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Ap4n2r1mt V1
Ap4n2r1mt V1
Halogen-Free Product
Advanced Power N-CHANNEL ENHANCEMENT MODE
Electronics Corp. POWER MOSFET
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Absolute Maximum Ratings@Tj=25 C(unless otherwise specified)
Symbol Parameter . Rating Units
VDS Drain-Source Voltage 40 V
VGS Gate-Source Voltage +20 V
4
ID@TC=25℃ Drain Current, VGS @ 10V (Silicon Limited) 170 A
4
ID@TC=25℃ Drain Current, VGS @ 10V 100 A
3
ID@TA=25℃ Drain Current, VGS @ 10V 37.5 A
3
ID@TA=70℃ Drain Current, VGS @ 10V 21 A
1
IDM Pulsed Drain Current 300 A
PD@TC=25℃ Total Power Dissipation 104 W
3
PD@TA=25℃ Total Power Dissipation 5 W
5
EAS Single Pulse Avalanche Energy 125 mJ
TSTG Storage Temperature Range -55 to 150 ℃
TJ Operating Junction Temperature Range -55 to 150 ℃
Thermal Data
Symbol Parameter Value Unit
Rthj-c Maximum Thermal Resistance, Junction-case 1.2 ℃/W
3
Rthj-a Maximum Thermal Resistance, Junction-ambient 25 ℃/W
1
201911291
AP4N2R1MT-V1
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Electrical Characteristics@Tj=25 C(unless otherwise specified)
Symbol Parameter Test Conditions Min. Typ. Max. Units
BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=250uA 40 - - V
2
RDS(ON) Static Drain-Source On-Resistance VGS=10V, ID=20A - - 1.6 mΩ
VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 2 - 4 V
gfs Forward Transconductance VDS=5V, ID=20A - 95 - S
IDSS Drain-Source Leakage Current VDS=32V, VGS=0V - - 10 uA
IGSS Gate-Source Leakage VGS=+20V, VDS=0V - - +100 nA
Qg Total Gate Charge ID=20A - 96 154 nC
Qgs Gate-Source Charge VDS=20V - 22 - nC
Qgd Gate-Drain ("Miller") Charge VGS=10V - 22 - nC
td(on) Turn-on Delay Time VDS=20V - 20 - ns
tr Rise Time ID=20A - 53 - ns
td(off) Turn-off Delay Time RG=1.6Ω - 44 - ns
tf Fall Time VGS=10V - 15 - ns
Ciss Input Capacitance VGS=0V - 5660 9056 pF
Coss Output Capacitance VDS=20V - 725 - pF
Crss Reverse Transfer Capacitance f=1.0MHz - 300 - pF
Rg Gate Resistance .
f=1.0MHz - 1.3 2.6 Ω
Source-Drain Diode
Symbol Parameter Test Conditions Min. Typ. Max. Units
IS Source Current ( Body Diode ) - - 100 A
2
VSD Forward On Voltage IS=20A, VGS=0V - - 1.2 V
trr Reverse Recovery Time IS=20A, VGS=0V - 27 - ns
Qrr Reverse Recovery Charge dI/dt=100A/µs - 18 - nC
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
2 o
3.Surface mounted on 1 in copper pad of FR4 board, t <10sec ; 60 C/W at steady state.
4.Package limitation current is 100A .
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5.Starting Tj=25 C , VDD=30V , L=0.1mH , RG=25Ω
2
AP4N2R1MT-V1
320 200
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T C =25 C 10V T C = 150 o C 10V
8.0V 8.0V
7.0V 160 7.0V
240 6.0V 6.0V
ID , Drain Current (A)
160
80
80
40
0 0
0 2 4 6 8 0 1 2 3 4 5
7.5 2.0
I D = 20 A I D =20A
T C =25 C o V G =10V
6.5
1.6
Normalized RDS(ON)
5.5
RDS(ON) (mΩ)
1.2
.
4.5
0.8
3.5
0.4
2.5
1.5
0.0
2 4 6 8 10 -100 -50 0 50 100 150
I D =250uA
1.6
Normalized VGS(th)
10
IS(A)
1.2
T j =150 o C T j =25 o C
0.8
0.4
0.1 0.0
0 0.2 0.4 0.6 0.8 1 1.2 -100 -50 0 50 100 150
3
AP4N2R1MT-V1
f=1.0MHz
12 10000
I D = 20 A
10
V DS =20V
8000
VGS , Gate to Source Voltage (V)
C (pF)
6000
C iss
6
4000
2000
2
C oss
C rss
0 0
0 20 40 60 80 100 120 1 11 21 31 41 51
1000 1
Duty factor=0.5
Normalized Thermal Response (Rthjc)
0.05
ID (A)
.
10
0.02
100us 0.01
P
0.01 Single Pulse t
T
1
1ms Duty factor = t/T
Peak T = P x R +T
T C =25 o C
10ms
Single Pulse DC
0.1 0.001
0.01 0.1 1 10 100 0.00001 0.0001 0.001 0.01 0.1 1
Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance
200 200
V DS =5V
160 160
ID , Drain Current (A)
ID , Drain Current (A)
120 120
Limited by package
80 80
T j =150 o C
40
T j =25 o C
40
o
T j = -55 C
0 0
25 50 75 100 125 150 0 2 4 6 8
o
T C , Case Temperature ( C) V GS , Gate-to-Source Voltage (V)
Fig 11. Drain Current v.s. Case Fig 12. Transfer Characteristics
Temperature
4
AP4N2R1MT-V1
20 120
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T j =25 C
100
16
80
12
60
40
4
V GS =10V 20
0 0
0 20 40 60 80 100 120 0 50 100 150
Fig 13. Typ. Drain-Source on State Fig 14. Total Power Dissipation
Resistance
2
I D =1mA
1.6
Normalized BVDSS
1.2
0.8
.
0.4
0
-100 -50 0 50 100 150
o
T j , Junction Temperature ( C)
5
AP4N2R1MT-V1
MARKING INFORMATION
Part Number
4N2R1
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