N11MCS-120 • Nikon

Step-and-Repeat System

Test Reticle Instruction Manual

Test Reticles R2205HA/R2205HB
Parameter Explanation
Version 7.0

NSR/MCSV Series

Nikon Corporation N11MCS-120

Document Version 1.0
November 4, 1994
Version 1.0 i
N11MCS-120 • Nikon

ATTENTION: IMPORTANT NOTICE

Nikon has prepared this manual for use by Nikon personnel and customers as a guide for the
proper operation or maintenance of Nikon equipment and software. The drawings, specifications
and information contained herein are the exclusive property of Nikon. They shall not be used in
whole or part as the basis for manufacture or sale of any equipment or computer programs. Any
copying, use or disclosure of any drawings, specifications or information in this manual must
conform strictly to the licensing agreement between customer and Nikon.

Copyright© 1994, an unpublished work by Nikon Precision Inc.

All rights reserved.

The information in this manual is subject to change without notice. Nikon assumes no
responsibility for any errors that may appear in this manual. Nikon reserves the right to publish
updated versions of this manual or portions hereof, without notice and without obligation to
update, nor to keep current the information contained in this manual.

NIKON MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE

CONTENTS HEREOF AND SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.

Nikon® is a registered trademark of Nikon Corporation.

4/93
N7BR705-501J94h(H)
4229

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N11MCS-120 • Nikon

DOCUMENT REVISION STATUS

PRODUCT: Nikon Step-and-Repeat System, NSR/MCSV Series

DOCUMENT: Test Reticle Instruction Manual, Test Reticles R2205HA/R2205HB Parameter

Explanation, Version 7.0, NSR/MCSV Series

The following describes the revised pages that should be in this document. All documents are
originally issued as Version 1.0. Revisions to selected pages within a document are issued as
Version 1.1, 1.2, and so on. Revisions to an entire document are issued as new Versions
(Version 2.0, 3.0, etc.). As an example, the third revision (0.3) to the second version (2.0) of a
document would be Version 2.3.

Nikon uses the Document Revision Status page to keep track of, and to provide you with, the
most recent or updated version of this document.

REVISION DESCRIPTION
DATE

11/04/94 Version 1.0

Version 1.0 iii

N11MCS-120 • Nikon

SAFETY INFORMATION

In an effort to protect users from personal harm and to protect the system from damage, Nikon
has adopted the use of warnings, CAUTIONS, and NOTES in all training manuals.

• WARNINGS indicate that personal harm is possible if the warning is not heeded.
• CAUTIONS indicate that the system may be damaged if the caution is not heeded.
• NOTES contain additional support information.

The following is a listing of WARNINGS, CAUTIONS, and NOTES that should be observed
throughout NSR system operation. Additional WARNINGS, CAUTIONS, and NOTES appear in
the text of this manual.

Warning – Mercury arc lamps operate under high pressure and emit
ultraviolet (UV)radiation that is dangerous to the eyes and skin. Always follow
rigid safety precautions when working around mercury arc lamps. Ensure the
lamp housings are in place before the lamp is turned ON. Wear suitable eye and
skin protection to protect yourself from ultraviolet radiation and high intensity light.

Warning – Use EXTREME CAUTION when working around any power supply
areas. High voltage exists throughout the system. Observe standard electrical
safety precautions to avoid personal injury or damage to the equipment.

Warning – DO NOT remove any covers or touch any lead wires to avoid
electrical shock.

Warning – Use of controls or adjustments, or performance of procedures other

than those specified herein may result in hazardous radiation exposure.

Warning – Lasers used in Nikon alignment systems emit radiation that can cause
eye damage. DO NOT stare into the laser beams. All NSRs with Class 3b or
higher laser subsystems must have its work area (i.e., chamber) secured from
any stray laser light emissions at all times. This requirement is in adherence to
nationally recognized standards for the safe use of lasers. To eliminate the
possibility of anyone coming in contact with any laser emission, ensure that the
appropriate laser light covers are properly secured in place whenever a system is
left unattended. When working on any system which is illuminated with a laser,
the proper use of safety eyewear is a requirement.

Version 1.0 iv
N11MCS-120 • Nikon

Warning – Keep hands, hair, tools, and loose clothing away from any moving
parts to avoid personal injury or damage to the equipment.

Warning – Prolonged operation of the keyboard and monitor may cause fatigue.
Frequent short breaks and appropriate seating should be used to reduce fatigue.

CAUTIONS
DO NOT operate the system when temperature specifications have been
exceeded to avoid damage to the system and unreliable performance.

Observe standard clean room procedures at all times to prevent

component damage due to contamination.

Mercury arc lamps may explode or fail if skin oils or contaminants are
deposited on the lamps. Always wear clean room gloves when handling
mercury arc lamps.

Ensure a high level of cleanliness is maintained at all times for all wafer
handling subassemblies to avoid wafer handling failures. Errors may
occur if there is contamination on the wafer handling subassemblies.

NOTE
There are no operator-serviceable parts on Nikon systems. Please refer any
servicing requirements to qualified service personnel.

It is the customer’s responsibility to maintain back-up systems and user/data

disks. This is extremely important in restoring system integrity in a minimum
amount of time should a catastrophic disk error occur.

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 N11MCS-120 • Nikon

EMERGENCY MACHINE OFF

The Nikon NSR systems are equipped with an Emergency Machine Off (EMO) circuit. This circuit
uses four EMO buttons:

1. EMO1 on the rear of the system

2. EMO2 on the front of the system
3. EMO3 on the front of the Control Console
4. EMO4 on optional/auxiliary equipment

Applying power to the main input power circuit breaker also applies power to the Transformer.
The 24 VAC secondary from the transformer goes to terminal block and out through the EMO
buttons. Power flows through the EMO buttons to the ON/OFF buttons on the NEMA box on the
rear of the system. Pushing the ON button closes relay MC, allowing the Emergency Power
Dropout Contactor to close, applying power to the NSR.

Pressing any of the EMO buttons or the OFF button on the NEMA box opens the 24 VAC circuit,

BREAKER
Emergency Power
Main Input
Dropout Contactor
Power Circuit

U1
From AC 200 V
Facility V1 3ø
To System
W1

Circuit MC
Protection Terminal
Block
Main Body
200/24 V Emergency OFF
Transformer
EMO1

This diagram represents the EMO2

operational components of
the EMO circuit.
EMO3
Actual components vary
depending on specific features
of the system ordered. EMO4
(Optional/
Accessory)
MC

ON OFF

which opens MC and the Emergency Power Dropout Contactor, shutting off power to the NSR.
Figure 1 shows the typical EMO circuit.

Figure 1
EMO Circuit

Version 1.0 vi
N11MCS-120 • Nikon

TABLE OF CONTENTS

SECTION 1 -- OVERVIEW

SECTION 2 - R2205HA VERSION 7.0 SERIES TEST RETICLE

2.1 Overlay Measurement Unit .......................................................................................... 2-2

2.1.1 Various Measurement Marks in the Overlay Measurement Unit .................................... 2-3
2.1.2 Various Alignment Marks in the Overlay Measurement Unit .......................................... 2-4
2.2 Measurement Unit for Stepping .................................................................................. 2-5
2.2.1 Measurement Mark Positions in the Main Scale Unit ..................................................... 2-5
2.2.2 Subscale Unit Mark Positions ........................................................................................ 2-6
2.3 Wafer Global Alignment Marks ................................................................................... 2-6
2.4 LIA/FIA Multi-Point Alignment Unit ............................................................................ 2-7
2.5 TTR Alignment Marks ................................................................................................ 2-10
2.5.1 TTR Type I Mark .......................................................................................................... 2-10
2.5.2 TTR Type II Mark ......................................................................................................... 2-10
2.6 Reticle Alignment Marks ........................................................................................... 2-11
2.6.1 Reticle Alignment Mark ................................................................................................ 2-11
2.6.2 Reticle Multi-Point ISS Unit .......................................................................................... 2-11
2.6.3 NSR-2005EX ISS Mark ................................................................................................ 2-12
2.7 Resolution Chart For Exposure Condition Setting ................................................. 2-13

SECTION 3 - R2205HB VERSION 7.0 SERIES TEST RETICLE

3.1 Lens Controller Reduction Change Measurement Unit ............................................ 3-1

3.2 Focus Measurement Unit ............................................................................................ 3-2
3.2.1 Measurement Mark Coordinates in the Unit ................................................................... 3-3
3.3 Reticle Blind Setting Accuracy Evaluation Scale ..................................................... 3-3
3.4 Orthogonality Measurement Unit ............................................................................... 3-4
3.5 Wafer Global Alignment Marks ................................................................................... 3-4
3.5.1 LSA Search Marks ......................................................................................................... 3-4
3.5.2 LSA Multi Marks ............................................................................................................. 3-5
3.5.3 FIA Alignment Marks ...................................................................................................... 3-5
3.6 Reticle Alignment Marks ............................................................................................. 3-5
3.6.1 Reticle Cross Alignment Mark ........................................................................................ 3-5
3.6.2 Reticle ISS Mark ............................................................................................................ 3-6
3.6.3 NSR-2005EX ISS Mark .................................................................................................. 3-7
3.7 Resolution Chart .......................................................................................................... 3-8

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3.7.1 Normal Resolution Chart ................................................................................................ 3-8

3.7.2 Long Resolution Chart ................................................................................................... 3-8

SECTION 4 - PROCESS DATA FILES

4.1 Process Data File 22nUSRA ........................................................................................ 4-1

4.1.1 STEP (For Stepping Evaluation) .................................................................................... 4-1
4.1.2 MRB (For Mirror Bow Evaluation) .................................................................................. 4-2
4.1.3 REG1 (For Overlay Evaluation) ..................................................................................... 4-2
4.1.4 WGA (For Overlay Evaluation) ....................................................................................... 4-2
4.1.5 EGA (For Overlay Evaluation) ........................................................................................ 4-2
4.1.6 DD (For Overlay Evaluation) .......................................................................................... 4-3
4.1.7 FIA (For Overlay Evaluation) .......................................................................................... 4-3
4.1.8 MAT1 (For Matching Evaluation) ................................................................................... 4-3
4.1.9 MAT2 (For Matching Evaluation) ................................................................................... 4-3
4.1.10 RATE (For Stepping Rate Evaluation) ........................................................................... 4-3
4.1.11 THRPT1 (For Throughput Evaluation) ........................................................................... 4-3
4.1.12 THRPTW (For Throughput Evaluation) .......................................................................... 4-4
4.1.13 THRPTE (For Throughput Evaluation) ........................................................................... 4-4
4.1.14 THRPTD (For Throughput Evaluation) ........................................................................... 4-4
4.1.15 THRPTF (For Throughput Evaluation) ........................................................................... 4-4
4.1.16 ALRUN (For Alignment Running Evaluation) ................................................................. 4-4
4.1.17 ALRUNF (For Alignment Running Evaluation) ............................................................... 4-4
4.2 Process Data File 22nUSRB ........................................................................................ 4-5
4.2.1 TPR (For Test Print Evaluation) ..................................................................................... 4-5
4.2.2 RESO (For Resolution Evaluation) ................................................................................ 4-5
4.2.3 RB (For Reticle Blind Evaluation) ................................................................................... 4-5
4.2.4 LCM (For Magnification Evaluation) ............................................................................... 4-6
4.2.5 LCH (For Heat Evaluation) ............................................................................................. 4-6
4.2.6 WLREP (For Wafer Prealignment Evaluation) ............................................................... 4-6
4.2.7 WLRSIDE1 (For Wafer Prealignment Evaluation) ......................................................... 4-6
4.2.8 WLRSIDE2 (For Wafer Prealignment Evaluation) ......................................................... 4-6
4.2.9 ORT1 (For Orthogonality Evaluation) ............................................................................. 4-6
4.2.10 ORT2 (For Orthogonality Evaluation) ............................................................................. 4-6
4.2.11 ORTSIDE (For Orthogonality Evaluation) ...................................................................... 4-7
4.2.12 ORTM and ORTM90 (For Orthogonality Evaluation) ..................................................... 4-7
4.2.13 ORTMSIDE (For Orthogonality Evaluation) ................................................................... 4-7

APPENDIX A - PROFILES OF THE MARKS

A.1 Overlay Measurement Unit .......................................................................................... A-1

A.2 Stepping Unit in Overlay Measurement Unit ............................................................. A-2
A.3 Various Measurement Marks in Overlay Measurement Unit .................................... A-3
A.3.1 LSA-AMS X Mark ........................................................................................................... A-3

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A.3.2 Box in Box Mark ............................................................................................................. A-3

A.3.3 Bars in Bars Mark ........................................................................................................... A-4
A.3.4 Moire Marks ................................................................................................................... A-5
A.3.5 FIA-AMS Marks .............................................................................................................. A-6
A.4 Alignment Marks in Overlay Measurement Unit ........................................................ A-7
A.4.1 LSA X 7 Multi-Mark ........................................................................................................ A-7
A.4.2 LSZ X 7 µm Pitch 1:1 Mark ............................................................................................ A-7
A.4.3 LSA X 12 µm Pitch 9-Line Mark ..................................................................................... A-8
A.5 Measurement Unit for Stepping .................................................................................. A-9
A.6 Wafer Global Alignment Marks ................................................................................. A-10
A.6.1 LSA-Search X Mark ..................................................................................................... A-10
A.6.2 LSA-Search Y Mark ..................................................................................................... A-10
A.6.3 LIA-Search I Mark ........................................................................................................ A-10
A.6.4 LIA-Search II Mark ....................................................................................................... A-11
A.6.5 LSA, FIA Search Marks ................................................................................................ A-12
A.6.6 LIA/FIA Multi-Point Alignment Marks ........................................................................... A-14
A.7 TTR Alignment Marks ................................................................................................ A-16
A.7.1 TTR Type I Mark .......................................................................................................... A-16
A.7.2 TTR Type II Mark ......................................................................................................... A-17
A.8 Reticle Alignment Mark ............................................................................................. A-18
A.9 Resolution Chart for Exposure Condition Setting .................................................. A-19
A.9.1 Resolution Chart Position in Overlay Measurement Unit ............................................. A-19
A.9.2 Resolution Chart for Exposure Condition Setting ......................................................... A-20
A.10 Reticle Blind Setting Accuracy Evaluation Scale ................................................... A-21
A.11 Resolution Charts ...................................................................................................... A-22
A.11.1 Normal Resolution Chart .............................................................................................. A-22
A.11.2 Long Resolution Chart ................................................................................................. A-23

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FIGURES

SECTION 4 - PROCESS DATA FILES

4-1 Stepping Exposure ......................................................................................................... 4-2

4-2 Evaluation of Reticle Blind Setting Accuracy (Blind Scales) .......................................... 4-5

APPENDIX A - PROFILES OF THE MARKS

A-1 Overlay Measurement Unit ............................................................................................ A-1

A-2 Stepping Unit in Overlay Measurement Unit .................................................................. A-2
A-3 LSA-AMS X Mark ........................................................................................................... A-3
A-4 Box in Box Mark ............................................................................................................. A-3
A-5 Bars in Bars Mark ........................................................................................................... A-4
A-6 Moire X Mark .................................................................................................................. A-5
A-7 Moire Y Mark .................................................................................................................. A-5
A-8 FIA-AMS Mark ................................................................................................................ A-6
A-9 LSA X 7 Multi-Mark ........................................................................................................ A-7
A-10 LSZ X 6 µm Pitch 1:1 Mark ............................................................................................ A-7
A-11 LSA X 12 µm Pitch 9-Line Mark ..................................................................................... A-8
A-12 Main Pattern ................................................................................................................... A-9
A-13 Sub Pattern .................................................................................................................... A-9
A-14 LSA-Search X Mark ..................................................................................................... A-10
A-15 LSA-Search Y Mark ..................................................................................................... A-10
A-16 LIA-Search I Mark ........................................................................................................ A-10
A-17 LIA-Search II Mark ....................................................................................................... A-11
A-18 LSA, FIA Search Mark Type I ...................................................................................... A-12
A-19 LSA, FIA Search Mark Type II ..................................................................................... A-13
A-20 LIA/FIA Multi-Point Alignment Marks (Line Marks) ...................................................... A-14
A-21 LIA/FIA Multi-Point Alignment Marks (Square Marks) .................................................. A-15
A-22 TTR Type I Mark .......................................................................................................... A-16
A-23 TTR Type II Mark ......................................................................................................... A-17
A-24 Reticle Alignment Mark ................................................................................................ A-18
A-25 Resolution Chart Position in Overlay Measurement Unit (Inside Circle) ...................... A-19
A-26 Resolution Chart for Exposure Condition Setting ......................................................... A-20
A-27 Reticle Blind Setting Accuracy Evaluation Scale ......................................................... A-21
A-28 Normal Resolution Chart .............................................................................................. A-22
A-29 Long Resolution Chart (enlarged view) ........................................................................ A-23

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N11MCS-120 • Nikon

TABLES

SECTION 2 - R2205HA VERSION 7.0 SERIES TEST RETICLE

2-1 Evaluation Patterns on Reticle A .................................................................................... 2-1

2-2 Overlay Measurement Unit Mark Positions .................................................................... 2-2
2-3 Measurement Mark Positions ......................................................................................... 2-3
2-4 Alignment Mark Positions ............................................................................................... 2-4
2-5 Positions of Measurement Unit for Stepping .................................................................. 2-5
2-6 Measurement Mark Positions in the Main Scale Unit ..................................................... 2-5
2-7 Sub Scale Mark Positions .............................................................................................. 2-6
2-8 Wafer Global Alignment Mark Positions ......................................................................... 2-6
2-9 Unit Coordinates ............................................................................................................ 2-7
2-10 Unit Coordinates ............................................................................................................ 2-7
2-11 Y Alignment Positions .................................................................................................... 2-8
2-12 XY Alignment Mark Positions ......................................................................................... 2-9
2-13 TTR Type I Mark Positions ........................................................................................... 2-10
2-14 TTR Type II Mark Positions .......................................................................................... 2-10
2-15 Reticle Alignment Mark Positions ................................................................................. 2-11
2-16 Unit Coordinates .......................................................................................................... 2-11
2-17 X Mark Positions .......................................................................................................... 2-12
2-18 Y Mark Positions .......................................................................................................... 2-12
2-19 NSR-2005EX ISS Mark Positions ................................................................................ 2-12
2-20 Coordinates of Resolution Chart .................................................................................. 2-13

SECTION 3 - R2205HB VERSION 7.0 SERIES TEST RETICLE

3-1 Evaluation Patterns on Reticle B .................................................................................... 3-1

3-2 Overlay Measurement Unit Mark Positions .................................................................... 3-2
3-3 Focus Measurement Unit Positions ............................................................................... 3-2
3-4 Measurement Mark Positions in the Unit ....................................................................... 3-3
3-5 X Scale Positions ........................................................................................................... 3-3
3-6 Y Scale Positions ........................................................................................................... 3-4
3-7 Orthogonality Measurement Unit Positions .................................................................... 3-4
3-8 LSA Search Marks ......................................................................................................... 3-4
3-9 LSA Multi Marks ............................................................................................................. 3-5
3-10 FIA Alignment Marks ...................................................................................................... 3-5
3-11 Reticle Cross Alignment Mark Positions ........................................................................ 3-5
3-12 Y Mark Coordinates ....................................................................................................... 3-6
3-13 X Mark Coordinates ....................................................................................................... 3-7
3-14 NSR-2005EX ISS Mark Positions .................................................................................. 3-7

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N11MCS-120 • Nikon

3-15 Coordinates of Normal Resolution Chart ....................................................................... 3-8

3-16 Coordinates of Long Resolution Chart ........................................................................... 3-8

Version 1.0 xii

N11MCS-120 • Nikon Overview

SECTION 1
OVERVIEW

The NSR R2205HA and HB Version 7.0 series test reticles can be used for the
NSR-2005G8/i8 series or higher with an exposure area of 21.2 x 21.2 mm or 22 x
22 mm. However, these test reticles are currently used for evaluation and are
supported only for the NSR2205i11 series or Higher. These test reticles can also
be used for Excimer steppers in addition to g-line and i-line steppers.

With test reticles of Version 7.0 or higher, reticle A, which was a single reticle in
previous versions, is divided into two reticles reticles A and B. These two reticles
are switched depending on the types of evaluations required. Version 7.0 series
test reticles are not compatible with Version 6 series test reticles because the
configuration and placement of measurement marks have been changed.
However, for reticle A which evaluates overlay accuracy, the measurement
marks on the wafer are compatible among Version 7 series regardless of the lens
type.

The following reticles are required for NSR evaluation:

1 Reticle A
Measures overlay accuracy, stepping accuracy, reticle rotation
repeatability accuracy, and moving mirror bow.
2 Reticle B
Measures lens controller accuracy, reticle blind accuracy, and
orthogonality.
3 CD Reticle
Evaluates lens image formation performance (except contact holes.)
4 DIS Reticle (Distortion)
Used for lens distortion measurement, reticle rotation accuracy, and
distortion matching.
5 MF Reticle (Measure Focus)
Automatically measures focus in an exposure area.

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N11MCS-120 • Nikon Overview

NOTES
This manual is for test reticles of R2205HA Version 7 series and R2205HB
Version 7 series, and describes only the information of the patterns placed on
these reticles

Actual usage of the test reticles is not described in this manual. For more details
about how to use the test reticles refer to the NSR Acceptance Test Methods and
Conditions.

All figures are shown in Appendix A, “Profiles of the Marks.”

Warning – Prolonged operation of the keyboard and monitor may cause fatigue.
Frequent short breaks and appropriate seating should be used to reduce fatigue.

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N11MCS-120 • Nikon R2205HA Version 7.0 Series Test Reticle

SECTION 2
R2205HA VERSION 7.0 SERIES TEST RETICLE

This section describes the information of the patterns placed on the R2205HA
Version 7.0 series test reticle (called reticle A). Table 2-1 lists the patterns placed
on reticle A.

TABLE 2-1 Evaluation Patterns on Reticle A

No. Item
1 Overlay measurement unit
2 Measurement unit for stepping
3 Wafer global alignment mark
4 LIA alignment mark
5 FIA alignment mark
6 FIA two-dimensional alignment mark
7 TTR alignment mark (2 types)
8 Reticle multi-point ISS mark

More intra-shot multi-point measurements are performed during evaluation of

overlay accuracy. With the overlay evaluation mark on the conventional reticle A,
a measurement mark manufacturing error may vary for each evaluation point due
to stitching errors during drawing. Thus, to solve this problem, a new production
method has been adopted for this version of reticle A.

In addition, alignment marks such as the TTR alignment mark, intra-shot multi-
point measurement mark and FIA two-dimensional mark which are not supported
in Version 6 are included in Version 7.

The following sections describe each mark in detail.

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N11MCS-120 • Nikon R2205HA Version 7.0 Series Test Reticle

2.1 OVERLAY MEASUREMENT UNIT

The overlay measurement unit has a dimension of 1000 µm (vertical) and 1000
µm (horizontal) on a wafer. This unit contains the main scales and subscales of
various measurement patterns. The main scale and subscale are placed (160 µm
160 µm) apart. Thus, an offset of (160 µm, 160 µm) is added to the first pattern
during overlay evaluation.

In addition, standard alignment marks such as LSA (Single, 7 Multi), FIA and LIA
are included in this unit. A resolution chart and a stepping unit may be included in
this unit depending on the input position. For the profiles of the overlay
measurement unit and the stepping unit in the overlay measurement unit, see
Appendix A.1 and A.2.

Table 2-2 lists overlay measurement unit mark positions.

TABLE 2-2 Overlay Measurement Unit Mark Positions

X coordinate Y coordinate X coordinate Y coordinate

-5000 12000 5000 0
0 12000 10000 0
5000 12000 -10000 -5000 *
-10000 10000 -5000 -5000 *
-5000 10000 * 0 -5000 *
0 10000 * 5000 -5000 *
5000 10000 * 10000 -5000 *
10000 10000 * -10000 -10000 *
-10000 5000 * -5000 -10000 *
-5000 5000 * 0 -10000 *
0 5000 * 5000 -10000 *
5000 5000 * 10000 -10000
10000 5000 * -5000 -12000
-10000 0 * 0 -12000
-5000 0 5000 -12000
0 0

*: Stepping unit is built in the overlay measurement unit.

Reticle A is arranged so that adjacent patterns are not overlaid even if X and Y
coordinates are shifted 2000 µm before exposure.

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N11MCS-120 • Nikon R2205HA Version 7.0 Series Test Reticle

2.1.1 Various Measurement Marks in the Overlay Measurement Unit

For profiles of the various measurement marks in the overlay measurement unit,
see Appendix A.3. Table 2-3 lists various measurement mark positions in the
overlay measurement unit.

TABLE 2-3 Measurement Mark Positions

X coordinate Y coordinate X coordinate Y coordinate

-5000 12000 5000 0
0 12000 10000 0
5000 12000 -10000 -5000 *
-10000 10000 -5000 -5000 *
-5000 10000 * 0 -5000 *
0 10000 * 5000 -5000 *
5000 10000 * 10000 -5000 *
10000 10000 * -10000 -10000 *
-10000 5000 * -5000 -10000 *
-5000 5000 * 0 -10000 *
0 5000 * 5000 -10000 *
5000 5000 * 10000 -10000
10000 5000 * -5000 -12000
-10000 0 * 0 -12000
-5000 0 5000 -12000
0 0

NOTE
Manual read vernier (+0.5 to -0.5 µm, 0.02 µm reading) is also available.

The figure numbers in the remark field correspond to the figures in Appendix A.

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N11MCS-120 • Nikon R2205HA Version 7.0 Series Test Reticle

2.1.2 Various Alignment Marks in the Overlay Measurement Unit

To use various alignment marks with overlay evaluation, calculate the

coordinates in a shot with a combination of the unit coordinates and the
coordinates in the unit. For profiles of the various alignment marks in the overlay
measurement unit, see Appendix A.4. Table 2-4 lists various alignment mark
positions in the overlay measurement unit.

TABLE 2-4 Alignment Mark Positions

N o. Item X Y Remark
1 LSA X Positive 0 60
2 LSA Y Positive 60 0
3 LSA X Negative 450 380
4 LSA X Negative 310 220
5 LSA Y Negative 380 450
6 LSA Y Negative 220 310
7 LSA X 7 multi Positive 400 -350 Figure A-9
8 LSA X 7 multi Negative 400 -450
9 LSA Y 7 multi Positive -350 400
10 LSA Y 7 multi Negative -450 400
11 LIA X 6 µm pitch 1:1 Positive -240 450 Figure A-10
12 LIA X 6 µm pitch 1:1 Negative -240 -450
13 LIA Y 6 µm pitch 1:1 Positive 450 -240
14 LIA X 6 µm pitch 1:1 Negative -450 -240
15 FIA X 12 µm pitch 9 lines Positive 180 -350 Figure A-11
16 FIA X 12 µm pitch 9 lines Positive 180 -450
17 FIA X 12 µm pitch 9 lines Positive -350 180
18 FIA X 12 µm pitch 9 lines Positive -450 180

NOTE
The figure numbers in the remark field correspond to the figures in Appendix A.

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N11MCS-120 • Nikon R2205HA Version 7.0 Series Test Reticle

2.2 MEASUREMENT UNIT FOR STEPPING

The measurement unit for stepping is placed at the coordinates shown in Table
2-5, and contains patterns within a square area of (20, 20) to (-400, -400) for
input coordinate values. For the profile of the measurement unit for stepping, see
Appendix A.5.

TABLE 2-5 Positions of Measurement Unit for Stepping

Main X coordinate Main Y coordinate Sub X coordinate Sub Y coordinate

X step -10000 9000 10000 9000
X step -10000 5000 10000 5000
X step -10000 0 10000 0
X step -10000 -5000 10000 -5000
X Step -10000 -9000 10000 -9000
Y step -5000 -12000 -5000 12000
Y step 0 -12000 0 12000
Y step 5000 -12000 5000 12000
Y step -9000 -10000 -9000 10000
Y step -5000 -10000 -5000 10000
Y step 0 -10000 0 10000
Y step 5000 -10000 5000 10000
Y step 9000 -10000 9000 10000

2.2.1 Measurement Mark Positions in the Main Scale Unit

The patterns shown in Table 2-6 are the same as those in the overlay
measurement unit.

TABLE 2-6 Measurement Mark Positions in the Main Scale Unit

Measurement mark X Coordinate Y Coordinate

LSA-AMS X -20 -80
LSA-AMS Y -80 -20
Box in Box (10 in 20) Main -200 -200
Box in Box (20 in 30) Main -280 -280
Moire Main X -230 -40
Moire Main Y -40 -230

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 N11MCS-120 • Nikon R2205HA Version 7.0 Series Test Reticle

2.2.2 Subscale Unit Mark Positions

The patterns shown in Table 2-7 are the same as those in overlay measurement
unit.

TABLE 2-7 Sub Scale Mark Positions

Measurement mark X Coordinate Y Coordinate

LSA-AMS X 0 -80
LSA-AMS Y -80 0
Box in Box (10 in 20) Main -200 -200
Box in Box (20 in 30) Main -280 -280
Moire Main X -230 -40
Moire Main Y -40 -230

2.3 WAFER GLOBAL ALIGNMENT MARKS

Some of the wafer global alignment marks placed on the test reticle are not
currently supported, but may be supported in the future. For the profile of each
alignment mark, see Appendix A.6. Table 2-8 lists the wafer global alignment
mark positions.

TABLE 2-8 Wafer Global Alignment Mark Positions

Item X Coordinate X Coordinate Remark

LSA Search Y Triple Positive -6500 6000 Figure A-15
LSA Search Y Triple Negative -5500 6000
LSA Search X Triple Positive -6200 6000 Figure A-14
LSA Search X Triple Positive -6800 6000
LSA Search X Triple Negative -5800 6000
LSA Search X Triple Negative -6200 6000
LIA Search Y 8 µm pitch 5500 6000 Figure A-16
LIA Search X 8 µm pitch 5900 6000
LIA Search Y 6 µm pitch 6200 6000 Figure A-17
LIA Search X 6 µm pitch 6600 6000
FIA Search Y 8 µm pitch -6200 -6000 Figure A-18
FIA Search Y 6 µm pitch -6050 -6000 Figure A-19
FIA Search X 8 µm pitch -5900 -6000 Figure A-18
FIA Search X 6 µm pitch -5750 -6000 Figure A-19

NOTE
The figure numbers in the remark field correspond to the figures in Appendix A.

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2.4 LIA/FIA MULTI-POINT ALIGNMENT UNIT

The alignment marks in the overlay measurement unit can also be used for multi-
point measurement alignment in a wafer. For the coordinates, see Section 2.1,
“Overlay Measurement Unit.” For the profile of each alignment mark, see
Appendix A.6.6. Table 2-9 lists the unit coordinates.

TABLE 2-9 Unit Coordinates

Table 2-10 lists the X alignment mark positions in the unit.

TABLE 2-10 Unit Coordinates

NOTE
X Coordinate Y Coordinate
-10000 10000
10000 10000
0 0
-10000 -10000
10000 -1000

The figure numbers in the remark field correspond to the figures in Appendix A.

Item X coordinate Y coordinate Remark

LIA 6 [µm] pitch 4 [µm] line 150 900 Figure A-20 (a)
LIA 6 [µm] pitch 4 [µm] line 150 -900
LIA6[µm] npitch5 [µm] nline 400 900 FigureA-20(b)
LIA6[µm] mpitch5urnline 400 -900
LIA6[µm] npitch5.5 [µm] nline 150 800 FigureA-20(c)
LIA6[µm] npitch5.5[µm] nline 150 -800
LIA 6[µm] mpitch 0.5 µm*2 400 800 FigureA-20(d)
LIA 6[µm] npitch 0.5 µm*2 400 -800
LIA/FIA 8[µm] pitch 4[µm] nline 150 700 FigureA-20(e)
LIA/FIA 8 [µm] [µm] n pitch 4 line 150 -700
LIA/FIA 8[µm] [µm] n pitch 5 line 400 700 FigureA-20(f)
LIA/FIA 8[µm] pitch 5 [µm] mline 400 -700
LIA/FIA 8 [µm] pitch 7 [µm] line 150 600 Figure A-20 (g)
LIA/FIA 8 urn Ditch 7 [µm] line 150 -600
LIA/FIA 8 µm pitch 7.5 µm line 400 600 Figure A-20 (h)
LIA/FIA 8 [µm] pitch 7.5 [µm] line 400 -600

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Table 2-11 lists the Y alignment mark positions in the unit.

TABLE 2-11 Y Alignment Positions

Table 2-12 lists the XY alignment mark positions in the unit.

TABLE 2-12 XY Alignment Mark Positions

Item X coordinate Y Coordinate

LIA 6 [µm] pitch 4 [µm] line -900 150
LIA 6 [µm] pitch 4 [µm] line 900 150
LIA6[µm] npitch5 [µm] nline -900 400
LIA6[µm] mpitch5urnline 900 400
LIA6[µm] npitch5.5 [µm] nline -800 150
LIA6[µm] npitch5.5[µm] nline 800 150
LIA 6[µm] mpitch 0.5 µm*2 -800 400
LIA 6[µm] npitch 0.5 µm*2 800 400
LIA/FIA 8[µm] pitch 4[µm] nline -700 150
LIA/FIA 8 [µm] [µm] n pitch 4 line 700 150
LIA/FIA 8[µm] [µm] n pitch 5 line -700 400
LIA/FIA 8[µm] pitch 5 [µm] mline 700 400
LIA/FIA 8 [µm] pitch 7 [µm] line -600 150
LIA/FIA 8 urn Ditch 7 [µm] line 600 150
LIA/FIA 8 µm pitch 7.5 µm line -600 400
LIA/FIA 8 [µm] pitch 7.5 [µm] line 600 400

NOTE
Arrangement: 6 [µm] pitch 19*19; 8 [µm] pitch 15*15

The figure numbers in the remark field correspond to the figures in Appendix.

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2.5 TTR ALIGNMENT MARKS

For the profiles of the TTR alignment marks, see Appendix A.7.

Item X coordinate Y Coordinate Remark

6 µm pitch 3 µm square -860 860 FigureA-21(a)
6 µm pitch 3 µm square 860 860
6 µm pitch 3 µm square -860 -860
6 µm pitch 3 µm square 860 -860
6 µm pitch 5 µm square -640 860 FigureA-21(b)
6 µm pitch 5 µm square 640 860
6 µm pitch 5 µm square -640 -860
6 µm pitch 5 µm square 640 -860
8 µm pitch 4 µm square -860 640 FigureA-21(c)
8 µm pitch 4 µm square 860
8 µm pitch 4 µm square -860 -640
8 µm pitch 4 µm square 860 -640
8 µm pitch 7 µm square -640 640 FigureA-21(d)
8 µm pitch 7 µm square 640 640
8 µm pitch 7 µm square -640 -640
8 µm pitch 7 µm square 640 -640

2.5.1 TTR Type I Mark

The alignment mark coordinates (TTR Type mark positions) shown in Table 2-13
indicate the wafer mark coordinates when a wafer is shifted (160 µm, 160 µm)
during the second exposure.

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TABLE 2-13 TTR Type I Mark Positions

Item X Coordinate Y coordinate

X+y side 700 8765
X-y side -700 -8765
Y+x side 8765 700
Y-x side -8765 -700

2.5.2 TTR Type II Mark

The unit combining reticle and wafer marks is placed at the coordinates shown in
Table 2-14 (TTR Type II mark positions). The alignment mark coordinates shown
in Table 2-14 indicate the wafer mark coordinates when a wafer is shifted (160
µm, 160 µm) during the second exposure.

TABLE 2-14 TTR Type II Mark Positions

Item X Coordinate Y coordinate

X+y side -600 8800
X-y side 600 -8800
Y+x side 8800 -600
Y-x side -8800 600

2.6 RETICLE ALIGNMENT MARKS

For the profile of the reticle alignment mark, see Appendix A.8.

2.6.1 Reticle Alignment Mark

Table 2-15 lists the reticle alignment mark positions.

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TABLE 2-15 Reticle Alignment Mark Positions

X Coordinate Y coordinate Remark

13800 0
-13000 0 SRA Mark
-12600 0 SRA Mark
12600 0 SRA Mark
13000 0 SRA Mark
-13800 0
0 -14150

2.6.2 Reticle Multi-Point ISS Unit

The reticle multi-point ISS unit contains twenty 1 -[µm] negative lines arranged on
a wafer, and supports both areas of 21.2 x 21.2 mm and 22 x 22 mm. All units
are arranged with the same lines.

1 Unit coordinates (on wafer)

Table 2-16 lists the unit coordinates.

TABLE 2-16 Unit Coordinates

X Coordinate Y coordinate
-5600 13100
5600 13100
-11120 8600
11120 8600
-11120 -8600

2 X marks in the unit (on wafer)

Table 2-17 lists the X mark positions in the unit.

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TABLE 2-17 X Mark Positions

X Coordinate Y coordinate
-200 200
200 200
0 0
-200 -200
200 -200

3 Y marks in the unit (on wafer)

Table 2-18 lists the Y mark positions in the unit.

TABLE 2-18 Y Mark Positions

X Coordinate Y coordinate
-200 0
200 0

2.6.3 NSR-2005EX ISS Mark

Alignment may be performed on the NSR-2005EX. Table 2-19 lists the NSR-
2005EX ISS mark positions.

TABLE 2-19 NSR-2005EX ISS Mark Positions

Item Y coordinate Remark

X Single 0 -13300
X Multi -800 -13300
Y Single -13300 5420
Y Single 13300 5420
Y Single -12800 -4000
Y Single 12800 -4000
Y Multi -13300 5000
Y Multi 13300 5000
Y Multi -12800 -5420
Y Multi 12800 -5420

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2.7 RESOLUTION CHART FOR EXPOSURE CONDITION SETTING

This resolution chart is not used for lens evaluation, but used to determine
exposure conditions and to check a focus shift during exposure. This chart is
placed inside several overlay accuracy evaluation units so that the chart does not
overlay with other patterns if shifted by (160 µm 160 µm).For the profile of the
resolution chart for exposure condition setting, see Appendix A-9. Table 2-20 lists
the coordinates of the resolution chart.

TABLE 2-20 Coordinates of Resolution Chart

X coordinate Y coordinate
-10250 9700
9750 9700
-250 -300
-10250 -10300
9750 -10300

There are 12 different dimensions for the resolution chart. They are 0.50, 0.45,
0.40, 0.35, 0.32, 0.30, 0.26, 0.26, 0.25, 0.24, 0.22 and 0.20 µm, and the chart
contains negative and positive patterns.

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SECTION 3
R2205HB VERSION 7.0 SERIES TEST RETICLE

This section describes the information of the patterns placed on the R2205HB
Version 7.0 series test reticle (called reticle B). Table 3-l lists the patterns placed
on reticle B.

TABLE 3-1 Evaluation Patterns on Reticle B

No. Item
1 Lens controller reduction change measurement unit
2 Focus measurement unit
3 Orthogonality measurement unit
4 Wafer global alignment mark

Reticle B is used to evaluate the control accuracy of the lens controller. Since
reticle A is produced not to transmit exposure light, reticle B has been produced
to compensate for reticle A. Reticle B is mainly used for evaluation of relative
values: thus, the original plate is created with an EB drawing unit which was used
to create test reticles of previous versions.

3.1 LENS CONTROLLER REDUCTION CHANGE MEASUREMENT UNIT

This unit is the same as the stepping accuracy evaluation unit for reticle A,
except placement positions. Table 3-2 lists the lens controller reduction change
measurement unit positions.

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TABLE 3-2 Overlay Measurement Unit Mark Positions

Main Sub
Item Item Item Item
X step -10000 8000 10000 8000
X step -10000 4000 10000 4000
X step -10000 0 10000 0
X step -10000 -4000 10000 -4000
X step -10000 -8000 10000 -8000
Y step -8000 -12000 -8000 12000
Y step -4000 -12000 -4000 12000
Y step 0 -12000 0 12000
Y step 4000 -12000 4000 12000
Y step 8000 -12000 8000 12000
Y step -8000 -10000 -8000 10000
Y step -4000 -10000 -4000 10000
Y step 0 -10000 0 10000
Y step 4000 -10000 4000 10000
Y step 8000 -10000 -8000 10000

3.2 FOCUS MEASUREMENT UNIT

The focus measurement function of the SMP (Self Measurement Program) is

used to measure the relative variation of the focus. The unit is covered with
chrome in the vertical direction so that the unit does not disappear even if it is
exposed with open blinds to check the focus. The unit size is 450 µm (vertical)
and 550 µm (horizontal), and is placed at the following coordinates (Table 3-3).

TABLE 3-3 Focus Measurement Unit Positions

X coordinate Y coordinate X coordinate Y coordinate

1000 12000 9000 0
-9000 10000 -9000 -10000
-1000 10000 -1000 -10000
9000 10000 9000 -10000
-9000 0 1000 -12000
0 0 - -

3.2.1 Measurement Mark Coordinates in the Unit

All measurement marks in the unit have (62.5, -62.5) as the relative position of
the Y scan mark against the X scan mark. In addition, an L & S pattern is
provided to check exposure conditions visually. Table 3-4 lists the measurement
mark positions in the unit.

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TABLE 3-4 Measurement Mark Positions in the Unit

X scan Y scan
X Y X Y
0.5 µm 0°, 90° -87.5 162.5 -25 100
0.5 µm 45°, 135° -212.5 162.5 -150 100
0.45 µm 0°, 90° 162.5 162.5 225 100
0.45 µm 45°, 135° 37.5 162.5 100 100
0.40 µm 0°, 90° -87.5 37.5 -25 -25
0.40 µm 45°, 135° 212.5 37.5 -150 -25
0.35 µm 0°, 90° 162.5 37.5 225 -25
0.35 µm 45°, 135° 37.5 37.5 100 -25
0.30 µm 0°, 90° 162.5 -87.5 225 -150
0.30 µm 45°, 135° 37.5 -87.5 100 -150

3.3 RETICLE BLIND SETTING ACCURACY EVALUATION SCALE

For the profile of the reticle blind setting accuracy evaluation scale, see Appendix
A.1 0. Tables 3-5 and 3-6 list the X scale and Y scale positions, respectively.

TABLE 3-5 X Scale Positions

X coordinate Y coordinate
±7000 12500
±7000 ±11000
±6000 ±1 0000
±6000 ±8000
±4000 ±6000
±2000 ±3000
±6000 0
±7000 -12700

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TABLE 3-6 Y Scale Positions

X coordinate Y coordinate
0 ±9000
±11000 ±7000
±10000 ±6000
±8000 ±6000
±6000 ±4000
±3000 ±2000

3.4 ORTHOGONALITY MEASUREMENT UNIT

The orthogonality measurement unit has the same structure as the measurement
unit for stepping. Tables 3-7 lists the orthogonality measurement unit positions.

TABLE 3-7 Orthogonality Measurement Unit Positions

Item X coordinate Y coordinate

Main scale 3000 -3000
Sub scale 3000 3000

3.5 WAFER GLOBAL ALIGNMENT MARKS

3.5.1 LSA Search Marks

Table 3-8 lists the LSA search marks.

TABLE 3-8 LSA Search Marks

Item X coordinate Y coordinate Remark

Global Search Y (Triple) 4000 0
Global Search X (Triple) 4000 -300
Global Search Y (Triple) 4000 -2000 Orthogonality alignment
Global Search X (Triple) 3700 -2000 Orthogonality alignment
Global Search Y (Triple) 4000 0
Global Search X (Triple) 4000 -300

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3.5.2 LSA Multi Marks

Table 3-9 lists the LSA multi marks.

TABLE 3-9 LSA Multi Marks

Item X coordinate Y coordinate Remark

7 Multi X -3000 0 For orthogonality measurement
7 Multi X 3000 0 For orthogonality measurement
7 Multi Y -2500 0 For orthogonality measurement
7 Multi Y 2500 0 For orthogonality measurement

3.5.3 FIA Alignment Marks

Table 3-10 lists the FIA alignment marks.

TABLE 3-10 FIA Alignment Marks

Item X coordinate Y coordinate Remark

12 µm Pitch 9 lines X -2700 0 For orthogonality measurement
12 µm Pitch 9 lines X 2700 0 For orthogonality measurement
12 µm Pitch 9 lines Y -2400 0 For orthogonality measurement
12 µm Pitch 9 lines Y 2400 0 For orthogonality measurement

3.6 RETICLE ALIGNMENT MARKS

3.6.1 Reticle Cross Alignment Mark

Tables 3-11 lists the reticle cross alignment mark positions.

TABLE 3-11 Reticle Cross Alignment Mark Positions

X coordinate X coordinate Remark

13800 0
-13000 0 SRA Mark
-12600 0 SRA Mark
12600 0 SRA Mark
13000 0 SRA Mark
-13800 0
0 -14150

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3.6.2 Reticle ISS Mark

The reticle ISS mark consists of twenty 1 -µm negative lines which are arranged
on a wafer, and support both areas of 21.2 x 21.2 mm and 22 x 22 mm. All units
are arranged with the same lines (different from the design drawing).

Y mark (on wafer)

Table 3-12 lists the Y mark coordinates.

TABLE 3-12 Y Mark Coordinates

X coordinate Y coordinate
-5800 13100
5800 13100
-11320 8600
-10920 8600
10920 8600
11320 8600
-11320 -8600
-10920 -8600
10920 -8600
11320 -8600
-5800 -13300
5800 -13300

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X mark (on wafer)

Table 3-13 lists the X mark coordinates.

TABLE 3-13 X Mark Coordinates

X coordinate Y coordinate
-5600 13100
5600 13100
-11320 8400
-10920 8400
10920 8400
11320 8400
-11320 -8400
-10920 -8400
10920 -8400
11320 -8400
-5600 -13300
5600 -13300

3.6.3 NSR-2005EX ISS Mark

Alignment may also be performed on the NSR-2005EX. Table 3-14 lists the
NSR-2005EX ISS mark positions.

TABLE 3-14 NSR-2005EX ISS Mark Positions

Item X coordinate Y coordinate

X Single 0 -13300
X Multi -800 -13300
Y Single -13300 5420
Y Single 13300 5420
Y Single -12800 -4000
Y Single 12800 -4000
Y Multi -13300 5000
Y Multi 13300 5000
Y Multi -12800 -5420
Y Multi 12800 -5420

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3.7 RESOLUTION CHART

3.7.1 Normal Resolution Chart

A total of seven conventional resolution charts are placed at the reticle center
and its vicinity. For the profile of the normal resolution chart, see Appendix A.1 1.
Table 3-l 5 lists the coordinates of the normal resolution chart.

TABLE 3-15 Coordinates of Normal Resolution Chart

X coordinate Y coordinate
-10000 10000
10000 10000
-10000 1000
2000 1000
10000 1000
-10000 -10000
10000 -10000

3.7.2 Long Resolution Chart

A conventional long resolution chart is placed near the reticle center. For the
profile of the long resolution chart, see Appendix A.1 1. Table 3-16 lists the
coordinates of the long resolution chart.

TABLE 3-16 Coordinates of Long Resolution Chart

Direction X coordinate Y coordinate

Horizontal -3000 1400
Vertical -2000 -1500

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SECTION 4
PROCESS DATA FILES

Process data files are used to check accuracy and performance of NSR2205i11
series or higher with an exposure area of 21.2 x 21.2 mm and 22 x 22 mm. The
R2205HA Version 7 series and R2205HB Version 7 series test reticles are used
together with process data files “22nUSRA” and “22nUSRB” for all types of
evaluations. However, process data files “VER10USRA” and “VER10USRB” are
used to display only the versions of process data files in the comment field in the
screen display, and cannot be used for exposure.

As an example, the meaning of process data file “22nUSRA” is shown below:

22: Maximum square exposure area 22 mm (6” reticle)

n: Wafer size (inch)
USR: Process data ID
A: Reticle name

NOTES
This process program is not supported by machines prior to NSR-2205i11 series.

For details about NSR accuracy, standards, measurement methods and

conditions, refer to the NSR Acceptance Test Methods and Conditions which is
submitted when a contract is signed.

To improve functions, the specifications and contents of the process data files
may be changed without notice.

4.1 PROCESS DATA FILE 22NUSRA

This section describes the process data which is included in process data file
“22nUSRA”.

4.1.1 STEP (For Stepping Evaluation)

The STEP file is used to evaluate stepping accuracy (positioning repeatability

accuracy) of the wafer stage. Parts of shots are overlaid and exposed to form X
and Y verniers for evaluation, as shown in Figure 4-1.

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X Vernier

Y Vernier

FIGURE 4-1 Stepping Exposure

4.1.2 MRB (For Mirror Bow Evaluation)

The MRB file is used to evaluate moving mirror bow correction measurement.

4.1.3 REG1 (For Overlay Evaluation)

The REG1 file is used for the first exposure when measurement is evaluated with
WGA, EGA, DD (LSA), and FIA.

4.1.4 WGA (For Overlay Evaluation)

The WGA file is used for the second exposure of overlay accuracy evaluation
with EGA (Enhanced Global Alignment) of LSA. With the wafer global alignment,
the WGA marks are used to perform an LSA search alignment. Also, 3-shot EGA
measurements in a wafer are performed with LSA, and the second exposure is
performed with the baseline shift method using the measurement results.

4.1.5 EGA (For Overlay Evaluation)

The EGA file is used for the second exposure of overlay accuracy evaluation with
EGA of LSA. With the wafer global alignment, the WGA marks are used to
perform an LSA search alignment. Also, 1 O-shot EGA measurements in a wafer
are performed with LSA, and the second exposure is performed with the baseline
shift method using the measurement results.

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4.1.6 DD (For Overlay Evaluation)

The DD file is used for the second exposure of overlay accuracy evaluation with
Die by Die (D/D) alignment of LSA. With the wafer global alignment, the WGA
marks are used to perform an LSA search alignment. Also, 2-shot EGA
measurements in a wafer are performed with LSA, and the second exposure is
performed on all shots that may be aligned with the baseline shift method using
the D/D measurement result of LSA.

4.1.7 FIA (For Overlay Evaluation)

The FIA file is used for the second exposure of overlay accuracy evaluation with
EGA of FIA. With the wafer global alignment, the WGA marks are used to
perform an FIA search alignment. Also, 1 O-shot EGA measurements in a wafer
are performed with FIA, and the second exposure is performed with the baseline
shift method using the measurement results.

4.1.8 MAT1 (For Matching Evaluation)

The MAT1 file is used for the first exposure of matching evaluation among the
same type of machines.

4.1.9 MAT2 (For Matching Evaluation)

The MAT2 file is used for the second exposure of matching evaluation among the
same type of machines. With the wafer global alignment, the WGA marks are
used to perform an LSA search alignment. Test reticle A is used for both the first
and second exposure. The second exposure is performed with the baseline shift
method.

4.1.10 RATE (For Stepping Rate Evaluation)

The RATE file is used for stepping rate evaluation.

4.1.11 THRPT1 (For Throughput Evaluation)

The THRPTl file is used for the first exposure during evaluations such as
THRPTW, THRPTE, THRPTD, THRPTF, ALRUN and ALRUNF.

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4.1.12 THRPTW (For Throughput Evaluation)

The THRPTW file is used for the second exposure of throughput evaluation with
EGA of LSA. With the wafer global alignment, the WGA marks are used to
perform an LSA search alignment. Also, 3-shot EGA measurements in a wafer
are performed with LSA, and the second exposure is performed using the
measurement results.

4.1.13 THRPTE (For Throughput Evaluation)

The THRPTE file is used for the second exposure of throughput evaluation with
EGA of LSA. With the wafer global alignment, the WGA marks are used to
perform an LSA search alignment. Also, 10-shot EGA measurements in a wafer
are performed with LSA, and the second exposure is performed using the
measurement results.

4.1.14 THRPTD (For Throughput Evaluation)

The THRPTD file is used for the second exposure of throughput evaluation with
D/D alignment of LSA. With the wafer global alignment, the WGA marks are used
to perform an LSA search alignment. Also, 2-shot EGA measurements in a wafer
are performed with LSA, and the second exposure is performed on all shots that
may be aligned using the D/D measurement result of LSA.

4.1.15 THRPTF (For Throughput Evaluation)

The THRPTF file is used for the second exposure of throughput evaluation with
EGA of FIA. With the wafer global alignment, the WGA marks are used to
perform an FIA search alignment. Also, 10-shot EGA measurements in a wafer
are performed with FIA, and the second exposure is performed using the
measurement results.

4.1.16 ALRUN (For Alignment Running Evaluation)

The ALRUN file is used for operation tests such as wafer alignment, wafer loader
prealignment, and reticle blind operation. With the wafer global alignment, the
WGA marks are used to perform an LSA search alignment. Two types of reticle
blinds are specified for each wafer.

4.1.17 ALRUNF (For Alignment Running Evaluation)

The ALRUNF file is used for operation tests such as wafer alignment, wafer
loader prealignment, and reticle blind operation. With the wafer global alignment,
the WGA marks are used to perform an FIA search alignment. Two types of
reticle blinds are specified for each wafer.

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4.2 PROCESS DATA FILE 22NUSRB

This section describes the process data which is included in process data file
“22nUSRB”.

4.2.1 TPR (For Test Print Evaluation)

The TPR file is used to calculate the proper focus and exposure time. Focus
offset 17 steps and exposure time 11 steps are used to stop the reticle blind and
to expose only the shot center. Because the TEST-2 wafer exposure mode is
used, a wafer is exposed by entering the center and step values of the exposure
time, and the center and step values of the focus offset. The exposure time and
focus offset value are increased or decreased by adjusting values from the map
center.

4.2.2 RESO (For Resolution Evaluation)

The RESO file is used to evaluate resolution on the entire wafer. The entire wafer
surface is exposed with the reticle blinds fully opened. The maximum exposure
area can also be evaluated at the same time. Because the NORMAL wafer
exposure mode is used, the exposure time and focus offset value are fixed.

4.2.3 RB (For Reticle Blind Evaluation)

The RB file is used to evaluate reticle blind setting accuracy. Exposure is

performed as shown in Figure 4-2, and blind scales from 8 points (minimum shot)
to 16 points can be measured. For a shot to be used for evaluation of the
maximum exposure area, exposure is performed with the reticle blinds fully
opened.

FIGURE 4-2 Evaluation of Reticle Blind Setting Accuracy (Blind Scales)

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4.2.4 LCM (For Magnification Evaluation)

The LCM file is used for collecting magnification data of lens controller accuracy
evaluation.

4.2.5 LCH (For Heat Evaluation)

The LCH file is used for heat evaluation of lens controller accuracy.

4.2.6 WLREP (For Wafer Prealignment Evaluation)

The WLREP file is used for evaluation of wafer prealignment repeatability. With
the wafer global alignment, the triple WGA marks are used to perform an LSA
search alignment.

4.2.7 WLRSIDE1 (For Wafer Prealignment Evaluation)

The WLRSlDE1 file is used for the first exposure of wafer prealignment
repeatability evaluation. This file is for use with the NSR in which the 90° OF
(orientation flat) is mounted on the wafer loader.

4.2.8 WLRSIDE2 (For Wafer Prealignment Evaluation)

The WLRSIDE2 file is used for the second exposure of wafer prealignment
repeatability evaluation. This file is for use with the NSR in which the 90° OF is
mounted on the wafer loader. With the wafer global alignment, the triple WGA
marks are used to perform an LSA search alignment.

4.2.9 ORT1 (For Orthogonality Evaluation)

The ORT1 file is used for the first exposure of orthogonality and straightness
evaluations of shot arrays and the interferometer moving mirror.

4.2.10 ORT2 (For Orthogonality Evaluation)

The ORT2 file is used for the second exposure of orthogonality and straightness
evaluations of shot arrays and the interferometer moving mirror. For exposure for
orthogonality evaluation, a wafer is loaded on the wager loader by rotating 90
degrees in the counterclockwise direction when viewed from the top of the wafer.
For exposure for straightness evaluation, a wafer is loaded on the wager loader
by rotating 180 degrees when viewed from the top of the wafer. In either case,
with the wafer global alignment, the single WGA mark is used to perform an LSA
search alignment.

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4.2.11 ORTSIDE (For Orthogonality Evaluation)

The ORTSIDE file is used for the second exposure of orthogonality evaluations
of shot arrays and the interferometer moving mirror. This file is for use with the
NSR in which the 90° OF is mounted on the wafer loader. With the wafer global
alignment, the single WGA mark is used to perform an LSA search alignment.

4.2.12 ORTM and ORTM90 (For Orthogonality Evaluation)

The ORTM and ORTM90 files are used for orthogonality measurements of shot
arrays and the interferometer moving mirror. To evaluate orthogonality, load the
first wafer (ORT1) for orthogonality measurement with the ORTM placing the OF
side in front, execute t-EGA measurement (FIA), and record the orthogonality
correction value (A).Next, load a wafer on the wafer holder with the ORTM90 by
rotating the wafer 90 degrees in counterclockwise direction when viewed from
the top, execute t-EGA measurement (FIA), and record the orthogonality
correction value (B). The orthogonality can be calculated using the following
equation:

Orthogonality of interferometer moving mirror = (A + B)/2 (µrad)

Orthogonality of shot arrays = -(orthogonality of interferometer moving mirror)

(µrad)

4.2.13 ORTMSIDE (For Orthogonality Evaluation)

The ORTMSIDE file is used to measure orthogonality of shot arrays and the
interferometer moving mirror. This file is for use with the NSR in which the 90°
OF is mounted on the wafer loader. The functions are the same as those of the
ORTM90.

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N11MCS-120 • Nikon Profiles of the Marks

APPENDIX A
PROFILES OF THE MARKS

The profiles of the marks descibed in the previos sections are shown below.

A.1 OVERLAY MEASUREMENT UNIT

Figure A-1 Overlay Measurement Unit

Version 1.0 A-1

N11MCS-120 • Nikon Profiles of the Marks

A.2 STEPPING UNIT IN OVERLAY MEASUREMENT UNIT

Figure A-2 Stepping Unit in Overlay Measurement Unit

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N11MCS-120 • Nikon Profiles of the Marks

A.3 VARIOUS MEASUREMENT MARKS IN OVERLAY MEASUREMENT UNIT

A.3.1 LSA-AMS X Mark

Main Mark Sub Mark Measurement Mark

20

Figure A-3 LSA-AMS X Mark

A.3.2 Box in Box Mark

Main Mark Sub Mark Measurement Mark

Figure A-4 Box in Box Mark

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N11MCS-120 • Nikon Profiles of the Marks

A.3.3 Bars in Bars Mark

Main Mark

Sub Mark

Figure A-5 Bars in Bars Mark

Version 1.0 A-4

N11MCS-120 • Nikon Profiles of the Marks

A.3.4 Moire Marks

Figure A-6 Moire X Mark

Main Mark Sub Mark Measurement Mark

Figure A-7 Moire Y Mark

Version 1.0 A-5

N11MCS-120 • Nikon Profiles of the Marks

A.3.5 FIA-AMS Marks

Figure A-8 FIA-AMS Mark

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N11MCS-120 • Nikon Profiles of the Marks

A.4 ALIGNMENT MARKS IN OVERLAY MEASUREMENT UNIT

A.4.1 LSA X 7 Multi-Mark

Figure A-9 LSA X 7 Multi-Mark

A.4.2 LSZ X 7 µm Pitch 1:1 Mark

Figure A-10 LSZ X 6 µm Pitch 1:1 Mark

Version 1.0 A-7

N11MCS-120 • Nikon Profiles of the Marks

A.4.3 LSA X 12 µm Pitch 9-Line Mark

Figure A-11 LSA X 12 µm Pitch 9-Line Mark

Version 1.0 A-8

N11MCS-120 • Nikon Profiles of the Marks

A.5 MEASUREMENT UNIT FOR STEPPING

Figure A-12 Main Pattern

Figure A-13 Sub Pattern

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N11MCS-120 • Nikon Profiles of the Marks

A.6 WAFER GLOBAL ALIGNMENT MARKS

A.6.1 LSA-Search X Mark

Figure A-14 LSA-Search X Mark

A.6.2 LSA-Search Y Mark

Figure A-15 LSA-Search Y Mark

A.6.3 LIA-Search I Mark

Figure A-16 LIA-Search I Mark

Version 1.0 A-10

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A.6.4 LIA-Search II Mark

Figure A-17 LIA-Search II Mark

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A.6.5 LSA, FIA Search Marks

Figure A-18 LSA, FIA Search Mark Type I

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Figure A-19 LSA, FIA Search Mark Type II

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N11MCS-120 • Nikon Profiles of the Marks

A.6.6 LIA/FIA Multi-Point Alignment Marks

Figure A-20 LIA/FIA Multi-Point Alignment Marks (Line Marks)

Version 1.0 A-14
N11MCS-120 • Nikon Profiles of the Marks

Figure A-21 LIA/FIA Multi-Point Alignment Marks (Square Marks)

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A.7 TTR ALIGNMENT MARKS

A.7.1 TTR Type I Mark

Input Coordinates

Shield Area

Figure A-22 TTR Type I Mark

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N11MCS-120 • Nikon Profiles of the Marks

A.7.2 TTR Type II Mark

Figure A-23 TTR Type II Mark

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A.8 RETICLE ALIGNMENT MARK

Figure A-24 Reticle Alignment Mark

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N11MCS-120 • Nikon Profiles of the Marks

A.9 RESOLUTION CHART FOR EXPOSURE CONDITION SETTING

A.9.1 Resolution Chart Position in Overlay Measurement Unit

Figure A-25 Resolution Chart Position in Overlay Measurement Unit

(Inside Circle)

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N11MCS-120 • Nikon Profiles of the Marks

A.9.2 Resolution Chart for Exposure Condition Setting

Figure A-26 Resolution Chart for Exposure Condition Setting

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N11MCS-120 • Nikon Profiles of the Marks

A.10 RETICLE BLIND SETTING ACCURACY EVALUATION SCALE

Figure A-27 Reticle Blind Setting Accuracy Evaluation Scale

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N11MCS-120 • Nikon Profiles of the Marks

A.11 RESOLUTION CHARTS

NOTE
Magnifications of photos in Figures A-28 and A-29 are different.

A.11.1 Normal Resolution Chart

Figure A-28 Normal Resolution Chart

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N11MCS-120 • Nikon Profiles of the Marks

A.11.2 Long Resolution Chart

Figure A-29 Long Resolution Chart (enlarged view)

Version 1.0 A-23