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US3605262
US3605262
US3605262
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INVENTOR.
4A1/M1 GW.171
. BY 4- 4.4.4.
1772AM's
United States Patent Office 3,605,262
Patented Sept. 20, 1971
1. 2
3,605,262 bond of high strength is obtained and characterized
PRODUCTION OF RIVETTYPE further in that the bond resists separation, de-stripping
BMETAL CONTACTS or delamination at the interface due to thermal shock
Akira Shibata, Tokyo, Japan, assignor to Chugai and/or constant aggravated use in service.
Electric Industrial Co., Ltd., Tokyo, Japan
Filed Nov. 14, 1968, Ser. No. 775,649 Another object is to provide a method for producing
Claims priority, application Japan, Aug. 2, 1968, bimetal contacts of the rivet type of improved life in
43/54,693 Which both the contact metal forming the top of the rivet
U.S. C. 29-630C
nt. C. H0r 9/16
4 Claims and the metal forming the base material are generally
mutually responsive to cold-pressure bonding but not suf.
O ficient to assure good bonding strength capable of with
ABSTRACT OF THE DISCLOSURE
standing de-stripping, delamination or separation at the
interface. Thus, the method resides in the use of a novel
A rivet-type bimetal contact is produced by coaxially combination of operational steps in which the bonding
Superposing a linear piece of a ductile precious contact strength is improved to overcome the disadvantages inher
metal onto the end face of a different ductile metal with 5 ent in previous methods.
its opposite end anchored in a die, the contact faces of These and other objects will more clearly appear when
the two metals being freshly cut. The contact metal is taken in conjunction with the following disclosure and
axially upset by applying impact pressure to deform and the accompanying drawings, wherein:
flatten the superposed metals at least 20% of their height, FIGS. 1 to 3 illustrate one preferred embodiment in
and preferably at least 30 or 50%, to bring the cut faces 20 carrying out the novel method; and
into intimate and crystallographic contact whereby the FIG. 4 shows graphically the interrelation of pressure,
interface is increased in area and effect cold bonding of temperature, hardness, deformation and heating current
the two faces, and then immediately heating the two as a function of time in carrying out the novel combina
metals to an elevated temperature below the melting points tion of operational steps of the method provided by the
25 invention.
of the metals but above the recrystallization temperature
while under pressure to complete the deformation and In the method of the invention, the rivet type bimetal
form a high strength bond at the bimetal interface. contact is produced by coaxially superposing a linear piece
lom
of a ductile precious contact metal onto the end face
of a different ductile metal whose opposite end is supported
This invention relates to a method for producing bi Snugly within a die opening. The contacting end faces of
metal electrical contacts of the rivet-type by pressure the two pieces are freshly cut before contacting them in
bonding and, in particular, to a novel method for produc order to optimize the bonding between them. The contact
ing bimetal contacts characterized by high resistance to metal is then axially upset by the application of impact
thermal shock and high strength at the bonding interface. 35
pressure to deform or flatten the contact metal together
The contact metals employed in the rivet-type bimetal with the exposed portion of the base material, the amount
provided by the invention include the ductile precious of deformation being at least 20% of their height and,
metals silver, platinum, gold, palladium and alloys based preferably, at 30 or 50%, in order to bring the cut end
on these metals; while the metal making up the base faces into intimate or crystallographic contact, the area
material of the bimetal rivet includes such metals as iron, 40
at the interface being increased substantially beyond the
mild steel, silver and silver alloys, nickel, nickel silver, original diameter of the contact metal and the base ma
aluminum and aluminum alloys, copper and copper alloys terial. By crystallographic contact is meant bringing the
such as copper-zinc alloys, and the like. end faces as close as 4 angstroms, more or less, as a result
In a copending application Ser. No. 788,258, filed Dec. of which some cold bonding is set up due to molecular
31, 1968, a method is provided for pressure-bonding a 45 attraction. At this stage of upsetting, a balance is achieved
precious contact metal to a base material of another metal between the applied pressure and the deformation resist
in which the metals are mutually responsive to cold ance of the two metals. Immediately or substantially
pressure-bonding, the bonding being preferably performed instantaneously after the upsetting, heat is applied elec
at the interface between freshly cut surfaces. The elec rically to the deformed superposed metals while still under
trical bimetal contacts produced by this method exhibit 50 pressure to raise the temperature at the interface to above
relatively better electrical and heat conductivity prop the recrystallization temperature but below the melting
erties compared to similar contacts produced by such points of the metals to complete the deformalion and effect
conventional methods of soldering, spot welding or by metallurgical bonding at the interface with little or no
metal in-laying. However, such pressure-bonded contacts diffusion of the metals at the interface. This metallographic
tended to separate, de-strip or delaminate at the interface 55 condition is important as it provides a clean interface
with constant and aggravated use and when subjected to having good electrical and heat conductive properties and
thermal shock due to stresses set up at the bonded inter improved resistance to de-stripping or separation during
face. aggravated service under conditions involving thermal
It is thus the object of this invention to provide an shock and stress. In a preferred aspect of the invention,
improved bonding technique for producing bimetal con 60
a die punch or header is employed having a cavity of
tacts of the rivet type characterized in that an interfacial predetermined volume within which the contact metal is
3,605,262
3 4.
confined during deformation so as to assure the final shape base material can be vigorously cold worked or deformed
and dimensions of the bonded contact. to lower their recrystallization temperatures substantially.
The advantage of axially cold deforming the contact Thus, as stated hereinbefore in the case of highly de
metal against the base material or substrate is that clean formed silver, the recrystallization temperature may be
metal contact during initial compression is assured with below a few hundred C., e.g. 200° C. to 300° C. or even
the substrate. Moreover, before heat is applied to the lower.
compressed contact metal and base material, an intimate The pressure is first applied by the punch until a rela
crystallographic contact is assured between the two metals tive balance is obtained between the applied pressure and
at the interface. Apparently, because of the vigorous metal the deformation resistance of the contact metal. As shown
flow which occurs under high pressure along the inter O in FIG. 2, the punch approaches die 4 (which is water
face, the contact metal is intimately and crystallographi cooled) to effect some deformation without touching it,
cally brought in contact with the end face of the base following which a high current is immediately applied
material, the distance, as stated hereinbefore, between across the punch and die, causing the metals to heat to
the two metals at the interface being of the order of a above the recrystallization temperature at and to each side
few angstroms, for example, as close to 4 angstroms, 15 of the interface and flow still further and fill up the cavity
more or less. While such closeness of metal surfaces will completely as shown in FIG. 3 to form the bimetal rivet
result in some cold bonding, this by itself is not sufficient between the punch and die shown in FIG. 3. During cold
where optimum resistance to thermal shock and aggra compression, the contact metal flows along the interface
wated use are important. However, since there is a highly 1A between it and the base metal 2 to provide intimate
cold worked region at the interface due to the vigorous 20 crystallographic contact with the substrate, that is to say,
flow of contact metal along the interface, the immediate contact in which molecular forces of attraction come
application of heat to the contact metal to raise it to a into play, following which the deformed metals are imme
temperature above its recrystallization temperature while diately heated and the remainder deformation completed
still under pressure results in immediate recrystallization (FIG. 3) and bonding effected at the interface with prac
of the cold worked region at the interface which leads to 25 tically no or minimum diffusion of the metal into the
a strong crystallographic bond. other across the interface. By first applying the pressure
Where the contact metal is silver and where it, together on the cold metals, the inflow of the ambient atmosphere
with the exposed base material, has been cold deformed, is prevented and, thus, oxidation is avoided along the
for example, at least about 50% or higher in height before clean interface during the heating step as punch 3 meets
being heated, its recrystallization temperature is usually 30 the surface of die 4. As stated hereinabove, the voltage
very low and may be as low as a few hundred degrees necessary to supply the current is substantially instan
centigrade. It must be remembered, however, that the taneously applied before punch 3 meets die 5. The cur
vigorous metal flow of both metals which occurs along rent flow between punch 3 and die 5 causes the metals to
and at the interface may be of a higher order of deforma heat up and deform further. Since the partially deformed
tion than the metal away from the interface so that it 35
metals immediately soften upon heating, metal flows
may recrystallize at a more rapid rate and provide highly quickly to fill up the punch cavity and while bonding
improved bonding with the metal substrate at the inter cleanly to the base material.
face during the initial stages of heating under pressure. The amount of heat necessary is easily determined by
The heating takes place in the order of up to about a trial and error so long as the temperature exceeds the
few hundred milliseconds by passing a high Surge of heat 40 recrystallization temperatures of the metals and is below
ing current across the interface for time periods of, for the melting points. If the temperature does not exceed the
example, 20 to 150 or 200 milliseconds. Very strong bonds recrystallization point of the metal, then the metals will
have been obtained with such short time heating. Recrys not flow appreciably at the interface and a high strength
tallization takes place simultaneously in both materials bond may not be obtained. On the other hand, if melting
which results in reduced working strain and minimizes the to any degree occurs at the interface, substantial diffu
formation of a diffusion zone at the bonded Surface. Thus, sion is apt to occur across the interface leading to the
by having an unstressed interface coupled with improved disadvantages which are encountered in spot welding,
bonding, resistance to thermal shock is maximized. soldering or brazing. Assuming the total height to be de
Referring now to the drawings, and, in particular to formed is 4 mm., exclusive of the metal in the die, it might
FIG. 1, a linear piece of ductile contact metal 1, e.g., a first be deformed to a height of 2 mm. (50% reduction
segment of a wire, of a precious metal, such as silver, 50 in height) and immediately heated to above the recrystal
platinum, gold, palladium or alloys based on these metals, lization temperature while under pressure and the height
is provided with a freshly cut end face 1" as shown. The then further reduced to 1 mm. to cause the metal to fill
linear piece or wire segment 1 is coaxially superposed up the cavity and bond itself still further at the interface
upon a corresponding linear piece or wire segment of a during completion of recrystallization. As will be apparent
base material of a different ductile metal 2, such as silver, 55 from FIG. 2, when substantial deformation is effected
nickel, aluminum, copper and the like, which similarly so that the interface A increases in area to achieve crys
has a freshly cut end face 2', the two freshly cut end tallographic contact, the electrical resistance R at the in
faces being in contact with each other. The shank of the terface may be equal to or lower than the resistance R
base material is anchored or snugly fitted within a die and R2 of the contact metal and base material respective
opening 4A and backed up by a supporting pin 5, leaving 60 ly. Thus, when a difference in electrical potential is applied
exposed a portion for deformation having a height lig across the contact metal and the base of the rivet, both
corresponding to height h of the contact metal. The two metals are heated to above the recrystallization tempera
superposed pieces are located between a vertically mov ture and below the melting point without high resistance to
able upper punch 3 and lower die 4, the upper punch heat generation at the interface of the deformed metals.
having a metal-forming cavity 3A, located Substantially 65 This contributes to forming a uniform and strong bond
centrally at the end face thereof. The contact metal and at the interface of both metals. In addition, the heating
the exposed base material have at least the same volume eliminates cold work strain which renders the bond more
as that of the punch cavity, except that the total height stable under conditions of thermal shock in use.
h1 and h is greater than the depth of the cavity so that The factors which enter into the method of the inven
the metals can be reduced in height at least greater than 70 tion are illustrated in FIG. 4 which relates the hardness
20%, generally at least more than 30% and, more pref 10, deformation 6, temperature 9, pressure 7 and current
erably, at least about 50% and higher. The metals are 8 as a function of time. As the pressure is applied as shown
deformed by bringing down the punch as shown in FIG. in FIGS. 1 and 2, the pressure rises to the level b and is
2. Depending upon the amount of impact pressure and maintained at that level as shown for upwards of one
speed of punch 3 against die 4, the contact metal and the 75 second, more or less. In the meantime, the hardness 10
3,605,262
5 ' -
rises to the level shown as the metal is deformed to the axially Superposed on top of the supported silver piece,
level a, e.g. 50%, shown in curve 6 and continued at that the contacting end faces of both pieces having previously
level to c. Immediately after the metals have been cold been freshly cut. Punch 3, having a cavity 3A of about
deformed to the level a, heating current is applied to a 3 mm. in diameter and a depth of 1 mm., is brought verti
level e-f for several hundred milliseconds. The tempera cally down in contact against the platinum contact metal
ture of the metals still under pressure rises as shown in and impact pressure applied to upset the superposed
curve 9 and reaches an optimum level above the recrystal metals until the interface between the silver base material
lization temperature of the metals. As the metals heat up and the platinum is increased in diameter by deformation
above the recrystallization temperature while under pres to approximately 2.7 mm. Immediately, at this point,
sure, they deform still further and fill up the punch cavity O While the pressure is still applied, a voltage of 2.5 and
as shown by the deformation increase from c to don curve a current of 180 amperes are applied between the punch
6 due to the softening of the metals (note the hardness and the die for a period of 15 milliseconds to cause the
drop of curve 10 following application of heating). At f temperature to rise to 320° C. which is above the recrys
of curve 8, the current is shut off and the temperature tallization temperatures of the metals. As a result of the
drops as shown in curve 9, the pressure thereafter being 5 heating, the metals deformed further under the com
relieved as shown by curve 7. As stated above, the cycle pression load to produce a composite platinum-silver
may be carried out over a total time of about one second bimetal contact of the rivet type having a head dimension
or so, the heating being carried out within the total cycle of 3 mm. in diameter and 1 mm. in thickness and an ex
over a time period of up to about several hundred, e.g. tending shank portion of silver of 1.5 mm. in diameter
200, milliseconds or more. 20
and 1 mm. long.
As illustrative of the novel method for producing bi
metal contacts of the rivet type, the following examples The contact was subjected to thermal shock and then
are given: left in a furnace at 700° C. for 30 seconds. Upon re
EXAMPLE 1. moval from the furnace and cooling, the contact was
A linear piece of copper, e.g., a wire segment having a 25 crushed with a vise around the top or head portion and
diameter of 2 mm. and a length of 4 mm. is snugly inserted an attempt made to de-strip the platinum contact with
into die opening 4A (note FIG. 1), leaving a 2 mm. por a pair of pincers or pliers. No stipping occurred at the
tion of the piece exposed above the die, the inserted por interface, thus indicating that the bond was of very good
tion being backed up or supported by die pin 5. A linear 30
quality, had high strength and resisted thermal shock.
piece of silver 2 mm. in diameter and 2 mm. high is co
axially superposed on top of the supported copper piece, EXAMPLE 3
the contacting end faces of both pieces having previously
been freshly cut. Punch 3, having a cavity 3A centrally A linear piece of silver or wire segment of about 1 mm.
located at its compacting face of about 4 mm. in diameter 35
in length and 1.5 mm. in diameter is inserted at its shank
and 1 mm. deep, is brought vertically down in contact end into a 1 mm. opening of die 4 to a depth of 0.5 mm.,
against the silver contact metal and impact pressure ap leaving a length of 1 mm. exposed for bonding with a
plied to upset the superposed metals until the interface linear piece of a gold-silver alloy containing 10% gold
1A is increased in diameter to approximately 3.6 mm. having a diameter of 1 mm. and a length of 1 mm. A
(note FIG. 2). Immediately thereafter, a voltage of about 40 freshly cut end face of the gold alloy was placed in con
2.2 and a current of 250 amperes are applied between the tact with a freshly cut end face of the supported silver
punch and the die (which is preferably water cooled) for piece, the gold alloy being coaxially superposed onto the
a period of about 300 milliseconds to heat the metals at silver base material and the two subjected to axial com
least at the interface to 280° C. (above the recrystalliza pression by bringing punch 3 vertically down upon the
tion temperature) while under pressure and the deforma 45 exposed end of the gold alloy piece, the metal forming
tion completed by additional metal flow due to softening cavity of the punch being 2 mm. in diameter and 0.5
or annealing of the metal above the recrystallization tem mm. deep. As a result of the deformation, the freshly
perature. The bimetal contact produced had a top or head cut end surfaces are brought into intimate and crystal
dimension of about 4 mm. in diameter and 1 mm. thick lographic contact, wherein the diameter at the interface
and an extending shank portion of copper 2 mm. in diam 50
is increased to approximately 1.8 mm. Immediately foll
eter and 2 mm. long. lowing, while the pressure is still applied, an alternating
The bimetal rivet produced in accordance with the current of 2 volts and 120 amperes is applied for about
foregoing method was incorporated in a relay for a de 10 milliseconds to raise the temperature to 350° C.,
stripping or a delamination test. An alternating current which is above the recrystallization temperatures of the
of 200 volts, 50 amperes and a power factor of about 0.3 55
metals, and the metals compressed and deformed to fill
was applied and at this power load (about 3000 Watts) an the cavity up completely. The finished bimetal rivet had
oscillating opening and closing test was carried out at the a head diameter of 2 mm. and a thickness of 0.5 mm.
rate of 1,200 times per hour. After a total of 50,000 OS and a shank length of 0.5 mm. with a diameter of 1 mm.
cillations of making and breaking contact, no de-stripping
or separation of the contact metal was observed. 60 The bimetal contact produced in accordance with the
However, in a test conducted where the bimetal rivet foregoing example was subjected to a shearing test at the
was made by cold bonding only, the contact metal Sep interface bond, resulting in a failure by shear at a load
arated or de-stripped from the base material after only of 28 kg/min, which is indicative of a strong bond.
2,000 of opening and closing of the relay. This is an im 65
Additional examples were prepared using such con
provement in life of substantally over 25 times, keeping tact metals as Ag-Cd (13%); Au-Ag-Pt; Au; Ag-CdO
in mind that the bimetal contact of the invention did not (10%); Ag-Ni, Au-Ag-Ni; Ag; Au-Ni; Ag-Pd; etc. These
fail. examples are itemized in Tables I, II and III. Table I sets
EXAMPLE 2 forth the materials, their dimensions and the die and punch
70 dimensions. Table II sets forth the degree of cold deforma
A linear piece of silver having a diameter of 1.5 mm. tion (increase in diameter of the interface) before the ap
and a length of 3 mm. is snugly inserted at its shank plication of heat, the amount of power employed for the
end into the die opening 4A and supported by die pin 5 heating, the time of power application and the tempera
to provide an exposed portion 2 mm. high. A linear piece ture to which the metals are heated; while Table III gives
of platinum 1.5 mm. in diameter and 2 mm. long is co 75 the finished dimensions of the bimetal contact and a brief
3,605,262
7 8
summary of the test results. The symbol stands for diam Ex. Nos. 4, 9 and 10 that the relay test conducted using
eter, l is length and h is height. an alternating current of 200 volts, 50 amperes and a
TABLE I
Dimensions of
Material linear piece Length of
insertion Cavity of
Example Contact, Contact, Base, in die, punch,
Number percent Base ll. Ill.
4------------------ Ag-Cd (13). Cu 2.54 x 2 2.54 x 4.5 2.5 51 x Lh
All 69-------
5------------------ 1.2 x 2. 1.2 x 3. 1 1.0 2.5 x 1.