flux, a considerable amount of flux removal is
accomplished during this stage. In the case of rosin
fluxes, the prewash stage has an additional benefit in
that it brings the temperature of the parts up closer to
that required for the saponification process, although
too high a water temperature in the prewash can bake
on the flux and make the removal process more diffi-
cult. Some cleaning systems have the option to add
additional surfactants or chemistry into the prewash
stage. At the end of a programmed recirculation time,
the prewash solution is drained from the cleaning
chamber.
• Wash. The wash stage is usually employed to remove
the bulk of the flux and soils on the boards. Program-
mable amounts of cleaning chemistry are introduced
along with clean water and recirculated over the
boards. In the case of water soluble fluxes, little or no
chemistry may be required. Some systems have hold-
ing tanks for the wash solution and re-use them, thus
reducing liquid waste. In rosin flux removal with
saponifier solutions, foaming can be a problem. In this
case most batch systems have the ability to meter in a
programmable amount of defoaming agent. Foaming
can also be reduced by increasing the wash tempera-
ture.
22
January 1996
• Rinses. Multiple rinse, recirculate and drain cycles, or
closed loop rinsing may be employed. Closed loop
systems continuously recirculate a portion of the rinse
water through DI resin and carbon beds. In both rinse
to drain and closed loop systems, the rinse water resis-
tivity levels are monitored and can be used to deter-
mine when rinsing is complete. In the case of multiple
rinses, (non-closed loop), some systems allow intro-
duction of a small amount of rinse aid during the first
few rinses.
• Drying. Drying in single chamber batch systems is
difficult and time consuming. The ‘‘sealed chamber’’
of the batch system is not ideal for good air circula-
tion. Air knives or other mechanical methods of mois-
ture removal are not possible. Drying therefore con-
sists of evaporation into the air in the chamber and
subsequent removal. Drying time is primarily a func-
tion of chamber temperature and air circulation. When
air circulation is increased, more energy is carried
away. Higher drying temperatures are the best way to
reduce drying time, but this is limited by what the
parts being cleaned can tolerate and equipment con-
struction. In single chamber batch systems, drying
consumes a significant part of the overall cleaning
time. Throughput can be doubled simply by using an
external dryer.
13.2.2 Multi-Chamber Immersion One type of batch
equipment incorporates a series of individual tanks into a
bench or series of cleaning modules. Parts are transported
from tank to tank for cleaning, rinsing and drying, either
manually or by automation. Tanks are offered in a variety
of sizes, depending on part dimensions and throughput
requirements. The number of tanks is determined by the
chemistry being used and the level of cleanliness required.
Aqueous cleaning would most commonly be performed
with a single cleaning sump, two rinse sumps and a dryer.
Some low volume applications or those applications not
requiring high cleanliness levels might use only a single
rinse.
Agitation in these systems is most often by ultrasonic
energy or ‘‘spray under immersion’’ (SUI). Because ultra-
sonics is not geometry sensitive, and has the ability to
clean under very low stand-off heights, it is often consid-
ered a superior method of agitation in this type of batch
equipment.
Aqueous rinsing in these systems is a dilution ratio of con-
taminated chemistry dragged out from one bath into the
next, and is dependent on contamination loading and
throughput. It is important that the rinse water is continu-
ously replenished in order to reach required cleanliness
levels. Some systems, especially spray-in-air, continually
drain the used rinse water and introduce fresh onto the
parts. When immersion rinsing is being used, either a
January 1996
‘‘dump and fill’’ method or a continual overflow should be
used. In multiple tank systems, counter cascade rinsing
allows for conservation of water by flowing fresh deionized
water into the final rinse bath, and then overflowing into
the previous rinse bath. This rinse should then overflow
into waste water treatment. Overflow weirs are effective
because most contaminants rise to the surface. If stagnant
rinses are used, contaminant levels quickly rise and render
the rinse ineffective.
Drying in multiple chamber batch systems is most often
accomplished using forced hot air. Some systems employ
hot airknives to speed drying.
13.2.3 Multi-Chamber Spray The basic principle of
these machines is to have separate chambers for cleaning/
rinsing and for drying. The baskets are slid along the
machine horizontally, either manually or automatically, so
that there is no lifting of parts. The duration of each opera-
tion is individually controlled, so that the full flexibility of
a batch system can be exploited.
A. Advantages: Low energy and low water require-
ments; low operating cost.
B. Disadvantages: Maximum efficiency can be obtained
only if boards are properly oriented and spaced in the
baskets; high peak power.
C. Typical Cycle: A typical cycle consists of a number
of steps followed systematically. In general, four to
five baskets are processed at any one time: the first is
in the loading station while the second is in the wash
phase. An optional third basket can be in a hold posi-
tion while the fourth basket is being dried and the
fifth basket is in the unloading station. The linear
construction of high-throughput machines makes
automation of the basket movement easy.
• A loading station consists of a stainless steel table
upon which an empty basket is placed, ready to
receive the soldered assemblies. Once loaded, the
basket is slid into:
• The washing/rinsing machine. As the lid of this
machine is closed, manually or automatically, the
wash cycle starts. The sprays on the wash arms
provide solid jets of water at high velocity. At the
end of the wash period, the wash water is allowed
to drain back into the sump. The rinse cycle con-
sists of spraying the boards with deionized water
using dedicated sprays. When this cycle is finished,
the lid of the machine is opened and the basket can
be slid onto:
• The holding table which allows a basket, if
required, to drain while the drying machine is being
liberated. From there, it is slid into:
• The drying machine. This machine is started auto-
matically when its lid is closed. It consists basically
of two air knives which rotate slowly and asynchro-
IPC-AC-62A
nously. During the first part of the drying cycle, the
air is blown through the machine and blasts off
excess water. After the air knifing, the assemblies
are dried with hot air. The machine can then be
opened and the basket slid onto:
• The unloading table. This is silimar to the loading
table and allows the operator to empty the baskets
for reuse.
13.3 In-Line Equipment In-line cleaning is a high vol-
ume cleaning process. Equipment may be of modular or
non-modular design. The modular design allows great flex-
ibility with respect to expandability. All parts are subjected
to the same process. The last board loaded will receive the
same identical cleaning as the first board loaded. In-line
systems are not as loading sensitive as batch systems can
be.
The in-line process is comprised of four to five main steps,
and varies with flux type being cleaned. The length and
number of wash, rinse and dry modules is determined by
the ultimate conveyor speed required. Once a conveyor
speed is determined, appropriate test runs must be per-
formed to establish optimum operational parameters (con-
veyor speed, temperature, pressure, volume, drying). The
following minimum base configuration would apply for
each type of flux or paste.
• Isolation. Some type of air or water isolation should be
present between process stages on in-line systems, as
the cleaning and water treatment costs can be nega-
tively affected. Also, if too much wash gets into the
rinse, it will foam to the point that adequate rinsing
will not take place.
• Prewash. This cleaning step removes the gross con-
taminants and is generally a necessary step when pro-
cessing water soluble fluxes or temporary solder
masks.
• Wash. This cleaning step is where the high impinge-
ment spray dislodges and solubilizes the flux from
beneath components. The closer the component/board
stand-off, the higher the energy must be.The flow rate
of this section may depend on board complexity and
flux/wash compatibility. One or more of these stages
may be present, depending on line speed and cleanli-
ness requirements. In rosin removal, chemistry would
be added that solubilizes and removes the flux. Auto-
matic injection of chemical will aid the repeatability of
the process.
• Rinse. This cleaning step is where the high impinge-
ment spray dislodges and solubilizes the chemical
wash water from beneath components. The closer the
component/board stand-off, the higher the energy must
be. None or more of these stages may be present,
23
IPC-AC-62A
depending on the line speed and cleanliness require-
ments. The flow rate of this section would depend on
board complexity.
• Final Rinse. This cleaning step is where the board is
subjected to a purified DI water rinse. It is the last
water the board will see. This will rid the board of any
residual ionic contaminants, and will ensure spot free
product, if the drying step is not 100 percent.
• Dry. This step is where residual water is stripped from
the board. It is desirable that drying be accomplished
by hot high pressure air, not by evaporation. One or
more of these stages may be present, depending on
line speed and dryness requirements.
• Orbital. Systems that emulate the in-line process, are
also available. They wash, rinse and dry with the same
concept as outlined above, but with decreased through-
put. They have similar process steps as linear in-lines,
but process the parts vertically and transport them in a
circle. A load/unload person is required. The advantage
of these systems is that less floor space is required.
13.4 Screen and Stencil Cleaners Conventional Clean-
ing Equipment. Both In-line and batch cleaning equipment
used for aqueous post solder cleaning, can be employed to
clean stencils and screens. Equipment configuration may
limit the sizes that can be processed. Specialized equip-
ment is available for larger screens and stencils.
Specialized Equipment. Designed for screen and stencil
cleaning are typically batch type cleaners, that employ a
wash, rinse and drying cycles, similar to the conventional
batch washers, but with adequate chamber sizes and rack-
ing arrangements to accommodate the geometry of the
tools to be processed. Optional filters and settling tanks are
available to filter-out the solder particles from the solder
paste remaining after screening.
Care must be taken to not damage the imaging emulsion
film on the screens. Equipment with spray-in-air, spray-
under-immersion, or immersion with ultrasonic agitation is
used. Drying with forced air at ambient or elevated tem-
perature is featured on some of the available equipment.
14.0 EVALUATION AND PROCESS OPTIMIZATION
Prior to implementing an aqueous cleaning process, data
needs to be collected to evaluate the process capability.
14.1 Evaluation and Data Collection
14.1.1 Material and Component Compatibility A list of
materials of construction that may be exposed to the clean-
ing and drying operations should be compiled. This list
should be checked for compatibility with the cleaning
medium, wash, rinse, and drying conditions.
24
January 1996
14.1.2 Testing for Residues (Surface Cleanliness) Pro-
cess performance in regards to ability to remove surface
contamination can be assessed by a variety of tests.
a. Ionic Residues. Water soluble and ionizable residues can
be detected by extraction with a 2-propanol/water mix-
ture with a known resistivity (or conductivity) and mea-
suring the decrease in resistivity (or increase in conduc-
tivity) and correlating this change to micrograms of
NaCl equivalent/square unit (typically square centimeter
or square inches) of the part area.
A maximum of 1.56 µg/cm2 eq. NaCl is set for military
requirements. Users of conformal coatings achieve with
fine cleaning a value of less than 0.5 µg/cm2 eq. NaCl.
While this type of test is not truly scientific, it provides
a good tool to assess general process performance with
rosin flux processes.
The user can choose from several test methods that
range from a manual method with low equipment cost
but high operational cost, to refined methods with auto-
mated instrumentation, i.e.
• IPC-TM-650, Method 2.3.25, ‘‘Resistivity of Solvent
Extract’’ (Manual)
• IPC-TM-650, Method 2.3.26, ‘‘Ionizable Detection of
Surface Contaminants’’ (Dynamic Method)
• IPC-TM-650, Method 2.3.26.1, ‘‘Ionizable Detection
of Surface Contaminants’’ (Static Method)
b. Rosin. Non-removed rosin can also be detected and
measured after extraction from the part surfaces, similar
to the extraction of ionic materials. A quantitative deter-
mination of rosin residues can be performed with High
Performance Liquid Chromatography technique and
Ultra-violet (UV) Spectrophotometry. Residual rosin is
expressed in micrograms per square unit. IPC-TM-650,
Method 2.3.27.1, or IPC-TM-650 Method 2.3.27, can be
used for residue analysis. Technical paper, IPC-TP-383,
‘‘Organic Surface Contamination - Its Identification,
Characterization, Record Effects on Surface Insulation
Resistance and Conformal Coating Adhesion’’ is useful
for the understanding of potential effects from excessive
rosin residues.
c. Organics. In addition to rosin, other organic contami-
nants may be present on printed wiring boards and com-
ponents. In particular, polyglycol compounds are note-
worthy, as detrimental effects from some of these
materials were noted by many investigators. IPC
TM-650 lists two methods for organic contaminant
detection, i.e., a qualitative method TM 2.3.38, and a
quantitative instrumental method, TM 2.3.3.9.
d. Specific Ions. Solvent extract resistivity (or conductiv-
ity) testing expresses all of the ions extracted to an
equivalency factor, i.e. sodium chloride. Another labora-
tory technique, Ion Chromatography (IC), is capable of
January 1996
measuring the levels of specific ions, such as Cl−, Br−,
SO4−2, NO3− , Na+, K+, organic acid radicals etc. This
technique is very useful for tracing a contaminant origin
or characterizing a flux/cleaning system. IPC-TM-650,
Test Method 2.3.28 may be used for such purpose.
Note: Both the Infrared Analytical Method (c) and the Ion
Chromatography Method (d) require relatively expensive
instrumentation and highly skilled operators. Testing may
be performed by contracted laboratories.
14.1.3 Electrical/Environmental Testing The main
function of a printed wiring assembly (PWA) is to transmit
specific electrical signals without interference. Contami-
nants can cause interference. Electrical testing under worst
case environmental conditions will prove adequate design
and contaminant removal. Electrical testing may be per-
formed by:
• Functional testing of the finished product during and
after exposure to specific environmental conditions
• Electrical/environmental testing with coupons that
simulate worst case circuit configurations
a. Surface Insulation Resistance (SIR). The most common
test is the measurement of surface insulation resistance
under specific environmental conditions using test cou-
pons with interleaved comb patterns, such as the IPC
B-24 or B-25 test boards or the B-36 board for surface
mounted components. IPC-TM-650, Test Method 2.6.3
can be used for this purpose. Other test board configu-
rations and environmental and test conditions may be
used as dictated by internal and/or proprietary require-
ments.
Due to the relatively long test time, labor and equipment
demands, this type of testing is typically confined to
process qualification and requalification and is not used
for routine process monitoring.
b. Resistance to Electromigration. The ability of a dielec-
tric surface, that separates two biased conductors, to
resist the migration of metal, is influenced by many fac-
tors. One common factor is the influence of water films
that bridge the two biased conductors. Certain contami-
nants, for example polyglycols and associated process
chemicals, behave hygroscopically and their presence
will decrease the resistance to electromigration. Closely
related to this, electrochemical migration requires the
presence of ionic surface contamination: this will reduce
the resistance of the water film, causing even greater
problems. The degree of resistance to electromigration
can be determined using IPC-TM-650 Method 2.6.14.
c. Corrosion Resistance Testing. Vaguely related to elec-
trochemical migration testing, corrosivity testing is
beginning to be used to give numerical comparisons to
failure mechanisms from this cause. The resistance of a
IPC-AC-62A
very fine conductor in a special test pattern is monitored
throughout the test. If ionic electromigration occurs, this
conductor becomes corroded and its resistance
increases. By monitoring the rate of increase up to rup-
ture, considerable information may be gained from the
curve shape. Refer to IPC TM-650, Method 2.6.3.
d. Results of Phase 2 Tests of aqueous cleaners (water with
additives). Several formulations have been tested, quali-
fied and rated better than the CFC 113/methylalcohol
benchmark. Detailed reports may be obtained from
EMPF (Electronic Manufacturing Productivity Facility),
Indianapolis, Indiana, USA.
14.2 Optimizing and Controlling Process Parameters
Optimal conditions need to be established to achieve
acceptable cleanliness with worst case configurations in
regards to pitch, component stand-off height and other
entrapping configurations. Once the optimal process
parameters are defined by evaluation and testing, and main-
tained by process control, adequate process performance is
assured. Emphasis should be placed during initial evalua-
tion, on obtaining as wide a process window as possible.
The wider the window, the less effort will have to be spent
on process maintenance, i.e., corrective action to bring con-
ditions back within the window.
14.2.1 Process Controls Process performance must be
monitored to assure that the established process perfor-
mance window is maintained. Periodic readings of tem-
perature, flow, pressure, wash composition, pH, conductiv-
ity etc. should be made and the values plotted on charts
with posted upper and lower limits for the condition con-
trolled. Saponifier and other critical reactant concentrations
must be routinely checked in accordance with recommen-
dations by the wash media supplier. Measurements that
show values outside the limits, indicate corrective action
will be required to bring the condition back within the
established window.
15.0 WASTE MANAGEMENT AND REGULATORY ISSUES
The cleaning process generates air emissions, solid waste
and wastewater. A discharge permit is required in many
instances, for very small or infrequent industrial wastewa-
ter discharges from cleaners such as batch or dip tanks. The
three regulatory agencies that a user must review are fed-
eral (national), state (regional), and local. Each company
must meet the minimum federal standards. The state regu-
lations may be the same or even more restrictive than the
federal. Finally, the local community’s regulations will be
at least as restrictive as state regulations.
15.1 Environmental Issues In the selection (and use) of
a post solder cleaner, manufacturers must consider the
effect of the cleaning agent on air emissions, wastewater
25
IPC-AC-62A
discharge and solid waste generation. Special authorization
or permits for air, wastewater and special handling of solid
waste are very often the rule in those nations that have no
precise legal definition of permitted discharges. The fol-
lowing are most often a concern:
Air Emissions
• VOCs (volatile organic compounds)
• ozone depleting substances
• global warming substances
Wastewater
• heavy metal cations (notably lead, tin and copper)
• anions (notably phosphates, nitrites and sulfates)
• complexing/chelating agents (notably EDTA salts
and ammonium/amine compounds)
• pH (acid or basic condition)
• COD/BOD
• toxicity to aqueous life before and after biodegrada-
tion
• other (temperature, solid matter, suspended matter,
surface tension modifiers, etc.)
Solid Waste
• heavy metal cations (notably lead, tin and copper)
• all leachable toxic materials over up to 100 years in
authorized discharge conditions
• used solvent1
1
Even though the spent solvent is not a solid, the US EPA classifies liquids,
semi-solids and solids as a solid waste (see Code of Federal Regulations, Pro-
tection of the Environment, Parts 260-299, July 1, 1991, p. 23)
15.1.1 Air Emissions Air emissions are a concern for
some chemical cleaning agents that are used when cleaning
rosin type fluxes. Generally, there are two types of air
emissions from such a cleaning process; (1) VOCs and (2)
water vapor. VOCs are generated from cleaning with
saponifier formulations containing glycol ethers, non-linear
alcohol and in some cases, emulsions. In certain nations
and regions, VOCs are highly regulated because of their
vapors’ photochemical reactivity with nitrogen oxides, pro-
ducing smog. The water vapor from an evaporator that is
used to concentrate the chemicals from a wash tank may
require an air emission discharge permit. In any case, it is
important to consult with the regulatory agencies before a
cleaning process is installed. Depending on the particular
chemical(s) emitted, the amount of the chemical(s) emitted
and the amount of other chemical emissions from that
facility, the emissions may or may not be regulated by the
State (other regional permitting authority under the Clean
Air Act (CAA)). An air emissions permit may be needed if
the emissions thresholds for a given chemical or a group of
chemicals at that facility is exceeded. The world wide trend
is toward increasing the stringency of VOC regulations.
However, the definition of what constitutes a VOC varies
much from one country or region to another.
Some drying processes may employ hydrochlorofluorocar-
bons (HCFCs), hydrofluorocarbons (HFCs) or perfluoro-
26
January 1996
carbons (PFCs). All HCFCs are ozone depleting albeit less
so than CFCs, and their use is permitted according to the
Montreal Protocol. Nevertheless, their use is regulated in
time. Many nations have already forbidden their use or are
in the process of doing so. HFCs and PFCs have high glo-
bal warming potentials (some PFCs have a GWP index of
over 10,000 compared with carbon dioxide) and long atmo-
spheric lifetimes. Although few nations have yet enacted
legislation restricting their use, it may be expected that this
will come about within a decade. No matter whether there
is no regulation on the use of some types of halogenated
organic substances, it is not only recommended to limit
their emissions to an absolute minimum for both environ-
mental and safety and health reasons, but it also makes
sound economic sense.
15.1.2 Wastewater The discharge of any wastewater
stream, both by total flow and by chemical make-up must
conform to national, regional and local regulations in all
nations. These may vary from very strict limits with little
hope of being granted any form of derogation to relatively
flexible conditions. Many nations, particularly in Europe,
have draconian legal requirements dictated on a national
scale, covering many aspects of waste water quality. Oth-
ers have less comprehensive regulations, covering only the
more important considerations. Local authorities may offer
derogations to national legislation where their local treat-
ment plant is able to handle the otherwise out-of-tolerance
waste. Derogations are frequently accorded to small users,
particularly if it may be shown that the cost of treating a
small quantity of slightly polluting waste would be out of
all proportion to the damage that could be caused. It must
be noted that because an installation is approved in one
place, it may not be elsewhere. In all cases, it is wise to
discuss an installation with the local authorities before put-
ting it into service, as a polluting fait accompli is never
looked at with a kindly eye.
In the USA, the discharge of the waste water stream, both
by total flow and by chemical make-up will very likely
require a permit from the local public owned treatment
works (POTW) under the Clean Water Act (CWA). In addi-
tion, such a permit may also require co-current approval
(and in rare cases, regional EPA approval). It is important
that any new or additional wastewater flow from a post
solder cleaning process step be reviewed with local POTW
officials BEFORE commencing the discharge of wastewa-
ter. Such a review may result in the POTW waiving the
need for a permit, or in reducing the monitoring require-
ments of a required permit. Home dishwasher part cleaning
operations must comply with the same regulations.
Even though there is no universal US EPA rule for elec-
tronics part cleaning, any state can have its own regulations
for these processes. Throughout the USA, these vary
greatly from one regulatory agency to another, from mini-
mal to very strict. A regulatory personnel’s interpretation
January 1996
and knowledge of this process will determine the difficulty
that one will have with discharging the wastewater. Some
local communities may decide to prohibit a discharge of
industrial waste water. Other communities will follow the
state’s requirements and will rely on the state to monitor
the wastewater for them.
In the past, many nations and regions (states) allowed the
combining of domestic sewage with industrial wastewater
including heavy metals as long as the final wastewater
complied with the regulations. However, today many of
these cleaning operations are now considered as a point
source discharge. With increasing frequency, regulatory
personnel are taking samples of wastewater from the wash
tank drain and the rinse water drain of the cleaning equip-
ment.
In most European countries and many Asian ones, it is a
legal requirement that the discharge be measured directly
from the machine or the individual wastewater treatment
plant and that dilution of the wastewater stream either from
within the machine or without it, is expressively forbidden.
In other words, if the discharge from the machine does not
conform to the regulations, the water must be purified in
such a way that it does.
One of the more difficult aspects of wastewater treatment is
that of heavy metal cations. Taking the three most impor-
tant ones for electronics cleaning, the known regulations at
the time of writing may vary from place to place as fol-
lows:
Table 15−1 Heavy Metal in Effluent
Metal Legislative Range Approximate Average
Tin 0.5 to unlimited 2.5 mg/liter
mg/liter
Lead 0.05 to 1 mg/liter 0.15 mg/liter
Copper 0.5 to 5 mg/liter 1.14 mg/liter
In some nations, the permitted concentration is expressed
in peak milligrams-per-liter, in others parts-per million. For
the sake of simplicity, the two units were considered here
as equivalent. Very few regulations in the world permit
integrating/averaging to determine the limit.
In the calculation of this average, those nations with unlim-
ited permitted total in cation concentration were ignored:
this figure is therefore an average of those nations with a
finite limit.
It is evident that removing heavy metals from waste water
does not destroy these metals. At the best they are trans-
ported into another form, such as concentrate from mem-
brane treatment or regenerated two bed ion exchangers, as
resins from mixed bed ion exchangers or as a solid precipi-
tate after hydroxide or ferrite treatment. All these waste
materials are at least as dangerous as the original cations in
the waste water. They are only displaced. It is a bounden
IPC-AC-62A
duty to ensure they are disposed of in as environmentally-
friendly manner as possible, no matter the chosen way.
15.1.3 Solid Waste The disposal of spent or waste clean-
ing chemicals is regulated in most countries as hazardous
waste. Spent cleaning chemicals, filter cartridges, activated
carbon or others must be analyzed and characterized by
someone knowledgeable in hazardous waste generation,
storage and shipment regulations. In the USA, the federal
TCLP (Toxic Characteristic Leachate Procedure) test is the
minimum that must be performed. Applicability of the haz-
ardous waste rules subject a facility to extensive regula-
tions on personnel training, storage and handling require-
ments and record keeping. Even if hazardous waste rules
are not applicable, local or state rules on solid waste may
apply. Some states offer technical assistance to aid in this
determination. Documentation of test results and records
must be kept to assure the regulatory agency of compliance
with today’s ‘‘cradle to grave’’ requirement. Complete
records of the amount of regulated wastes generated, trans-
ported, and disposed are required.
In addition to analogue regulations, there are very severe
rules in Europe simply for the transport of hazardous waste
and, for that matter, any toxic material. Furthermore, most
regions operate licensed liquid and solid chemical disposal
sites which are specially constructed to protect the air, sur-
face and ground waters (especially phreatic sites) and the
surrounding soil. Every load of waste must be clearly
labelled as to the nature of the contents. Generally, it is a
wise precaution to make sure that a site can accept a given
waste before despatching it. Combustible waste is usually
incinerated in special kilns. In particular, special licenses
are required to transport waste across a national frontier,
according to the Basel Convention.
15.2 Contamination Removal and Treatment
15.2.1 Air Emissions The treatment process is highly
dependent upon the air emission regulation and the con-
taminant being removed. Using activated carbon and/or
condensation of the undesirable vapors may be appropriate.
15.2.2 Wastewater There are two major operations that
will most often require treatment or eliminate discharge
with a closed-loop water recycling system:
• chemical cleaning wash tank discharge (generally
required)
• discharging to a septic system (closed-loop advised)
For most chemical operations, the sampling method used
will have a major impact on what action is necessary to
meet the regulatory discharge limits. For example, for
chemical cleaning processes, the great majority of the lead
generated will be in the wash tank wastewater. The amount
of lead discharged can vary widely depending upon the
27
IPC-AC-62A
chemical cleaning agent being used. The adjustment of pH
and/or lead treatment before discharge is typical.
Wastewater discharged to a septic system (ground water),
is subject to much more restrictive regulations than those
for a POTW. Test wells drilled around the septic system are
generally required to monitor the ground water pollution.
Once the site is polluted, you will be responsible indefi-
nitely for remediation that can be very expensive.
15.2.2.1 Wastewater Discharge to a Drain The cleaning
equipment can be purchased and the wastewater tested for
compliance with the regulations, if the plant site is not in a
sensitive environmental region or on a septic system. If the
user meets the federal, state and local regulations, then
wastewater may be discharged without any pretreatment.
However, when regulations are not met, the user will have
to buy equipment to treat the wastewater. It is best that a
user take a proactive approach by finding other users that
have very similar soldering chemistries and review the
effluent characteristics with the user’s own regulatory agen-
cies. Otherwise, the user may have to take drastic steps to
correct the violation or possibly not be allowed to operate
until the wastewater discharge is in compliance.
15.2.2.1.1 Treat & Discharge Three key steps should be
reviewed
• expected contaminants being discharged
• regulatory discharge limits for the expected contami-
nants and conditions
• method used to treat the contaminants and conditions
15.2.2.1.1.1 Lead Removal In the USA, restrictions on
lead discharge have increased during the last several years.
The printed circuit board manufacturing categorical stan-
dard may sometimes be used as a guideline by the states.
Subpart H- printed circuit board sub category section
413.80(b) states that the term ‘‘operation’’ shall mean any
step in the printed circuit board manufacturing process in
which the board is immersed in an aqueous bath which is
followed by a ‘‘rinse’’ (Code of Federal Regulations, Pro-
tection of the Environment, parts 400 to 424 July 1, 1992,
p. 262). The key words ‘‘board being immersed’’ is not a
process step of the great majority of PCB cleaning opera-
tions. The boards are ‘‘spray washed.’’ From this interpre-
tation, the board assembly operation is not subject to any
federal standard unless the boards are being immersed in
the water. Therefore, only batch cleaners that actually
immerse the boards in water would be required to comply
with this regulation. If the PCB categorical standard is
used, the user would be required to comply with the fol-
lowing additional regulation if specific ‘‘states’’ regulations
are not as restrictive:
average daily lead values for four monitoring
days = 0.4mg/l
maximum lead concentration for any one day= 0.6 mg/l
28
January 1996
Either of two methods can be used to reduce the lead con-
centration found in a wastewater stream to acceptable lev-
els.
• mechanical filtration (lead particles)
• ion-exchange resin removal (dissolved lead)
Both solid wastes from these two methods must be tested
(federal and state) to determine whether they are hazardous
waste or not. If they are hazardous, they must be mani-
fested and hauled by a licensed carrier to a special hazard-
ous waste landfill.
15.2.2.1.1.2 pH treatment For most saponifiers, the pH
is usually too high to meet regulatory discharge limits. The
typical technology that is used is an acid chemical feed
system.
Sometimes, there may be a need for a caustic chemical
feed system for low pH. Some insoluble salts of lead may
precipitate and leave a fine residue at the bottom of the
neutralization tank. A representative sample of the waste-
water should be taken and analyzed to determine the
acceptability of discharging to the sewer without treatment.
15.2.2.1.1.3 BOD/COD Reduction Packaged biological
wastewater treatment system (basic design is similar to a
municipal sewerage treatment system used for cities). Acti-
vated carbon treatment may have to be used to increase the
safety margin of the equipment.
This method will reduce the COD/BOD/TOC to acceptable
levels for the POTW. With proper mechanical filtration the
lead will not accumulate in the system and the accumulated
solids at the bottom will most likely be considered as land-
fillable solid waste, or hauled by a septic system waste
hauler. Testing of the accumulated solids should be per-
formed before the solid waste is discarded to a landfill.
15.2.2.1.2 Wastewater Reduction In certain applica-
tions, a reverse osmosis (RO) membrane process can be
used to treat the wastewater from the entire cleaning opera-
tion (e.g. for a water soluble flux) or the rinse water from
a chemical cleaning application. Depending upon the
chemical cleaning agent used, it can allow from 50% to
90% reuse of the rinse water. This method is useful when
a good reliable source of water is a problem or the hauling
of the wastewater is a major concern. Membrane processes
have reject waste streams that contain a high concentration
of contaminants usually requiring treatment or hauling to a
treatment facility. The reject stream may need pH, lead,
BOD/COD/TOC treatment, or combination depending
upon the discharge regulations. The typical water purity
from such a wastewater membrane process is 50,000
ohms-cm and higher, the purity being dependent upon the
amount of influent contaminants to the membrane. All
membranes are sensitive to contaminants, but the RO is the
most sensitive to the widest range of contaminants. They
January 1996
can be irreversibly fouled and, if replacement is frequent,
the process will become prohibitive.
15.2.2.2 No Wastewater Discharge to Drain There are
three basic methods to eliminate wastewater discharge
depending upon the contaminants being generated by the
cleaning process and the user’s objective.
15.2.2.2.1 Hauling The wastewater can be hauled by a
vehicle to a wastewater treatment facility. Depending upon
a number of factors such as the availability of a facility,
volume of water and type of contaminants, it can be viable
for an in-line cleaner for short term, but is more appropri-
ate for batch cleaners and other low volume users.
15.2.2.2.2 Zero-Discharge When hauling large volumes
of water or a closed-loop process is very costly, or recy-
cling a chemical cleaning agent is not viable, or treating
and discharging is not possible, then a process that reduces
the amount of water can be appropriate.
For example, saponifiers are used to remove the RMA
fluxes and pastes. For most of these chemicals, the high
level of ionic contaminants makes an ion-exchange closed-
loop recycling system prohibitively expensive (especially
for the wash tank and highly contaminated rinses) unless
special precautions are taken. In a zero-discharge system,
an evaporator (solar, gas or electric) can be used to reduce
the volume by 30% to 95%, but none of the wastewater is
typically recycled. Before this process is used, it is very
important to examine the characteristics of the saponifier
carefully to make sure that flammability or other dangerous
conditions are not encountered during the evaporation pro-
cess. Evaporation may increase VOC levels, perhaps in
excess of the level allowed by the site permit. Organic
saponifiers generate sludge and VOC waste streams while
inorganic saponifiers only generate sludge waste streams.
The VOCs are increasingly being regulated and, depending
upon the state where the plant is located, the extent of the
regulation can vary greatly. Permits to operate the evapora-
tors are also required in some of the states. During the
evaporation process the contaminants will be concentrated
and hazardous waste permitting may be required.
15.2.2.2.3 Closed-Loop Water Recycling (Total) This
design is used for treating all of the wash and the rinse
wasetwater from a cleaning process that uses a water
soluble flux and paste. A closed-loop process, by definition,
means that no water is discharged to drain.
The system must be operating properly, otherwise these
may become concerns:
• Contaminants contributed by the tap water
• Contaminants not removed by the closed loop separa-
tion technologies
IPC-AC-62A
• Contaminants may remain on the boards and parts
• Contaminants may accumulate in the piping and sys-
tems
It is beneficial to use a closed-loop water recycling process
because:
• wastewater treatment results in a payback on the origi-
nal capital equipment (deionized or reverse osmosis
treated tap water increases the cost of tap water by
about ten times, along with the recovery of the heated
water energy saving together can make this investment
affordable)
• uncertainty of water supply
• excessive cost to monitor and treat the contamination
levels (typically lead) in the ground water, if wastewa-
ter is discharged to a septic system (expensive test
wells are typically required to be used for monitoring).
A typical closed-loop design includes the following
three sequential process steps:
Table 15−2 Separation Technologies
Process Step Purpose
particulate removes solder balls and micro-particles
organic removes organic constituents in the flux and
paste
ionic removes dissolved acids and minerals
The two major closed-loop water recycling designs are:
chelating and non-chelating. The key difference between
them is the manner in which the deionizing ion-exchange
resins that follow the chelate resin are handled and segre-
gated.
The cost to operate a closed-loop system is dependent upon
the amount of materials that dissolve in the wasetwater.
Such materials as removable mask, finger tape, or starch
(used as stand-offs for devices) can increase operating costs
significantly.
15.2.2.2.3.1 Non-Chelating Ion-Exchange Resin
Design Typical design is shown in Figure 15-1. This
design does not use a specific heavy metal ion-exchange
resin. Since the lead does not accumulate excessively in
this resin, as it would in a chelating resin, the solid waste
generated is most often not hazardous according to the fed-
eral TCLP test. As non-hazardous waste, the solid waste
can be transported by a non-regulated carrier or disposed in
a sanitary landfill. In all cases, tests need to be performed
and the results be kept on file.
In most European countries, and possibly elsewhere, these
resins would be considered as hazardous waste and should
be treated accordingly.
15.2.2.2.3.2 Chelating Ion-Exchange Resin Design
This design uses a specific heavy metal ion-exchange resin
that removes the ionic lead and other heavy metals from
29
IPC-AC-62A January 1996

the wastewater stream. Upon exhaustion of the resin, it can organic compounds, it may be incinerated in an approved
become hazardous solid waste and must be manifested to a kiln. Some kilns are also capable of accepting sludge con-
licensed waste hauler and disposed in a special landfill. The taining small percentages of heavy metals, especially
only advantage of this design is that it allows the ion- cement kilns designed for chemical incineration.
exchange resin downstream from the chelating resin to be
handled by a non-heavy metal regenerator. The end user
must monitor this resin closely and replace well before any
leakage of lead is detected.
CAUTION: More than 90% of the resin regenerators in the
USA are not heavy metal regenerators. It is very important
that the generator (user) realize that the user is still legally
liable for any ultimate misuse of resin containing lead
regardless who is at fault.
A non heavy metal generator will only accept lead free res-
ins because of the potential of cross-contaminating resins
used by laboratories, hemodialysis and other critical pro-
cess endusers. Unless strict controls are used, lead may
contaminate the ion-exchange resins and not be lead-free as
required. The typical design is shown in Figure 15-2.

15.2.2.2.3.3 Combination Design RMA cleaning appli-

cations using organic saponifiers pose the most difficulty if
the enduser desires to recycle as much as possible and dis-
charge the minimum amount of hazardous waste. The very
high level of dissolved minerals (ionic) in the wash water
is the key problem. If a closed-loop ion-exchange resin
design is used, the drag-out of the high ionic content
chemical would cause a prohibitively high operating cost.
However, reasonable operating costs can be achieved if the
amount of drag-out of the chemicals going into the rinse
water is greatly reduced. The goal of the end user can still
be achieved with a combination design that includes
closed-loop water recycling, zero-discharge and treat &
discharge as previously discussed. One or more of these
designs can be used depending upon whether it is a batch
or in-line process, volume of the dragout or final rinse
wastewater, discharge regulations, and several other fac-
tors.
Another more recent process is a multiple stage system that
uses a biological treatment as its core process and includes
several separation technologies.

15.2.3 Solid Waste The solid (or sludge) waste from any
of the above processes may be classified as hazardous or
regulated waste depending upon the federal (TCLP), state
and local regulations. The saponifiers will produce sludge
or solid waste that will be considered probably as hazard-
ous because of the amount of lead accumulated in the tank
and other factors. Whether it is hazardous or that it be
regulated can vary depending upon the actual chemical
cleaner being used.
In some European countries, all industrial sludge is consid-
ered hazardous and must be treated accordingly with
deposit in a chemically approved landfill. If the sludge is of

30
January 1996 IPC-AC-62A

CLEANER

Mechanical Filter Carbon Filter Ion Exchange Mechanical Filter

Figure 15−1 Closed Loop Design without Chelating Agent

CLEANER

Mechanical Filter Carbon Filter Chelate Resin Ion Exchange Mechanical Filter

Figure 15−2 Closed Loop Design with Chelating Agent

31
IPC-AC-62A January 1996

Appendix A

Contents:
Figure 1 Basic Steps for Cleaning Process
Selection/Design
Table 1 High Ionics Readings after Cleaning
Table 2 White Residue
Table 3 Incomplete Drying
Table 4 Water Recycling, Short Mechanical Filter Life
Table 5 Water Recycling, Poor Organics Removal
Table 6 Water Recycling, Short Life of Ion Exchange
Resin
Table 7 Miscellaneous Process Anomalies
Note: The contents of this appendix address lessons
learned from practical application of aqueous cleaning
operations employed for post solder cleaning.
Typical process anomalies that may be encountered with
aqueous cleaning processes, are shown in the following
seven tables. Possible causes for encounterable anomalies
and recommended action for correction are listed from
industry experience.
Cleaning concepts and practical applications have evolved
rapidly in great numbers and the technology continues to
grow at an even more rapid pace. Therefore, new causes
for process deviations from an average pattern, and appro-
priate remedies will need to be determined and added.
The reader is advised to work closely with suppliers of sol-
dering fluxes, wash media and application equipment to
cope successfully with process anomalies that are not
addressed by the tables of Appendix A.
IPC-PE-740 is an additional source for process trouble-
shooting.

32
 Solder Required Required
Flux to be Used DFE

Figure A−1
Conditions Cleanliness Dryness
January 1996

1
Define Soldering
and Cleaning
Requirements

Basic Steps
Process/Parts Environmental Waste Management Safety
2 Compatibility Impact and Conservation and Health
Select
Wash/Rinse/Dry
Process

Available In-Line Equipment

Process Volume or Batch
3 Floorspace Features
Select
Application
Equipment

Test Equipment Talent Needed External Services

4 Test Methods Required Required
Define Testing
Needed for
Qualification,
Control &
Monitoring
Optimize Optimize Optimize
Initiate Design Optimize Waste
Process Equipment Conservation
Changes Management
Conditions Features
5
Conduct
Pilot Run
Finalize Control Issue
and Monitor Qualify Process Process/Material Train Production
Frequency Specifications Personnel

33
IPC-AC-62A
IPC-AC-62A January 1996

Appendix A, Table One High Ionics Reading After Cleaning

Possible Cause Recommended Action Ref. No.
Wash medium is not compatible with flux Consult with flux supplier for correct medium A1-1
Wash/rinse times are too short Lower conveyor speed A1-2
Increase wash/rinse cycle time (batch) A1-2A
Misaligned airknives Adjust angles to optimum A1-3
Rinse water purity is inadequate Check resistivity of rinse water, improve A1-4
Wash/rinse temperature is too low or too high Optimize temperature A1-5
Wash/rinse spray nozzles are plugged Check and clean nozzles, replace filters A1-6
Component clearances are too narrow Provide adequate clearances by design A1-7
Provide mechanical action to aid penetration A1-7A
Excessive flux was applied during soldering Reduce quantity of flux used A1-8
Use lower solids flux A1-8A
Preheat/soldering temperature/time was excessive Optimize soldering conditions A1-9
Permanent soldermask retains flux Optimize type(s) of soldermask used A1-10
Improve cure/mix quality of soldermask A1-10A
Temporary soldermask was not totally removed Improve wash/rinse times and temperature A1-11
Low solubility residues from component/board mfg. Optimize wash to solubilize residues A1-12
Consult with component/board mfgr. for prevention A1-12A
Manual handling (fingerprints) after cleaning Improve handling (gloves) A1-13
Dust/dirt settling on parts after cleaning Improve cleanliness of production area A1-14
Poor racking in batchwashers Improve racking practices A1-15
Poor PWB design Inform designer of requirement A1-16

Appendix A, Table Two White Residue

Possible Cause Recommended Action Ref. No
Detergent or saponification residues Check and optimize wash type, conc., time. and temp. A2-1
Optimize operation of air knives A201A
Clean nozzles, replace filters A2-1B
Use prewash. optimize rinse time and temperature A2-1C
Excessive preheat and solder temperature and time Optimize preheat and solder operation A2-2
Flux residues are aged Reduce ‘‘wait time’’ between soldering and cleaning A2-3
Incompatibility of soldermask with cleaning process Select compatible soldermask A2-4
Select compatible wash medium, conc. and temperature A2-4A
Undercured or badly mixed soldermask Cure soldermask, improve mix quality A2-5
Undercured laminate Check Tg, cure laminate A2-6
Hard water reaction with saponifier Make-up and replenish wash with DI water A2-7
Poor rinse water quality Rinse with DI water A2-8
Wash/rinse temperature too low or too high Adjust temperature A2-9
Wash/rinse times too short Increase wash/rinse dwell time A2-10

34
January 1996 IPC-AC-62A

Appendix A, Table Three Incomplete Drying

Possible Cause Recommended Action Ref. No
Poor angle of airknives Optimize angle A3-1
Air pressure is too low for nozzle design Adjust air pressure A3-2
Duration of drying cycle is too short Lower conveyor speed (in-line) A3-2
Increase length of heating section (in-line) A3-2A
Increase length of drying time (batch) A3-2B
Drying temperature is too low Optimize drying temperature A3-3
Centrifugal force is too low Increase rotation (rpm) in centrifugal dryer A3-4
Water layer on top of liquid drying agent Remove water A3-5
Poor heat transfer in vacuum chamber Preheat parts before vacuum drying A3-6
Part configuration entraps water Increase drying time, use oven bake as follow up A3-7
Gross drying is inadequate for required dryness Use oven drying as follow up A3-8

Appendix A, Table Four Water Recycling, short Mechanical Filter Life

Possible Cause Recommended Action Ref No
Drag-out from wash/prewash Improve isolation with airknife A4-1
Install filter in wash/prewash A4-1A
Scum formation in wash Use soft or DI water for sap. make-up and replenishment A4-2
Excessive volume of water soluble mask processed Minimize amounts of soluble mask used A4-3
Remove mask in wash/prewash A4-3A
Use mask with lower particulate levels A4-3B
Filter size is too small for volume processed Increase filter size A4-4

Appendix A, Table Five Water Recycling, Poor Organics Removal

Possible Cause Recommended Action Ref. No
Carbon filter is exhausted Replace with fresh carbon filter(s) A5-1
Monitor filter performance with TOC/COD tests A5-2
Use back-up filter, establish frequency for replacement A5-2A
Provide effective and prior mechanical filtration A5-2B
Poor adsorption characteristics of materials Optimize carbon type(s) and organics to be removed A5-3
Use BOD/COD, TOC measurements to determine compat. A5-3A
Flow rate is too high for carbon filter size Reduce flow or increase filter size A5-4
Biogrowth in filters Provide around the clock agitation A5-5
Use anti-bio treatments (ozonation, chlorination) A5-5A

Appendix A, Table Six Water Recycling, Short Life of Ion Exchange Resins
Possible Cause Recommended Action Ref. No
Volume processed is too high for resin volume Increase resin volume A6-1
High ionic sources (water soluble mask etc.) Reduce amounts used A6-2
‘‘Fouling compounds’’ are present in process water Replace damaged resin, eliminate fouling source A6-3
Fine particles are present in process water Eliminate by mechanical prefiltration A6-4
Water temperature is too high for resin type Replace damaged resin, reduce temperature A6-5
Use heat exchangers A6-5A
Biogrowth in resin beds Use higher temperature rated resin A6-6
Provide agitation, use anti-bio treatments A6-6A

35
IPC-AC-62A
Appendix A, Table Seven
Anomaly
Damage to electr. component
Damage to electr. insulation
Elastomer degradation
Lubricant removed
Dull/discolored solder
Water marks on surface
Boards ‘‘flip’’ in wet section
Incomplete rosin removal
Excessive foaming in wash
Excessive foaming in rinse
36
January 1996
Miscellaneous Anomalies
Possible Cause Recommended Action Ref. No
Component not sealed, or Use adequately sealed components A7-1
inadequately sealed
Add component after cleaning A7-1A
Provide compatible wash, if possible A7-1B
Process temperature is too high Optimize processing temperature A7-1C
Incompatibility of wash with insulation Provide compatible insulation or wash A7-2
Incompatibility of insulation with Optimize temperature of wash/drying A7-3
temperature
Wash medium attack Provide compatible elastomer or wash A7-4
Incompatibility of elastomer with Optimize temperature of wash/drying A7-4A
temperature
Incompatibility with wash medium Provide compatible wash medium A7-8
Relubricate after wash/rinse/dry A7-8A
Install component after cleaning/drying A7-8B
Wash medium is too agressive Optimize medium type used A7-9
Optimize concentration A7-9A
Process temperature is too high Optimize temperature A7-9B
Consult medium supplier, use A7-9C
inhibitors
Rinse water quality inadequate Provide isolation (airknives) between A7-10
stations
Use DI water for rinsing A7-10A
Remove surface water before evapor. A7-10B
drying
Parts are too light Process parts in mesh type cages A7-11
Unbalanced top and bottom spray Balance spray pressures A7-11A
Exhausted saponifier wash Replenish or make-up new bath A7-12
Saponifier concentration is too low Add make-up to required optimum A7-12A
concentration
Wash temperature is too low Adjust to recommended optimum A7-12B
Increase wash cycle time A7-12C
(batchwasher)
Rosin too heavily polymerized Adjust temperature profile of soldering/
reflow machine
Change flux type
Rosin soap build-up Provide a fresh wash solution A7-13
Contact wash medium supplier for A7-13A
foam control
Saponifier concentration is too high Optimize concentration A7-13B
Air entrapment Check for damaged plumbing, correct A7-13C
Pump cavitation Increase flow rate, check for blocked A7-13D
nozzles
Chemical incompatibility of flux with Consult flux manufacturer A7-13E
wash
Saponifier solution temperature too Increase saponifier solution
low temperature to that recommended by
the manufacturer
High drag-out from wash Provide effective isolation (airknives) A7-14
Use pre-wash to avoid build-up in A7-14A
wash
January 1996 IPC-AC-62A

Appendix B

Note: This appendix contains standard IPC test methods

from IPC-TM-650 which are commonly used for direct and
indirect assessment of cleanliness of printed wiring boards
and assemblies.
With changes in the cleaning technology, changes in test
methods must be anticipated. The reader is well advised to
keep up with new developments in test technology for
cleanliness assessment.

Contents:

1. Method 2.3.25, ‘‘Resistivity of Solvent Extract

(Manual)’’
2. Method 2.3.26, ‘‘Ionizable Detection of Surface Con-
taminants (Dynamic Method)’’
3. Method 2.3.26.1, ‘‘Ionizable Detection of Surface
Contaminants (Static Method)’’
4. Method 2.3.27, ‘‘Cleanliness Test - Residual Rosin’’
(UV Method)
5. Method 2.3.27.1, ‘‘Rosin Flux Residue Analysis,
HPLC Method’’
6. Method 2.3.28, ‘‘Ionic Analysis of Circuit Boards, Ion
Chromatography Method’’
7. Method 2.3.38, ‘‘Surface Organic Contaminant Detec-
tion Test (In-House Method)’’
8. Method 2.3.39, ‘‘Surface Organic Contaminant Detec-
tion Test (Infrared Analytical Method)’’
9. Method 2.6.3.1, ‘‘Moisture and Insulation Resistance -
Polymeric Soldermasks and Conformal Coatings’’
10. Method 2.6.3.3 ‘‘Corrosivity Testing’’
11. Method 2.6.9.1, ‘‘Test to Determine Sensitivity of
Electronic Assemblies to Ultrasonic Energy’’
12. Method 2.6.13, ‘‘Assessment of Susceptibility to
Metallic Dendritic Growth : Uncoated Printed Wiring’’
13. Method 2.6.14, ‘‘Resistance to Electromigration, Poly-
mer Soldermask’’

37
The Institute for Interconnecting and Packaging Electronic Circuits Number
2215 Sanders Road • Northbrook, IL 60062-6135 2.3.25

Subject
Resistivity of Solvent Extract

Date Revision
2/88 A
IPC-TM-650 Originating Task Group
TEST METHODS MANUAL Ionic Conductivity (5-32a)

1.0 Scope This test method is designed for determining the 5.3 Use 100 milliliters of wash solution for each 250 mm2
presence of ionizable surface contaminants on printed-wiring [10 in.2] of the board or assembly area and direct in a fine
boards and assemblies. The basis of the test is the change in stream on both sides of the test specimen. The wash activity
electrical resistivity of the solvent used to wash the printed- shall occur for a minimum of one (1) minute. It is imperative
wiring board or assembly. The resistivity is lowered when con- that the initial washings be included in the sample to be mea-
taminants, such as plating salts, flux residues, etchants, or sured for resistivity.
detergents, are dissolved.
5.4 Measure the resistivity of the collected wash solution in
2.0 Applicable Documents accordance with the conductivity bridge manufacturer’s
instructions.
2.1 See 6.1, References
6.0 Notes
3.0 Test Specimen Any printed-wiring board or assembly
of sufficient area to provide enough the solvent to determine 6.1 References This test procedure, including solution
its resistivity. preparation and a laboratory ware cleaning procedure, is
documented in Materials Research Report No. 3–72.
4.0 Test Equipment ‘‘Printed- wiring assemblies; Detection of ionic contaminants
on’’. Application for copies of this report should be addressed
4.1 Miscellaneous laboratory ware such as beakers, funnels, to:
storage and wash bottles. The laboratory ware may be made
Freedom of Information Act Office
of glass or polyethylene but it is imperative that all apparatus
Naval Avionics Center
used in this procedure be scrupulously clean.
6000 East 21st Street
Indianapolis, IN 46219–2189
4.2 Conductivity Bridge, Barnstead Model PM–70CB or
equivalent.

4.3 Conductivity Cell, Beckman Model CEL-A01-Y87-CERT

with a cell constant K = 0.10/cm or equivalent.

4.4 Wash solution composed of 75% by volume, ASC

Reagent Grade isopropyl alcohol, 25% by volume distilled
water with a minimum resistivity of 6.0 x 106 ohm-cm.

4.5 Linear measuring device such as calipers capable of

measuring the area of the printed-wiring board or assembly to
the nearest 25.4 mm2 [1.0 in.2].

5.0 Test Procedure

5.1 Determine the surface area of the printed-wiring board

or assembly including both sides of the board and an estimate
of the area of any components mounted thereon.

5.2 Suspend the test specimen within a convenient sized

funnel positioned over a collection breaker.

Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement. Page 1 of 1
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
IPC-TM-650
TEST METHODS MANUAL
1.0 Scope
1.1 Purpose This test method establishes a procedure for
determining the amount of surface ionic soil on a printed
board or printed board assembly. The soil must be soluble in
water, alcohol or some mixture of both. The determination can
be made on either a quantitative or a qualitative basis.
1.2 Restrictions The equipment used does not differenti-
ate between specific ionic specie. It determines their presence
and ranks them according to their ionic mobilities. Salts with
higher ionic mobilities are weighed heavier than salts with
lower ionic mobilities.
1.3 Application This method has application as a quality
control tool and as a method for developing and evaluating
cleaning process parameters. As a quality control tool, it can
be used to inspect parts to determine if they conform to pre-
determined levels of cleanliness. In process development this
procedure can be used to evaluate solvent and process effi-
ciency and also to set levels of acceptable cleanliness.
2.0 Applicable Documents None
3.0 Test Specimen Any preproduction or production bare
printed board or printed board assembly.
4.0 Test Equipment A dynamic measurement device
which extracts the ions from the surface being measured and
checks conductivity of a rinse solution. Solvent is pumped
through a recirculating loop which includes a plastic tank,
conductivity cell and ion exchange column to remove all
traces of ions from the solvent before entering the tank. The
conductivity cell used is temperature compensated to avoid
reading variations caused by temperature changes. A meter-
ing pump pumps the solution through the loop at a constant
rate. A recorder is used to follow the change of conductivity
with time. (See notes).
5.0 Procedure
5.1 Solvent Systems The equipment can be used with
either pure water or water/alcohol mixtures. Water is used
when only water soluble salts such as plating salts are to be
measured. The use of pure water results in a measuring fluid
with an initial conductivity of about 0.1 micromhos (10
megohms).
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Number
2.3.26
Subject
Ionizable Detection of Surface Contaminants
(Dynamic Method)
Date Revision
11/94 A
Originating Task Group
Ionic Conductivity (5-32a)
Water/alcohol systems are used when nonpolar soils might
encapsulate or otherwise mask the water soluble ionic soils.
Various alcohols have been used successfully. The preferred
systems use either N-propanol or isopropanol as the alcohol
solvent. Because of the high dielectric constant of the alco-
hols, excessive alcohol in the mixture will generally degrade
the sensitivity of the measurement. To obtain maximum sen-
sitivity and to insure sufficient alcohol to readily remove all
nonpolar residue, the recommended mixtures are 40% (by
volume) N- propanol and 60% water or 50% (by volume) iso-
propanol and 50% water. Mixtures with as high as 75% by
volume is isopropanol have been successfully used.
5.2 Calibration Once the fluid in the system has estab-
lished a stable level of conductivity, a precise quantity of cali-
bration solution is injected into the test solution. The system
then integrates the variables of test solution conductivity,
pumping rate, sample area and time into a contamination level
specified as equivalent micrograms of sodium chloride (per
sq.) of the sample.
5.3 Testing Once the system has been calibrated in accor-
dance with 5.2, the test specimen is immersed in the sample
tank. Care must be taken not to handle the sample or any of
the appliances used to insert it into the tank. Finger dirt con-
tains highly mobile ionic soils and may give spurious readings.
During the course of the measurement, the conductivity of the
solution will depart from the baseline of conductivity and then
gradually return. When it has returned to the baseline, no
additional soil can be removed and the measurement is com-
plete.
The curve for that sample is then integrated as per section 5.2
and the calibration curve is used to determine the amount of
contamination on the part.
5.4 Evaluation Without a sample in the tank, a condition
will be established in which the conductivity of the solvent, as
measured by the conductivity cell, will attain a constant low
value. With the introduction of a contaminated sample into the
tank, the conductivity reading measured at the cell will rise
rapidly. The sample remains immersed in the solvent until the
conductivity of the solvent returns to its original equilibrium
level. At that point, no further ionic material can be removed
from the sample.
Page 1 of 2
 IPC-TM-650
Number Subject Date
2.3.26 Ionizable Detection of Surface Contaminants (Dynamic Method) 11/94

Revision
A

5.4.1 Theory of Measurement Technique The entire
amount of ionic material removed from the sample can be
related to the integral of the conductivity readings over the
period of time required to dissolve the material and purge it
through the system as follows: At any instant, t, the number
of moles, n1, of ionic material within the conductivity cell is n1
= Vc X Ct where Ct is the concentration of ions and Vc is the
cell volume which is constant. Over an infinite amount of time,
the total number of moles of ions passing through the cell, N,
will be:
B. Measurements of purity of incoming and redistilled
solvents.
C. Measurement of amount of activated rosin flux dissolved in
the boiling sump of a vapor degreaser.
D. Measurement of activity level of activated rosin fluxes.
6.2 Availability The equipment specified, or its equivalent,
may be procured commercially. Source is Alpha Metals Inc.
(Equipment name is IonographTM).

N =∫o∞ nt dt = Vc ∫o∞ Ct dt

Since we are dealing with very low concentrations (10–4N), we

can assume complete ionization, therefore:

Conductivity = L = kC

(assuming one salt to be present). Of course, different ionic

salts with different ionic mobilities will give different conductivi-
ties for a given concentration.

N = kVc ∫o∞ Lt dt

If the monitor and recorder responses are linear with respect

to L, then according to the last equation, the area under the
conductivity-time curve which is charted on the recorder is a
linear function of N, the total amount of ions removed from the
sample.

5.4.2 Treatment of Test Data The number obtained from

section 5.3 will be the ionic contamination on the surface of
the board in terms of equivalent micrograms of sodium chlo-
ride. (If the calibration solution contained a different salt than
sodium chloride the number will be in term of equivalent
micrograms of that salt). It is common practice to divide this
figure by the total area on both sides of the printed board or
printed board assembly and present the data in terms of
equivalent micrograms of salt per unit of area.

By using a scale of measurement based on only one salt, i.e.

sodium chloride, the ionic contaminants are being measured
in terms of their ionic mobility. The more mobile or active an
ion is, the more likely it is to cause a problem. Thus, while this
test method will not differentiate between specific ions, it is an
effective way of quantifying the presence of many ions.

6.0 Notes

6.1 Other Uses The equipment measures the ionic activity

of any part or solution which contains ionic material, it may be
used for various other purposes. A partial list appears below:

A. Incoming inspection of reflowed tin/lead boards to deter-

mine if residues have been completely removed.

Page 2 of 2
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
IPC-TM-650
TEST METHODS MANUAL
1.0 Scope
1.1 Purpose This test method establishes a procedure for
determining the amount of surface ionic soil on a printed
board or printed board assembly. The soil must be soluble in
water, alcohol or some mixture of both. The determination can
be made on either a quantitative or a qualitative basis.
1.2 Restrictions The equipment used does not differenti-
ate between specific ionic specie. It determines their presence
and ranks them according to their ionic mobilities. Salts with
high ionic mobilities are weighted heavier than salts with lower
ionic mobilities.
1.3 Application This method has application as a quality
control tool and as a method for developing and evaluating
cleaning process parameters. As a quality control tool, it can
be used to inspect parts to determine if they conform to pre-
determined levels of cleanliness. In process development this
procedure can be used to evaluate solvent and process effi-
ciency and also to set levels of acceptable cleanliness.
2.0 Applicable Documents None
3.0 Test Specimen Any preproduction or production bare
printed board or printed board assembly.
4.0 Test Equipment A measuring device based on extrac-
tion of ions in a static volume of solution. Solution is cleaned
through ion exchange columns to a high resistivity value
before initiation of a test. During a test, a recirculating loop is
used consisting of the solution in the test tank being pumped
to provide agitation, past the measuring probe and back into
the test cell again, bypassing the ion exchange columns. Thus
the term ‘‘static’’. A meter or digital display along with a
recorder or printer is used to record the results. The conduc-
tivity probe is temperature compensated.
5.0 Procedure
5.1 Solvent/Systems The equipment can be used with
alcohol/water mixtures of 50% alcohol/50% water to 75%
alcohol/25% water plus or minus 10%.
Alcohol/water systems are used when nonpolar soils might
encapsulates or otherwise mask the water soluble ionic soils.
Various alcohols have been used successfully. The preferred
systems use either N-propanol or isopropanol as the alcohol
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Number
2.3.26.1
Subject
Ionizable Detection of Surface Contaminants
(Static Method)
Date Revision
11/94
Originating Task Group
Ionic Conductivity (5-32a)
solvent. Because of the high dielectric constant of the alco-
hols, excessive alcohol in the mixture will generally degrade
the sensitivity of the measurement. To obtain maximum sen-
sitivity and to insure sufficient alcohol to readily remove all
nonpolar residue, the recommended mixtures are from 50%
alcohol (by volume) and 50% water to 75% alcohol (by vol-
ume) and 25% water. The recommended optimum mixture is
recommended to be 75% alcohol/25% water.
5.2 Calibration Once the fluid in the system has estab-
lished a high level of cleanliness (20 megohms or higher), a
precise quantity of calibration solution is measured into the
test solution. The system then measures resistivity, which can
be calculated into a final contamination level expressed in
equivalent micrograms of sodium chloride.
5.3 Testing Once the system has been calibrated in accor-
dance with 5.2, and the solution cleaned to a high resistivity
value, a test may be accomplished by immersing the test
specimen in the test cell. Care must be taken not to handle
the sample or any of the appliances used to insert it into the
tank. Finger dirt contains highly mobile ionic soils and may
give false readings.
After insertion of the sample and during the course of the
measurement, the resistivity of the solution will decline. End of
test is determined by a preselected time or (depending on
model of equipment) automatically aborted when no further
change in contamination is measured.
5.4 Evaluation Without a sample in the tank, a condition
will be established in which the resistivity of the solvent, as
measured by the conductivity cell, will obtain a maximum
value as indicated by the meter or display readings in mego-
hms. With the introduction of a contaminated sample into the
test cell, the resistivity reading will decay. The sample remains
immersed in the solvent for the predetermined time or if auto-
matic time was preselected, until no further contamination is
measured.
5.4.1 Theory of Measurement Technique The entire
amount of ionic material removed from the sample can be
related using a formula for mathematical calculation of con-
tamination as the equivalent of NaCl is micrograms per sq.
Where:
D = Volume of solution in test cell
B = End resistivity in megohms.
Page 1 of 2
 IPC-TM-650
Number Subject Date
2.3.26.1 Ionizable Detection of Surface Contaminants 11/94
(Static Method)
Revision

C = Sample surface area (L x W x 2)

G = Starting resistivity in megohms
A = % of alcohol in test solution
E = Empirical constant –0.008175
F = Empirical constant 0.3093028

Formula will be:

D 1 − 1 = Micrograms NaCl/Sq.
C x 10 (A E + F)
x
( B G )
Calculation can also be computed without subtracting the
starting contamination (1/G). This is assuming that the starting
contamination is small enough so that it may be ignored.

5.4.2 Treatment of Test Data The number obtained from

Section 5.3 will be the ionic contamination on the surface of
the board in terms of equivalent micrograms of sodium chlo-
ride. (If the calibration solution contained a different salt than
sodium chloride, the number will be in terms of equivalent
micrograms of that salt). It is common practice to divide this
figure by the total area on both sides of the printed board or
printed board assembly and present the data in terms of
equivalent micrograms of salt per unit of area.

By using a scale of measurement based on only one salt i.e.,

sodium chloride, the ionic contaminants are being measured
in terms of their ionic mobility. The more mobile or active an
ion is, the more likely it is to cause a problem. Thus, while this
test method will not differentiate between specific ions, it is an
effective way of quantifying the presence of many ions.

6.0 Notes

6.1 Other Uses Because the equipment measured the

ionic activity of any part or solution which contains ionic mate-
rial, it may be used for various other purposes. A partial list
appears below:

A. Incoming inspection of reflowed tin/lead boards to deter-

mine if residues have been completely removed.

B. Measurement of purity of incoming and redistilled solvents.

C. Measurement of amount of activated rosin flux dissolved in
the boiling sump of a vapor degreaser.

D. Measurement of activity level of activated rosin fluxes.

6.2 Availability The equipment specified, or its equivalent,

may be procured commercially. Source is Alpha Metals Inc.
(Equipment name is OmegameterTM).

Page 2 of 2
The Institute for Interconnecting and Packaging Electronic Circuits Number
2215 Sanders Road • Northbrook, IL 60062-6135 2.3.27

Subject
Cleanliness Test—Residual Rosin

Date Revision
1/95
IPC-TM-650 Originating Task Group
TEST METHODS MANUAL New Methods Task Group (5-32f)

1.0 Scope To quantify the residual rosin left from solder Once the extraction unit is assembled, weigh a cotton cellu-
paste and/or wave soldering flux after the reflow and cleaning lose thimble on an analytical balance to the forth decimal
process. place. Record the weight.

2.0 Applicable Documents Remove the top of the solder paste jar and use a spatula to
stir the solder paste. Scoop about 25 grams of fresh solder
IPC-TR-580 Cleaning and Cleanliness Test Program Phase 1 paste and put it into the thimble. Immediately weigh the
Results thimble and paste together to the fourth decimal place.
Record that weight.
3.0 Test Specimen A printed circuit board assembly which
has been cleaned after soldering. Carefully remove the round bottomed flask and the Soxhelt
extraction tube from the condenser. Place the thimble con-
4.0 Apparatus taining the paste into the Soxhlet extraction tube and set it
a) Ultraviolet spectrophotometer aside. Pour about 300 ml of TEST SOLUTION into the round
bottomed flask. This amount is not critical. Reassemble the
b) Balance capable of measuring 0.0001 grams
Soxhlet extraction tube and the round bottomed flask back
c) Balance capable of measuring 500 grams together with the condenser and mantle.

d) 100 ml volumetric flasks (5) Turn on the water supply to a slow but steady flow. Turn on
the power to the mantle and gradually heat the TEST SOLU-
e) 250 ml volumetric flask
TION to a boil. As the solvent boils, vapors will condense in
f) 1000 ml volumetric flask the coil and start dripping into the cellulose thimble containing
the paste. As the condensate fills the Soxhlet tube, it will even-
g) Squeeze bottle
tually fill to a point that a siphon will drain the condensate back
h) Soxhlet Extraction Tube down into the round bottom flask. Continued filling and drain-
ing of the Soxhlet tube will wash away the flux residues and
i) 500 ml round bottomed flask
leave only the solder in the thimble.
j) Friedrich condenser
Allow the condensate to flush for two hours. At the end of the
k) Heating Mantle capable of heating a 500 ml flask two hours, disconnect the soxhlet and round bottom flask
from the condenser. If TEST SOLUTION is not covering the
l) 250 ml Erlenmeyer flask paste already, add some so that the paste is covered by at
Materials: least two inches. Using a long object such as a spatula, stir
the solder paste to release any remaining trapped flux. Reas-
a) TEST SOLUTION—HPLC TEST SOLUTION with 1.0% v/v
semble the tube and flask back together and let the solvent
phosphoric acid and 0.1% v/v water added.
boil for another two hours.
b) Solder paste to be used on assembly line
After four hours of boiling, disconnect the Soxhlet and round
c) GLAD-LOCK recloseable freezer bags (7 inch x 8 inch x bottomed flask from the condenser and turn off the water.
2.7 mil) Pick the thimble up and let the TEST SOLUTION drain back
into the Soxhlet tube. Set the thimble on a paper towel to air
5.0 Procedure dry for about one hour then place it in an oven at 150°F for
two hours. Remove the thimble from the oven and let it cool
5.1 Preparing the Standards First, analyze the compo-
to room temperature. Weigh the thimble and dry solder
nents of the solder paste. To do this assemble a Soxhlet
together to four decimal places and record the weight.
extraction apparatus. Set the round bottomed flask in the
heating mantle and plug the mantle into a power regulator so Pour the TEST SOLUTION that is in the Soxhlet tube into the
that the temperature can be controlled. DO NOT TURN THE round bottomed flask with the rest of the solvent. Place the
POWER ON AT THIS TIME. Hook the inlet of the condenser round bottomed flask in the mantle and bring the solvent back
to a water supply, and the outlet to a drain. to a boil. Let the TEST SOLUTION evaporate until the volume

Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement. Page 1 of 5
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
 IPC-TM-650
Number Subject Date
2.3.27 Cleanliness Test—Residual Rosin 1/95

Revision

is around 50 to 100 ml then remove it from the mantle. Weigh As done previously, let the paste flux for two hours then stir it
a 250 ml erlenmeyer flask to at least 2 decimal places and with a spatula. Flux for another two hours. When flushing is
record the weight. Pour the solvent from the round bottomed complete, lift the thimble up and let the TEST SOLUTION drip
flask two times to make sure all of the residue is in the erlen- back into the Soxhlet tube. Set the thimble on a paper towel
meyer. and let it air dry for one hour. Place the thimble in an oven at
150°F for two hours. Remove the thimble from the oven and
Set the erlenmeyer on a hot plate and evaporate the solvent
let it cool to room temperature. Weigh the thimble and paste
dry. The flask will probably not go completely dry, but it will
reduce to a thick, viscous looking solvent. Remove the flask together to the fourth decimal place and record the weight.
from the heat and let it cool. When the flask is at room tem- Pour the solvent remaining in the Soxhelt tube into the round
perature, weigh the flask and residue together and record the bottom flask and let it boil down to about 100 ml. Remove the
weight. flask from the heat. Weigh a 500 ml volumetric flask to the
Repeat this testing at least four times to get an average of second decimal place and record the weight. Pour the TEST
each weight. SOLUTION from the round bottomed flask into the volumetric.
Rinse the round bottomed flask with TEST SOLUTION at least
**CAUTION: SOLDER IS A HAZARDOUS MATERIAL. twice to be sure all of the residue is in the volumetric. Rinse
DISPOSE OF SOLDER AND SOLDER PASTE PROP- the inside of the volumetric down and continue to add TEST
ERLY. SOLUTION until the flask is about half full. Weigh the flask and
the solvent together to the second decimal place and record
5.1.1 Standards Calculations:
the weight. Cap the flask and mix thoroughly.
(Thimble + wet paste wt.) – thimble wt. = wet paste wt.
5.2.1 Calculations
(Thimble + dry solder wt.) – thimble wt. = dry solder wt.
(thimble + paste wt. ) – thimble wt. = paste wt.
(Flask + residue wt.) – flask wt. = residue wt.
Example: 32.8293 – 4.2686 = 28.5607
100 x dry solder wt. = % metal
wet paste wt. (thimble + dry solder wt.) – thimble wt. = metal wt.
100 x residue wt. = % residue Example: 29.6060 – 4.2686 = 25.3374
wet paste wt. *this weight should be within 1% of your average metal wt.
all % metals x average % residue paste wt. – metal wt. = flux wt.
number of times run
Example: 28.5607 – 25.3374 = 3.2233
all % residues x average % residue
number of times run (volumetric flask + solvent wt.) – volumetric wt. = solvent wt.

*Note: All % metals run and the amount listed in technical Example: 175.22 = 199.96
data sheets should be within 2% of each other. All % rosins flux wt. x average % residue = wt of residue in flask
run and the amount listed in technical data sheets should be
within 1% of each other. Example: 3.2233 X 0.55 = 1.77

residue wt. = % residue in stock solution

5.2 Standards: Making the Stock Solution Once the sol-
solvent wt.
der paste components have been verified, standards can be
made. Example:
Weigh a cotton cellulose thimble to the fourth decimal place 1.77 = 0.00885 grams or 0.885%
and record the weight. Add about 25 grams of fresh solder 199.96
paste to the thimble and weigh it immediately. Record the
weight. 5.3 Making the Standards from the Stock Solution
First, calculate the amount of stock solution you will need for
Put the thimble into the Soxhlet tube and assemble the each standard. Standards that will be used are 0.002%,
extraction unit as described earlier. Turn on the water to the
0.004%, 0.006%, 0.008% and 0.010%.
condenser and the power to the mantle. Gradually bring the
solvent to a boil.

Page 2 of 5
 IPC-TM-650
Number Subject Date
2.3.27 Cleanliness Test—Residual Rosin 1/95

Revision

5.3.1 Calculations bance reading as the 0.00% standard. This is also known
To make 50 grams of 0.002% standard: as the ‘‘Y ntercept.’’

0.002 x 50 = wt. of stock solution to be (4) Remove the sample cuvette and dump the TEST SOLU-
% residue in volumetric used for standard * TION. Fill the cuvette with the 0.002% standard and insert
it back into the spectrophotometer. Record the absor-
*Note: If the amount of stock solution to be taken from the bance reading.
500 ml volumetric is less than one gram, dilute the concentra-
(5) Repeat step four until all of the standards have been mea-
tion of the solvent. This will decrease your margin of error.
sured. Rinse the cuvette at least two times with TEST
Example: SOLUTION between each standard. Be sure that the out-
0.002% x 50 = 0.1129 grams side of the cuvette is clean and dry before each measure-
0.885% ment.
So: (6) When all of the standards have been measured, graph the
Dilute 10 grams of 0.885% = 190 grams TEST SOLUTION absorbance readings versus the percent concentration.
Draw a line that best fits the points plotted. Ideally, the line
10 x 0.885% = 0.04425%
should run through all of the points plotted (see Figure 1).
200
If it does not, a problem has occurred in either the stan-
Now: dards or a data entry. Check the printout to see that all
0.002% x 50 = 2.26 grams data was entered properly. Look at the graph to see if one
0.04425% of the data points is located off line with the others as in
Figure 2. If all of the points seem to be scattered, there is
Calculate the rest of the standard using the same calculation,
probably something wrong with the stock solution and the
substituting the standard number for 0.002. whole process will need to be redone.

5.4 Making the Standards
Get five, 100 ml volumetric flasks and label them:
1) 0.002% residue
2) 0.004% residue
3) 0.006% residue
4) 0.008% residue
5) 0.010% residue
Weigh or zero the first volumetric labeled 0.002%. Add the
amount of stock solution to the flask (Example: 2.26). Add
TEST SOLUTION until the weight reaches 50 grams not
including the weight of the flask. Cap the flask immediately
and mix thoroughly.
Mix the rest of the standards using the different amounts of
stock solutions calculated.
5.5 Procedure: Measuring the Standards
1) Turn on the spectrophotometer and let the system warm
up.
2) Fill the sample cuvette (fill both cuvettes if your system is a
double beam) with clean TEST SOLUTION. Place the
cuvette(s) into the holder(s).
(3) Go to 241 nm wavelength and zero or record the absor-
(7) Calculate the slope of the line using the following calcula-
tion:
slope = change in concentration
change in absorbance
5.6 Procedure: Sample Analysis
1) Take a GLAD-LOCK bag and add exactly 100 ml of TEST
SOLUTION. To reduce the chance of leaking, keep the
sealing part of the bag as dry as possible when adding the
solvent.
2) Handle the board being tested with gloved hands and
insert it into the bag along with the TEST SOLUTION.
3) Remove as much of the air from the bag as possible then
seal the top of the bag closed. Fold the top of the bag over
twice to reduce the size of the bag and to add to the seal.
4) Hold the folded top of the bag with one hand, and hold the
board in place with the other. Damage to the bag is likely
to occur if the board is allowed to shift around while shak-
ing. Shake the bag containing the board for 10 minutes.
5) At the end of 10 minutes, REMOVE THE BOARD FROM
THE BAG.
6) Again, rinse the sample cuvette at least twice with clean
TEST SOLUTION. Fill the cuvette with a sample of TEST
SOLUTION from the bag. Insert the cuvette into the sample

Page 3 of 5
 IPC-TM-650
Number Subject Date
2.3.27 Cleanliness Test—Residual Rosin 1/95

Revision

Figure 1

Page 4 of 5
 IPC-TM-650
Number Subject Date
2.3.27 Cleanliness Test—Residual Rosin 1/95

Revision

Figure 2

chamber of the spectrophotometer and record the absor- 9) To calculate the residual rosin in micrograms per square
bance reading. inch using the following calculation:
Note: In the case of the boards that have high levels of con- residual rosin micrograms/sq. in =
tamination, the absorbance reading will be off scale. In that ppm rosin X specific gravity of TEST SOL. X ml TEST SOL. in bag
case, add another 100 ml of TEST SOLUTION to the bag and Surface area of board
shake it for a couple of minutes. Repeat step six. If it is still off
scale, add another 100 ml until the absorbance readings are
less than 3.000. Keep track of the amount of TEST SOLU-
TION that is added.
7) Convert the absorbance readings to concentration percent
using the following calculation:

concentration % = slope x absorbance + Y intercept

8) Convert the concentration percent to parts per million

(ppm) using the following calculation:

___% x 1,000,000
100 = ppm

Page 5 of 5
The Institute for Interconnecting and Packaging Electronic Circuits Number
2215 Sanders Road • Northbrook, IL 60062-6135 2.3.27.1

Subject
Rosin Flux Residue Analysis—HPLC Method

Date Revision
1/95
IPC-TM-650 Originating Task Group
TEST METHODS MANUAL New Methods Task Group (5-32f)

1.0 Scope 5.1 Extraction

1.1 This High Performance Liquid Chromatography (HPLC) 5.1.1 Record area of PWB. General rule on surface area is
procedure outlines the analysis of rosin flux residues remain- (length x width x 2)+10% for a populated PWB.
ing on a printed wiring board (PWB) after defluxing. This test
can be used for the evaluation of processes used to clean 5.1.2 Place processed PWB in extraction bag, or equivalent
rosin based soldering fluxes.
5.1.3 Prepare 75/25 (by volume), lPA/H20 solutions for the
Applicable Documents extraction.

IPC-TP-383 ‘‘Organic Surface Contamination - Its identifica-

5.1.4 Add 75-200 mls of IPA/H20 solution to extraction bag,
tion Characterization, Record Effects on Surface Insulation
enough to cover PWB.
Resistance and Conformal Coating Adhesion.’’

1PC-TR-580 ‘‘Cleaning and Cleanliness Test Program Phase 5.1.5 Heat seal bag and place in water bath at 80° ± 5°C for
1 Results.’’ 1 hour (cut vent hole in bag).

3.0 Test Specimens 5.1.6 Dilute (with IPA/H20 solution) or concentrate extract to
get approximately 100 ml of extract per 35 sq inch of PWB
3.1 Printed wiring board (PWB) for extraction area.

4.0 Apparatus and Materials 5.1.7 Extract unprocessed PWB blank, in same manner as
sample.
4.1 HPLC systems with UV detection
5.2 Standard and sample analysis
4.2 Waters C18 Novapak column, or equivalent
5.2.1 Set HPLC instrument conditions as follows:
4.3 Suitable extraction vessel, KAPAKT bag, or equivalent,
Wavelength ................................ 220 & 240 nanometers
to extract PWB
(The two wavelengths are needed to get optimum
response from all constituients. See attached cromato-
4.4 Volumetric Flasks
grams.)
Column temp ......................................................... 60°C
4.5 Acetonitrile, HPLC grade
Mobile phase ............................ Acetonitrile/water 60/40
................................................ 25 millimolar Na2PO4H20
4.6 Deionized water, HPLC grade
Flow rate ............................................ 2 milliliters/minute
Sample size .............................................. 10 microliters
4.7 Rosin Standards: abietic acid, dehydroabietic acid,
(Instrument conditions may be changed to optimize
neoabietic acid (Helix BioTech, 604-270-7468, Aldrich Chemi-
separation)
cal, Alltech Associates)
5.2.2 Prepare standards of known concentration
4.8 2-Propanol (IPA), HPLC grade
5.2.3 Establish retention times and areas of rosin standards
4.9 Sodium phosphate monobasic, NaH2PO4oH20)
5.2.4 Prepare calibration curves for each of the identifiable
4.10 Hot water bath, 80° ± 5°C peaks in the extract chromatogram.

5.0 Procedure 5.2.5 Run extracts obtained in 5.1

Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement. Page 1 of 3
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
 IPC-TM-650
Number Subject Date
2.3.27.1 Rosin Flux Residue Analysis—HPLC Method 1/95

Revision

5.3 Calculation of residue concentration

5.3.1 Concentration of material in solution

(milligrams/liter) = (AxBxC)/(DxE)

A = Area of material peak

B = Concentration of standard (milligrams/liter)
C = Injection volume of standard (microliters)
D = Are of standard peak
E = Injection volume of sample (microliters)

Residual material {(micrograms/inch squared)(ug/in2)} =

((FxG)/H)x1000ug/mg

F = Concentration of material in solution (milligrams/liter)

G = Volume of extract solvent (liter)
H = PWB surface area (square inch)

Chromatogram of IPA/H2O Extract of a PWB at 220 nm

Solvent System

150

aufs

100
Abietic

50 Neoabietic
Dehydroabietic

0 2 4 6 8 10 12 14
Minutes IPC-2.3.27.1-001

Figure 1

Page 2 of 3
 IPC-TM-650
Number Subject Date
2.3.27.1 Rosin Flux Residue Analysis—HPLC Method 1/95

Revision

Chromatogram of IPA/H2O Extract of a PWB at 240 nm

Abietic

150

aufs
Neoabietic
100

Solvent System
50

0 2 4 6 8 10 12 14
Minutes IPC-2.3.27.1-002

Figure 2

Page 3 of 3
The Institute for Interconnecting and Packaging Electronic Circuits Number
2215 Sanders Road • Northbrook, IL 60062-6135 2.3.28
Subject
Ionic Analysis of Circuit Boards Ion
Chromatography Method
Date Revision
1/95
IPC-TM-650 Originating Task Group
TEST METHODS MANUAL New Methods Task Group (5-32f)

1.0 Scope 5.1 Extraction

l.0 This test procedure is designed to measure the level of 5.1.1 Record area of PWB. General rule on surface area is
anionic contaminants on the surface of circuit boards by ion (length x width x 2) + 10% for a populated PWB.
chromatography.
5.1.2 Use clean gloves when handling the samples to be
2.0 Applicable Documents tested, and then place each sample in the extraction bag.

IPC-TP-1043 ‘‘Cleaning and Cleanliness Test Program,

5.1.3 Prepare 75/25 IPA/H20 solutions for the extraction.
Phase Ill, Water Soluble Fluxes, Part 1: B-Z4, lnteractions of
Water Soluble Fluxes with Metal/Substrates. October, 1992.‘‘ 5.1.4 Add 100-250 mls of the extraction solution to the
IPC-TP-1044 ‘‘Cleaning and Cleanliness Test Program, extraction bag (enough to cover the PWB).
Phase III, Water Soluble Fluxes, Part 2: B-36, Comparison to
Phase 1 Rosin Benchmark’’, September 1992. 5.1.5 Heat seal the extraction bag and place in the 80°C
water bath for one hour (cut a vent hole in the bag).
3.0 Test Specimens
5.1.6 Measure solution volume after extraction.
3.1 Printed Wiring Board (PWB) for extraction
5.1.7 Prepare unprocessed PWB as control.
4.0 Apparatus and Material
5.2 Standard and Sample Analysis.
4.1 Dionex 4000i (Ion Chromatograph) or equivalent. The
system consists of a gradient pump and an anion column 5.2.1 Inject solution into Ion Chromatograph (IC) and calcu-
(AS4A-SC or equivelant), and a conductivity detector. A sys- late against known standards.
tem which is operating properly shou]d be capable of 50 ppb
or better. The equipment and chemistry should be set up and 5.2.2 Values from the IC are in the ppb in solution range.
standardized per manufacturers’ instructions.
5.2.3 Standards should be used per mfg. instruction. (Chlo-
ride levels of 100 ppb are recommended).
4.2 Hot Water Bath capable of holding 80°C ±5°C.

5.2.4 A calculation to take into account for surface area and

4.3 Use a clean heat sealable bag, ie. KAPAKT 500 series or
evaporation must be done so as to compare all different sizes
equivalent, with less than 250 ppb extractable contaminants.
of circuit boards.
(Specify cleanliness level or manufacturers’ part number.)
(ppb value from IC/1000) x (final volume/original volume)
ug/cm2 =
4.4 Cleanroom vinyl gloves. (<3ppm of Cl) Surface Area (cm2)

4.5 Hi-purity deionized water 18.3 meg-ohm grade and

chloride levels of less than 50 ppb.

4.6 Hi-purity chemicals for eluent and regenerant

preparation.

4.7 NIST traceable standards

4.8 2-Propanol (IPA), Electronic grade

5.0 Procedure

Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement. Page 1 of 1
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
The Institute for Interconnecting and Packaging Electronic Circuits Number
2215 Sanders Road • Northbrook, IL 60062-6135 2.3.38
Subject
Surface Organic Contaminant Detection Test
(In-House Method)
Date Revision
2/88 A
IPC-TM-650 Originating Task Group
TEST METHODS MANUAL Printed Board Test Methods (7-11d)

1.0 Scope 5.0 Procedure

1.1 This simple and rapid non-destructive test method is for
use in determining if organic, non-ionic contaminants are
present on bare printed wiring board, and completed assem-
bly surfaces in the production area by limited technical per-
sonnel. Although the test fluid is also capable of dissolving
very small amounts of various inorganic compounds, their
presence would generally be masked by the much higher lev-
els of the organic contaminants.
1.2 The test will neither identify the contaminants present
nor separate contaminant mixtures into the individual constitu-
ents (see test method 2.3.39). The present visual limit of
organic contaminant detection by this method is approxi-
mately 10 micrograms/cm2.
2.0 Applicable Documents
IPC-TP-383 ‘‘Organic Surface Contamination—Its Identifica-
tion, Characterization, Removal, Effects on Insulation Resis-
tance and Conformal Coating Adhesion.’’
IPC-TM-650 Test Method 2.3.39, ‘‘Surface Organic Con-
tamination Identification Test (Laboratory Analytical Method.)’’
3.0 Test Specimen
3.1 A bare printed wiring board or completed assembly at
least 50 mm x 75 mm [2″ x 3″] x thickness.
5.1 Preparation
5.1.1 Pre-clean microscope slide by rinsing the slide with
test fluid, drying it as described in 5.2, and establishing that it
is free from residues as described in 5.4.
5.1.2 Hold the test specimen by the edges at an angle
above the pre-cleaned microscope slide. The specimen
should not touch the slide.
5.2 Test
5.2.1 Slowly drip 0.25–0.50 ml. of test fluid onto the test
specimen, allowing it to wash across a small area of the sur-
face of the specimen and drip onto the microscope slide. Do
not allow medicine dropper to touch test specimen. See Fig-
ure 1.
5.2.2 Evaporate the test fluid with a gentle stream of dry, oil-
free air or nitrogen in a well-ventilated fume hood. If the com-
pressed air or nitrogen specified above is not available, a
gentle air stream may be generated using a large rubber
squeeze bulb and glass tube.
5.2.3 Rapid evaporation of the test fluid must be avoided, to
prevent evaporative cooling of the glass slide and subsequent
moisture condensation from the air onto the slide.

4.0 Apparatus & Materials 5.2.4 Application of sufficient heat to evaporate the water
may volatize part or all of the residue and invalidate the
4.1 The test fluid; Spectro or High Pressure Liquid Chroma- results.
tography (HPLC) grade acetonitrile. Other appropriate sol-
vents may be used as agreed upon by user and vendor. 5.2.5 Repeat until 2 ml. of test fluid washings per square
inch of washed specimen surface area have been accumu-
4.2 Microscope slides, 25 mm x 75 mm [1″ x 3″], glass lated on the slide.

4.3 Disposable glass medicine dropper with rubber squeeze 5.3 Control
bulb
5.3.1 Dispense the same quantity of test fluid onto a dupli-
4.4 60 ml. (2 oz.) capacity rubber squeeze bulb fitted with cate pre-cleaned microscope slide and allow to evaporate.
glass medicine dropper tube
5.3.2 Examine the slide as described in 5.4. No residue
4.5 Lint free gloves should be seen.

Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement. Page 1 of 2
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
 IPC-TM-650
Number Subject Date
2.3.38 Surface Organic Contaminant Detection Test (In-House Method) 2/88

Revision
A

Printed Wiring
Assembly on
Bare Board
▼

Residue
▼

Microscope
Slide

IPC-2.3.38-01

Figure 1 Contaminant collection on microscope slide

5.3.3 If residues are seen, the test fluid is not pure enough
to use in this test.
5.3.4 A faint outline of the test fluid may be seen on the
slide. This does not necessarily indicate the presence of con-
tamination.
5.4 Evaluation Hold the slide on the edges and tilt so over-
head incident light is reflected from the surface. The residues
(if present) washed from the test specimen will be readily vis-
ible.
6.0 Notes
6.4 Fisher Scientific Co. straight medicine droppers, catalog
number 13,700, were used to develop this test. Equivalent
droppers or disposable pipettes may be used.
6.5 Fisher Scientific Co. 60 ml. (2 oz.) capacity rubber
squeeze bulbs, catalog number 14–070D (or equivalent), are
suitable for this use when fitted with a straight glass medicine
dropper.
6.6 The actual identification of the contaminant(s) may be
accomplished using IPC Test Method 2.3.39. If identification
is to be performed, the specimen can be transferred to an
MIR plate. See paragraph 5.3.1 of IPC Test Method 2.3.39.

6.1 Test fluid from Fisher Scientific Co. High Pressure Liquid
Chromatography (HPLC) grade acetonitrile was used to
develop this test method. Equivalent material from other sup-
pliers may be used, provided no residue remains after evapo-
ration as described in this test method.

6.2 The American Conference of Governmental and Indus-

trial Hygienists has adopted a 40 ppm (v/v) Threshold Limit
Value (TLV) for acetonitrile. It is recommended that the appli-
cation and evaporation of test fluid be carried out in a well-
ventilated fume hood. Rubber gloves and safety glasses
should be provided for the person(s) running the test.

6.3 Fisher Scientific Co. plain glass microscope slides (1″ x

3″), catalog number 12–549, were used to develop this test.
Equivalent slides may be used for testing.

Page 2 of 2
The Institute for Interconnecting and Packaging Electronic Circuits Number
2215 Sanders Road • Northbrook, IL 60062-6135 2.3.39
Subject
Surface Organic Contaminant Identification Test
(Infrared Analytical Method)
Date Revision
2/88 A
IPC-TM-650 Originating Task Group
TEST METHODS MANUAL Printed Board Test Methods (7-11d)

1.0 Scope 5.2 Obtain the contaminated microscope slide specimen

1.1 This infrared spectrophotometric analysis test method is
for use in identifying the nature of non-ionic organic contami-
nants present on printed wiring board and assembly surfaces
by use of the Multiple Internal Reflectance (MIR) Method, once
their presence has been established by the solvent extraction
procedure in IPC-TM-650, Test Method 2.3.38. This test
should be performed only by an experienced spectroscopist.
2.0 Applicable Documents
prepared in Test Method 2.3.38.
5.3 Test Hold the contaminated microscope slide by the
edges at an angle above the clean MIR plate. The specimen
should not touch the plate.
5.3.1 Transfer the residue from the microscope slide as
described below. Slowly drip 0.25–0.50 ml. of test fluid onto
the contaminated microscope slide, allowing it to wash across
the surface and drip onto the MIR plate. (See Figure 1).

IPC-TP-383 ‘‘Organic Surface Contamination—Its Identifica-

tion, Characterization, Removal, Effects on Insulation Resis-
tance and Conformal Coating Adhesion.’’

IPC-TM-650 Test Method 2.3.38, ‘‘Surface Organic Con-

taminant Detection Test (In-House Method).’’

3.0 Test Specimen

3.1 A bare printed wiring board or completed assembly at

least 51 mm x 51 mm [2″ x 2″] x thickness.

4.0 Apparatus & Materials

4.1 An infrared spectrophotometer capable of scanning the

2.5–16 micron range. Figure 1 Contaminant Transfer to MIR Plate

4.2 A multiple internal reflectance (MIR) attachment with a 5.3.2 Evaporate the test fluid with a gentle stream of dry, oil-
KRS–5 or ZnSe plate. (See 6.10). free air or nitrogen in a well-ventilated fume hood.

4.3 The test fluid is Spectro or High Pressure Liquid Chro-
matography (HPLC) grade acetonitrile. Other appropriate sol-
vents may be used as agreed upon by user and vendor.
4.4 Disposable glass medicine dropper with rubber squeeze
bulb or 2 ml. capacity glass syringe.
5.0 Procedure
5.1 Clean an MIR plate by moistening a soft tissue with test
fluid, then gently wiping the surface of the plate until all resi-
dues have been removed. Since the KRS–5 plate scratches
easily, stubborn stains may be removed by ultrasonic cleaning
in acetone.
5.3.3 The same procedures may be followed if test is per-
formed by applying test fluid directly on a bare board or com-
pleted assembly and depositing the washed contaminant
directly onto an MIR plate. (See Fi2gure 2).
5.3.4 Place the MIR plate in the MIR attachment. Generate
an infrared spectrum of the residue according to the instru-
ment manufacturer’s recommended procedure. Remove and
clean the MIR plate.
5.4 Evaporate the same amount of test fluid on clean MIR
plate to obtain a contr3ol specimen.
5.5 Evaluation

Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement. Page 1 of 4
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
 IPC-TM-650
Number Subject Date
2.3.39 Surface Organic Contaminant Identification Test (Infrared 2/88
Analytical Method)
Revision
A

5.5.1 Compare the test and control spectra. 6.1 A Perkin Elmer Model 283 infrared Spectrophotometer
was used to develop this test method. Equivalent instruments
from other manufacturers should be satisfactory if they have
provision for a multiple internal reflectance (MIR) attachment.

6.2 The test fluid Fisher Scientific Co. High Pressure Liquid
Chromatography (HPLC) grade acetonitrile was used to
develop this test method. Equivalent material from other sup-
pliers may be used, provided no residue remains after evapo-
ration as described in this test method. Other solvents may be
required to dissolve specific residues.

6.3 Fisher Scientific Co. straight medicine droppers, catalog

number 13–700, were used to develop this test. Equivalent
droppers or disposable pipettes may be used.

6.4 The American Conference of Governmental and Indus-

Figure 2 Contaminant Collection on MIR Plate
trial Hygienists has adopted a 40 ppm (v/v) Threshold Limit
Value (TLV) for acetonitrile. It is recommended that the appli-
5.5.2 If the spectra are not identical, the test specimen is
cation and evaporation of acetonitrile be carried out in a well-
contaminated.
ventilated fume hood. Rubber gloves and safety glasses
should be provided for person(s) running the test.
5.5.3 The chemical class for the contaminant may be deter-
mined from the major bands in the spectrum in Table 1.
6.5 Modified procedures permit detection and identification
of contaminant residues containing carboxylic acid, carboxylic
Table 1 Organic Contaminant Class Identification
by Major Infrared Spectrum Bands acid salts, ester, hydroxyl, amide, or nitrile (cyano) functional
Major Contaminant Class groups. For example, dicyandiamide (‘‘dicy’’), dehydroabietic
Infrared Spectrum Bands acid, unpolymerized bisphenol-A type epoxy resins, rosin and
Organic Contaminant Needed For Identification long chain amides have also been identified on printed wiring
Class (expressed in microns)
surfaces.
Ether, Aliphatic ....................... 8.8–9.1
Ether, Aryl .............................. 7.8–8.0 6.6 Although the test fluid is also capable of dissolving very
Carboxylic Acid ...................... 3.2–4.1 small amounts of various inorganic compounds, their pres-
5.8–5.9 ence would generally be masked by the much higher levels of
6.9–7.1
10.4–10.9 the organic contaminants.
Carboxylic Acid Salts ............. 6.2–6.4
7.1–7.4 6.7 Rapid evaporation of the acetonitrile must be avoided to
prevent evaporative cooling of the MIR plate and subsequent
Ester ...................................... 5.7–5.8
8.0–8.5 moisture condensation from the air onto the plate. Application
Amide..................................... 2.8–3.3
of sufficient heat to evaporate the water may volatilize part or
5.9–6.5 all of the residue and invalidate the results. The present limit of
Nitrile (cyano)......................... 4.4–4.5 detection of arylalkyl polyether residues by this method is 10
micrograms/cm2.
Alcohol (includes hydroxyl 2.8–3.1
glycols, polyols, etc.) ............. 8.7–9.7
6.8 The maximum organic surface contamination levels that
will still permit reliable end-use operation of printed wiring
5.5.4 See Figures 3 and 4, comparative examples of spec-
assemblies of differing component densities and conductor
trum graphics. line spacings have not been established for the various con-
taminants.
6.0 Notes
6.9 The present limit of detection can be easily extended by

Page 2 of 4
 IPC-TM-650
Number Subject Date
2.3.39 Surface Organic Contaminant Identification Test (Infrared 2/88
Analytical Method)
Revision
A

Figure 3 Typical Spectrum Comparison

an order of magnitude using more sophisticated instrumenta-

tion and computer enhanced spectra. (See Figure 3 and 4).

6.10 The KRS–5 plate is very toxic; it should be handled

only with gloved hands, and should be polished with recom-
mended polishing compound to minimize generation of haz-
ardous dust.

Page 3 of 4
 IPC-TM-650
Number Subject Date
2.3.39 Surface Organic Contaminant Identification Test (Infrared 2/88
Analytical Method)
Revision
A

Figure 4 Typical Spectrum Comparison

Page 4 of 4
The Institute for Interconnecting and Packaging Electronic Circuits Number
2215 Sanders Road • Northbrook, IL 60062-6135 2.6.3.1
Subject
Moisture and Insulation Resistance-Polymeric
Solder Masks and Conformal Coatings
Date Revision
1/96 C
IPC-TM-650 Originating Task Group
TEST METHODS MANUAL Solder Mask Performance Task Group (5-33b)

1.0 Scope This test method is to determine the moisture 5.3 Specimen Preparation
and insulation resistance of applied polymer solder mask, or
conformal coatings under two separate prescribed conditions 5.3.1 Positive, permanent and non-contaminating identifica-
of temperature and humidity. One is for Class T and the other tion of test specimen is of paramount importance.
Class H. The electrical measurement methods are different for
Class T and Class H. Raw material qualification testing is per- 5.3.2 Visually inspect the test specimens for any obvious
formed on designated comb patterns. Production quality con- defects, as described in IPC-A-600. If there is any doubt
formance testing is performed on a standard ‘‘Y’’ pattern. about the overall quality of any test specimen, the test speci-
men should be discarded.
2.0 Applicable Documents
5.3.3 One uncoated specimen subjected to the same pro-
J-STD-004 Requirements for Soldering Fluxes
cessing (except coating) as the coated specimens shall be
3.0 Test Specimens supplied with each set of coated samples for testing as a
control.
Applicable comb pattern on IPC-B-25A

‘‘Y’’ pattern with 25 mil lines/25 mil spacing or minimum
spacing on the production board, whichever is smaller.
4.0 Apparatus
4.1 A clean test chamber capable of programming and
recording an environment of 25 ±2°C(77 ±4°F) to at least 65
±2°C (149 ±4°F) and 90% to 98% relative humidity minimum.
4.2 A power supply capable of producing a standing bias
potential of 100 VDC with a tolerance of ±10%.
5.4 Electrical Connections
5.4.1 For qualification specimens, solder a single strand
Teflon insulated wire, using the flux specified in 4.4, to each
pad of the appropriate comb pattern. These wires will be used
to connect each pad of the designated comb pattern to polar-
ization and insulation resistance testing. When soldering the
wires onto the pads care should be taken to insure that the
flux does not splatter onto the combs. A simple off-contact
shield fixture should be used to protect the test patterns from
flux spitting during soldering.

4.3 A resistance meter capable of reading high resistance NOTE: AN ALTERNATE METHOD IS TO USE GOLD PLATED
(1012 ohms or greater), with a test voltage of 100VDC. ALLIGATOR CLIPS.

4.4 Flux Water white rosin Type Symbol A & B of J-STD-
004 (rosin with percent halide less than 0.5%).
4.5 Drying oven capable of maintaining at least 120°C.
5.0 Test
5.1 Ambient Conditions Class
−5°C and 40% - 50% RH.
5.4.2 For quality conformance specimens, solder single
strand Teflon insulated wire in each of the connection points
of the ‘‘Y’’ pattern specimens. These wires will be used to
connect the ‘‘Y’’ patterns to polarization and insulation resis-
tance testing.
5.5 Soldering Flux Removal
T and Class H 25 +2,
5.5.1 The flux shall not be removed.

5.2 Test Conditions NOTE: IF FLUX HAS CONTAMINATED THE COMB PAT-
TERN ON THE CONTROL THE SAMPLE SHALL BE DIS-
5.2.1 Class T 65 ±2°C, 90 ±3% RH, NO BIAS, STATIC, 24 CARDED AND A NEW ONE USED. IT CANNOT BE CLEANED
Hours BECAUSE IT WILL NOT REPRESENT THE CLEANING PRO-
CESS THAT WAS USED PRIOR TO SOLDER MASK APPLI-
5.2.2 Class H 25 - 65 ±2°C, 90 −5 +3% RH, 50 VDC BIAS, CATION.
CYCLING, 62⁄3 days

Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement. Page 1 of 4
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
 IPC-TM-650
Number Subject Date
2.6.3.1 Moisture and Insulation Resistance-Polymeric Solder Masks and 1/96
Conformal Coatings
Revision
C

5.6 Specimen Handling For the remainder of the test, the

2– B 4–
surface of the test specimens either uncoated or coated either
with solder mask or conformal coating, depending on which is
under test, should not be handled or exposed to any other
contaminating influence.

5.7 Procedure

5.7.1 Condition specimens at 50 ±2°C (122 ±4°F) with no

added humidity, for a period of 24 hours.

5.7.2 Class H

5.7.2.1 Allow specimens to cool, measure and record the 1+ 3+ 5+

initial insulation resistance measurements at ambient labora-
tory conditions. Apply 100 VDC on the specimen’s test points
as specified in 5.7.2.3 with the resistance meter and take the
reading after 1 minute. See note 6.1.

5.7.2.2 Place specimens in a chamber, in a vertical position

and under a condensation drip shield. Connect the DC volt-
age source to the specimen test points as indicated in para- Figure 1
graph 5.7.2.3. Each chamber load shall contain at least one
uncoated board that is representative of the cleaning process
used prior to solder mask application for each solder mask A –
tested.

5.7.2.3 The test points for qualification tests are 1 to 2, 2 to

3, 3 to 4 and 4 to 5 on a 5 terminal comb pattern. The test
points for a 2 terminal comb pattern are at each pair of termi-
nals. For the ‘‘Y’’ pattern, test points are at all connection
points on the pattern.

On a five terminal comb, test points 1,3 and 5 are connected

to the positive terminal and test points 2 and 4 are connected
to the negative terminal of the resistance meter. One of the
test points of a two terminal comb is connected to the nega-
tive terminal and the other test point to the positive. One side
of the ‘‘Y’’ pattern should be connected to the negative termi-
nal and the other side to the positive.
+
5.7.2.4 Close chamber door and apply a 50 VDC bias to all Figure 2
combs or ‘‘Y’’ patterns tested.
a) Start test at 25°C and raise temperature to 65°C over a
5.7.2.5 Expose test specimens to 20 cycles of temperature time span of 1.75 ±0.75 hours
and humidity. Polarizing voltage shall be maintained through-
b) Maintain temperature at 65°C for 3 +0.5-0 hours
out the entire 20 cycle period. Humidity shall be maintained at
c) Lower temperature from 65 to 25°C over 1.75 ±0.5
85% minimum through the cycles except that when going to
hours
low temperature, step (c), the humidity may drop to 80% mini-
mum. NOTE: There shall be no delay between cycles.

One cycle is as follows:

Page 2 of 4
 IPC-TM-650
Number Subject Date
2.6.3.1 Moisture and Insulation Resistance-Polymeric Solder Masks and 1/96
Conformal Coatings
Revision
C

Insulation resistance shall be read as specified in paragraph

COUPON “E” 5.7.2.3. Electrical connections to specimens shall be made so
.300 that electrical polarization voltage and the test voltage, of the
same polarity are connected to the same terminal.

– + +
E
– .350 TYP 5.8.1.2 For qualification testing, measure and record insula-
tion resistance once every 24 hours, between hours 2 and 3
of the high temperature phase of each cycle. These tests are
to be conducted without opening the chamber.

Completion of qualification testing shall be accomplished by

disconnecting the bias voltage; remove the specimens from
the chamber, read and record insulation resistance after one
hour and before two hours at ambient laboratory conditions.

5.8.1.3 For conformance testing with the ‘‘Y’’ pattern, the

Figure 3
5.7.3 Class T
5.7.3.1 Allow specimens to cool. Measure and record the
initial insulation resistance measurements at ambient labora-
tory conditions. Apply 100 VDC voltage on the specimen’s
test points as specified in 5.7.3.2. See Note 6.1.
5.7.3.2 The test points for qualification tests are at each pair
of terminals.. One of the test points is connected to the nega-
tive terminal and the other to the positive terminal.
measurements (as specified in paragraph 5.7.2.3) must be
taken after disconnecting the bias voltage, removal of the
specimens from the chamber and after 1 hour and before 2
hours stabilization at ambient laboratory conditions. See note
6.2.
5.8.2 Class T
5.8.2.1 Connect resistance meter read and record insula-
tion resistance. Apply 100 VDC on the specimen’s test points
as specified in 5.7.3.2 with the resistance meter and take the
reading after 1 minute.
5.9 Evaluation

5.7.3.3 Place specimens in a chamber in a vertical position,

under a condensation drip shield. Connect the DC voltage
source to the specimen test points as indicated in paragraph
5.7.3.2 Each chamber load shall contain at least one
uncoated board that is representative of the cleaning process
used prior to solder mask application for each solder mask
tested.
5.7.3.4 Close chamber door and bring chamber to 65°C
and 90% RH.
5.7.3.5 Allow specimens to stabilize at conditions for 24
hours.
5.9.1 Class H
5.9.1.1 Each test specimen shall be evaluated for insulation
resistance quality following and/or during the stated condi-
tions Although several insulation resistance readings are taken
during the test only the final readings in the chamber and the
reading taken outside the chamber shall be used to determine
pass/fail criteria. (Other readings are optional and may be
used for diagnostic information or aborting the test).
5.9.1.2 After completion of all electrical testing, the test
specimens shall be examined for mealing, blisters, delamina-
tion or other forms of degradation following 24 hour stabiliza-
tion at ambient laboratory conditions. See note 6.2.

5.8 Measurement 5.9.2 Class T

5.8.1 Class H 5.9.2.1 All insulation resistance readings shall be averaged

and shall be greater than the minimum listed in the relevant
5.8.1 Disconnect 100 VDC polarizing voltage source before specification. No individual insulation resistance value may be
taking any insulation resistance measurement. less than 0.1 x IRmin Two measurements may be excluded

Page 3 of 4
 IPC-TM-650
Number Subject Date
2.6.3.1 Moisture and Insulation Resistance-Polymeric Solder Masks and 1/96
Conformal Coatings
Revision
C

from calculating the average (see Note 6.3) if there is an
assignable cause of low insulation resistance that can be
attributable to the laminate itself or to the process used to
produce the board. Such assignable causes include:
a) Contamination of the insulating surface of the board
such as lint, solder splines, or water droplets from the
conditioning chamber
b) Incompletely etched patterns that decrease the insulat-
ing space between conductors by more than the
amount allowed in the appropriate design requirements
drawing
c) Scratched, cracked or obviously damaged insulation
between conductors.
5.9.2.2 After completion of all electrical testing, the test
specimens shall be examined for mealing, blisters, delamina-
tion or other forms of degradation following 24 hour stabiliza-
tion at ambient laboratory conditions.
6.0 Notes
6.1 Initial wire placement must be maintained to ensure
reproducible results.
6.2 Specimens may be stabilized at ambient conditions
specified, inside the chamber.
6.3 The average insulation resistance (IRavg) is calculated
from:
N

FΣ
IRavg = 10
1
N i
G
log IRi

Where:
N = Number of test points (16 nominal)
IRi = Individual insulation resistance measurements

Page 4 of 4
The Institute for Interconnecting and Packaging Electronic Circuits Number
2215 Sanders Road • Northbrook, IL 60062-6135 2.6.3.3

Subject
Surface Insulation Resistance, Fluxes

Date Revision
1/95 A
IPC-TM-650 Originating Task Group
TEST METHODS MANUAL Flux Specifications Task Group (5-24a)

1.0 Scope This test method is to characterize fluxes by
determining the degradation of electrical insulation resistance
of rigid printed wiring board specimens after exposure to the
specified flux. This test is carried out at high humidity and heat
conditions.
2.0 Applicable Documents
4.2 A power supply capable of producing a standing bias
potential of 45–50 volts DC with a tolerance of ±10%.
4.3 A resistance meter capable of reading high resistance
(1012ohms) with a test voltage of 100 volts or an ammeter
capable of reading 10-10 amps in combination with 100 volts
DC power supply.

IPC-B-24 Surface Insulation Resistance Test Board 4.4 Three 2000 ml beakers
IPC-A-600 Acceptability Guidelines
4.5 Exhaust ventilation hood.
3.0 Test Specimens
4.6 Metal tongs.
3.1 Comb Patterns Use the IPC-B-24 test pattern which
4.7 Soft bristle brush
consists of four comb patterns per coupon. The individual
comb, pictured in Figure 1, has 0.4 mm lines and 0.5 mm
4.8 Deionized or distilled water (2 megohm-cm, minimum
spacing. The test coupon shall be unpreserved bare copper
resistivity recommended).
metallization.
4.9 Drying oven capable of maintaining at least 50°C.
3.2 Laminate The laminate material for this test shall be
FR-4 epoxy-glass. 5.0 Test

4.0 Apparatus
4.1 A clean test chamber capable of programming and
recording an environment of 25 +10/-2°C to at least 85 ±2°C
and 85% ±2% relative humidity. A salt solution and desiccator
may be used to maintain humidity if a tight temperature con-
trol is maintained on the temperature of the chamber.
5.1 Test Conditions All fluxes will be tested at 85 ±2°C,
85±2% relative humidity for 168 hours.
5.2 Specimen Preparation There shall be 3 test coupons
for each liquid flux to be tested in the cleaned state (see Table
1, A). When testing liquid fluxes which are intended to remain
in the uncleaned state, six test coupons are required. Three
uncleaned test coupons shall be wave soldered pattern side
down (Table 1, B) and three shall be wave soldered pattern
side up (Table 1, C).
Solder paste coupons shall be reflowed pattern side up and
either cleaned (Table 1, D) or not cleaned (Table 1, E). In addi-
tion, there shall be at least 2 unprocessed control coupons for
comparison purposes (Table 1, F).

5.2.1 Positive, permanent and non-contaminating identifica-

tion of test specimens is of paramount importance. (For
example, a vibrating scribe.)

5.2.2 Visually inspect the test specimens for any obvious

defects, as described in IPC-A-600. If there is any doubt
about the overall quality of any test specimen, the test speci-
men should be discarded.
Figure 1 Typical ‘‘Comb Pattern’’ (from IPC-B-24)

Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement. Page 1 of 4
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
 IPC-TM-650
Number Subject Date
2.6.3.3 Surface Insulation Resistance, Fluxes 1/95

Revision
A

Table 1 Coupons for SIR Testing 5.3.1.2 Solder Paste Stencil print the solder paste on to
the comb pattern using a 0.2 mm thick stencil (the IPC-A-24
Number of
Sample Group Flux/Solder Clean Coupons
artwork contains the stencil design).
A yes yes 3
5.3.1.2.1 The samples shall be run through a reflow solder-
B yes no 3 ing process using the temperature profile recommended by
C yes no 3 the vendor.
D yes yes 3
E yes no 3 5.3.2 Cleaning of Samples

F no no 2
A = Pattern down/clean
B = Pattern down/no clean
C = Pattern up/no clean
D = Solder paste/reflow/clean
E = Solder paste/reflow/no clean
F = Control (precleaned, unprocessed)
5.2.3 Clean the test coupon with deionized or distilled water
and scrub with a soft bristle brush for a minimum of 30 sec-
onds. Spray rinse thoroughly with deionized or distilled water.
Rinse cleaned area thoroughly with fresh 2-propanol.
An alternative cleaning method is to place the test coupon in
an ionic contamination tester containing 75% 2-propanol,
25% deionized water and process the solution until all ionics
have been removed.
During the remainder of the specimen preparation, handle test
specimens by the edges only, or use non-contaminating rub-
ber gloves.
5.2.4 If boards are to be stored before treatment, place the
boards in Kapak bags or other contamination-free containers
and close bags (do not heat seal). (Kapak bags are available
from Fischer, VWR and other distributors).
5.3 Procedure
5.3.2.1 After exposure to flux and solder, samples to be
tested in an uncleaned state shall be evaluated as in 5.3.3
through 5.4.1.
5.3.2.2 After exposure to flux and solder, samples to be
tested in the cleaned state shall be cleaned using one of the
procedures listed below. The cleaning parameters shall be
reported in the Qualification Test Report (Appendix A).
5.3.2.2.1 The samples to be cleaned shall be cleaned with
an appropriate environmentally safe solvent or aqueous clean-
ing medium. The use of a commercial in-line or batch cleaner
is preferred. If this is not available, the following laboratory
cleaning process shall be followed.
Three samples shall be cleaned (within 30 minutes or less)
after soldering. For solvent or aqueous detergent cleaning,
three 2000 ml beakers each containing 1000 ml of solvent
shall be used such that one beaker serves as the primary
cleaning stage and the other two are used for rinsing pur-
poses. Each test coupon shall be agitated in each beaker for
1 minute. In the case of aqueous detergent, one beaker shall
contain the cleaning agent and the remaining beakers shall
contain deionized water for rinsing purposes. After the clean-
ing procedure is complete, samples are dried for 2 hours at
50°C. Following cleaning, the specimens shall be tested as
outlined in 5.3.3 through 5.4.1.

5.3.3 Preparation of Samples for Chamber Visually

5.3.1 Sample Preparation Flux application and soldering.
5.3.1.1 Liquid Flux or Flux Extract Coat the comb pat-
tern with a thin coating of the liquid flux or flux extract under
test.
5.3.1.1.1 The test coupons shall be exposed to solder by
floating the fluxed comb patterns of the test specimens face
down on the solder pot at 245-260°C for 4 ±1 seconds. Wave
solder of comb patterns face down at 245-260°C and a con-
veyor speed with a contact time of 3 ±1 seconds. For fluxes
to be tested in the uncleaned state, a second set of comb
patterns shall be fluxed and floated pattern up on the solder
pot or passed pattern up over the solder wave.
inspect all combs and discard any combs with bridging of
conductors. Use water white rosin to solder teflon-insulated
wires to the connection points of the specimens. Do not
attempt to remove the flux residues. Connectors may be used
in lieu of soldering wires but are not recommended. In the
event of a dispute, the samples with soldered wires shall be
used as a referee.
5.3.4 Place the specimens in the environmental chamber in
a vertical position such that the air flow is parallel to the direc-
tion of the board in the chamber. Set the chamber tempera-
ture at 85±2°C and humidity at 20% RH and allow the oven
to stabilize at this temperature for 3 hours. Then, slowly ramp
the humidity to 85±2% over a minimum 15 minute period.

Page 2 of 4
 IPC-TM-650
Number Subject Date
2.6.3.3 Surface Insulation Resistance, Fluxes 1/95

Revision
A

Allow the specimens to come to equilibrium for at least 1 hour
before applying the bias voltage to begin the test. If a salt
solution and dessicator are used for humidity, specimens shall
be held for 24 hours before beginning the test.
5.3.5 Connect the 45–50v DC voltage source to the speci-
men test points to apply the bias voltage to all specimens.
5.4 Measurements
densation on the cooler oven window can be blown around
the oven as microdroplets which deposit on test specimens
and cause dendritic growth if the spots bridge the distance
between two electrified conductors. Both of these conditions
must be eliminated for proper testing.
6.2 IPC-B-24 test board artwork and electronic data is avail-
able from IPC.

5.4.1 Measurements shall be made with test specimens in

the chamber under the test conditions of temperature and
humidity at 24, 96 and 168 hours. To take these measure-
ments, the 45 - 50v DC bias voltage source must be removed
from the test specimen and a test voltage of -100v DC shall
be applied. (Test voltage polarity is opposite the bias polarity.)

5.5 Evaluation

5.5.1 Each comb pattern on each test specimen shall be

evaluated by the insulation resistance values obtained at 96
and 168 hours. If the control coupon readings are less than
1000 megohms, a new set of test coupons shall be obtained
and the entire test repeated. The reading at 24 hours may fall
below the required value provided that it recovers by 96
hours. Any reason for deleting values (scratches, condensa-
tion, bridged conductors, outlying points, etc., must be
noted).

5.5.2 All specimens shall also be examined under a 10x to

30x microscope using backlighting within 24 hours of com-
pleting the testing. If the coupons are to be held longer, they
shall be placed in Kapak or other noncontaminating container
and stored in a dessicator. All samples must be evaluated
within 7 days. If dendritic growth or corrosion is observed, it
shall be determined if the dendrite spans 25% or more of the
original spacing. This latter condition will constitute a failure. It
should be determined whether dendritic growth is due to con-
densation from the chamber (see paragraph 6.1).

5.5.3 Rejection of results for more than 2 combs for a given

condition shall require the test to be repeated.

6.0 Notes

6.1 If condensation occurs on the test specimens in the

environmental chamber while the samples are under voltage,
dendritic growth will occur. This can be caused by a lack of
sufficient control of the humidification of the oven. Water spot-
ting may also be observed in some ovens where the air flow
in the chamber is from back to front. In this case, water con-

Page 3 of 4
 IPC-TM-650
Number Subject Date
2.6.3.3 Surface Insulation Resistance, Fluxes 1/95

Revision
A

Appendix A
Qualification Test Report

I.D. Number:

Flux Classification: Date of Manufacture:

Original Use by Date:

Manufacturer’s Identification: Requalified Use by Date:

Manufacturer’s Batch Number: Original:

Date Original Qualification Tests Completed: Date Requalification Tests Completed:

Tested By: Pass: _ Tested By: Pass: _

Witnessed By: Fail: _ Witnessed By: Fail: _

Certification Test IPC-TM-650 Method Test Requirement Result Pass/Fail/NA

Copper Mirror 2.3.32

Halides Qualitative

Silver Chromate 2.3.33

Fluoride Spot 2.3.35.1

Halides Quantitative

Chloride, Bromide 2.3.35, 2.3.28

Fluoride 2.3.35.2

Nonvolatile Determination 2.3.34

Total as Chloride

Corrosion 2.6.15

SIR 2.6.3.3 Cleaned

Not Cleaned

Fungus (optional) 2.6.1

Cleaning Procedure for Flux Characterization

Cleaning Material

Cleaning Equipment

Cleaning Process Parameters

Page 4 of 4
The Institute for Interconnecting and Packaging Electronic Circuits Number
2215 Sanders Road • Northbrook, IL 60062-6135 2.6.9.1
Subject
Test to Determine Sensitivity of Electronic
Assemblies to Ultrasonic Energy
Date Revision
1/95
IPC-TM-650 Originating Task Group
TEST METHODS MANUAL Ultrasonic Cleaning Task Group (5-31e)

1.0 Scope lapse of microscopic bubbles or cavities in a liquid, produced

The purpose of this test method is to provide a consistent by introducing high frequency (ultrasonic) sound waves into a
procedure to test the sensitivity of electronic components to liquid. The agitation from countless implosions of these
ultrasonic energy. There has been a reluctance in the elec- bubbles create a highly effective scrubbing of both exposed
tronics industry to use ultrasonic energy for printed board and hidden surfaces of parts immersed in the cleaning
assemblies cleaning because of the possibility of damage to solution.
wire bonds in active, hermetically sealed components or other Degas: The act of removing entrained gas from cleaning fluid.
damage that might cause latent failures. Gas bubbles tend to absorb ultrasonic energy, thereby
decreasing the amount of energy available for cleaning.
Recent work has shown that electronic components have a
low potential for damage from ultrasonics (See 6.1) under
2.0 Applicable Documents
conditions seen in most cleaning processes. In addition, MIL-
STD-2000 Rev. A and J-STD 001 now allow for the use of
2.1 Institute for Interconnecting and Packaging Elec-
ultrasonic cleaning, as does the proposal for IEC TC91 Inter-
tronic Circuits (IPC)
national Standards based on an updated revision of the
J-STD-001. IPC-T-50 Terms and Definitions for Interconnecting and
Packaging Electronic Assemblies
1.1 Definitions
IPC-CH-65 Guidelines for Cleaning of Printed Boards and
Ultrasound: All sound in frequencies above the range of Assemblies
human hearing. For the purpose of ultrasonic cleaning, fre-
quencies between 18-800 kHz are in commercial use. In the 2.2 Joint Industry Standards
lower frequency ranges, fluid cavitation is the primary agitation
J-STD-001 Requirements for Soldered Electrical and Elec-
method. In the higher frequency ranges, microstreaming (i.e.,
tronic Assemblies
fluid pumping) is believed to be the form of mechanical
agitation.
2.3 Military MIL-STD-2000 Rev. A Standard Require-
Frequency: The number of periodic oscillations, vibrations of ments for Soldered Electrical and Electronic Assemblies
waves per unit of time, usually expressed in cycles per sec-
ond. 2.4 Other Publications

Generator: An electronic system which converts the 50 or 60
Hz power line electricity into an ultrasonic frequency drive sig-
nal which powers the transducers in their resonant frequency
range.
Transducers: Convert electrical energy from the generator into
mechanical (vibratory) energy, producing high intensity sound
waves in a liquid and causing cavitation. Transducers are pri-
marily of two types.
Piezoelectric: Piezoelectric ceramics, which change dimen-
sions in the presence of an electric field. Thickness varies in
response to an applied voltage. Conversion efficiency =
70-90%
Magnetostrictive: Made of nickel or its alloys, it changes
length when placed in a magnetic field. Conversion efficiency
= 20-50%
IEC-TC-91 Proposed International Standard (based on
J-STD-001) International Requirements for Soldered Electrical
and Electronic Assemblies Using Surface Mount and Related
Assembly Technologies
3.0 Test Specimens
The board mounted components to be tested should be the
exact type and configuration the tester intends to use in pro-
duction. A statistically valid number of each type and package
style of component of interest should be tested. For example,
if actual production boards are used for testing and only one
of a particular component is contained on the board, then a
statistically valid number of boards will have to be tested. If,
instead of production boards, dummy boards are used, they
should be of the same general size and construction as pro-
duction boards. A minimum of five boards shall be run.

Cavitation: The rapid formation and oscillation or violent col- 4.0 Apparatus

Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement. Page 1 of 5
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
 IPC-TM-650
Number Subject
2.6.9.1 Test to Determine Sensitivity of Electronic Assemblies to
Ultrasonic Energy
Revision
4.1 Tank
Testing shall be done in an ultrasonic tank, preferably in the
equipment to be used in production. Water is to be used as
the ultrasonic transmission testing fluid, regardless of the
cleaning agent to be used in the production process. Water
will degas, transmit ultrasonics, and cavitate more easily than
most new cleaning agents and is, therefore, considered a
‘‘worst case’’ ultrasonic testing fluid. Care must be taken to
maintain water level during testing. Water temperatures
should be maintained at 60°C ±5°C (140°F ±10°F).
It is recommended that testing equipment operate near 40
KHz or higher and have a power output in the range listed in
the chart below. Power is measured as the output from the
generator to the transducers. Note in the chart that the
amount of power necessary is scaled for various tank sizes.
Tank Size liters Power Density
(gallons) watts/liter(watts/gallon)
Magnetostrictive Piezoelectric
19 (5) 66-76 (250-290) 33-38 (125-145)
38 (10) 53-58 (200-220) 26.5-29 (100-110)
95 and greater (25 21-32 (80-120) 10.5-16 (40-60)
and greater)
If power densities or frequencies differing from the
ranges listed above are to be used in production, they
should be used in testing as well, and noted on the
Ultrasonic Test Data Record.
5.0 Procedure and Evaluation
Note: Standard ESD handling methods should be used in
handling and assembly so as not to have ESD damage
misinterpreted as damage by ultrasonic exposure.
5.1 Procedure
5.1.1 Solder components into (onto) a test circuit board.
Perform functional electrical tests on components to be sub-
jected to ultrasonic energy. It is suggested that all compo-
nents go through standard prescreening tests to eliminate
infant mortality. Note any anomalies and ignore any malfunc-
tions in further testing.
5.1.2 Visually inspect the solder joints of SMD leads at
10-15x for conformance with J-STD-001. Document any
observed defects with notes or photos.
5.1.3 Fill the test tank with deionized water. Turn on ultra-
sonics and allow a minimum of 15 minutes for the water to
degas. Evidence of cavitation should be obtained by placing a
Page 2 of 5
Date
1/95
piece of aluminum foil in the water for one minute and inspect-
ing for an erosion pattern (evidence of cavitational activity). If
the surface of the foil is not disrupted, continue to degas until
the foil confirms ultrasonic activity.
Test components in the equipment described above. Boards
should be placed in the tank in the same quantity and orien-
tation as will be the case in production, taking into consider-
ation the size of the test tank in relation to the production unit.
Boards should be positioned perpendicular to the radiating
surface (tank surface where transducers are mounted) and
should not be allowed to rest on the radiating surface (Figure
1).
Subject specimens to ultrasonics for a time period 10 times
longer than the expected exposure anticipated under normal
cleaning conditions or thirty minutes, whichever is longer.
5.1.3 (Optional) Conduct any environmental stressing test(s)
as specified by the reliability requirement of the product line in
concern.
5.2 Evaluation Method
5.2.1 Repeat the functional electrical test in 5.1.1. Any fail-
ures should be analyzed for cause of failure. Any failure,
excluding those noted in 5.1.1 or attributable to a docu-
mented defect, will be considered caused by the ultrasonics.
5.2.2 Repeat the visual inspections as described in 5.1.2.
Any defect which is not assignable to a previously docu-
mented defect will also be considered caused by ultrasonics.
5.2.3 Any component exhibiting no failures or 100% reliabil-
ity after ultrasonic testing will be considered safely resistant to
ultrasonics under the conditions tested. Any component with
less than 100% reliability will be suspect unless subsequent
testing can demonstrate that it is 100% reliable. Unless clas-
sified or proprietary, please report test results to the Ultrasonic
Cleaning Task Group of the IPC for compilation in the
attached list.
Note: It is important that the IPC receives as much data as
possible, whether it be to support previously submitted
data, add new data, or provide conflicting data on cer-
tain components. All information received will be
entered into a database for all IPC members to access.
The database will prove more useful as the volume of
data increases.
6.0 Notes Contact IPC for a list of tested components.
6.1 References
 IPC-TM-650
Number Subject Date
2.6.9.1 Test to Determine Sensitivity of Electronic Assemblies to 1/95
Ultrasonic Energy
Revision

6.1.1 William Vuono and Ayche McClung, ‘‘An Update on

an Assessment of Ultrasonic Cleaning Techniques for Military
Printed Wiring Boards,’’ presented at IPC Fall Meeting, 1990.

6.1.2 B.P. Richards, P. Burton and P.K. Footner, ‘‘Does

Ultrasonic Cleaning of PCBs Cause Component Problems: An
Appraisal,’’ IPC Technical Review, June 1990.

6.1.3 B.P. Richards, P. Burton and P.K. Footner, ‘‘The

Effects of Ultrasonic Cleaning on Device Degradation,‘‘ Circuit
World. Vol 16, No. 3.

6.1.4 B.P. Richards, P. Burton and P.K. Footner, ‘‘The

Effects of Ultrasonic Cleaning on Device Degradation—An
Update,‘‘ Circuit World. Vol 17, No. 4.

6.1.5 B.P. Richards, P. Burton and P.K. Footner, ‘‘The

Effects of Ultrasonic Cleaning on Device Degradation—Quality
Crystal Devices,’’ Circuit World. Vol. 18, No. 4.

6.1.6 B.P. Richards, P.K. Footner, and P. Burton, ‘‘A Study

of the Effect of Ultrasonic Cleaning on Component Quality—
Hybrid Devices,’’ Circuit World. Vol 19, No.1.

6.1.7 Fritz Ehorn, ‘‘Final Report on the Structural Dynamic

Analysis of Selected PWB Components Under the 400 Khz
Ultrasonic Cleaning Environment,’’ MEL Ref. MS7507, March
6, 1991.

6.1.8 William Puskas and Gary Ferrell, ‘‘Process Control

Ultrasonic Cleaning,’’ presented at Nepcon West, 1988.

6.1.9 Kenneth S. Suslick, ‘‘The Chemical Effects of Ultra-

sound,’’ Scientific American, February, 1989

6.1.10 Ismail Kashkoush, Ahmed Busnaina, Frederick Kern,

Jr. and Robert Kunesh, ‘‘Particle Removal Using Ultrasonic
Cleaning,’’ Institute of Environmental Sciences, 1990
Proceedings.

Page 3 of 5
 IPC-TM-650
Number Subject Date
2.6.9.1 Test to Determine Sensitivity of Electronic Assemblies to 1/95
Ultrasonic Energy
Revision

Figure 1

Page 4 of 5
 IPC-TM-650
Number Subject Date
2.6.9.1 Test to Determine Sensitivity of Electronic Assemblies to 1/95
Ultrasonic Energy
Revision

Ultrasonic Test Data Record

Name of tester Date

Company
Address
Phone Fax
Make and model of equipment
Tank size Dimensions (cm cm x cm)
Generator output power Frequency (KHz)
No. of boards tested per trial Substrate
Exposure time
Other stress testing (pre- or post-)
Describe
Component tested No. tested Passed Failed Comments
Type Mfgr Part #

Mail to: IPC Fax to: 847-509-9798

2215 Sanders Road
Northbrook, IL 60062-6135
Attn: Ultrasonic Cleaning Task Group

Page 5 of 5
The Institute for Interconnecting and Packaging Electronic Circuits Number
2215 Sanders Road • Northbrook, IL 60062-6135 2.6.13
Subject
Assessment of Susceptibility to Metallic Dendritic
Growth: Uncoated Printed Wiring
Date Revision
10/85
IPC-TM-650 Originating Task Group
TEST METHODS MANUAL N/A

1.0 Scope This test method will demonstrate a relative

degree to which uncoated printed wiring boards are suscep-
tible to dendritic growth due to the presence of ionic residues
and condensed moisture. This test method is particularly suit-
able for printed wiring board manufacturing process control.
IPC-2613-1

2.0 Applicable Documents

Figure 1
IPC-TR-476 How to Avoid Metallic Growth Problems on
Electronic Hardware 5.1.3 Place the board for viewing on the microscope, so
that the parallel conductors are in view. Provide lighting that
MIL-P-55110 Printed Wiring Boards
will illuminate the test board on top and/or underneath.

3.0 Test Specimens Test pattern is chosen from, but not

5.1.4 Using the eye dropper, place a drop of DI water
restricted to e.g., MIL-P-55110 type ‘‘Y’’ pattern with a pair of
across the conductors that are in view under the microscope,
conductors having typically 15-30 mils separation (See Figure
at least 0.5 inch away from the place where external wires are
1). A pair of parallel conductors on an uncoated production
attached to parallel conductors. Adjust power supply to 15 V
printed wiring board, with spacing between conductors of
and turn the power supply on. Simultaneously start the stop-
approximately 15-30 mils is suitable as well.
watch.

4.0 Equipment/Apparatus
5.1.5 Carefully observe the action using the microscope.
Adjust the power of the microscope so the entire water area
4.1 Power Supply A dc power supply capable of providing
is in view.
a metered 0-20 V dc, and 100 milliamps current.
5.1.6 Bubbles may appear within about 5 seconds. This is
4.2 Microscope 50-100 power microscope and means of
hydrogen evolution-electrolysis of water.
providing direct and/or indirect lighting on specimen.
5.1.7 Depending on PWB ionic cleanliness level and the
4.3 Miscellaneous Items DI water sample (2 oz.) kept in a
characteristics of the PWB surface, there may be a dendritic
plastic bottle, eye dropper, a 1/2 watt-10K ohm current limit-
(tree-like) growth from the negative to positive conductor,
ing resistor and a stop watch.
appearing within a typical (for a given board) but generally very
broad time span of a few seconds to several minutes.
5.0 Procedure

5.1.8 The condition of dendritic growth is much easier to

5.1 Preparation
observe with an artificial light source placed under the test
board. A clear demonstration of the dendritic growth can be
5.1.1 Attach a wire to each of the conductors on the ‘‘Y’’
performed if tap water containing ionic contamination is used
pattern test board, or to corresponding, parallel conductors
in place of DI water (see paragraph 5.1.4).
on a production PWB.

5.1.9 Once the dendritic growth has reached the positively

5.1.2 Connect a 10K resistor in series to the power supply
charged conductor, most action will cease; turn off the stop-
as shown in Figure 1. The resistor will limit the current to 1.5
watch. The elapsed time is a relative measure of susceptibility
milliamp maximum.
of the PWB in question to undergo dendritic growth under
high humidity (condensed moisture) environment. At least ten

Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this Page 1 of 2
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
 IPC-TM-650
Number Subject Date
2.6.13 Assessment of Susceptibility to Metallic Dendritic Growth: 10/85
Uncoated Printed Wiring
Revision

separate measurements are needed to obtain a statistically

meaningful result.

6.0 PWB Process Test/Sampling For testing of lot con-

formity at least ten different PWBs with parallel conductors as
per Section 3 shall be tested.

7.0 Test Interpretation Test for susceptibility to metallic

dendritic growth is a relative measure of localized ionic residue
levels. As such, it does not have direct relationship with abso-
lute PWB reliability measure. The results of this test are found
useful in the PWB process control by testing board-to-board
and lot-to-lot variations.

Page 2 of 2
The Institute for Interconnecting and Packaging Electronic Circuits Number
2215 Sanders Road • Northbrook, IL 60062-6135 2.6.14
Subject
Resistance to Electrochemical Migration, Polymer
Solder Mask
Date Revision
6/95 B
IPC-TM-650 Originating Task Group
TEST METHODS MANUAL Solder Mask Performance Task Group (5-33b)

1.0 Scope This test method is to determine the ability of a 5.1 Test Conditions
polymer solder mask protective coating to withstand an envi- Class H 85 ±2°C 85% RH 168 hours
ronment conducive to causing electrochemical migration. Class T 85 ±2°C 90% RH 500 hours

2.0 Applicable Documents 5.2 Desiccator Preparation Prepare a saturated solution

IPC-TR-476 How to Avoid Metallic Growth Problems on
Electronic Hardware
3.0 Test Specimens
3.1 Designated comb pattern coated with the polymer sol-
der mask coating to be tested for qualification testing.
of distilled water and potassium sulfate (approximately 35g
per 100cc) at 85°C. Pour into desiccator to a level just below
the ceramic plate. Crystals of potassium sulfate should remain
visible in the saturated solution in the chamber at operating
temperature.
5.3 Specimen Preparation

3.2 Standard military ‘‘Y’’ pattern test coupons for coating
conformance testing. The space in the ‘‘Y’’ pattern should be
either 25 mil lines/25 mil spaces or the minimum spacing on
the production board, whichever is smaller.
4.0 Equipment/Apparatus
4.1 Power Supply Capable of supplying 10 ±5% VDC @ 1
amp max.
4.2 Test Chamber Capable of maintaining up to 100± 1°C.
5.3.1 For qualification testing, solder single stranded Teflon
insulated wires to each land of comb patterns. These wires
will be used to connect the lands to outside the chamber bias
voltage while the boards are hermetically sealed in the cham-
ber.
5.3.2 For conformance testing, solder stranded wire in each
of the connecting points of the ‘‘Y’’ pattern specimens. These
wires will be used to connect the patterns to outside the
chamber bias voltage while the boards are hermetically sealed
in the chamber.

4.3 Desiccator or Chamber 10″ diameter minimum, with 5.3.3 Place specimens in the chamber or desiccator in a
openings for connecting wires to pass through while maintain- vertical position, such that they do not touch one another. If
ing a hermetic seal. using a desiccator, seal the wire exit with Dow Corning RTV
or equivalent and place the desiccator in an 85 ±2°C oven.
4.4 Ammeter Capable of accurately reading 1 microamp,
HP 34703A or equivalent. 5.4 Wiring for Standard Board System

4.5 Potassium Sulfate Reagent Grade potassium sulfate. 5.4.1 Connect the combs as shown in the schematic in Fig-
ure 1.
4.6 RTV Dow Corning 732 RTV potting compound or
equivalent. 5.4.1.1 Place appropriate limiting resistors in each line per
4.7.
4.7 Resistor Class H − 10 megohm
Class T − 1 megohm 5.4.1.2 Power the comb with 10 VDC.

4.8 Microscope 30X 5.5 Wiring for Production Board System

5.0 Procedure

Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement. Page 1 of 3
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
 IPC-TM-650
Number Subject Date
2.6.14 Resistance to Electrochemical Migration, Polymer Solder Mask 6/95

Revision
B

5.7.2 Examine board under microscope for electrochemical

per 5.9

5.8 Evaluation Class T

5.8.1 Turn on chamber and allow samples to come to test

conditions.

5.8.3 After the 96 hour stabilization period at test conditions,

the initial insulation resistance measurements shall be made
using 45 to 100 volts DC. Make measurements between ter-
minals 1 and 2, 2 and 3, 3 and 4, and 4 and 5. Measurements
shall be made with the patterns under test conditions. Termi-
Figure 1
nals 2 and 4 shall be at one potential, and terminals 1, 3 and
5 at the opposite potential.
5.5.1 Wire the standard ‘‘Y’’ pattern as shown in the sche-
matic in Figure 2.
5.8.3 Connect the samples to the power supply with the
current limiting resistors in-circuit, and apply 10 VDC for the
duration of the test. The test polarity shall be the same as the
measurement polarity used in 5.8.2.

5.8.4 After 404 hours (500 hours total test time) disconnect
the power supply and repeat the measurements per 5.8.2
with the patterns under test conditions.

5.8.5 The average insulation resistance (IRavg) is calculated

from:
N

IRavg = 10FΣ 1
N i
G
log IRi

Where:
Figure 2
N = Number of test points (16 nominal)
IRi = Individual insulation resistance measurements
5.5.1.1 Place the appropriate limiting resistor to each line
(see 4.7). The average insulation resistance value shall not degrade by
more than a decade as a result of the applied bias, i.e.:
5.5.1.2 Power appropriate ‘‘Y’’ pattern with 10 VDC. IRinitial
IRfinal ≥
10
5.6 Testing Where an assignable cause of low insulation resistance, which
is properly attributable to the laminate itself or to the process
5.6.1 Monitor and record leakage current before chamber used to produce the PWB, can be found, then such a value
conditioning to ensure acceptability of initial sample. can be excluded from calculating the average value provided
that 15 (of the original 16) test points are included in the aver-
5.7 Evaluation Class H age. such assignable causes include:

• Contamination on the insulating surface of the board

5.7.1 Turn on chamber and allow samples to come to test
such as lint, solder splines, or water droplets from the
conditions.
conditioning chamber.

5.7.2 At the end of 168 hours, stop test, allow samples to • Incompletely etched patterns that decrease the insu-
return to ambient conditions and measure resistance. lating space between conductors by more the amount
allowed in the appropriate design requirements draw-
ing.

Page 2 of 3
 IPC-TM-650
Number Subject Date
2.6.14 Resistance to Electrochemical Migration, Polymer Solder Mask 6/95

Revision
B

• Scratched, cracked or obviously damaged insulation

between conductors.

5.9 Visual Examination After completion of the electro-

chemical migration test, the test samples shall be removed
from the test chamber and examined, with backlighting, at
10x magnification.

6.0 Notes

6.1 Protective coatings are helpful in preventing electro-

chemical migration but there is no assurance that the protec-
tion is complete unless the coating is adequately bonded to a
good clean board.

Page 3 of 3
Standard Improvement Form
The purpose of this form is to provide the
Technical Committee of IPC with input
from the industry regarding usage of
the subject standard.
IPC-AC-62A
Individuals or companies are invited to If you can provide input, please complete
submit comments to IPC. All comments this form and return to:
will be collected and dispersed to the IPC
appropriate committee(s). 2215 Sanders Road
Northbrook, IL 60062-6135
Fax 847.509.9798

1. I recommend changes to the following:

Requirement, paragraph number
Test Method number , paragraph number

The referenced paragraph number has proven to be:

Unclear Too Rigid In Error
Other

2. Recommendations for correction:

3. Other suggestions for document improvement:

Submitted by:

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Education and Training

IPC conducts local educational workshops and national conferences to help you better understand emerging
technologies. National conferences have covered Ball Grid Array and Flip Chip/Chip Scale Packaging. Some workshop
topics include:
Printed Wiring Board Fundamentals High Speed Design
Troubleshooting the PWB Manufacturing Process Design for Manufacturability
Choosing the Right Base Material Laminate Design for Assembly
Acceptability of Printed Boards Designers Certification Preparation
New Design Standards
IPC video tapes and CD-ROMs can increase your industry know-how and on the job eff ectiveness.
For more information on programs, contact John Riley
tel 847/509-9700 ext. 308 fax 847/509-9798
e-mail: rilejo@ipc.org http://www.ipc.org
For more information on IPC Video/CD Training, contact Mark Pritchard
tel 505/758-7937 ext. 202 fax 505/758-7938
e-mail: markp@taos.newmex.com
http://www.ipc.org

Training and Certification

IPC-A-610 Training and Certification Program
“The Acceptability of Electronic Assemblies” (ANSI/IPC-A-610) is the most widely used specification for the PWB
assembly industry. An industry consensus Training and Certification program based on the IPC-A-610 is available to
your company.
For more information, contact John Riley
tel 847/509-9700 ext. 308 fax 847/509-9798
e-mail: rilejo@ipc.org http://www.ipc.org/html/610.htm

IPC Printed Circuits Expo

IPC Printed Circuits Expo is the largest trade exhibition in North America devoted to the PWB industry. Over 90
technical presentations make up this superior technical conference.

April 28-30, 1998 March 16-18, 1999

Long Beach, California Long Beach, California

For more information, contact Kim Behr

tel 847/509-9700 ext. 319 fax 847/509-9798
e-mail: behrki@ipc.org http://www.ipc.org

How to Get Involved

The first step is to join IPC. An application for membership can be found on page 74.
Once you become a member, the opportunities to enhance your competitiveness are vast. Join a technical committee
and
learn from our industry’s best while you help develop the standards for our industry. Participate in market research
programs which forecast the future of our industry. Participate in Capitol Hill Day and lobby your Congressmen and
Senators for better industry support. Pick from a wide variety of educational opportunities: workshops, tutorials, and
conferences. More up-to-date details on IPC opportunities can be found on our web page: http:/www.ipc.org.
For information on how to get involved, contact:
Jeanette Ferdman, Membership Manager
tel 847/509-9700 ext. 309 fax 847/509-9798
e-mail: JeanetteFerdman@ipc.org http://www.ipc.org
 A P P L I C AT I O N FOR SITE MEMBERSHIP

Thank you for your decision to join IPC members on the “Intelligent Path to Competitiveness”! IPC Membership is
site specific, which means that IPC member benefits are available to all individuals employed at the site designat-
ed on the other side of this application.
PLEASE CHECK
APPROPRIATE To help IPC serve your member site in the most efficient manner possible, please tell us what your facility does by
CATEGORY choosing the most appropriate member category.

■ Our facility manufactures and sells to other companies, printed wiring boards or other electronic interconnection products on
INDEPENDENT the merchant market.
PRINTED BOARD
MANUFACTURERS WHAT PRODUCTS DO YOU
MAKE FOR SALE?

n One-sided and two-sided rigid printed n Flexible printed boards n Discrete wiring devices
boards n Flat cable n Other interconnections
n Multilayer printed boards n Hybrid circuits

Name of Chief Executive Officer/President___________________________________________________________________

■
Our facility assembles printed wiring boards on a contract basis and/or offers other electronic interconnection products for sale.
INDEPENDENT
PRINTED BOARD
ASSEMBLERS n Turnkey n Through-hole n Consignment
EMSI COMPANIES n SMT n Mixed Technology n BGA
n Chip Scale Technology

Name of Chief Executive Officer/President ________________________ _

■ Our facility purchases, uses and/or manufactures printed wiring boards or other electronic interconnection products for our own
OEM – use in a final product. Also known as original equipment manufacturers (OEM).
MANUFACTURERS
OF ANY END IS YOUR INTEREST IN:
PRODUCT n purchasing/manufacture of printed circuit boards
USING
PCB/PCAS n purchasing/manufacturing printed circuit assemblies
OR CAPTIVE
MANUFACTURERS What is your company’s main product line? __________________________________________________________________
OF PCBS/PCAS

■ Our facility supplies raw materials, machinery, equipment or services used in the manufacture or assembly of electronic inter-
INDUSTRY connection products.
SUPPLIERS What products do you supply?_____________________________________________________________________________

■ We are representatives of a government agency, university, college, technical institute who are directly concerned with design,
GOVERNMENT research, and utilization of electronic interconnection devices. (Must be a non-profit or not-for-profit organization.)
AGENCIES/
ACADEMIC
TECHNICAL
LIAISONS

Please be sure both sides of this application are correctly completed

 A P P L I C AT I O N FOR SITE MEMBERSHIP

Site Information:

Company Name

Street Address

City State Zip Country

Main Phone No. Fax

Primary Contact Name

Title Mail Stop

Phone Fax e-mail

Alternate Contact Name

Title Mail Stop

Phone Fax e-mail

Please check one:

❏ $1,000.00 Annual dues for Primary Site Membership (Twelve months of IPC membership begins from the time the application
and payment are received)

❏ $800.00 Annual dues for Additional Facility Membership: Additional membership for a site within an organization where
another site is considered to be the primary IPC member.

❏ $600.00** Annual dues for an independent PCB/PWA fabricator or independent EMSI provider with annual sales of less than
$1,000,000.00. **Please provide proof of annual sales.

❏ $250.00 Annual dues for Government Agency/University/not-for-profit organization

TMRC Membership ❏ Please send me information on Membership in the Technology Marketing Research Council (TMRC)
AMRC Membership ❏ Please send me information for Membership in the Assembly Marketing Research Council (AMRC)

Payment Information

Enclosed is our check for $

Please bill my credit card: (circle one) MC AMEX VISA DINERS

Card No. Exp date ____________________

Authorized Signature

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Chicago, IL 60678-3491 Northbrook, IL 60062-6135

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PLEASE ATTACH BUSINESS CARD

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Tel: 847 509.9700

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2215 Sanders Road Tel 847.509.9700
Northbrook, Illinois Fax 847.509.9798
60062-6135