UF Package

20-Lead Plastic QFN (4mm × 4mm)

(Reference LTC DWG # 05-08-1710 Rev A)

0.70 0.05

4.50 0.05
3.10 0.05
2.45 0.05
2.00 REF

2.45 0.05

PACKAGE OUTLINE

0.25 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS PIN 1 NOTCH
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED R = 0.20 TYP
BOTTOM VIEW—EXPOSED PAD OR 0.35 ¥ 45
0.75 0.05 R = 0.05 R = 0.115 CHAMFER
4.00 0.10 TYP TYP
19 20

PIN 1 0.40 0.10

TOP MARK
(NOTE 6) 1

2.45 0.10 2
4.00 0.10 2.00 REF

2.45 0.10

(UF20) QFN 01-07 REV A

0.200 REF 0.25 0.05

0.00 – 0.05 0.50 BSC
NOTE:
1. DRAWING IS PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220
VARIATION (WGGD-1)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE