Internal Use Only

North/Latin America http://aic.lgservice.com

Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com

COLOR MONITOR
SERVICE MANUAL
CHASSIS NO. : LM14A
MODEL: 22MP55D
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL62449316 (1311-REV00) Printed in China

 CONTENTS

CONTENTS .............................................................................................. 2

PRECAUTION............................................................................................3

SERVICING PRECAUTIONS.....................................................................4

SPECIFICATIONS......................................................................................6

TIMING CHART .......................................................................................11

ADJUSTMENT .........................................................................................14

BLOCK DIAGRAM...................................................................................18

TROUBLE SHOOTING ............................................................................19

EXPLODED VIEW .................................................................................. 22

SVC. SHEET ...............................................................................................

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
-2- LGE Internal Use Only
 PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT. WARNING

• There are some special components used in LCD monitor that BE CAREFUL ELECTRIC SHOCK !
are important for safety. These parts are marked on the
• If you want to replace with the new backlight (CCFL) or LIPS
schematic diagram and the Exploded View. It is essential
part, must disconnect the AC power because high voltage
that these critical parts should be replaced with the
appears at inverter circuit about 650Vrms.
manufacturer’s specified parts to prevent electric shock, fire or
other hazard.
• Handle with care wires or connectors of the inverter circuit. If
• Do not modify original design without obtaining written the wires are pressed cause short and may burn or take fire.
permission from manufacturer or you will void the original parts
Leakage Current Hot Check Circuit
and labor guarantee.
AC Volt-meter

TAKE CARE DURING HANDLING THE LCD MODULE WITH

Good Earth Ground
BACKLIGHT UNIT. such as WATER PIPE,
To Instrument's CONDUIT etc.
exposed 0.15uF
• Must mount the module using mounting holes arranged in four METALLIC PARTS
corners.
1.5 Kohm/10W
• Do not press on the panel, edge of the frame strongly or electric
shock as this will result in damage to the screen.
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1 Ω
• Do not scratch or press on the panel with any sharp objects,
*Base on Adjustment standard
such as pencil or pen as this may result in damage to the panel.

• Protect the module from the ESD as it may damage the

electronic circuit (C-MOS).

• Make certain that treatment person’s body are grounded

through wrist band.

• Do not leave the module in high temperature and in areas of

high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit within the

module.

• If the surface of panel become dirty, please wipe it off with a

softmaterial. (Cleaning with a dirty or rough cloth may damage
the panel.)

CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
-3- LGE Internal Use Only
 SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or re-connecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) is opropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-4-
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500ºF to 600ºF.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500ºF to 600ºF)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500ºF to 600ºF)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
LGE Internal Use Only
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
-5- LGE Internal Use Only
 SPECIFICATIONS
1. General Specification

No Item Content Remark

1 Customer BRAND
2 User Model Name 22MP55D
3 Sale region Refer to Suffix standard
4 Feature 21.5” Wide LCD MONITOR
5 Chassis Name LM14A
General External SW
Menu, READER , Func., Auto, input/Exit, Power
Scope &Adj.
6
Function OSD,DDC2B,DDC2AB, HDCP, Control Lock,
Original Ratio / Wide, Black level, Super Energy Saving

Power Cord Length : 1.5±0.05 M Refer to Suffix

7 Shape : Wall-out standard and power
Color : Black cord table

Length : 1.5m
Signal Cable Shape : Detachable Type Refer to Suffix
(D-SUB) Color : Black standard
Pin : Triple Row, 15 Pin D-Sub

Length : 1.5m
Shape : Detachable Type Refer to Suffix
DVI
Color : Black standard
8 Cable Pin : Triple Row, 18-Position DVI-D

Audio Length : ,Shape : ,Color: ,Pin Do not Support

TV Length : ,Shape : ,Color: ,Pin Do not Support

Input: AC100~240V 50~60Hz, 19V, 1.3A Refer to Suffix

9 Power
Output: DC 19V 1.3A standard

P/No Specification

10 Applying module list

EAJ62311701 LM215WF3-SLK1

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
-6- LGE Internal Use Only
2. Mechanical specification
No Item Content Remark
Width (W) Length (D) Height (H)
Product Before Packing 56.7cm 18.8cm 44.8cm With stand
1
Dimension 56.7cm 6.2cm 34.4cm Without stand
After Packing 63.5cm 41.1cm 12.4cm
Product Only SET 3.3
2
Weight With BOX 4.9kg
3 20ft 40ft / 40ft HC
Container Individual or Indi. Pallet Indi. Pallet W/Wide
Loading Palletizing (NON EU)
Quantity 918 680 1890/2 1496/16
205 72
4 Stand Type Base detachable
Assy Size (W x D x H) 24.3cm x 18.8cm x 4.3cm Only stand base
Tilt Degree -3°（+3°/-7°）~ +20°（+5°/-0°）

Tilt force 0.8~1.3kgf

Folding Degree None
5 Appearance General Refer to Standard of LG(56)G2-1011

3. Optical Character

No Item Criteria Remark

Viewing Angle Horizontal(R/L) : 178º (Typ.)
1
<CR≥10> Vertical(Top/Bottom) : 178º (Typ.)
2 Luminance(휘도) Average Luminance 200(min), 250 (Typ.) Warm
(cd/m2) (Full white pattern, 0.7V) (6500K)
Average Luminance 150 (min) Medium
(cd/m2) (Full white pattern, 0.7V) (8000K)
Average Luminance 150(min) Cool
(cd/m2) (Full white pattern, 0.7V) (9300K)
Luminance
75%(min),
Uniformity
3 Contrast Ratio(명암 비) 600(MIN), 1000(TYP), DFC->5,000,000:1(Typ.)

4 Response Time Gray to Gray: 14ms(Average),

X: 0.3650 ± 0. Y: 0.3605 ± 0. Luminance(cd/ Contrast Ratio:

Reader1
Paper mo 015 015 m2): 80 ± 20 (60 ~ 100:1)
5
de X: 0.3530 ± 0. Y: 0.3670 ± 0. Luminance(cd/ Contrast Ratio:
Reader2
015 015 m2): 80 ± 20 (60 ~ 100:1)

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
-7- LGE Internal Use Only
4. Engineering Specification

1 Supported Sync. Type Separate Sync., Digital

Analog/ Horizontal 30 ~ 83kHz
2 Operating Frequency
Digital Vertical 56 ~ 75 Hz
Analog/ Max. 1920×1080 @ 60Hz
3 Resolution
Digital Recommend 1920×1080 @ 60Hz

4 Input Voltage Voltage :100 – 240 Vac, 50

5 Inrush Current Cold Start : 50 A Hot : 120 A
6 Sync
Operating Condition Video LED Wattage
(H/V)
22MP55D/HQ:24W(typ) Test condition
23MP55HQ/H/D:26W(typ) 1.1920x1080@60
Activ Hz
On/On white 24MP55D/HQ:30W(typ)
e 2. burst pattern
27MP55HQ:30W(typ)
3. 100~240V
4. After aging
22MP55D/HQ:28W(max) 30min
On Mode 23MP55HQ/H/D:29W(ma
x)
24MP55D/HQ:34W(max)
Activ
On/On white 27MP55HQ:35W(max)
e

측정방법) 제어판
Æ 전원 옵션에서
디스플레이 끄기
Off/On white 와 PC를 절전모
Sleep Mode ≤ 0.3W
On/Off Off Blinki 드로 하기 두가지
(D-SUB , DVI)
Off/Off ng 설정이 있는데,
PC를 절전모드로
하기만 선택하고
측정해야 함.
Off Mode
- - Off ≤ 0.3 W(Typ.)
(Power switch off)
High SES low:10%~20% -Test Condition
Super Energy Saving High/Low/off white
Low SES high:20%~30% (1)
22MP55D/HQ:<20W/H Adjust the cente
23MP55D/H/HQ:<21W/H r luminance to
EPA6.0
24MP55D/HQ:<22W/H 200 cd/㎡
27MP55HQ:<25W/H
7 MTBF 30,000 HRS with 90% Lamp Life : 30,000 Hours(Min)
Confidence level
8 Using Altitude 5,000 m (for Reliability) 3,000m(for FOS)

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
-8- LGE Internal Use Only
 9 Environ 0peratin Temperature 10 °C ~ 35 °C
ment g Humidity 10% ~ 80%
Conditio Storage Temperature -20 °C ~ 60 °C
n Humidity 5% ~ 90% non-condensing
BRIGHTNESS 0 ~ 100
17 Language:
WARM English,
PRESET MEDIUM Germanic,
COOL French, Spanish,
COLOR TEMP
RED Italian, Swedish,
USER GREEN Finnish,
MENU
BLUE Portuguese
(Monitor
ORIGINAL WIDE Brazilian
block)
RATIO ORIGINAL Portuguese,
▶ HIGH / LOW Polish, Russian,
BLACK LEVEL
(BLACK LEVEL enable at HDMI input) Greek, Chinese,
LANGUAGE ▶ ENGLISH Japanese,
Korean, Ukrainian
FACTORY
▶ NO( /YES ) Hindi
RESET
CHANNEL
2~69(AIR) / 1 ~ 125(CABLE)
ADD/DEL CH ADD/DELETE Function Support:
CHANNEL
AUTO CHANNEL ON/OFF No
SELECT AIR/CABLE
OSD FINE TUNE 0 ~ 100
MENU
CONTRAST 0~100
BRIGHTNES
0~100
S Function Support:
ADJUSTMENT
SHARPNESS 0~100 No
COLOR 0~100
MENU TINT 0~100
(AV/TV VOLUME 0~100
block) BASS 0~100
TREBLE 0~100 Function Support:
AUDIO
MUTE ON/OFF No
SOUND
MONO/STEREO
LANGUAGE▶
English/German/French/Esperanto
Italian/Korean…
Function Support:
SETUP IMAGE SIZE ▶ FULL/1:1
No
OSD POSITION
TRANSPAREN
0~100
CY

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
-9- LGE Internal Use Only
5. Applying module Character
No Item Content Remark
Maker LGD
Type TFT
Active Display Area 23.8inches(60.4cm) diagonal
Pixel Pitch [mm] 0.2745 mm x 0.2745 mm
Electrical Interface 2ch-LVDS
Color Depth 6-bit with A-FRC, 16.7M colors
LCD Module Size (Outline) [mm] 543.0(H) x 317.4(V) x 11.2(D) mm (Typ.)
1
Feature
Hard coating(3H), Anti-glare treatment of
Surface Treatment
the front polarizer
Operating Mode Transmissive mode, normally Black
Back light Unit White LED
Typical 14ms
R/T
Max. 25ms
Minimum Normal Maximum
WX 0.283 Cool
White Typ-0.03 Typ+0.03
WY 0.298 (9300K)
WX 0.301 Medium
Typ-0.03 Typ+0.03
WY 0.310 (8000K)
CIE Color White
WX 0.313 Warm
2 Coordinates Typ-0.03 Typ+0.03
WY 0.329 (6500K)
(색 좌표)
RX 0.650
Red
RY 0.338
GX 0.320 Warm
Green Typ-0.03 Typ+0.03
GY 0.613 (6500K)
BX 0.154
Blue
BY 0.061

(1) Standard Measurement Condition

• Ambient Luminance Level : dark ( < 10 lux)
• Ambient Temperature : Normal Temperature(10ºC ~ 25ºC)
• warm-up Time : More than 30 min (at Full White Pattern)
• Input Signal : VESA 1920 X 1080 @ 60 Hz
• Contrast : 70 (But, the contrast is 100 when we check response time)
• Brightness : Max. 100
• Color Temp : CUSTOM
• Clock/Clock Phase : The Best Setting
(2) Another Spec.: Product Specification Standard( LG(55)G1-1034 )
(3) Cosmetic Spec. : LCD Module IIS Spec.

5.1 Display Area

1) Active Display Area of the LCD Monitor Should be within Cabinet’s Bezel.
2) Distance Difference between Active Area and Bezel C
| A-B|<1.0 mm , | C-D|<1.0 mm
A: The Distance from The Left of Active Area to the Bezel Active area
B: The Distance from The Right of Active Area to the Bezel
A
C: The Distance from The Top of Active Area to the Bezel
D: The Distance from The Bottom of Active Area to the Bezel
A A B

Bezel

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
- 10 - LGE Internal Use Only
6. EDID
6.1 22MP55D
No Item Content 16진 Data
1 Manufacturer ID GSM 1E 6D
(Analog) 23076（5A 24）
2 Product ID (DVI) 23077（5A 25）
(HDMI) 23078(5A 26)
3 Year 2013
4 Version 1 01
Analog : 3
5 Revision DVI : 3 03
HDMI:3
6 Serial Number * *
7 Week ** **
8 Model Name 22MP55 --
9 Check Sum **** ****
10 Special Item Need to Input Serial Number

** Protocol : DDC 2AB

6.2 EDID Ver. 1.3 FOR ANALOG

6.3 EDID Ver. 1.3 FOR DVI (128Byte)

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
- 11 - LGE Internal Use Only
 TIMING CHART
(1) Signal(Video & Sync)

V id e o

B
C
S yn c

D E F
A

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
- 12 - LGE Internal Use Only
 (2) H/V Timing

DOT Frequency Total Front Back

CLASSIF Polar Display Sync. Resolut
MODE CLOCK [kHz]/ Period Porch Porch
ICATION ity (A) (C) ion
[MHz] [Hz] (E) (D) (B)
H(Pixels) - 31.468 900 720 18 108 54 720 X
1 28.321
V(Lines) + 70.08 449 400 12 2 35 400
H(Pixels) - 31.469 800 640 16 96 48 640 x
2 25.175
V(Lines) - 59.94 525 480 10 2 33 480
H(Pixels) - 37.5 840 640 16 64 120 640 x
3 31.5
V(Lines) - 75 500 480 1 3 16 480
H(Pixels) + 37.879 1056 800 40 128 88 800 x
4 40.0
V(Lines) + 60.317 628 600 1 4 23 600
H(Pixels) + 46.875 1056 800 16 80 160 800 x
5 49.5
V(Lines) + 75.0 625 600 1 3 21 600
H(Pixels) - 48.363 1344 1024 24 136 160 1024 x
6 65.0
V(Lines) - 60.0 806 768 3 6 29 768
H(Pixels) + 60.023 1312 1024 16 96 176 1024 x
7 78.75
V(Lines) + 75.029 800 768 1 3 28 768
H(Pixels) + 108.0 67.500 1600 1152 64 128 256 1152 x
8
V(Lines) + 75.000 900 864 1 3 32 864
H(Pixels) + 63.981 1688 1280 48 112 248 1280 x
9 108.0
V(Lines) + 60.02 1066 1024 1 3 38 1024
H(Pixels) + 79.976 1688 1280 16 144 248 1280 x
10 135.0
V(Lines) + 75.035 1066 1024 1 3 38 1024
H(Pixels) - 65.290 2240 1680 104 176 280 1680 x
11 146.25
V(Lines) + 59.954 1089 1050 3 6 30 1050

H(Pixels) + 67.50 2200 1920 88 44 148 1920 x

12 148.50
V(Lines) + 60 1125 1080 4 5 36 1080

z D-SUB/DVI DTV Mode is not supported (interlace mode)

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
- 13 - LGE Internal Use Only
 ADJUSTMENT
1. Coverage
Apply to 60.4 cm (23.8 inch) Wide monitor made in Monitor Factory
Gumi Korea) or made in accordance with the standard of Gumi
Factory process.
2. Appointment
2.1 Adjustment must be done as fixed sequence, and adjustment
sequence can be modified after agreement withthe responsible
R&D engineer considering mass-production condition.
2.2 Power : AC 100 - 240 Voltage (Free)
2.3 Input signal:
2.3.1 RGB Input: As Product Standard (Signal ROM : LB800K
Ver1.6)
2.3.2 RJ-45 input : As Product Standard (Ethernet connection
through network from Host PC)
* PC spec for MK(Minikey) Loader (TBD): CPU - Dual core 2.0
GHzD, Memory - 2 GByteD
*PC spec for Host PC (TBD): CPU - Dual core 2.0 GHzD,
Memory - 2 GByteD
2.4 Warm-up Time: Over than 30 minutes
2.5 Adjustment equipment : White balance equipment (CA-110),
Display adjust equipment, VG-813(or VG819), Oscilloscope,
PC (More than 486 computer ) & White balance adjust
program.
3. Adjustment
3.1 Overview
Use factory automation equipment and adjust automatic
movement. But, do via passivity adjust in erroroccurrence.
3.2 Adjustment order
(refer to the Adjustment standard and adjustment command table)
3.2.1 Board Assembly Line
3.2.1.1 15pin D-sub (RGB)
· Connect input signal to 15pin D-sub.
· Check the firmware version & model name. And write the
firmware code to the serial Flash ROM by ISP.
· Ready for adjustment : check whether adjustment command
works normally or not and the operating state of each mode.
· Check the display state of gray color when 256 gray scale
patterns is embodied.
· Read by EEPROM Read Command to check whether initial
value is correct or not.
3.2.1.2 MK( Minikey ) Loading
· Open MK Loader Tool on MK Loader PC.
( * MK Loader PC should be connected Internet)
· Connect input signal to RJ-45 input with LAN cable connected
network devices such as routers.
· Turn on the Monitor set.
· Click the box when the °∞empty port °∞box is changed to “write
mini-key” in MK Loader Tool.
3.2.1.2 RJ-45 input
· Connect input signal to RJ-45 input with LAN cable connected
network devices such as routers.
· Check USB 1.1 Port (Keyboard/ Mouse) : @RJ-45 input
· Check USB 2.0 Port (USB Memory Stick 2port) : @RJ-45 input
· Check Audio (Ear-phone out/ Mic in/ Speaker) : @RJ-45 input,
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 14 -
PC audio volume : MAX
* LAN cable
* Router
* PC: vSpace S/W for N+ ( Ver 4.5.xx.xx ) --- Caution: Ver
4.4.xx.xx for N1742L family
3.2.2 Total Assembly Line
· Ready : Heat-run during5 minutes in the state with signal
· Connect input signal to D-sub.
· Default value before adjustment : Contrast “70” , Brightness
‘100(Max)”
3.2.3 Adjustment of Horizontal/Verticality screen
position, Clock and Clock Phase at each Mode.
· There is no special factory mode adjustment. Writing initial value
of EEPROM in Board Assembly line is adjusting Preset Mode
and Reset mode. (EEPROM is initialized when AC Power is
ON first.)
· If the change of FOS data is needed after M.P, it is possible by
writing Mode Data with EEPROM write command or modifying
the Mode Data in MICOM itself.
3.2.4 Color coordinates adjustment and Luminance
adjustment.
3.2.4.1 Color coordinates adjustment
· Monitor Contrast / Brightness
- Contrast : 70
- Brightness : 100(Max)
· CA-110: Set “channel 9”
· Signal Generator : At cut-off and drive --> 16 step pattern for
ADC (Program No.: 31)
- Output Voltage : 700 mVp-p
- Output Mode : Mode 12 (SXGA 60 Hz)mode Setting.
3.2.4.2.Adjustment : Board Assembly Line
· Select RGB mode
· Input 16 step pattern for ADC (Program No.31 (Mode 12,Pattern
11)). (Video level : 700 mVp-p)
· Adjust by commanding AUTO_COLOR_ADJUST
· Confirm “Success” message in Screen or Check the data of
0xFE, 0xFF address of EEPROM(0XA6) is 0xAA after waiting 5
seconds.
· If there is “FAULT” message or the data of 0xFE, 0XFF address
of EEPROM(0xA6) is not 0xAA, do adjust again.
· If all Adjustment is completed, the values of 6500K, User Color
and 9300K are saved automatically.
· Select RGB mode
· Input 16 step pattern for ADC (Program No.31 (Mode 12,Pattern
11)). (Video level : 700mVp-p)
· Adjust by commanding AUTO_COLOR_ADJUST
· Confirm “Success” message in Screen or Check the data of
0xFE,0xFF address of EEPROM(0xA6) is 0xAA after waiting 5
seconds.
3.2.4.3. Confirm at Total Assembly Line: adjustment
· Check the data of 0xFE, 0xFF address of EEPROM(0xA6) is
0xAA.
· If the data of 0XFE, FF address of EEPROM(0xA6) is not
0xAA, do adjust again by 3.2.4.2.
LGE Internal Use Only
3.2.4.4. Confirm PRESET 6500K Color coordinates and Adjust when there is Process change or Adjustment setting change.
PRESET 9300K Color coordinates .
· Set as Aging mode ON, by commanding AGING_ON/OFF 3.2.5.5. OSD & Adjustment device Confirmation : Confirm
command code. operation mentioned as product spec.
· Select Module that is being used in present production by · Vary Brightness and Contrast and confirm the variation of
commanding MODULE SELECT. ( It is not needed so far. Luminance and display status.
However, it will be needed to apply other modules) · Operate the f-engine function and confirm variation of Luminance.
· Send SYSTEM RESET command to set Module data. · Make sure to do FACTORY RESET after confirmation of OSD
· Input Full White Pattern (Video level : 700 mVp-p) function.
· Set as 9300K by commanding COLOR_MODE_CHANGE
Command code. 3.2.5.6. Confirm the display state by inputting 8 color Bar Pattern &
· Check to meet x = 0.283 ± 0.03, y=0.298 ± 0.03, and confirm. 256 Gray Scale pattern.
· Only if it does not meet, adjust as below steps.
· Adjust to meet x = 0.283 ± 0.01, y=0.298 ± 0.01 in 5 minutes. and 3.2.5.7. DPM operation confirmation : Check if Power LED Color
confirm. and Power Consumption operates as standard.
· Save 9300K Color by commanding COLOR SAVE Command · Measurement Condition : 230 V@ 50 Hz (Analog)
code. · Confirm DPM operation at the state of screen without Video
· Set as 6500K by commanding COLOR_MODE_CHANGE Signal.
Command code.
· Check to meet x = 0.313 ± 0.03, y=0.329 ± 0.03, and confirm. 3.2.5.8. RJ-45 input
· Only if it does not meet, adjust as below steps. · Connect input signal to RJ-45 input with LAN cable connected
· Adjust to meet x = 0.313 ± 0.01, y =0.329 ± 0.01, and confirm. network devices such as routers.
· Save 6500K Color by commanding COLOR SAVE Command · Check USB 1.1 Port (Keyboard/ Mouse) : @RJ-45 input
code. · Check USB 2.0 Port (USB Memory Stick 2port) : @RJ-45 input
· Set as sRGB by commanding COLOR_MODE_CHANGE · Check Audio (Ear-phone out/Mic in/Speaker) : @RJ-45 input, PC
Command code. audio volume : MAX
· Adjust to meet Y = 150 ± 50, and confirm. * LAN cable
· Save sRGB Color by commanding COLOR SAVE Command * Router
code. * PC: vSpace S/W for N+ ( Ver 4.5.xx.xx ) --- Caution: Ver
3.2.4.5. Confirm User color coordinates . 4.4.xx.xx for N1742L family
· Confirm Whether User color is saved same as 6500K.
· After confirming Color coordinates, Must return to 6500K 3.2.5.9. DDC EDID Write
( Set as Aging mode ON, by commanding AGING_ON/OFF
3.2.5 Confirm Operation state. command code. )
3.2.5.1 Operation mode : Confirm whether each appointed mode 1) SUFFIX: xxxxxPN
operate correctly or not. · Connect analog Signal Cable to D-sub wafer.
3.2.5.2 Confirmation of Adjustment condition and operation : · Write EDID DATA to EEPROM(24C08) by using DDC2AB
Confirm whether it meet Auto/Manual equipment Adjustment protocol.
standard or not. · Check whether written EDID data is correct or not.
· Confirm Analog screen state : Confirm screen state at below (refer to Product spec).
mode. --> After writing EDID, send Elapsed Time Clear command.
Appointment mode (RGB input): (Elapsed time should not be displayed, after EDID writing)
640*480 @60Hz (Mode 1), : Confirm periodically (in the first set of new lot, process change)
800*600@75Hz(Mode 5), whether module name and aging time disappeared on the self-
1024*768@60Hz(Mode 8), diagnostics OSD with signal cable disconnected.
1280*1024@60Hz(Mode 12), --> If Elapsed Time Clear command isn°Øt executed, module
SMPTE pattern(Check 0%,5%,95%,100%) name, aging time and TCO word appear on the self-diagnostics
–Mode can be added. OSD.(Module name and aging time should not appear after
writing EDID)
3.2.5.3. Confirm Auto adjustment operation. --> Make sure to do FACTORY RESET at the final process.
· Input Analog 1 Dot on/off & Rectangle Pattern at Mode
12(1280x1024@60 Hz) 3.2.5.10. Shipping condition
· Confirm adjustment operation by changing Clock, Phase, H/V · Contrast : 70
Position. · Power Switch : Off
· Check Clock, Phase by pressing AUTO Key. · Brightness : “100(Max)”
· Confirm first set of new lot by periods · Color Select : Preset ( 6500K )
· Language Select : Refer to product spec.
3.2.5.4 Other quality · OSD Position : Center
· Confirm that each items satisfy under standard condition that was · Power indicator : ON
written product spec. · Flatron f-engine : Normal
· Confirm Applying Module & MICOM Setting --> Confirm with
Service OSD
- Confirm at Service OSD by “Menu + Power key” on .(from
Power off)
- Confirm first set of new lot by periods, and confirm periodically
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 - LGE Internal Use Only
4.Standard of Auto/Manual equipment adjustment

No Category Class(Type) Rule Remark

Safety UL UL60950-1 YES
CSA (cUL) CSA C22.2 No.60950-1-03 YES
1
TUV-GS(TUV-Type) EN60950-1 TUV-Type
SEMKO EN60950-1 No
EMC FCC CLASS B FCC 47 CFR Part 15 Class B YES
2
CE EN55022B, EN55024, EN61000-3-2, 3 YES
X-Ray DHHS DHHS Rule 21 CFR Subchapter J N/A
3
(CRT only) HWC HWC Radiation Emitting Device ACT N/A
Low MPR II MPR 1990:8; MPR 1990::01
4 NO
Radiation
TCO6.0 Emission, Ergonomics, Ecology, Energy
5 TCO YES
saving
Ergonomics ISO9241 (CRT) ISO9241-3, 7, 8 NO
6
ISO13406-2 (LCD) ISO13406-2,ISO9241-307 NO
Etc KC(SAFETY) Electric Supplies Safety Rule
(Korea) (K60950) No

7
KC(EMC) MIC Ordinance 825
MIC Notice 100,Class B, YES
Electric Article Technical Standard Ⅲ
CCC GB4943, GB9254, GB17625.1 YES
8 Etc
(China)

Test Hi-Pot 1500 V ac or 2121Vdc, 1 sec, under 10mA No

9
Earth Continuity 25 A, 1 sec, under 0.1 ohm No
10 EPA 6.0 EnergyStar 6.0 Energy Star Display Version 6.0 Yes

*Check items No. 2, 3, 4, 5 and 7 at RGB input.

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
- 16 - LGE Internal Use Only
5. Pattern for Adjustment
Pattern 0 : FULL BLACK (State of without video signal )
Pattern 1 : FULL WHITE (Don’t display other Character except for White Pattern)
Pattern 3 : FULL WHITE
Pattern 4 : Cross hatch pattern (Horizontal 10Line, Vertcial 8Line) & Rectangle Pattern
Pattern 5 : 1 Dot on, 1 Dot off & Rectangle Pattern
Pattern 6 : Vertical Sync only input (Use signal cable of which Pin #5 is GND)
Pattern 7 : Horizontal Sync only input (Use signal cable of which Pin #5 is GND)
Pattern 8 : State of without Vertical/Horizontal Sync and Video Signal. (Use signal cable of which Pin #5 is GND)
Pattern 9 : 8 Color Bar Pattern + 16 Gray Level Pattern
Pattern 10 : SMPTE Pattern
Pattern 11 : 16 Gray Step Pattern (700mV)

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
- 14 - LGE Internal Use Only
 19V
From Adapter F/B
LED PANEL
(IPS ,FHD)

Only for training and service purposes

LED B/L
V_LED

LVDS

Copyright © 2010 LG Electronics. Inc. All right reserved.

19-to-5V DC/DC
24C02
Embedded
DVI IIC LED Driver

- 15 -
Block
T-Con 5V
DVI_TMDS
TsumoL58jhc2-1
LED
(Mstar) (White)

RGB IIC
BLOCK DIAGRAM (Main)

1Ch LDO

RGB KEY0/1
R/G/B/H/V

SPI
Data/ 6 Tact : Power/MENU/READER/
System 3.3V CLK
FUNCTION/AUTO/INPUT(Exit)
4M
SERIAL
Flash

LGE Internal Use Only

 No power issue

NO
Check JK100 PIN 1 CHECK ADAPTER

Only for training and service purposes

YES

NO
Is IC102
CHECK IC102
PIN2(19V),PIN3(5V)

Copyright © 2010 LG Electronics. Inc. All right reserved.

YES

NO
Is IC103 PIN2(3.3V) CHECK IC103

YES

- 16 -
NO
Is IC100 PIN49
1. NO POWER

`
CHECK CRYSTAL X100
PULSE

CHECK IC100
TROUBLESHOOTING GUIDE

IC102‐#2 IC102‐#3 IC103‐#2 X100

LGE Internal Use Only

 No Raster(OSD is not displayed) 

Only for training and service purposes

Check IC100
PIN9(3.3V) NO CHECK IC103 PIN2(3.3V)
PIN109(1.2V)

YES

Copyright © 2010 LG Electronics. Inc. All right reserved.

IC100 PIN48,49 NO 1.CHECK X100
14.318MHz 2. Trouble in IC100

YES
CHECK IC100
PIN32(H- NO CHECK  IC103

- 17 -
SYNC),PIN33(V-
SYNC)

YES
CHECK  CONNECTION From DSUB TO  
Is IC100 PIN49 NO IC100
PULSE

Trouble in cable or LCD module
2. NO RASTER (OSD IS NOT DISPLAYED) – MAIN

LGE Internal Use Only

 3. TROUBLE IN DPM

CHECK  PC. PC is going to  the DPM 

CHECK H/V SYNC LINE
mode

NO
NO
Check R127 AND R128

YES

YES
IC100 PIN32,33
Trouble in DPM

Trouble in  IC100

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
- 18 - LGE Internal Use Only
 EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts
are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as recommended
in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

910
900
400

550

560
500

540
200
300

330
 LED DRIVE CH
LED DRIVE CH
PCB P/N: EAX65582901_1.2 (LM14A) L103 D107

FB1
33UH BR210

FB4
FB3
FB2
19V_LED
100V C151
215 PANEL BIZ 215 PANEL BIZ C144
R245 R246 1uF 1uF

R188
100K
0 0 25V 50V

R183
100K
1/16W
1%
5VS
C154
33uF
7
100V
Date : 2013.07.24 Q102 D
C152 -55TO+105C

R184
0
1/16W
5%
Q101 Q103 Q104 R165 1uF FB1 JP129
2N7002K Q106 6

R189
100K
2N7002K D 2N7002K D 2N7002K D D 10 G AOD478 50V
L106-*1 R143
DRV 2.2K
0 G G G G S

R155
1M
1/16W
5%
R156
1M
1/16W
5%
R157
1M
1/16W
5%
R158
1M
1/16W
5%
FB2 JP130 5

R153
4.7K
1/16W
5%
C161 1/16W
1/8W
1.2VS 22pF 5%
5% S S S S
no bead 50V
4
JP128

C119 C121 C123 C143 3

1uF

R241
100K
1/16W
5%
R242
100K
1/16W
5%
R243
100K
1/16W
5%
R244
100K
1/16W
5%
0.1uF 0.1uF 0.1uF
25V C200 R161
16V 16V 16V
0.1uF 10 FB3 JP131
SENP 2
16V
3.3VS L106 3.3VS_MAIN
UBW2012-121F C128 FB4 JP132 1

1
1
1
1
1
1
1
1
1
1
22pF
power line bead C117 C118 C120 C122 C124 C125 C126 C127 C129 50V
C116 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF

R164
R166
R167
R168
R169
R172
R175
R178
R179
R180
0.1uF 0.1uF

VFB2
0.1uF 0.1uF

VDT8
VDT4

VFB8
VFB4
VDT2

VFB6
VDT6
0.1uF 16V 16V 16V 16V 16V 16V 16V 12507WR-06L
16V 16V
16V GND P102

OVP
C160
220pF
50V

Check!! Control wafer,LED Color

5VS 3.3VS_MAIN
1.2VS

P100 Control PWR 5V Control PWR 3.3V

SMAW200-06 R106 R109

KEY0

LED_INDICATOR
KEY1
DRV

VDT4
VFB4

VFB8
VDT6

VDT8
VFB6
VDT2

VFB2
L100 0 0

DVI_5V
DVI_DET

DVI_SCL

DVI_SDA
JP104 BLM18PG121SN1D
5VS
1
5VS
JP100 L104

0
0
2 R119 BG1608B121F

R117-*1
R118-*1
2.2

56
R104 R105

56
R114

Touch control
C105 4.7K 4.7K

Touch control
3 0.1uF 4.7K 130718
C104

R111
R113
56
16V READY ESD protection 0.1uF
MMBT3904-(F)

Tact control
Tact control

1/16W R117 1K
1/16W R118 1K
JP103 56->1K
4 Q100 16V
C R112

R116
1K
4.7K
JP101 B 3.3VS_MAIN
5 C110 LED_INDICATOR
KEY0 JP133

R115
0.1uF 3.3VS_MAIN
16V R110
JP102 POWER AUTO INPUT E
6 READY 4.7K
KEY1 LVDS OUT
MENU SES EXIT

20V
20V
20V
20V
C106 C108
68pF 68pF
50V 31
50V

ADUC 20S 02 010L

Touch control

ADUC 20S 02 010L

ADUC 20S 02 010L
ADUC 20S 02 010L
Touch control Y0M-B JP123 30

Multi Option Tact control Y0P-B JP107

29

Tact control Tact control 28

[EP]
DDCD1_DA/GPIO33
DDCD1_CK/GPIO32
GPIO31
GPIO30
GPIO27/SAR5
GPIO26/SAR4
GPIO25/PWM7
GPIO24/PWM6
GPIO23/PWM5
GPIO22/PWM4
SAR3/GPIO_SAR3
SAR2/GPIO_SAR2
SAR1/GPIO_SAR1
SAR0/GPIO_SAR0
GPIO20/RS232_TX1
GPIO21/RS232_RX1
GND_7
VDDP_7
VCTRL/GPIO56
VDDC_2
VDET3
STR3
GND_LED_2
STR2
VDET2
VDET1
STR1
GND_LED_1
STR0
VDET0
AVDD_GDPWR
GDRV

VA100
VA103
VA101
VA102
Y1M-B

READY
READY
JP108
C106-*1 C108-*1
27
130724 0.1uF 0.1uF Y1P-B JP109
READY->APPLY 16V 16V
Y2M-B JP110 26

99
98
97
25

128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
RX1_CN 1 96 GND_BST Y2P-B JP111
DVIC- 24
RX1_CP AVDD_LED C141 0.1uF
DVIC+
2 95 23
THERMAL 16V R146 CLKOUTM-B JP112
RX1_0N 3 94 REXT 51K 22
DVI0- 129 CLKOUTP-B JP113
1/16W
RX1_0P GND_LEDREF Y3M-B 21
4 93 5% JP114
DVI0+ GND
Y3P-B 20
RX1_1N ISNS Close to PIN93 JP115
Multi Option for APW7313(DC/DC) DVI1-
5 92 SENP 19
Y0M-A JP116
RX1_1P 6 91 VFB 18
APW7313 DVI1+ OVP Y0P-A JP117
IC102-*1 L102-*1 R103-*1 R145
C142
0.015uF
50V

APW7313KAITRG[EP]GND
C111-*1 C115-*1 10uH 100 RX1_2N COMP 33K 17
0.01uF 0.1uF
DVI2-
7 90
BS SS 25V 16V 16
1 8 1/10W Y1M-A JP118
APW7313 APW7313 APW7313 RX1_2P NC_17
VIN EN
APW7313 8 89

9
2 7 DVI2+ 15
Y1P-A JP119

THERMAL
LX COMP VDDP_1 LVB0P
3 6
R108-*1 C114-*1 R101-*1 R102-*1 9 88 14
GND FB 3300pF 68K
Y0M-B
4 5 8.2K 15K
50V NC_1 LVB0M Y2M-A JP120 13
APW7313 APW7313 APW7313 APW7313 10 87 Y0P-B
Y2P-A 12
NC_2 LVB1P JP121
11 86 Y1M-B 11
IC100 CLKOUTM-A JP124
NC_3 12 85 LVB1M 10
Y1P-B CLKOUTP-A JP122
NC_4 13 84 LVB2P Y3M-A JP125 9
Y2M-B
TSUML58CHC2-1 Y3P-A JP126 8
NC_5 14 83 LVB2M
Y2P-B 7
130722
NC_6 LVBCKP Improve Inrush
15 82 CLKOUTM-B Q108,R151,R152 APPLY 5VS VCOM-SCL JP134 6
R177 1K->2.7K
NEAR DC JACK 19V to 5V DC/DC 1.2VS NC_7 16 New(TSUMOL58CHC2) 81 LVBCKM C147 1uF->4.7uF VCOM-SDA JP135 5
CLKOUTP-B
JK100 ITLC JP136 4
DS-262HB
NC_8 17 80 LVB3P R329
Y3M-B 0 3
SHIELD_1 AVDDL_DVI LVB3M ZXMP3F30FHTA
4 18 79 Q108 PanelOPT(Non-ITLC)
Y3P-B R151 Q107 2
19V_LED MMBT3904(NXP)
5VS
S
D

GPIO34 GND_6 1K JP127

JP106 1
3 FIX 19 Need to change 78 C C153
C150
GPIO35 VDDP_6 B R176 C147 1uF R191
G

R107 20 77 4.7uF 10V 1000pF

2 SW 100K TSUML58JHC2 22K 10V 1K
R152 50V 10031HR-30
L101 TPS5433 GPIO36 21 76 LVA0P E 0
UBW2012-121F Y0M-A
VIN JP105 IC102 P101
1 GPIO37 LVA0M R162 R177
TPS54339EDDAR[EP]GND 22 75 For two channel Module
Y0P-A
10V

C103
1uF

4.7K 2.7K
C149

C107 4.7uF C158 GND_1 LVA1P READY

68uF C162 25V C
4.7uF 4.7uF VBST SS 23 74 Y1M-A
35V C163 1 8 MODON
25V 25V B Q105
105C 4.7uF VDDP_2 LVA1M MMBT3904(NXP)
25V 25V
24 73 Y1P-A R163
Close to IC VIN EN TPS5433

9
2 7 C115 LVA2P 4.7K E
TPS5433
R120 100 C130 0.047uF BIN0M 25 72

THERMAL
8200pF Y2M-A
C170 25V
25V R171
C109 TPS5433 SW VREG5
0.1uF 3 6 R121 56 C131 0.047uF BIN0P LVA2M
4.7uF 26 71 4.7K

VA104
25V C111 Y2P-A

30V
25V
BLUE 25V READY
0.1uF
5VS 16V GND VFB R122 100 C132 0.047uF GIN0M LVACKP

0
4 5 27 70 CLKOUTM-A

R108
TPS5433
25V
L102 R123 56 C133 0.047uF GIN0P LVACKM

TPS5433
4.7uH GREEN 28 69 CLKOUTP-A
50V
Large thermal PAD on bottom side R124 470 C134 1000pF SOGIN0 29 68 LVA3P
25V Y3M-A
C146
TPS5433 15pF R125 100 C135 0.047uF RIN0M LVA3M
READY READY R101 50V C114
30 67 Y3P-A
25V
100K TPS5433 0.47uF
C159 C100 C101 C102 1% 16V R126 56 C136 0.047uF RIN0P 31 66 GND_5
10uF 10uF 10uF 10uF R103 TPS5433 RED
0
10V 10V 10V 10V HSYNC0 HOLDZ/GPIO11
R127 56 32 65
1/10W HSYNC
TPS5433 TPS5433
R102
18K
4M Serial Flash

33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64

1% 3.3VS_MAIN
XIN
CSZ
SDO
SDI
SCK

NC_9
XOUT

IC101
R170

GND_2
NC_10
NC_11
NC_12
NC_13
NC_14
GND_3
NC_15
NC_16
RESET
GND_4

R182 W25X40CLSNIG
R128 56

VSYNC0
VDDP_3
VDDP_4
GPIO00
VDDC_1
VDDP_5

VSYNC 4.7K 4.7K C157

3.3VS_MAIN READY 0.1uF
CS VCC 16V
SPI_/CS 1 8
WPZ/GPIO10

R173 R190 10K

DO[IO1] HOLD
GPIO01/PWM0
GPIO02/PWM1
GPIO03/PWM2

5V to 3.3V LDO 33 2 7
1.2VS SPI_DO
IC103 R174 R192
3.3VS 33 WP CLK 33
R135
0

R133
0

AZ1117H-3.3 WP_Flash 3 6 SPI_CLK

R137
56
1/16W
1%

L105
MIIC_SCL/GPIO04
MIIC_SDA/GPIO05

BLM18PG121SN1D R193
INPUT OUTPUT X100 GND DI[IO0] 33
3 2

DDCA_CK/RS232_RX0
DDCA_DA/RS232_TX0
1A R181 4 5
5VS R131 R132 SPI_DI
1 4.7K
14.31818MHz
ADJ/GND 56 56 C156
R129 22pF
Large thermal PAD on bottom side R134
C155 C112 READY 50V

VA106
5.6V
10K R130

VA105
5.6V
1uF C113 0.1uF 1M READY
MODON

4.7uF 16V
READY 10V 10K C137 C138
10V 30pF 30pF 3.3VS_MAIN
5VS
SPI_DI

SPI_DO

130724 50V 50V

DSUB_DET
SPI_CLK

SPI_/CS

C140 10uF
WP_24C02
WP_Flash

Main IC EOS protection

10V PanelOPT(ITLC)
R136 C139 V-com:R138,R139,R141,R142
0.1uF R240 R141 R142
10K 4.7K Only used for LGD Panelbiz model
16V 4.7K 4.7K
DSUB_SCL
DSUB_SDA

33

R139
VCOM-SDA
33
VCOM-SCL
R138

R238 When apply LGD panel ,With ITLC pin :

100
ITLC Interlace mode :use R238 & R240
Normal mode: use R239
PanelOPT(ITLC) Other panel :keep R238 R239 R240 Ready

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS MP35,45,55,56,65
DSUB + DVI 2013-07-24
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. SCALER 1 2
 JK202 ESD_HDMI_NXP ESD_HDMI_NXP
DVI INPUT D201-*1 D202-*2
DSB47C-15BS1YN32 RCLAMP0524PA RCLAMP0524PA
10 1 10 1
9 2 9 2
DSUB INPUT 8 3 8 3
7 4 7 4

75
New(DVI)

75
75

ADUC 5S 02 0R5L
5.5V
ADUC 5S 02 0R5L
5.5V
ADUC 5S 02 0R5L
5.5V
JK203 6 5 6 5
DVI42C_24HS1YN4A
(OPT)ESD_HDMI_SEMTECH

VA200
VA201
VA202
R221
D201 10

R205
RCLAMP0524PA

R203
R204
17 9 1 10 1 DVI2-
RED_GND R222
6 9 2 10
GNDR
8 3 DVI2+
GND_2 R223
18 10 2 7 4 10
1 11 6 5 DVI1-
RED R224
RED 10
19 11 3 DVI1+
GREEN_GND
7 GNDG
JP204
DDC_DATA
DSUB_SDA 20 12 4
2 12 DVI_HPD
GREEN (OPT)ESD_HDMI_SEMTECH
D202 R225
GREEN RCLAMP0524PA 10
BLUE_GND 21 13 5 10 1 R226 DVI0- D204
8 9 2 10
GNDB KDS184
JP202 8 3 DVI0+ MMBD301LT1G A2
H_SYNC R228

C213
0.1uF
16V
22 14 6 10 D203 DVI_5V
HSYNC 7 4 C
3 13 6 5 R227 DVIC- A1
BLUE 10 5VS
BLUE JP203 DVIC+
NC 23 15 7 DVI_SCL
9 IC201
V_SYNC M24C02-RMN6T
VSYNC 24 16 8 DVI_SDA
4 14
R235
10K
1/16W
5%

GND_1 3.3VS_MAIN
E0 VCC
1 8
R233 4.7K
R234 4.7K

SYNC_GND R220 E1 WC WP_24C02

10

READY
READY
READY
READY
10K 2 7
JP205
DDC_CLOCK DVI_DET
DSUB_SCL

5.6V READY
20V
20V
20V
20V
5 15 E2 SCL R231 33 DVI_SCL
3 6
DDC_GND DVI_HPD
DSUB_DET R219 10K
VSS SDA R232 33 DVI_SDA
3.3VS_MAIN 4 5

68pF
50V
50V
DVI_5V

20V
20V
20V
20V
20V
VA208
VA209
VA210
VA211
VA213
R215 25 C208

ADUC 20S 02 010L

ADUC 20S 02 010L
ADUC 20S 02 010L
ADUC 20S 02 010L
ADUC 20S 02 010L
C207 68pF
0.1uF

C206
10K

C203 68pF
C205 68pF
16

C202 68pF
C204 68pF
16V
SHILED 50V 50V 50V 50V

VA203
VA204
VA205
VA206
VA207
ADMC 5M 02 200L
ADUC 20S 02 010L
ADUC 20S 02 010L
ADUC 20S 02 010L
ADUC 20S 02 010L

R209 4.7K
R210 4.7K
130718
ESD protection
EAF61530301
->EAF61530101

130620
130724
JIG GND Point addition
METAL Jack Shield addition

M1
MGJ63763402
JP_GND1 JP_GND2 JP_GND3 JP_GND4

Need to Swap shield P/N

for DVI+RGB

MGJ63763401: HDMI+RGB
MGJ63763402: DVI+RGB

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS MP35,45,55,56,65
DSUB + DVI 2013-07-24
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. Interface 2 2