6POl
Diagnostics and Experiments on LAPPS
D. Leonhardt, D.P. Murphy, S.G. Walton, R.A. Meger,
R.F. Fernsler and R.E. Pechacek, US. Naval Research
Laboratory, Washington, DC 20375, USA
Diagnostics and Experiments on LAPPS'
D. Leonhardt, D. P. Murphy, S. G. Waltoqt R. A. Meger,
R. F. Fernsler, R. E. Pechacekt
Plasma Physics Division, U.S. Naval Research Laborafory,
Washington,DC 20375-5346
NRL is developing a new plasma processing reactor called the
'Large
- Area Plasma Processing System' with applications to
semiconductor processing and other forms of surface
modification. The system consists of a planar plasma
distribution generated by a magnetically collimated sheet of 2-
5kV, 10 mA/cm* electrons injected into a neutral gas
background. This beam ionization process is both efficient at
plasma production and readily scalable to large (square meters)
area. The use of a beam ionization source largely decouples the
plasma production from the reactor chamber. Ion densities
(oxygen, nitrogen, argon, helium) of up to 5 ~ 1 0 cm-3
' ~ in a
volume of 2 cm x 60 cm x 60 cm have been produced in the
laboratory. Typical operating pressures range from 20-200
mtorr with beam collimating magnetic fields strengths of 10-
300 Gauss. Thus far the system has been operated with a
pulsed (10-2000 ps pulse length, <10 kHz, pulse repetition
frequency) hollow cathode. Temporally resolved
measurements of the plasma sheet using Langmuir probes,
spectrally resolved optical emission, microwave interferometry,
and cyclotron harmonic microwave emission will be presented.
Results of initial processing tests using an oxygen plasma
showing isotropic ashing of a photoresist will be shown.
Progress in the development of a dc hot filament cathode will
be presented along with the status of the 1 mz UHV chamber
for hture processing tests. An overview of the LAPPS process
along with theoretical treatments and issues will also be
presented by co-authors'.
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*Work supported by the Office of Naval Research
tSFA Inc., Landover, MD 20785
R. F. Fernsler, et al., this conference.
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6P02
Generation of High Density Plasma with Large
Volume Using Pulsed Glow Discharge
K. Takaki, D. Kitamura and T. Fujiwara, lwate
University, MoriokaAwate 020-8551, Japan
Generation of High Density Plasma with Large Volume Using
Pulsed Glow Discharge
K. Takaki, D. Kitamura, and T. Fujiwara
Department of Electrical and Electronics Engineering
Iwate University, Ueda 4-3-5
Morioka, Iwate, 020-855 1, Japan
A new technique, Plasma Source Ion Implantation (PSII) for the
surface modification of materials, was proposed by J. R. Conrad
in 1989. Recently, this technique has been studied all over the
world as Plasma Based Ion Implantation (PBII), Plasma
Immersion Ion Implantation (Pm, PI3), IONCLAD (called by
General Motors), PLAD (by Varian). In PBII, it is necessary to
generate high density plasma with large volume. Pulsed glow
discharge is one of the candidates for the ion source plasma
because it can easily generate large volume plasma, although for a
short time. This paper describes the characteristics of high current
pulsed glow discharge generated using a low impedance circuit. A
low inductance capacitor of 1.89 pF was used in this experiment.
The inductance of the device was calculated to be 444 nH from its
geometry. The discharge current was measured using PEARSON
C.T varying a circuit resistance in the range of 1 R and several
tens ohm. The gap voltage and consumed energy were obtained
from a circuit equation and the measured values of discharge
currents and breakdown voltage (i.e. initial charging voltage). The
gas used is dry air. As the results, the pulsed glow discharge with
high current above one hundred ampere was generated for several
microseconds. The current density on the cathode reached to
3.7 Ncm2 for a 2 cm gap at 12 Torr. This current density is one or
two order of magnitude larger than the calculated value of a
normal glow current density for a copper cathode and air. For the
calculation, a formula j ~ A / c m *=] 240*P2 where P is gas
pressure in Torr. When the circuit resistance become larger, the
current density of the pulsed glow discharge is gradually
approaching the value of the normal glow discharge.
265