PROBLEM 1.

11

KNOWN: Dimensions and thermal conductivity of a chip. Power dissipated on one surface.

FIND: Temperature drop across the chip.

SCHEMATIC:

ASSUMPTIONS: (1) Steady-state conditions, (2) Constant properties, (3) Uniform heat
dissipation, (4) Negligible heat loss from back and sides, (5) One-dimensional conduction in
chip.

ANALYSIS: All of the electrical power dissipated at the back surface of the chip is
transferred by conduction through the chip. Hence, from Fourier’s law,

ΔT
P = q = kA
t
or

t ⋅P 0.001 m × 4 W
ΔT = =
kW 2 2
150 W/m ⋅ K ( 0.005 m )

ΔT = 1.1 C. <
COMMENTS: For fixed P, the temperature drop across the chip decreases with increasing k
and W, as well as with decreasing t.
 PROBLEM 1.15
KNOWN: Long, 30mm-diameter cylinder with embedded electrical heater; power required
to maintain a specified surface temperature for water and air flows.

FIND: Convection coefficients for the water and air flow convection processes, hw and ha,
respectively.
SCHEMATIC:

ASSUMPTIONS: (1) Flow is cross-wise over cylinder which is very long in the direction
normal to flow.
ANALYSIS: The convection heat rate from the cylinder per unit length of the cylinder has
the form

q′ = h (π D ) ( Ts − T∞ )

and solving for the heat transfer convection coefficient, find

q′
h= .
π D (Ts − T∞ )

Substituting numerical values for the water and air situations:

28 × 103 W/m
Water hw = = 4,570 W/m 2 ⋅ K <

π × 0.030m (90-25 ) C

400 W/m
Air ha = = 65 W/m 2 ⋅ K. <
π × 0.030m (90-25 ) C

COMMENTS: Note that the air velocity is 10 times that of the water flow, yet

hw ≈ 70 × ha.

These values for the convection coefficient are typical for forced convection heat transfer with
liquids and gases. See Table 1.1.
 PROBLEM 1.16

KNOWN: Dimensions of a cartridge heater. Heater power. Convection coefficients in air

and water at a prescribed temperature.
FIND: Heater surface temperatures in water and air.
SCHEMATIC:

ASSUMPTIONS: (1) Steady-state conditions, (2) All of the electrical power is transferred
to the fluid by convection, (3) Negligible heat transfer from ends.

ANALYSIS: With P = qconv, Newton’s law of cooling yields

P=hA (Ts − T∞ ) = hπ DL (Ts − T∞ )

P
Ts = T∞ + .
hπ DL
In water,
2000 W
Ts = 20 C + 2
5000 W / m ⋅ K × π × 0.02 m × 0.200 m

Ts = 20 C + 31.8 C = 51.8 C. <

In air,
2000 W
Ts = 20 C + 2
50 W / m ⋅ K × π × 0.02 m × 0.200 m

Ts = 20 C + 3183 C = 3203 C. <

COMMENTS: (1) Air is much less effective than water as a heat transfer fluid. Hence, the
cartridge temperature is much higher in air, so high, in fact, that the cartridge would melt.

(2) In air, the high cartridge temperature would render radiation significant.
 PROBLEM 1.18
KNOWN: Chip width and maximum allowable temperature. Coolant conditions.
FIND: Maximum allowable chip power for air and liquid coolants.
SCHEMATIC:

ASSUMPTIONS: (1) Steady-state conditions, (2) Negligible heat transfer from sides and
bottom, (3) Chip is at a uniform temperature (isothermal), (4) Negligible heat transfer by
radiation in air.
ANALYSIS: All of the electrical power dissipated in the chip is transferred by convection to
the coolant. Hence,
P=q
and from Newton’s law of cooling,
2
P = hA(T - T∞) = h W (T - T∞).
In air,
2 2
Pmax = 200 W/m ⋅K(0.005 m) (85 - 15) ° C = 0.35 W. <
In the dielectric liquid
2 2
Pmax = 3000 W/m ⋅K(0.005 m) (85-15) ° C = 5.25 W. <
COMMENTS: Relative to liquids, air is a poor heat transfer fluid. Hence, in air the chip can
dissipate far less energy than in the dielectric liquid.
 PROBLEM 1.28
KNOWN: Length, diameter, surface temperature and emissivity of steam line. Temperature
and convection coefficient associated with ambient air. Efficiency and fuel cost for gas fired
furnace.
FIND: (a) Rate of heat loss, (b) Annual cost of heat loss.
SCHEMATIC:

ASSUMPTIONS: (1) Steam line operates continuously throughout year, (2) Net radiation
transfer is between small surface (steam line) and large enclosure (plant walls).
ANALYSIS: (a) From Eqs. (1.3a) and (1.7), the heat loss is

⎢⎣ (
q = qconv + q rad = A ⎡ h ( Ts − T∞ ) + εσ Ts4 − Tsur
4 ⎤
)
⎥⎦

where A = π DL = π ( 0.1m × 25m ) = 7.85m 2 .

Hence,

( )
q = 7.85m2 ⎡10 W/m2 ⋅ K (150 − 25) K + 0.8 × 5.67 × 10−8 W/m2 ⋅ K 4 4234 − 2984 K 4 ⎤
⎢⎣ ⎥⎦

q = 7.85m2 (1, 250 + 1, 095) w/m 2 = (9813 + 8592 ) W = 18, 405 W <
(b) The annual energy loss is

E = qt = 18, 405 W × 3600 s/h × 24h/d × 365 d/y = 5.80 ×1011 J

With a furnace energy consumption of Ef = E/ηf = 6.45 ×1011 J, the annual cost of the loss
is

C = Cg Ef = 0.01 $/MJ × 6.45 ×105MJ = $6450 <

COMMENTS: The heat loss and related costs are unacceptable and should be reduced by
insulating the steam line.
 PROBLEM 1.60
KNOWN: Thickness and thermal conductivity, k, of an oven wall. Temperature and emissivity, ε, of
front surface. Temperature and convection coefficient, h, of air. Temperature of large surroundings.
FIND: (a) Temperature of back surface, (b) Effect of variations in k, h and ε.
SCHEMATIC:

ASSUMPTIONS: (1) Steady-state, (2) One-dimensional conduction, (3) Radiation exchange with large
surroundings.
ANALYSIS: (a) Applying an energy balance, Eq. 1.13, at an instant of time to the front surface and
substituting the appropriate rate equations, Eqs. 1.2, 1.3a and 1.7, find
T −T
k 1 2 = h ( T2 − T∞ ) + εσ T24 − Tsur
L
4 .
( )
Substituting numerical values, find
0.05 m ⎡ W W ⎡ 4 ⎤
−8
400 K ) − (300 K ) ⎤ ⎥ = 200 K .
4
T1 − T2 = ⎢ 20 100 K + 0.8 × 5.67 × 10
⎢ ( ⎦⎥ ⎦
0.7 W/m ⋅ K ⎣ m 2 ⋅ K m2 ⋅ K 4 ⎣

Since T2 = 400 K, it follows that T1 = 600 K. <

(b) Parametric effects may be evaluated by using the IHT First Law Model for a Nonisothermal Plane
Wall. Changes in k strongly influence conditions for k < 20 W/m⋅K, but have a negligible effect for
larger values, as T2 approaches T1 and the heat fluxes approach the corresponding limiting values

10000
600
8000
Heat flux, q''(W/m^2)

6000
Temperature, T2(K)

500
4000

2000
400
0
0 100 200 300 400
Thermal conductivity, k(W/m.K)
300
0 100 200 300 400 Conduction heat flux, q''cond(W/m^2)
Convection heat flux, q''conv(W/m^2)
Thermal conductivity, k(W/m.K) Radiation heat flux, q''rad(W/m^2)
 PROBLEM 2.4
KNOWN: Symmetric shape with prescribed variation in cross-sectional area, temperature
distribution and heat rate.
FIND: Expression for the thermal conductivity, k.
SCHEMATIC:

ASSUMPTIONS: (1) Steady-state conditions, (2) One-dimensional conduction in x-direction, (3)

No internal heat generation.
ANALYSIS: Applying the energy balance, Eq. 1.11a, to the system, it follows that, since
E in = E out ,

q x = Constant ≠ f ( x ).

Using Fourier’s law, Eq. 2.1, with appropriate expressions for Ax and T, yields

dT
q x = −k A x
dx
d
6000W=-k ⋅ (1-x ) m2 ⋅ ⎡300 1 − 2x-x3 ⎤ .
dx ⎣⎢
(
K
⎦⎥ m )
Solving for k and recognizing its units are W/m⋅K,

-6000 20
k= = . <
( )
(1-x ) ⎡⎣⎢300 −2 − 3x 2 ⎤⎦⎥ (1 − x ) ( 2 + 3x 2 )
COMMENTS: (1) At x = 0, k = 10W/m⋅K and k → ∞ as x → 1. (2) Recognize that the 1-D
assumption is an approximation which becomes more inappropriate as the area change with x, and
hence two-dimensional effects, become more pronounced.
 PROBLEM 2.23
KNOWN: Temperature distribution in a one-dimensional wall with prescribed thickness and thermal
conductivity.
FIND: (a) The heat generation rate, q , in the wall, (b) Heat fluxes at the wall faces and relation to
q .
SCHEMATIC:

ASSUMPTIONS: (1) Steady-state conditions, (2) One-dimensional heat flow, (3) Constant
properties.
ANALYSIS: (a) The appropriate form of the heat equation for steady-state, one-dimensional
conditions with constant properties is Eq. 2.15 re-written as
d dT "#
q = -k
! $
dx dx
Substituting the prescribed temperature distribution,
d d " d 2bx = −2bk
q = -k
dx ! dx
4 a + bx 2 9# = − k
$ dx
q = -24-2000 C / m2 9 × 50 W / m ⋅ K = 2.0 × 105 W / m3 .

<
(b) The heat fluxes at the wall faces can be evaluated from Fourier’s law,
dT "
q ′′x 1 x6 = − k
dx #$ x
.

Using the temperature distribution T(x) to evaluate the gradient, find

16
q ′′x x = − k
d
dx
a + bx 2 = −2 kbx.
The fluxes at x = 0 and x = L are then

16
q ′′x 0 = 0 <
q ′′x 1 L6 = −2 kbL = -2 × 50W / m ⋅ K4-2000 C / m2 9 × 0.050m


q ′′x 1 L6 = 10,000 W / m2 . <

COMMENTS: From an overall energy balance on the wall, it follows that, for a unit area,
E in − E out + E g = 0 16 1 6  =0
q ′′x 0 − q ′′x L + qL

q = x
16 16
q ′′ L − q ′′x 0 10,000 W / m2 − 0
= = 2.0 × 105 W / m3.
L 0.050m
 PROBLEM 2.42
KNOWN: Temperature distribution in a spherical shell.
FIND: Whether conditions are steady-state or transient. Manner in which heat flux and heat rate
vary with radius.
SCHEMATIC:

ASSUMPTIONS: (1) One-dimensional conduction in r, (2) Constant properties.

ANALYSIS: From Equation 2.23, the heat equation reduces to
1 ∂ 2∂T  1 ∂T
r2 ∂ r
r

∂r
=
α ∂t 
.

Substituting for T(r),

1 ∂T 1 ∂ 2 C1  
α ∂t
=− 2
r ∂r
r 2 = 0.
r  
Hence, steady-state conditions exist. <
From Equation 2.22, the radial component of the heat flux is
∂T C
q ′′r = − k = −k 1 .
∂r r2

4 9
Hence, q ′′r decreases with increasing r 2 q ′′rα 1/ r 2 . <
At any radial location, the heat rate is

q r = 4πr 2q ′′r = 4πkC1.

Hence, qr is independent of r. <

COMMENTS: The fact that qr is independent of r is consistent with the energy conservation
requirement. If qr is constant, the flux must vary inversely with the area perpendicular to the direction
2
of heat flow. Hence, q ′′r varies inversely with r .
 PROBLEM 1.27

KNOWN: Area, emissivity and temperature of a surface placed in a large, evacuated

chamber of prescribed temperature.
FIND: (a) Rate of surface radiation emission, (b) Net rate of radiation exchange between
surface and chamber walls.
SCHEMATIC:

ASSUMPTIONS: (1) Area of the enclosed surface is much less than that of chamber walls.
ANALYSIS: (a) From Eq. 1.5, the rate at which radiation is emitted by the surface is

q emit = E ⋅ A = ε A σ Ts4

( )
qemit = 0.8 0.5 m 2 5.67 × 10-8 W/m 2 ⋅ K 4 ⎡⎣(150 + 273) K ⎤⎦
4

q emit = 726 W. <

(b) From Eq. 1.7, the net rate at which radiation is transferred from the surface to the chamber
walls is

(
q = ε A σ Ts4 − Tsur
4
)
( ) ⎢⎣
4 4
q = 0.8 0.5 m2 5.67 × 10-8 W/m 2 ⋅ K 4 ⎡( 423K ) - ( 298K ) ⎤
⎥⎦

q = 547 W. <
COMMENTS: The foregoing result gives the net heat loss from the surface which occurs at
the instant the surface is placed in the chamber. The surface would, of course, cool due to this
heat loss and its temperature, as well as the heat loss, would decrease with increasing time.
Steady-state conditions would eventually be achieved when the temperature of the surface
reached that of the surroundings.