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1984
Bailey, Eileen Wanjek M., "The effect of embossing process conditions on the surface properties of a
plasticized vinyl polymer." (1984). Masters Theses 1911 - February 2014. 2173.
Retrieved from https://scholarworks.umass.edu/theses/2173
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THE EFFECT OF EMBOSSING PROCESS CONDITIONS
ON THE SURFACE PROPERTIES
OF A PLASTICIZED VINYL POLYMER
A Thesis Presented
By
MASTER OF SCIENCE
February 19 8 4
ON THE
A Thesis Presented
By
Richard S. Stein
Richard J. Farris
\
Vinyl Polymers
Eileen M. Wanjek Bailey, B.S., Drexel University
i v
TABLE OF CONTENTS
ACKNOWLEDGEMENT
CHAPTER
I. INTRODUCTION -
Surface Structure ,
Background
b
Process Equipment
,g
VI. CONCLUSIONS 36
REFERENCES 37
APPENDIX 38
v
LIST OF TABLES
1. Effect of Moisture on Modulus and
Viscosity of Plasticized PVB Sheet
13
LIST OF ILLUSTRATIONS
Figure
1. Flow chart of Laminating Operation
6
2. Embossing Process 7
3. Embossed Surface as a Function of
Travel Time
8
4. Surface Temperature as a Function
of Travel ^
5. Surface Moisture Diffusion as a
Function of Travel Time 11
6. Experimental Embossing Process • . . ! 16
7. Die Lip Designs [ ;s
8. Embossing Roll Surface Pattern ?n
9. Surface Profile ] 25
10. Viscosity as a Function of Shear
Rate for Plasticized PVB 27
11. Surface Permanence as a Function
of Travel Time 30
12. Surface Permanence as a Function
of Travel Time and Viscosity 32
13. Schematic of Incremental Die
Flow Program 41
14. Schematic of Heat Transfer and
Moisture Diffusion Simulator 50
vi
CHAPTER 1
INTRODUCTION
shield .
1
temperature and rate at which polymer
a surface pattern
disappears in a heat treatment is very important and is
characterized by the property of surface permanence. In
industry, surface permanence is defined as the amount of
surface roughness that remains after exposure to 110°C for
Surface Structure
Backg round
Rolled Stored
U
23 - 27 C 4 - 7"C
22 - 25% RH 110°C
18 - 20 C Cooled to 27 C
cooling of surface,
moisture diffusion out of surface layer, and
relaxation of shear history.
4J
Q)
CD
pC
CO
cn
c
H
3
Q
<d
c
o3 a.
X! "H
U 2
CD 0^
c
H
^ 0
0) XI
a g
E W
CD
Eh 0
a
03 CD
4-1 >
fd
3
CO Eh
O
3
ON
•H
c
•H
M
3
Q
C
o
H
a -h
Q C
•H
cd cn
3 0
03 g
•H W
0
S o
CD
U rH
03 <U
4-1 >
03
W Eh
U
m
12
7
Moisture TG Modulus X 10 (dynes/cm
2
n * X 10
6
) (poises)
(% c 54
> ( ) 20 30 110-C 100 140V
0.17 26 8.1 1.02 0.158 4.00 2.10 0.925
Process Equipment
being cooled. The sheet was then stripped from the roll,
15
17
estimated gap. The die channel width was 3.0 in and the
1 I
w
in
c • •
0) o o
c
m
•
a o o
o o •
o
o 0)
>i
c
nj
on
o w
CM in lO 4J
c en
nt <
U
C
w
w
oj I o
c o O
H c «3 H
03 O • •
O o
u
< 0)
(/)
y
o
CU
M
3
n) CO
m c
U
M •H
M a 01
a 0)
a
a
•H
0J
•H
Q
cs
19
occasionally impossible.
stress of 883 psi. The nip pressure, 883 ps i , was cal cu-
lated based on nip dimensions 0.23 in width and 2.8 in
length. The width was determined by measuring the im-
pression made on carbon backed paper which was
squeezed in
the nip.
1 £ P, h . W ,
x M n w
d f f f
was assumed for this calculation and the die gap was esti-
tween 2.5 and 3.1 in and gauge was usually maintained be-
tween 0 . 027 and 0 . 035 in. The sheet was stripped by hand
.
22
SURFACE CHARACTERIZATION
multiplied by 100.
23
24
It—
lm * 5 x l
9 « 12mm
H, |tZ (
+ Z 2 +Z 3 + Z4 + Z 9 )
Hm *jlH +H 2 + H
3 + H4 + H )
|
5
MODELLING CALCULATIONS
26
28
at 150°C A = 160.0 s
at 190°C A = 16.0 s
at 195°C A = 12.7 s
at 200°C X = lo.l s
closer the die for a given travel time, the lower the
29
30
4-i Q)
0 O
C
c nj
0 4J
•H 01
4J
0 Q
C
3 a
03
0
<D
OJ *H
O Q
C
C C
ft ft
a
u 0)
a
•H
En
CD
U <H
9 « M-l >
< 2 U
5* * X ***
X xx o
-o
a
CD
•H
o
1
T
i 8 9
30N3NVNH3d %
31
>
03
u
Eh
4-1
0
c
0
•H
« i
o
c
3
w
rd
o
o
c
<DW
C 0
03 O
g CO
U -H
0) >
cu
T3
CD C
O 03
03
4-1 (U
sh e
3 -H
Cfi Eh
CM
8 u
3
•H
8
33
CHAPTER VI
CONCLUSIONS
REFERENCES
D ly and K TSang
^o "Structural Time Dependency
Behavior of Molten Polvm^rc „ JP enaenc y
In nH
in the Rheological
i
' ' e
Applied Polymer Science 26 (1981): ° Urnal ° f
U4?-U58?'
J. LFulton, H. H Hopfe, R. H Mosher,
.
K. .
R. Nickolls
"Sheeting Die/Embossing Process Development
Proprietary Report):
, " Monsanto
(MonsaJto
1979.
H. Hopfe, "Unsteady Heat and Mass Transfer
H.
in Two Dimen-
sions of a Curved Body," (Monsanto
Proprietary Report):
37
APPENDIX
38
APPENDIX A
NOMENCLATURE
Designation
Units
Heat flux .. -2
wm
Mass concentration of
%
Specific heat Dm K
3 -l
Equilibrium moisture concentration %
Mass diffusivity for water in PVB m
2//s
Thermal conductivity Wm~ K"
1 1
change in length m
Change in pressure across L pa
Vapor pressure of water pa
Vapor pressure of water @ dew point Pa
Vapor pressure of water @ temp. "T" Pa
Relative Humidity %
Temperature of melt at entrance to
flow increment °F
Temperature of melt at exit of flow
increment °F
r - t k
Air temperature °C
Temperature °F
Plastic sheet bulk temperature °c
Temperature °r
Metal shell temperature °c
Water temperature °C
Overall heat-transfer coefficient Wm~ 2 K~ 1
Melt velocity M/S
Thermal diffusivity cm 2 /s
Shear rate 1/s
Viscosity @ zero shear rate pa s
Residence time s
Time constant for viscoelastic
material s
Density Kg m~
Shear stress Pa
Shear stress as ? oo Pa
40
APPENDIX B
t y<£) C
t =
^
k 1/k
( 1 - (-^) )
OO
fied rate.
The length and the height of the flow channel are divided
5
O
rH
p4
•H
Q
03
P
C
e
LjJ UJ o
c
Q Q
M-l
0
0
•H
T (\J
c
v 6 n
<U Cn
jC0
U M
T J-i
OsJ _
42
£2!UTn
Az
- Tn ) L fTn-l -
EtLLIttMLLIn-j -
gLLSUu ,
n
iy 2Ay
'
D=
^ 2Ay 2
T n-l-2T
n
+ T
n+1 )
+ ^TAz
n
+ TY .
(U T W - * U m T^
W UJJ - UmTD) + ty ,
where:
Uw =
Um = (melt)
zrrsr~ ;
*r
44
APPENDIX C
Material Specs for Embossing
Equipment
ON ^
a •
— i
<x,
CL
Q_
<:
in
3
E
I
• •••••• • ••'•odd • •••••• »W
SI
•••••• • •• • • • J • • ••••«« a • •
s
8ti
o
u
00 0
SI
Si r-
1
mm — ^ *.
a
-
^^^^ww * m ^ ww v
Si
5i
-i
•
^ W flD » y^i/!^^»^^»*ri
••••
• • * • • •
^ — «N *c ^ c
s o••••••
f
r« ^ ^ v
i
oo r» r> 5£ * 2 £ 2 2 V 1^ u*
» ** « »
r« ^» — M_ • xi ?
If
UJ
1
XX^ X X ^ — X H u~
'
P*- f**
^ . IN IN
^ Nx r>i f~
i? W1 i/" 1
i-"
«r * *r
SI
rs IN x « - S.
J~
-T
J~ X X X
*>
'X X -T .T i/i JJ IN IN ^*INlNIN(Nr^w^»» <N rN ——
Q - 9 fl» s OP oe «« « x»>ss«««« 0 i""1 3 S
O — I
0* — ^SlN^i/'g-i^^ X V P* ^^U^^s^U^^^^'^lNlNr^as^m*
X r» x x x x ^ u~i IN INlT /I ^ ^ ^ IN IN ^
U*^ ^ f-i f~> if*
5
IN (N p» v * ^ in
im
it ii (N
«4 ~
ii i
SI U w
iuim C 3
0 0
X 00
J S5 c m
rsi <n J
IN (N (N P i^ —X
<S
^ 01 ^ ^ f» N N (N
— —.<T>iT'^^xX'*^^^
(ft
) Xir-r-i— ^ ^ X>
^^
X> *j C t-
|f
w Q.
• t
"^^%©l»»r^fft»<NfNI<Nr>l^ ^I^IN<N-« ——— —a* — p W
pj»
13*1
-
P- X- • PI ^^
»^ W iTUI Wl
48
APPENDIX E
H
TW-
= Va • VT - s K
49
Boundary Conditions:
Case 1: Case 2:
Tw = 39 C @ X=» 0 Ta = 27 C
Tw
Tp = 199°C Tp = 199 C
Ta = 27 C a X= 6 Ta = 27 C
acqui si t ion
3C = 2 D • V C
36
RH = 100.0 p.
-dp-
P
T
for. RH < 8 0%
Boundary Conditions
52
1 at X a 0 c = 0 contact rolls
x = 6
2 at x = 6 /2 ac/3 x = 0