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P01181 2014P015 Structural Analysis of Photoresist at Boundary Area in Resist Pattern PDF
P01181 2014P015 Structural Analysis of Photoresist at Boundary Area in Resist Pattern PDF
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Structural analysis of photoresist
at boundary area in resist pattern
It is very important for further miniaturization of semiconductor devices to investigate correlation
between chemical structure of resist and Line Width Roughness (LWR). In this study, a novel
sampling technique and Pyrolysis-GC/MS combined with micro-GPC enable usto analyze
chemical structures of resist pattern in detail.
・The optical intensity was dramatically changed Novel method for the analysis of resist pattern
at boundary area.
Solution①:Establishment of sampling method
・The solvent in which resist-components moderately
The resist pattern at boundary area was analyzed. dissolve is selected.
Samples ・The boundary area (surface) of resist pattern is
collected by soaking in organic solvent for a short time.
Lithographic performance
Polymer PAG Illumination
(70nmL/40nmS)
Solution②:Application of micro-GPC
・GPC Fractions are dropped on sample plate or cup directly.
Large F F
Annular LWR: 7.0 nm
Ecd: 15.5 mJ/cm2
Accordingly it is easy to be applied to IR, Pyrolysis-GC/MS
group
F F
SO3- S (Py-GC/MS) and MALDI-MS measurements.
Dipole LWR: 5.0 nm ・Injection volume: tens of micrograms.
Ecd: 13.5 mJ/cm2
Soaking in
organic solvent Polymer 50