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Lect 04
Lect 04
546
Lecture 04
Resistance, Capacitance, Inductance
Spring 2022
Jose E. Schutt-Aine
Electrical & Computer Engineering
University of Illinois
jschutt@emlab.uiuc.edu
ECE 546 – Jose Schutt‐Aine 1
What is Extraction?
- + - +
-
+
+
- + - +
So we can provide:
Improved design of interconnects
Robust design guidelines
Faster, more cost effective design cycles
ECE 546 – Jose Schutt‐Aine 3
Field Solvers – History
1960s 1990s
Conformal mapping techniques Adapting methods to parallel computers
Finite difference methods (2-D Laplace eq.) Including methods in CAD tools
Variational methods
1970s 2000s
Boundary element method Incorporation of Passivity
Finite element method (2-D) Incorporation of Causality
Partial element equivalent circuit (3-D)
1980s
Time domain methods (3-D) 2010s
Finite element method (3-D) Stochastic Techniques
Moment method (3-D) Multiphysics Tools
rPEEC method (3-D)
ECE 546 – Jose Schutt‐Aine 4
Categories of Field Solvers
ECE 546 – Jose Schutt‐Aine 5
Capacitance
Relation: Q = Cv
Q: charge stored by capacitor
C: capacitance
v: voltage across capacitor
i: current into capacitor
dv dQ
i (t ) C
dt dt
1 t
v(t ) i ( )d
C 0
ECE 546 – Jose Schutt‐Aine 6
Capacitance
d
+
V
A : area
oA
C= d
o : permittivity
ECE 546 – Jose Schutt‐Aine 7
Potential and Charge Distribution
2 Poisson’s Equation
First find solution for infinitely small point source at origin
2 r
(r ) potential (known)
ECE 546 – Jose Schutt‐Aine 9
Method of Moments
Operator equation
L(f) = g
f = unknown function
g = known function
f nf n
n
ECE 546 – Jose Schutt‐Aine 10
Method of Moments
in terms of basis functions fn, with unknown coefficients to get
n
L (f
n
n n )g
Finally, take the scalar or inner product with testing of weighting
functions wm:
n
n wm , Lf n wm , g
n nm g m
l 1
ECE 546 – Jose Schutt‐Aine 12
Moment Method Solution
D
x ', y ', z '
x, y, z dx ' dy ' dz '
E 4 R
2
L
Green’s function G: LG =
ECE 546 – Jose Schutt‐Aine 13
Basis Functions
Subdomain bases
1 xn x xn
P xn 2 2
0 otherwise
x1 x2 xn
1 x xn x xn
T xn 2 2
0 otherwise
x1 x2 xn
ECE 546 – Jose Schutt‐Aine 14
Conducting Plate
Z
Y
2b
2b
2a X
Sn
2a conducting plate
a a
x ', y ', z '
x, y, z dx ' dy '
a a
4 R
ECE 546 – Jose Schutt‐Aine 15
Conducting Plate
Setting = V on plate
x x ' y y '
2 2
R
a a
x ', y ', z '
V dx ' dy '
x x ' y y '
2 2
a a 4
ECE 546 – Jose Schutt‐Aine 16
Conducting Plate
Basis function Pn
s s
1 xm x xm
2 2
s s
Pn xm , yn 1 yn y yn
2 2
0 otherwise
ECE 546 – Jose Schutt‐Aine 17
Conducting Plate
Matrix equation:
N
V lmn f n
n 1
Matrix element:
1
lmn dx ' dy '
xm x ' yn x '
2 2
xm yn 4
1 N
C n sn lmn
1
sn
V n1 mn
ECE 546 – Jose Schutt‐Aine 18
Parallel Plates
z
2a
x
d
2a
Subscript ‘t’ for top and ‘b’ for bottom plate, respectively.
ECE 546 – Jose Schutt‐Aine 19
Parallel Plates
Matrix equation becomes l mn
tt
ltbmn nt g mt
Solution: l l g nt
t tt tb 1
m mn
charge on top plate
Capacitance C
2V
1
2V top
n sn
t
C 2b l2
tt
l
tb 1
mn
mn
ECE 546 – Jose Schutt‐Aine 20
Inductance
Relation: = Li
: flux stored by inductor
L: inductance
i: current through inductor
v: voltage across inductor
di d
v(t ) L
dt dt
1 t
i (t ) v( )d
L 0
ECE 546 – Jose Schutt‐Aine 21
Inductance
Magnetic Flux
z
r
H
I R
Idl
ECE 546 – Jose Schutt‐Aine 22
2‐D Isomorphism
Electrostatics Magnetostatics
ECE 546 – Jose Schutt‐Aine 23
2-D N-line LC Extractor using MOM
s w
t
h
r
ECE 546 – Jose Schutt‐Aine 24
Output from MoM Extractor
Capacitance (pF/m)
118.02299 -8.86533 -0.03030 -0.00011 -0.00000
-8.86533 119.04875 -8.86185 -0.03029 -0.00011
-0.03030 -8.86185 119.04876 -8.86185 -0.03030
-0.00011 -0.03029 -8.86185 119.04875 -8.86533
-0.00000 -0.00011 -0.03030 -8.86533 118.02299
Inductance (nH/m)
312.71680 23.42397 1.83394 0.14361 0.01128
23.42397 311.76042 23.34917 1.82812 0.14361
1.83394 23.34917 311.75461 23.34917 1.83394
0.14361 1.82812 23.34917 311.76042 23.42397
0.01128 0.14361 1.83394 23.42397 312.71680
ECE 546 – Jose Schutt‐Aine 25
RLGC: Formulation Method Electrical and Computer Engineering
y
x
z
3 350 m
(x,y,z)
r=1
y=dn
n t 70 m
2 2
y=dn-1
n-1
y=dn-2 r=3.2 100 m
1 t
1
r=4.3 200 m
(x o ,y o ,z o ) 150 m
y=dm P.E.C.
P.E.C.
m
y=dm-1
m-1
y=dm-2
* Computationally efficient
• Reference
– K. S. Oh, D. B. Kuznetsov and J. E. Schutt-Aine, "Capacitance Computations in a Multilayered Dielectric
Medium Using Closed-Form Spatial Green's Functions," IEEE Trans. Microwave Theory Tech., vol. MTT-
42, pp. 1443-1453, August 1994.
ECE 546 – Jose Schutt‐Aine 26
Multilayer Green's Function
Optional Top Ground Plane
y=dNd
Nd, o Nd
y=dNd-1
y=d2
2, o 2 y
y=d1
1, o 1 x
y=0
Bottom Ground Plane
ECE 546 – Jose Schutt‐Aine 27
Extraction Program: RLGC
RLGC computes the four transmission line parameters, viz., the capacitance matrix C, the
inductance matrix L, the conductance matrix G, and the resistance matrix R, of a multiconductor
transmission line in a multilayered dielectric medium. RLGC features the following list of
functions:
ECE 546 – Jose Schutt‐Aine 28
RLGC – Multilayer Extractor
• Features
– Handling of dielectric layers with no ground plane, either top or bottom ground plane
(microstrip cases), or both top and bottom ground planes (stripline cases)
– Static solutions are obtained using the Method of Moment (MoM) in conjunction with
closed-form Green’s functions: one of the most accurate and efficient methods for static
analysis
– Modeling of dielectric losses as well as conductor losses (including ground plane losses
– The resistance matrix R is computed based on the current distribution - more accurate than
the use of any closed-form formulae
– Both the proximity effect and the skin effect are modeled in the resistance matrix R.
– Computes the potential distribution
– Handling of an arbitrary number of dielectric layers as well as an arbitrary number of
conductors.
– The cross section of a conductor can be arbitrary or even be infinitely thin
• Reference
– K. S. Oh, D. B. Kuznetsov and J. E. Schutt-Aine, "Capacitance Computations in a
Multilayered Dielectric Medium Using Closed-Form Spatial Green's Functions," IEEE
Trans. Microwave Theory Tech., vol. MTT-42, pp. 1443-1453, August 1994.
ECE 546 – Jose Schutt‐Aine 29
RLGC – General Topology
350 m
r=1
70 m
r=3.2 100 m
r=4.3 200 m
150 m
P.E.C.
ECE 546 – Jose Schutt‐Aine 30
3-Line Capacitance Results
3
t
2 2
t
1 1
P.E.C.
350 m
r=1
70 m
r=3.2 100 m
r=4.3 200 m
150 m
P.E.C.
ECE 546 – Jose Schutt‐Aine 31
Modeling Vias
l1
Possible P.E.C.
y=dn
Nd
y=dn-1
2 y
y=d1
1 x
l2 l3
y=0
Possible P.E.C.
Medium
Via
1.6 2
4 l2
4.02
50
l1
3.2
1 l3
50
4
4.02
ECE 546 – Jose Schutt‐Aine 32
Modeling Discontinuities
l1
l
l l1 l2
w1
w
ce ce
l2
w2
Open
Bend
l1 l3 l3
l1 l2
l1 l2 l1 l2
w1
w1 w2
ce l2 ce
w2
Step
T-Junction
ECE 546 – Jose Schutt‐Aine 33
3D Inductance Calculation
Loop Inductance
I
I
a
I
ak
I
1 1
Lloop
B da A da
I I a I a
QUESTION: Can we associate inductance with piece
of conductor rather than a loop? PEEC Method
ECE 546 – Jose Schutt‐Aine 34
Partial Inductance (PEEC) Approach
QUESTION: Can we associate inductance
with piece of conductor rather than a loop?
I
I
a
I
ak
I
4 4 1 dli dl j
Lloop dai da j
i1 j1 ai a j aia j li l j 4 ri rj
DEFINITION OF PARTIAL INDUCTANCE
1 dli dl j
L pij dai da j
ai a j 4 a a l l ri rj
i j i j
4 4
Lloop sij L pij
i1 j1
ECE 546 – Jose Schutt‐Aine 35
Circuit Element K
[K]=[L]-1
• Better locality property
• Diagonally dominant
ECE 546 – Jose Schutt‐Aine 36
Locality of K Matrix
h 1 2 3 4 5
w s
11.4 4.26 2.54 1.79 1.38 103 34.1 7.80 4.31 3.76
4.26 11.4 4.26 2.54 1.79 34.1 114 31.6 6.67 4.31
[ L] 2.54 4.26 11.4 4.26 2.54 [ K ] 7.80 31.6 115 31.6 7.80
1.79 2.54 4.26 11.4 4.26 4.31 6.67 31.6 114 34.1
1.38 1.79 2.54 4.26 11.4 3.76 4.31 7.80 34.1 103
ECE 546 – Jose Schutt‐Aine 37
Package Inductance & Capacitance
ECE 546 – Jose Schutt‐Aine 38
Package Inductance & Capacitance
ECE 546 – Jose Schutt‐Aine 39
Metallic Conductors
Area th
Leng
Re s ist an ce : R
Length
R
Area
Package level: Submicron level:
W=3 mils W=0.25 microns
R=0.0045 /mm R=422 /mm
ECE 546 – Jose Schutt‐Aine 40
Metallic Conductors
Metal Conductivity
-1 m 10-7)
Silver 6.1
Copper 5.8
Gold 3.5
Aluminum 1.8
Tungsten 1.8
Brass 1.5
Solder 0.7
Lead 0.5
Mercury 0.1
ECE 546 – Jose Schutt‐Aine 41
Dielectrics
Dielectrics contain charges that are tightly
bound to the nuclei
Charges can move a fraction of an atomic
distance away from equilibrium position
Electron orbits can be distorted when an
electric field is applied
+
+ E
- -
ECE 546 – Jose Schutt‐Aine 42
Dielectrics
Charge density within volume is zero
Surface charge density is nonzero
sp
D=o(1+e)E=E
ECE 546 – Jose Schutt‐Aine 43
Dielectric Materials
1
v
LC
tan
ECE 546 – Jose Schutt‐Aine 44
Dielectric Materials
r
1
v
LC
Material r v(cm/s)
Polyimide 2.5-3.5 16-19
Silicon dioxide 3.9 15
Epoxy glass (FR4) 5.0 13
Alumina (ceramic) 9.5 10
ECE 546 – Jose Schutt‐Aine 45
Conductivity of Dielectric Materials
r j i
Loss TANGENT : tan
ECE 546 – Jose Schutt‐Aine 46
Combining Field and Circuit Solutions
Network Macromodel
Field Solution
Description Generation
Circuit
Bypass extraction Simulation
procedure through the use
of Y, Z, or S parameters
(frequency domain)
ECE 546 – Jose Schutt‐Aine 47
Full‐Wave Methods
B
E Faraday’s Law of Induction
t
D
H J Ampère’s Law
t
D Gauss’ Law for electric field
B 0 Gauss’ Law for magnetic field
FDTD: Discretize equations and solve
with appropriate boundary conditions
ECE 546 – Jose Schutt‐Aine 48
FDTD ‐ Formulation
FDTD solves Maxwell’s equations in time-domain
E 1
H
t 0
H 1
E
t 0
H z
y
x E x E x
Ez
Ez
E y
H x
H y H y
E y
H x
Ez
E x E x
H z
E y
Space Discretization
ECE 546 – Jose Schutt‐Aine 50
FDTD – Yee Algorithm
c t
E i, j , k E
n
x
n 1
x
y
H zn1/2 i, j , k H zn1/2 i, j 1, k
z
c t
i, j, k 1
Ey
n 1/2 n 1/2
y H i , j , k H
z y y
Hz
x
Ex Ex
Ez Ez
Ey Hx
Hy Hy
Ey
Hx Ez
Ex Ex
Hz
c t n
Ey
H n 1/2
x i, j , k H n 1/2
x
y
E z i , j 1, k E z i, j , k
n
c t n1/2
z
E y i, j , k 1 E yn i, j , k
ECE 546 – Jose Schutt‐Aine 51
2D-FDTD
Ey
Ex
Hz
y
x
1
Enx i , j En1 i 1 , j t H n 1/2 i 1 , j 1 H n1/2 i 1 , j 1
2 x 2 o y z 2 2
z 2 2
1
Eny i, j En1 i, j 1 t H n1/ 2 i 1 , j 1 H n1/2 i 1 , j 1
2
y 2 o x
z 2 2
z 2 2
n1/2 1 1 n 1/2 1 1 t n 1 E n i 1 , j
Hz i
2 , j H i , j E i , j 1
2 2 2 o y 2 x
2
z x
t n 1 1
E y i 1, j Ex i, j
n
-
o x 2 2
ECE 546 – Jose Schutt‐Aine 52
Absorbing Boundary Condition: 2D-PML Formulation
ECE 546 – Jose Schutt‐Aine 53
Importance of the PML
Example: Simulation of the sinusoidal point source
PML is “on”
PML is “off”
ECE 546 – Jose Schutt‐Aine 54
Some Features of the FDTD
Advantages
• FDTD is straightforward (fully explicit)
• Versatile (universal formulation)
• Time‐domain (response at all frequencies can be obtained
from a single simulation)
• EM fields can be easily visualized
Issues
• Resource hungry (fields through the whole problem space
are updated at each step)
• Discretization errors
• Time domain data is not immediately useful
• Problem space has to be truncated
ECE 546 – Jose Schutt‐Aine 55
Pros of The FDTD Method
• FDTD directly solves Maxwell’s equations providing all
information about the EM field at each of the space sells at
every time‐step
• Being a time‐domain technique, FDTD directly calculates the
impulse response of an electromagnetic system. Therefore? A
single FDTD simulation can provide either ultrawideband
temporal waveforms or the sinusoidal steady‐state response
at any frequency within the excitation spectrum
• FDTD uses no linear algebra
• Being a time‐domain technique, FDTD directly calculates the
nonlinear response of an electromagnetic system
ECE 546 – Jose Schutt‐Aine 56
Cons of The FDTD Method
• Computationally expensive, requires large random access
memory. At each time step values of the fields at each point
in space are updated using values from the previous step
• FDTD works well with regular uniform meshes but the use of
regular uniform meshes leads to staircasing. Implementation
of nonuniform meshes, on the other hand, requires special
mesh‐generation software and can lead to additional
computer operations and instabilities
• Requires truncation of the problem space in a way that does
not create reflection errors
ECE 546 – Jose Schutt‐Aine 57
Numerical Dispersion
• Occurs because of the difference between the
phase speed of the wave in the real world and
the speed of propagation of the numerical
wave along the grid
ECE 546 – Jose Schutt‐Aine 58
Setting Up a Simulation
Main steps:
Discretize the problem space – create a mesh
Set up the source of the incident field
Truncate the problem space – create the
absorbing boundary conditions (ABC)
We are using (mainly): t T
2
0
Rectangular mesh
pulse e spread
Plane wave source with Gaussian distribution
Perfectly matched layer (PML) for the ABC
ECE 546 – Jose Schutt‐Aine 59
3D FDTD for Single Microstrip Line
Computational domain size: 90x130x20 cells
(in x, y, and z directions, respectively) T=100
ECE 546 – Jose Schutt‐Aine 61
Simulation of the Microstrip Antenna
Frequency‐Dependent Parameters
fft(inc)
• S11 for the patch antenna S11 ( ) 20 log abs
fft( ref )
ECE 546 – Jose Schutt‐Aine 63
Simulation of Microstrip Structures
• Source setup:
• Microstrip Patch Antenna
ECE 546 – Jose Schutt‐Aine 64
Microstrip Coupler
• Branch line coupler
• Scattering parameters of the branch line
coupler
ECE 546 – Jose Schutt‐Aine 65
Single Straight Microstrip
• Comparison with measured data
ECE 546 – Jose Schutt‐Aine 66
Single Straight Microstrip
• Simulation with length doubled (example of
what happens when the mesh is bad)
ECE 546 – Jose Schutt‐Aine 67
Single Straight Microstrip
• Simulation with the adjusted mesh
ECE 546 – Jose Schutt‐Aine 68
Meandered Microstrip Lines
• Test boards were manufactured
ECE 546 – Jose Schutt‐Aine 69
Simulation and Measurements
• Scattering parameters
for the m‐line #3
ECE 546 – Jose Schutt‐Aine 70
Comparison with ADS Momentum
• The line was also simulated with Agilent ADS
Momentum EM simulator
ECE 546 – Jose Schutt‐Aine 71
Comparison with ADS Momentum
• S21 parameters
ECE 546 – Jose Schutt‐Aine 72
References
• A. Taflove, S.C. Hagness, Computational Electrodinamics: The Finite –
Difference Time‐Domain Method. 3‐d edition. Artech House Publishers,
2005.
• D. Sullivan, Electromagnetic simulation using the FDTD method, IEEE
Press series on RF and microwave technology, 2000.
• D.M. Sheen, S.M. Ali, M.D. Abouzahra, J.A. Kong, “Application of the
Three‐Dimensional Finite‐Difference Time‐Domain Method to the
Analysis of Planar Microstrip Circuits”, IEEE Trans. Microwave Theory
Tech., vol. 38, no 7, July 1990.
ECE 546 – Jose Schutt‐Aine 73