Detector Manual - Part1

Cobra®
Banknote Sorting Machine

Detector Service Manual
TP09311011 Rev 04 December 2003

Proprietary Rights Notice All Rights Reserved. This material contains items of technical information, advice, know-
how, drawings, designs, and specifications that embody substantial creative efforts and con-
fidential information, ideas, and expressions, all of which remain the valuable properties and
trade secrets of De La Rue International Limited. This duty of confidence also entails that
this material shall not be disclosed to a third party, or reproduced or transmitted in any form
or by any means, electronic, mechanical, or otherwise, including photocopying and record-
ing, or in connection with any information storage or retrieval system, without written con-
sent of De La Rue International Ltd.
The above duty of confidence also entails a prohibition of reproduction of this text without
specific authority, in writing, from De La Rue.
Manual Updates Look online for updates to this or other manuals at www.askdelarue.com. This website
contains additional resources, including Technical Bulletins produced by De La Rue. The
website requires a user ID and password. If you do not have access to this website, you can
apply by sending an e-mail to askdelarue@uk.delarue.com and completing a form.
Trademarks Cobra® is a trademark of De La Rue International Ltd.

Loctite® is a registered trademark of Henkel Consumer Adhesives, Inc.
Melinex® is a registered trademark of Dupont Teijin Films.
MS-DOS®, Windows® 95, Windows® 98, Windows NT®, and Windows® for Workgroups are
registered trademarks of Microsoft Corporation.
PerkinElmer® is a registered trademark of PerkinElmer Inc.
Polyart® is a registered trademark of ARJOBEX North America.
© December 2003 De La Rue International Ltd.
Walton Road, Farlington

Portsmouth, Hampshire PO6 1TJ, England
Telephone: +44 023 9238 3161
Telefax: +44 023 9232 5822
www.delarue.com
Revision History
Rev Level Issue Date Reason for Reissue
001 Initial Release
002 August 2002 Various updates in functionality.
003 June 2003 Addition of Section 16, Contact Image Sensor.
004 December 2003 Product functionality revisions:
Section 16, Contact Image Sensor, addition of section “Loading White

Correction Calibration Data”
Revision of Section 16 Parts List to add Thickness “B” document
Usability revisions (unrelated to product functionality), for example:
Updating cross-references
Standardisation of information organisation
Consistent heading usage
File size optimisation
Revisions to the front matter including copyright statements
Change of document category to service manual
Detector Service Manual TP09311011 Rev 04 December 2003 Page i

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Page ii Cobra Banknote Sorting Machine

Safety Issues
Safe Operation of Sorter The Cobra banknote sorter is a high-voltage electromechanical device.
Equipment Exercise caution while working in and around the system. Use the equip-
ment only as designed for use. To ensure your personal safety, review
this section carefully to understand appropriate operating practices before
operating the sorter. Make sure anyone who operates the sorter equip-
ment understands this material.
Operators should have accreditation by authorised De La Rue personnel

and, for their own safety, personnel should not operate the equipment
under any circumstance without formal training.
General Precautions Always turn power off before servicing.
Always remove keys from the sorter doors to prevent unauthorised

entry and operation by untrained personnel.
Never allow coffee, water, or any other liquid near the equipment
(unless required for cleaning or lubricating).
Never smoke while operating the equipment.
Personal Apparel Avoid, when possible, loose-fitting clothing, long hair, and jewelry
that can become tangled in the equipment and cause injury.
Always secure long hair with bands or clips.
Remove neckties, scarves, and jewelry when operating the sorter. If

you are required to wear a necktie or scarf, make sure it is clip-on
only.
Emergency Stop The equipment provides Emergency Stop switches that cannot be over-
ridden. The Emergency Stop switches are red push-type switches with a
yellow plate and, when activated, stop the machine if it is running and pre-
vent the machine from re-starting until de-activated. The intent of the
Emergency Stop button and any door/panel or cover interlocks is to keep
the Operator safe.
Note: In some systems, the Emergency Stop controls mechanical movement for
the transport only. Some components outside the transport can continue to oper-
ate with an activated Emergency Stop.
Press the Emergency Stop button to disable the transport motors

before cleaning the transport.
Transport System Open the sorter covers only when necessary.
Turn the sorter off before opening any covers.
Verify that the sorter has completely stopped before opening sorter
covers.
Never operate the sorter with interlocks disabled. That is, always
keep interlocks enabled while running the sorter.
Always keep strapper covers on during processing.
Detector Service Manual TP09311011 Rev 04 December 2003 Page iii

Always keep the strapper interlocks enabled while running the trans-
port.
Moving Parts Always keep hands clear of any moving mechanisms.
Never put your hands into the sorter where you are unable to see
them.
Never wrap cleaning cloths around your fingers or hands when

cleaning the sorter or the sensors.
Always keep strapper covers on during processing.
Always keep the strapper interlocks enabled while running the

sorter.
Keep hands and fingers clear of the strapper while operating.
Be sure hands and fingers are clear before pressing any strapper
button when clearing strapper faults.
Power Boxes, Batteries, and Access to power boxes should only be for trained, authorised personnel.
Switches
Remain aware of the dangers of arcing and burns from high-energy
components, such as batteries and Power Supply Units (PSUs).
Do not use cable or wire color as an indicator of the voltage or polar-

ity. Instead, use the wire number in conjunction with wiring dia-
grams/schedules and use a voltmeter to check whether the wire,
cable, or terminal is live before touching.
Install wall isolation switchgear in accordance with local regulations

and standards. The wall isolation switchgear must be capable of
being disconnected or locked in the Off position.
Always turn the main breaker Off unless troubleshooting electrical

distribution.
Always turn power Off before doing the following:
z Opening any power box doors
z Removing safety guards
z Touching any wire
z Removing connector inserts
z Disengaging or attempting to engage connectors
ESD and EMC Considerations Use normal precautions regarding Electrostatic Discharge (ESD)
sensitive Metal-Oxide Semiconductor (MOS) components to mini-
mise the risk of damage to these devices:
z Wear a personal grounding device, such as an ESD heel or

wrist strap before removing or installing MOS components.
z Work on MOS components in an antistatic workstation

equipped with antistatic matting/ESD heel or wrist straps.
z Avoid contact with the MOS device pins.
Page iv Cobra Banknote Sorting Machine

z Strap MOS device pins with conductive tape or place in an
antistatic bag, covering, foam, or grounded metal plate to
maintain the same potential on all pins.
z Place Printed Circuit Boards (PCBs) on/in an antistatic bag or

covering for transportation/storage.
z Do not wear clothing made of nylon or other synthetic material.
Always return shielding, such as covers and boxes, to their desig-

nated location before operating the machine to comply with Electro-
Magnetic Compatibility (EMC) regulations. Various parts of the
machine, such as PCBs, contactors, and items supplied by mains
power are housed in shielded boxes. The external machine cover
also forms part of the EMC shielding.
Solvents and Pneumatics Use nontoxic fluids for cleaning purposes. The fluids must comply
with relevant health and safety regulations. For example, a recom-
mended cleaning solvent for optical sensors has Part Number
02340172.
Verify that the air supply is removed, disconnected, or shut off

before attempting maintenance or service on a pneumatic system.
Exercise caution when troubleshooting the machine requires the

pneumatic system to be On.
Operating Environment Keep the area around the transport neat, clean, and vacuumed.
Keep cables and electrical cords neatly bundled, off the floor, and
out of the way.
Wear earplugs or other protection against sustained high-noise lev-

els.
Never look into any of the system lights.
Use eye protection when working near system lights because some
Ultra-Violet (UV) and laser lamps can be invisible when on.
Follow the safety precautions provided in relevant detector manuals

that accompany detectors that emit UV or laser light.
Exercise care when lifting equipment items weighing over 44

pounds (20 kg) during installation or removal of equipment. Con-
sider the handling of such items as a two-person task.
Safety Symbols The symbols on the following page can help prevent injury to the Opera-
tor. Make sure you know what these symbols represent.
Primary Symbol Description
Danger, High Voltage

Potentially lethal voltages are present. Use extreme care in any of these
areas. Turn power off before servicing.
Detector Service Manual TP09311011 Rev 04 December 2003 Page v

Primary Symbol Description
High Energy
Possibility of arcing and burns from high-energy components, such as bat-
teries or Power Supply Unit (PSU).
Warning, Laser Light

Do not look directly into laser beam.
Pinch Point Warning

Keep hands and objects clear when equipment is running.
Electro-Static Discharge Sensitive

Avoid contact with device pins or contacts. Use conductive tape or place on
anti-static pad or enclose in an anti-static bag or envelope to prevent dam-
age to device.
Cutting Blades
Certain mechanisms and heads contain sharp-edged blades. Use caution
when working in these areas.
Weight
Exercise care when lifting objects weighing 20 kg or more when installing
or removing the item. Consider such tasks as at least a two-person task.
Attention!
Pay close attention to the instructions that accompany this symbol.
Page vi Cobra Banknote Sorting Machine

Maintaining CE Compliance
Any installation practices, modifications, or maintenance procedures car-

ried out that are not in accordance with the requirements of or approved
by De La Rue Cash Systems, will nullify the CE certification of this prod-
uct and could lead to prosecution.
Detector Service Manual TP09311011 Rev 04 December 2003 Page vii

Technical Bulletins and Memoranda
Technical Bulletins Technical bulletins are numbered consecutively and customers of a prod-
uct will receive all technical bulletins.
Technical memoranda are used when a modification does not apply to all
machines (for example, a modification to a 220-volt 50Hz machine may
not be relevant to a 115-volt 60Hz machine). To prevent confusion, tech-
nical memoranda are not numbered.
A. Service Manual Amendments
After receiving a technical bulletin or technical memorandum that entails a

service manual amendment, the following actions should be taken:
Replacing Page Amendment 1. Insert the relevant pages into the manual and remove the old pages.
Manual custodians should file the old pages for future reference.
2. Complete the Record of Amendments page with the technical bul-

letin number (not required for a technical memorandum), a brief
description of the technical bulletin or memorandum, and the date.
3. File the technical bulletin or memorandum title page for future refer-
ence. Then destroy the remainder of the technical bulletin.
Non-Replacing Page 1. Amend the relevant pages in the manual and annotate the margin
Amendment next to the amendment with the technical bulletin number and date
or the technical memorandum date.
2. Complete the Record of Amendments page with the technical bul-

letin number (not required for a technical memorandum), a brief
description of the technical bulletin or memorandum, and the date.
3. File the technical bulletin or memorandum title page for future refer-
ence. Then destroy the remainder of the technical bulletin.
B. Machine Modification
Recommendation: Keep separate technical bulletin and techni-
cal memorandum files on each machine site as a reference for all
modifications issued. File the full copy of the technical bulletin
and technical memorandum.
This record shows all machine modifications, whether implemented in the

factory prior to machine installation, or those carried out on site.
C. Master Copies
The service manager should retain a master copy of all technical bulle-
tins/technical memoranda to use as a reference if required.
D. Record of Amendments
Do not record amendments on any page other than an amendment
record sheet.
Page viii Cobra Banknote Sorting Machine

E. Page Replacements
Take care that any page replacements issued in technical bulletins or
technical memoranda contain all previously issued changes.
Detector Service Manual TP09311011 Rev 04 December 2003 Page ix

RECORD OF AMENDMENTS
TECHNICAL BRIEF DESCRIPTION DATE AMENDED
BULLETIN No.
Page x Cobra Banknote Sorting Machine

Detector Service Manual TP09311011 Rev 04 December 2003 Page xi
Manual Contents
Section 1 General Detector Information
Section 2 Thickness Detector
Section 3 Solid State Holes and Tears
Section 4 Vision Detector
Section 5 Optical Pattern Detector
Section 6 UV Bright Detector
Section 7 Limpness Detector
Section 8 Soil Detector
Section 9 Twin Magnetic Ink Detector
Section 10 Infrared Detector
Section 11 Central Magnetic Ink Detector
Section 12 Transmissive Optical Detector
Section 13 Low Remanence Magnetic Ink Detector
Section 14 SDIII Detector
Page xii Cobra Banknote Sorting Machine

Section 15 Luminescence Detector
Section 16 Contact Image Sensor
About This Manual
The following describes various conventions used in this document. For

example, some of these conventions are text devices to enable you to
distinguish between text or commands that you enter into a system and
the system responses or prompts that appear on a terminal screen. Oth-
ers help you distinguish topic subordination as an aid to understanding
the document structure and organization. Still other text devices indicate
menu names, menu commands, or dialog box command buttons, fields,
and options; view, window, screen, or dialog box names; syntax place-
holders, and so on.
Manual Conventions Manual conventions are standards used in writing the manual to create a
consistent and organized format that is clear, concise, and easy to use.
The following information lists the standards used in this manual:
Topic headings within a chapter are presented as follows:
First-level Topic 1. HARDWARE

Headings:
Descriptive text.
Second-Level Topic 1.1 Product Overview

Headings:
Descriptive text.
Third-Level Topic 1.1.1 Other Description

Headings:
Descriptive text.
Fourth-Level Topic A. Additional Functions

Headings:
Procedures have numbered steps. Sometimes a step has two or

more substeps or requires you to choose from two or more options
Detector Service Manual TP09311011 Rev 04 December 2003 Page xiii

to complete the step. Occasionally a procedure step produces
optional results.
1. Use the system Reconciliation program to balance the batch …
1A. Enter rejects (culls) and verify that …
1B. Also use the system Accounting program to check …
2. Do one of the following:
2A. If the system has the new bander module, go to Step X.

2B. If the system has the original bander module, go to Step Y.
3. The stacker tray moves forward and detects the front of a bundle.
A. When the system does not detect the front of the bundle, the sys-
tem generates a …
B. When the system detects the front of the bundle but the bundle is
outside the expected range, the system generates a …
Any screen item that you can select using the mouse (point and
click), menu items, command keys, field names, or equipment labe-
ling appear as follows:
Click on (or Select) Enter Diagnostics Menu to access the Diag-
nostics menu.
Any keyboard keys that you need to press appear as follows:

Press ALT+F3.
Information that you need to type into the system is in a typewriter

font and all caps:
Enter CONF and press ENTER.
Information or a system prompt displays on screen as follows:

ARE YOU SURE YOU WANT TO DELETE THIS ITEM?
The Note tag offers additional information, usually to a previous
statement. Occasionally, the Note tag addresses an information
issue that you need to be aware of before you get to the information
that follows.
Note: Be sure to insert the document in the proper orientation.
Note: The next step requires at least two people to handle the equipment.
The Caution tag points out conditions or actions that can adversely
affect the desired result or interrupt equipment operation:
Caution!
Although an add-on module does not use 3-phase power, 3-phase
power remains accessible within the WB module AC power boxes.
The Warning tag points out conditions or actions that can adversely
affect the system, damage the equipment, or injure the operator:
Warning!
Reverse polarity connection of the DC power source to the XXX equip-
ment causes maximum arcs and sparks.
Page xiv Cobra Banknote Sorting Machine

The Danger tag points out conditions or actions that can result in
severe bodily injury or loss of life.
Danger! Potentially lethal voltages are present. Use extreme care in any of
these areas. Turn power off before servicing.
Manual Organisation
Looking for a part number?
You can find an illustrated parts list for each detector in topic number 8,
Illustrated Parts List, relevant to a specific detector. This section shows
necessary parts, numbers, and quantities in use.
Overview The Cobra Detector Service Manual contains the information described
below. Except for the overview Section 1, each section describes the fol-
lowing items, where applicable:
Section Organisation 1. Introduction
2. Principles of operation
3. Fault-finding tasks
4. Mechanical adjustments
5. Electrical adjustments
6. Maintenance
7. Removal and replacement of the detector
8. Illustrated parts list
Overview by Section The table of contents and index, if available, assist in locating information
quickly.
Section 1 provides a high-level overview of the Cobra Detector note

authentication system, including the detectors, operation, parameter
adjustment, self-checks in place, detector processor functions, and
specifics of fault diagnosis, system diagnostics and detector system
diagnostics.
Section 2 describes the Thickness detector, which detects notes

thicker than specifically set parameters representing a normal note.
Such a reading indicates folds, corners, or tape present on a note.
Detector Service Manual TP09311011 Rev 04 December 2003 Page xv

Section 3 describes the Solid-State Holes and Tears detector,
which detects holes and missing corners.
Section 4 describes the Vision detector, which reads illuminated

banknotes and creates an image that can then be used to sort by
denomination, face, and orientation, as well as outsorting suspect or
unrecognised notes.
Section 5 describes the Optical Pattern detector, which discrimi-

nates the reflective patterns from banknotes as they pass through
the detector.
Section 6 describes the Ultraviolet (UV) Bright detector, which iden-

tifies banknotes with abnormally high fluorescence responses to
ultraviolet light.
Section 7 describes the Limpness detector, a fitness detector which

assesses the audible response to bending a banknote passing
through a crackle roller.
Section 8 describes the Soil detector, another fitness detector

which determines whether the note is fit for use.
Section 9 describes the Twin Magnetic Ink detector. This detector

authenticates banknotes with both magnetic ink features and
machine-readable thread.
Section 10 explains the operation of the infrared detector, which

detects inks that absorb infrared radiation.
Section 11 describes the Central Magnetic Ink detector, which

authenticates ink features on banknotes.
Section 12 describes the Transmissive Optical detector, which you

can configure to verify the presence of a watermark barcode pattern
or an opaque thread signal within a captured note profile.
Section 13 describes the Low Remanence Magnetic Ink detector,

which measures the magnetic signature of banknotes with low
remanence characteristics.
Section 14 describes the SDIII detector, which measures certain

luminescence properties and provides UV Bright and SDIII detec-
tion.
Section 15 describes the Luminescence detector, which detects UV

Bright, fluorescence, and phosphorescence.
Section 16 describes the Contact Image Sensor detector, which

supports a range of note detection functions including sorting by
denomination, facing, and orientation, and outsorting suspect and
unrecognised notes.
Related Documents
The following documents provide additional information on the Cobra
banknote sorter. Some may be referenced within this document.
Cobra® Service Manual (TP01311011)
Page xvi Cobra Banknote Sorting Machine

GCC Diagnostics Guide (440-0163-002)
Cobra® User Guide (TML400)
Detector Service Manual TP09311011 Rev 04 December 2003 Page xvii

Page xviii Cobra Banknote Sorting Machine

Section 1
General Detector Information
Page 1-0 Cobra Banknote Sorting Machine

Contents
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Note Authentication and Assessment System . . . . . . . . . . . . 1
2. Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Detector Interface Board . . . . . . . . . . . . . . . . . . . . . . . 4
3. Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4. Fault Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.1 Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.2 Preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.3 Testing Transport System Integrity . . . . . . . . . . . . . . . . . . 7
5. Detector System Diagnostics - General . . . . . . . . . 9
5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.2 General Keyboard Protocol . . . . . . . . . . . . . . . . . . . . . . 10
5.3 Detector Processor Menu . . . . . . . . . . . . . . . . . . . . . . . 12
6. Detector System Diagnostics -
Function 1: Configuration . . . . . . . . . . . . . . . . . . . 13
6.1 Configuration Function Option 1, Load Configuration . . . . . . . . 15
6.2 Configuration Function Option 2, List Configuration . . . . . . . . . 15
6.3 Configuration Function Option 3, Edit Configuration . . . . . . . . 15
6.4 Configuration Function Option 4, (Not Used) . . . . . . . . . . . . 20
6.5 Configuration Function Option 5, ASCII Table . . . . . . . . . . . . 21
6.6 Option 0, End . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Function 2: System Diagnostics . . . . . . . . . . . . . . 22
7.1 Option 11 Display Status . . . . . . . . . . . . . . . . . . . . . . . 23
7.2 Option 12, View Memory . . . . . . . . . . . . . . . . . . . . . . . 24
7.3 Option 13, Change Memory . . . . . . . . . . . . . . . . . . . . . . 24
7.4 Option 21, Show Engineer’s Log . . . . . . . . . . . . . . . . . . . 25
7.5 Option 22, Test a Function . . . . . . . . . . . . . . . . . . . . . . 25
7.6 Option 23, Print Truth Table . . . . . . . . . . . . . . . . . . . . . . 25
7.7 Option 24, Show 1mm Counter . . . . . . . . . . . . . . . . . . . . 25
7.8 Option 31, Configurator Contents . . . . . . . . . . . . . . . . . . . 25
7.9 Option 32, Configurator Details . . . . . . . . . . . . . . . . . . . . 26
7.10 Option 33, Configurator Self Test . . . . . . . . . . . . . . . . . . . 26
7.11 Option 34, Configuration Verify . . . . . . . . . . . . . . . . . . . . 26
7.12 Option 41, RAM Test . . . . . . . . . . . . . . . . . . . . . . . . . 26
7.13 Option 42, EPROM Checksum Test . . . . . . . . . . . . . . . . . 26
7.14 Option 43, Printer Toggle . . . . . . . . . . . . . . . . . . . . . . . 26
7.15 Security Key Information . . . . . . . . . . . . . . . . . . . . . . . 26
7.16 Option 00, End . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
8. DETECTOR SYSTEM DIAGNOSTICS -
FUNCTION 3 ‘DETECTOR DIAGNOSTICS’ . . . . . . . 29
Detector Service Manual TP09311011 Rev 04 December 2003 Page 1-i

8.1 Option 11, List Detector Names . . . . . . . . . . . . . . . . . . . 29
8.2 Option 12, List Trace Measure Codes . . . . . . . . . . . . . . . . 30
8.3 Option 13, List Cull Text Codes . . . . . . . . . . . . . . . . . . . 30
8.4 Option 14, List Error Codes . . . . . . . . . . . . . . . . . . . . . . 30
8.5 Option 21, Show Algorithm Data . . . . . . . . . . . . . . . . . . . 30
8.6 Option 22, List Algorithm Text Codes . . . . . . . . . . . . . . . . 31
8.7 Option 23, Show DAC Settings . . . . . . . . . . . . . . . . . . . . 31
8.8 Option 24, Show Audio Calibration . . . . . . . . . . . . . . . . . . 31
8.9 Option 31, Detector Controller . . . . . . . . . . . . . . . . . . . . 31
8.10 Option 00, End . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Function 4: Trace Data . . . . . . . . . . . . . . . . . . . . 37
9.1 Trace System General Details . . . . . . . . . . . . . . . . . . . . 37
9.2 Option 11 ‘Examine Note Trace Data’ . . . . . . . . . . . . . . . . 38
9.3 Option 12, Examine Histogram Trace Data . . . . . . . . . . . . . 40
9.4 Option 13, Examine Trace Measure Table . . . . . . . . . . . . . 41
9.5 Option 21, Set Note Trace Conditions . . . . . . . . . . . . . . . . 42
9.6 Option 22, Set Up Histogram Trace . . . . . . . . . . . . . . . . . 45
Figures
1 Detector Interface Board - Block Diagram . . . . . . . . . . . . . . 5

2 Detector System Diagnostics Flow Chart . . . . . . . . . . . . . . . 9
3 Configuration Flow Chart . . . . . . . . . . . . . . . . . . . . . . . . 14
4 System Diagnostics Flow Chart . . . . . . . . . . . . . . . . . . . . 27
5 Detector Processor Decision Process . . . . . . . . . . . . . . . . . 28
6 Detector Diagnostics Flow Chart . . . . . . . . . . . . . . . . . . . . 36
7 Trace Data Flow Chart . . . . . . . . . . . . . . . . . . . . . . . . . 45
Tables
1 Resolving Error Messages . . . . . . . . . . . . . . . . . . . . . . . 7

2 Data Output Selections . . . . . . . . . . . . . . . . . . . . . . . . . 10
3 Edit Configuration Option 2 Master Table (Level 3) . . . . . . . . . 16
4 Edit Configuration Option 3 Process Data (Level 3) . . . . . . . . . 17
5 Edit Configuration Option 4, Note Data (Level 3) . . . . . . . . . . . 17
6 Edit Configuration Option 5, Detector Data (Level 3) . . . . . . . . . 18
7 Edit Configuration Option 6, Transport Data . . . . . . . . . . . . . 19
Page 1-ii Cobra Banknote Sorting Machine

8 Edit Configuration Option 7, Process Titles (Level 3) . . . . . . . . . 19
9 Edit Configuration Option 2, Condition Pts (Level 3) . . . . . . . . . 20
10 Edit Configuration Option 3, Note Base Data (Level 3) . . . . . . . . 20
11 Change Memory Option . . . . . . . . . . . . . . . . . . . . . . . . . 25
12 Explanation of Histogram Data . . . . . . . . . . . . . . . . . . . . . 41
13 Trace Measure Data . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Procedures
1 Testing System Operation . . . . . . . . . . . . . . . . . . . . . . . 7

2 Entering Text . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Detector Service Manual TP09311011 Rev 04 December 2003 Page 1-iii

Page 1-iv Cobra Banknote Sorting Machine
1. INTRODUCTION
This section describes Cobra note authentication and assessment detec-
tors. The remaining sections of the manual contain information relevant to
specific detectors.
1.1 Note Authentication and Assessment System
A. Introduction
The note authentication and assessment system employs a range of
detectors that sense the features and quality of each note. The detector
microprocessor determines from the detector responses, from a store of
note specifications and from the operator’s requirements, the pocket des-
tination for each note.
B. Detectors
The standard range of detectors comprise the following:
Standard Detectors A. Thickness (Doubles) detector, which detects multiple notes and the
length of each fold and tape
B. Solid state holes-and-tears detector, which detects holes, open

tears, and missing corners in notes, as well as the length of each
note
C. Limpness detector, which measures the audio condition of each

note
Notes that are too close together; that overlap; or are of incorrect length,
are passed to the cull pocket. Although the condition levels at which notes
are segregated, and the output batch quantities, are pre-set in software,
the operator may reset these.
Each detector interfaces by a common interface board to the detector

processor.
C. Operation
Once the operating process is selected, the detector processor passes to
the detector interface the decision parameters applicable to both the proc-
ess selected and the type and location of the detectors interfaced.
As notes are transported, the processor passes to the interface the timing
and position details of each note. These details enable the detector head
signals to be sampled as the note passes through the head, and sampled
repeatedly for every millimetre of transport movement. For each detector
the note signature so obtained, together with the detector decision param-
eters, enables a discrete decision to be made and forwarded by the inter-
face to the detector processor.
The detector processor collates the discrete decisions arising from all
detectors to get a composite decision for each note. This is compared
Detector Service Manual TP09311011 Rev 04 December 2003 Page 1-1

with the appropriate process truth table to make the note routing decision,
which is passed on to the transport processor.
D. Parameter Adjustment
The operator can adjust fitness parameters at the keyboard. The site
engineer can also adjust decision parameters, including truth tables, after
entering the appropriate pass code. The machine must be in standby
mode to perform these adjustments.
After any access to the configurable data, the detector issue level held in
the detector processor is automatically updated.
Upon request, the following data can be printed:
Process information
Detector truth tables
Detector settings
Configuration change history
E. Self Check
At certain times including machine switch-on and change of process, the
machine checks that all aspects of the interface and associated detector
heads are fully functional. Any malfunction is reported through the inter-
communication system to inform the operator or engineer. If a printer is
fitted, a diagnostic printout can be obtained if any check fails.
F. Detector Processor Functions

The detector and transport processors are identical except for firmware
differences. The detector processor does the following:
Information the Detector Holds a permanent record of the detector operating routine.
Processor Maintains
Holds a semi-permanent record of:
z Detector calibration parameters, which are amended automati-

cally to offset variations
z The customer’s detector package layout and operational

requirement
z The establishment’s note characteristics, which can be

amended by the service engineer.
Holds a current record of the findings of the detector interrogation.
Maintains the detector configuration table for use by itself, by the

detector interface, and by the transport processor.
Supports the operation of each detector.
Provides the combined findings of all detectors with a destination

code.

Monitors the performances of itself and the detector interface.
Supports the keyboard manipulation of configuration data, whilst

enforcing multi-level access by operator and engineer, and logging
in a history file in non-volatile memory those changes that affect the
machine’s security arrangements.
Decodes the process selection and primes the detectors accord-

ingly.
Supports the security key arrangement to ensure configuration

integrity.

2. DESCRIPTION
2.1 Detector Interface Board

The detector interface board receives from the detector processor the
decision threshold levels for the various detectors, and converts these
from digital to analogue form. It also receives the detector analogue out-
puts, and compares these with the corresponding threshold levels. The
result of the comparison for each detector is forwarded to the detector
processor. A block diagram of the detector interface board is shown in
Figure 1, “Detector Interface Board - Block Diagram,” on page 5.

Figure 1 Detector Interface Board - Block Diagram

3. MAINTENANCE
Perform the routine transport adjustments first. The transport must func-
tion correctly before the detectors can be correctly set. If a detector
requires readjustment later, make sure that the transport (flat) belts
adjustment is correct first.
To complete some detector adjustments it may be necessary to override

the cover interlock safety to run the machine with the main inspection
cover open.
Before carrying out any maintenance procedures, read the section on

Health and Safety, located in the preliminary pages of this manual.

4. FAULT-FINDING GUIDE
4.1 Error Messages

Some machine-reported error messages can be used in investigating
detector faults.
Table 1 Resolving Error Messages
Error Meaning Action
1-25 Fault with detector Turn computer off and on. If error
processor board still exists, replace the board with a
spare.
41-56 Fault with detector Turn computer off and on. If error
processor board still exists, replace the board with a
spare.
34 Detector is not ready Confirm that detector system con-
nectors are engaged. (Refer to the
relevant detector’s corresponding
block diagram.)
4.2 Preliminary
The note transport system performance affects detector performance.
Before investigating specific detector faults, confirm that the note trans-
port system is operating properly, as described in Section 4.3, Testing
Transport System Integrity.
If any part of the detector system is renewed, be sure to perform the Set-
ting Up procedure described in the corresponding appendix.
4.3 Testing Transport System Integrity

Before performing any diagnostic work on the detector, establish that the
note transport system works properly. To do this, perform the steps
described in Procedure 1.
Procedure 1 Testing System Operation
Step Procedure
Cleanliness 1. Check that all transport sensors and the detector are clean.
1.1 If any item is excessively dirty, remind the supervisor or oper-

ator of the importance of thorough daily cleaning.
Note Feeder 2. Check whether the feeder is doing multiple feeds.
2.1 Count the number of notes in the cull pocket.

2.2 Compare the count with the number of notes in the transport
trace (diagnostic function 09 in the DIAGNOSTICS menu, set up
to trace culls only).

3. For an excessive number of multiple feeds, check whether the notes
are any of the following conditions:
Badly degraded
Poorly prepared
Incorrectly loaded into the hopper

4. If the notes are in good condition, check that the separator roller and
O rings are clean.
4.1 Confirm that all parts are correctly fitted, undamaged and not
excessively worn.
Note Transport 5. Examine the condition of the note transport belts.
6. Check the setting of the belt tensions at each of the drive capstans.
7. Ensure all rollers move freely.
Culls 8. Use the transport note trace to determine whether the transport
processor is culling the notes.
9. Use the detector processor note trace to determine whether the
detector processor is culling the notes.
10. If either processor is initiating the culls, investigate and correct with
appropriate action against the cull reason.
11. If the cull rate is still excessive, investigate specific detector faults.
Service Report 12. Be sure the service report you prepare contains the following:
A statement verifying that the test for system integrity is completed
Details of all corrective actions taken

5. DETECTOR SYSTEM DIAGNOSTICS - GENERAL
5.1 Introduction
The detector processor supports a user interface of a keyboard and dis-
play. This section describes:
The detector processor functions available through keyboard opera-

tion to the operator, supervisor and engineer
How to perform these functions
A summary of the detector system diagnostics appears in the flow chart of

Figure 2.
DETECTOR SYSTEM
DIAGNOSTICS ACCESS
AUTHORITY 0
1 2 3 4 0
Configuration System Detector Trace Data END

Diagnostics Diagnostics
see Figure 3 see Figure 4 see Figure 6 see Figure 8
Figure 2 Detector System Diagnostics Flow Chart
A. Detector Processor Direct Communications

When the detector processor diagnostics are accessed, user interface
control is effectively handed over to the detector processor (direct com-
munications). The functions that require direct communications are:
A. Request change to condition sort level (diagnostics utility)
B. Set up condition sort pointers (set up utility)
C. Detector processor diagnostics
Functions (a) and (c) are specifically selected from within the machine
diagnostic environment. Function (b) is transparent to the operator and is
entered via a supervisor configuration screen.

5.2 General Keyboard Protocol
As far as is possible, certain protocols have been adopted throughout all
keyboard and display activities.
In those instances where comprehensive prompting is not possible due to

limited screen size, the following conventions are adopted.
How to Navigate the System
Key Description Action
Right arrow key Takes you to the next phase of an operation

(for example, displaying the next block of
memory
Left arrow key Where permitted, returns you to the previous

phase of an operation (for example, displaying
previous block of memory)
Abort key Cancels numeric input.
The screen is sometimes frozen to allow it to be examined before being

overwritten. The bottom right corner of the display shows the prompt ->.
Press the right arrow key to continue.
Prompts for numeric input expect, by default, decimal numbers. To enter

hexadecimal characters, a full QWERTY keyboard is required.
A. Screen or Printer Selection

Where appropriate, the operator has the option to output data either to the
printer or the screen. Where this is the case (for example, listing a config-
uration table), a menu offers these options:
Output to screen only 0
Output to printer 1
Enter an option -
Table 2 Data Output Selections
Type Result
0 Displays data on the screen.

1 Sends data to the printer
Note: An OKI321 printer must be connected to the mother-
board connector J22 using Cableform Part no.
3106003302.

B. Text Input
Where text input is required, the operator sees the following information.
!”£$%&’()*+,-./0123456789:;<=>?@
ABCDEFGHIJKLMNOPQRSTUVWXYZ[ ] _’
abcdefghijklmnopqrstuvwxyz
END
Procedure 2 Entering Text
How to Enter Text Step Procedure
1. To enter text, position the cursor under the desired character and
press ENTER.
2. Use the cursor arrows to move the cursor. As each character is
added to the string, it displays at the bottom left of the screen.
3. Press CLEAR to cancel the most recently entered character from the
string.
4. After entering the text string, terminate the entry by moving the cur-
sor under the word END. Press ENTER.
5. Some text strings are limited to a specific number of characters (as
stacker titles). This type of text entry automatically terminates when
the character limit has been reached.
C. Bit Mask Create or Modify

In certain applications the operator must create or modify a bit mask.
Where this is required, the operator is presented with information similar
to the following. In this example, detectors 1 to 8 are enabled, 9 to 32 dis-
abled.
Detector number ? _
000000FF
00000000000000000000000011111111
END ->
The masks are in binary format, each bit of the mask having a signifi-
cance appropriate to its application. Individual bits may be toggled on and
off by entering their bit number. Bit numbers may be referenced to 0 or 1
depending on the application.
D. Condition Sort Level Change - Diagnostics Utility

This utility enables the operator to adjust ALL of the sensitivity pointers
referenced by the current process.

E. Fault Reporting
The transport processor controls normal fault reporting. Fault codes 1000
to 40999 have been reserved for detector and detector processor faults.
The first two digits of the error code refer to the offending detector (for
example: 1xxx = detector 1, 12xxx= detector 12). Error codes which begin
with 40xxx refer to the detector processor itself. The remaining three dig-
its represent the actual error code logged.
5.3 Detector Processor Menu

This is the top level of the detector processor diagnostics routines and is
entered after the access authority has been established. After selection
the operator sees the menu shown in Figure 2, “Detector System Diag-
nostics Flow Chart,” on page 9.

FUNCTION 1: CONFIGURATION
Access authority required: 0
This function presents an options sub-menu giving access to the different

aspects of the configuration environment. On selection of this function the
following menu items display:
Configuration Function 1
Configuration menu (Level 1)

Load configuration 1 List configuration 2
Edit configuration 3 Not used 4
ASCII table 5 End 0
The flow chart in Figure 3 illustrates the configuration function.

Page 1-14
CONFIGURATION
Access Authori ty 0
1 2 3 4 5 0
Load Li st Edit Save ASCII Code End

Configuration Configuration Configurati on Configuration
Access 0 0 3 0
Authority
Page 2
Figure 3
Page 1 3 Page 2
1 2 3 4 5 6 7 0 1 2 3 0
Master History Proc esses Notes Detectors Transport Process End Edi t Conditi on Note Base End
Table Titles Tabl e Pointers Data
Page 2
Page 2 1 2 3 4 5 0
1 2 3 0 Li st Add Find Mod Edit End

Tables Table Tables Note Table
Complete Condition Note End Offset Text
Lis t Pointer Base Page 2
Table
1 2 3 4 5 0
Lis t Add Find Edit Add End

Tabl es Tables Tables Pointer Pointer
1 2 3 4 5 6 7 0
Create Master Process Note Detector Transpor t
Process End
Configuration Tabl e Data Data Data Data
Titles
Configuration Flow Chart

Page 1 Page 1
1 2 3 4 5 6 7 8 0 1 2 3 4 5 6 0 1 2 3 4 5 0
List
List Note End Add End List End
Add Tables Note Find Add
Tables Task s Engineer Detector Tables
Code Language Size Table Stack er
Scheduler Speed Mod Add TP
Modify Add Note Find Edit
Period Data Sort Table
Supervisor Det Mask Table Table
Code
Page 1
1 2 3 4 5 6 7 8 0 1 2 3 4 0
1 2 3 4 5 6 7 8 9 0
List Add Note Add List Add Detector End List End
Tables Find Mod End Tables Find Tables Find
Title Criterion Position
Ref Table Cond Ptr Table Table
Mod
Add Add TP Mod Det Add Table Edi t Title
Note Add Edit Detector Detector
Process Ref Mask
Dest Detector Parameters Name Read Time
Cobra Banknote Sorting Machine

6.1 Configuration Function Option 1, Load Configuration
This forces the loading of the configuration file from the configuration
EPROM. Any configuration data held in the system memory is overwrit-
ten. A warning message displays first; press ENTER to complete the oper-
ation or CLEAR to abort the function.
6.2 Configuration Function Option 2, List Configuration

This presents a sub-menu enabling the operator to list-print various tables

of the configuration file. The menu offered to the operator is split into two
pages. Use the right and left arrow keys to move between them.
List Configuration Page 1
Configuration List menu (Level 2)

Master table 1 History 2
Processes 3 Notes 4
Detectors 5 Transport 6
Proc. titles 7 End 0
– Change menu ->
List Configuration Page 2
Configuration List menu (Level 2)

Complete list 1 Cond. ptrs 2
Note base tbl. 3 End 0
– <- Change menu
After selecting the desired option, the operator can list all the defined data
tables, or select a specific table for listing. The operator can then print the
data or view it on screen.
6.3 Configuration Function Option 3, Edit Configuration

This presents another sub-menu enabling the operator to change the con-
figuration data tables. After selecting an option, the operator sees a spe-
cialised Edit menu, allowing changes to the selected data table type. The
Edit Configuration menu is split into two separate pages, which the opera-
tor can move between by using the right and left arrow keys.

Edit Configuration Page 1
Configuration Edit menu (Lev 2)

Create config. (DO NOT USE.) 1 Master tbl. 2
Process data 3 Note data 4
Detector data 5 Transp. data 6
Proc. titles 7 End 0
– Change menu ->
Edit Configuration Page 2:
Configuration Edit menu (Lev 2)

Edit title 1 Cond. ptrs. 2
Note base data 3 End 0
– <- Change menu
Option 1, Create Configuration Edit Configuration Page 1: Option 1, Create Configuration
DO NOT SELECT THIS OPTION. TO DO SO WILL CAUSE THE

DETECTOR TO STOP WORKING.
Option 2, Master Table Edit Configuration Page 1: Option 2, Master Table

This enables the operator to change the variables held in the configura-
tion file master table. On selection the Options menu described in Table 3
displays.
Table 3 Edit Configuration Option 2 Master Table (Level 3)
Option Name Description
1 List table This enables the master table to be listed to

either the display or printer.
2 Scheduler pd Modify nominal transport movement between
scheduler interrupts (scheduler period).
3 Note tasks Modify the maximum number of notes which may
be concurrently processed by the detector proc-
essor.
4 Speed Modify the nominal transport speed for the
machine as known by the detector processor.
5 Supervisor code Modify the supervisor access code.
6 Eng. code Modify the engineer access code.
7 Mod. Det. mask Modify the machine detector mask. Setting a bit
in the mask to zero switches the corresponding
detector off for ALL processes.
8 Add language DO NOT USE THIS OPTION.

0 End Select this to return to the Configuration Edit
menu (level 2).

Option 3, Process Data Tables Edit Configuration Page 1: Option 3, Process Data Tables
This enables the process data tables to be edited or created. On selec-
tion, the Options menu described in Table 4 displays.
Table 4 Edit Configuration Option 3 Process Data (Level 3)
1 List table(s) Enables all or specific process data tables to be

listed to either the display or the printer. If the
CLEAR key is pressed while displaying these
tables, the operator returns to the previous level.
2 Add process Creates a new process data table if the user-
supplied process identity is unique.
3 Add note Adds a new note number to a given process data
table. The operator also must supply the destina-
tion for each of the grades for this note.
4 Add T.P. ref. Changes the reference to a transport data table.
The new transport data table reference is
accepted only if the process table already exists.
5 Add title ref Change the reference to the process title table.
The new title reference is accepted only if the
process table already exists.
6 Mod. Det. mask Modifies the detector mask for the given proc-
ess. Setting a bit in the mask to zero switches
the corresponding detector off.
7 Find table Finds the address for the given process data
table. If the process table cannot be found, an
address of 0 displays.
8 Mod note dest. Modifies a note’s destination for the various
grades, for the process and note selected.
9 Mod. cond. ptr Modified the condition pointer mask that defines
which, if any, of the sensitivity pointers are to be
automatically offered to the operator at process
selection. Setting a bit in the mask to zero disa-
bles the corresponding pointer for operator
adjustment.
0 End Returns the operator to the Configuration Edit
menu (level 2).
Option 4, Note Data Edit Configuration Page 1: Option 4, Note Data

This enables the note data tables to be edited or created. On selection,
the Options menu described in Table 5 displays.
Table 5 Edit Configuration Option 4, Note Data (Level 3)
1 List table(s) Enables all or specific note data tables to be

listed to either the display or the printer.
2 Add note Creates a new note data table if the user-sup-
plied note identity is unique.
3 Add detector Adds a new detector reference to a note data
table. The new detector reference is accepted
only if valid (between 1 and 32) and if the detec-
tor data table already exists in the configuration.

Table 5 Edit Configuration Option 4, Note Data (Level 3)
4 Find table Finds the address for the given note data table. If
the note table cannot be found, an address of 0
displays
5 Note size Changes the default note size. This note size
applies only to note tables whose configured
dimensions, length or width, is zero. This makes
no changes to the configuration file, but simply
changes the default values held by the detector
processor.
6 Mod. data sort Modifies the data reduction type for each grade
of a note. This enables the operator to change
the data reduction to either AND, OR, NAND or
NOR data sort.
menu (level 2).
Option 5, Detector Data Edit Configuration Page 1: Option 5, Detector Data

This enables the detector data tables to be edited or created. On selec-
Table 6 Edit Configuration Option 5, Detector Data (Level 3)
1 List table(s) Enables all or specific detector data tables to be

listed to either the display or the printer.
2 Add det. Creates a new detector data table if the user
supplied detector identity is valid (1 to 32) and
unique.
3 Add crit. Adds a new detector criterion to a detector table
entry. The new criterion is created only if the
identity is unique within the context of the detec-
tor chosen.
4 Edit param Edits the parameters of a given detector or crite-
rion entry.
5 Find table Finds the address for the given detector data
table. If the detector table cannot be found then
an address of 0 displays.
6 Det. name Changes the four characters used to describe
the detector’s name or function.
7 Det. position Modifies the detector position. The detector posi-
tion should be measured with respect to the
transport track sensor B.
8 Det. read time Modifies the time at which the detector processor
reads the results from a detector. If this time is
set to zero, the detector processor calculates a
read time based on the detector position and the
note length.
menu (Level 2).

Option 6, Transport Data Edit Configuration Page 1: Option 6, Transport Data
This enables the transport data tables to be edited or created. On selec-
Table 7 Edit Configuration Option 6, Transport Data
1 List table(s) Enables all or specific transport processor data

tables to be listed to either the display or the
printer.
2 Add table Creates a new transport data table if the user-
supplied identity is unique.
3 Find table Finds the address for the given transport data
table. If the transport cannot be found, an
4 Edit table Enables the user to modify a stacker data entry
for a given transport processor data table.
5 Add stacker Creates a new stacker entry into a given trans-
port data table. The new stacker number must be
unique within the specified transport data table
and must be in the range 1 to 15.
menu (level 2).
Option 7, Process Titles Edit Configuration Page 1: Option 7, Process Titles

This enables the process title data tables to be edited or created. On
selection, the Options menu described in Table 8 displays.
Table 8 Edit Configuration Option 7, Process Titles (Level 3)
1 List table(s) Enables all or specific process title data tables to

be listed to either the display or the printer.
2 Add table Creates a new process title data table if the user-
supplied identity is unique. The user must enter a
new title string for each language defined in the
master table.
3 Find table Finds the address for the given title data table. If
the title table cannot be found, an address of 0
displays.
4 Edit title This option is not used by the Cobra machine.
menu (level 2).
Option 1, Edit title Edit Configuration Page 2: Option 1, Edit title

This option is not used by the Cobra machine.
Option 2, Condition Pts Edit Configuration Page 2: Option 2, Condition Pts

This enables the condition pointer data tables to be edited or created. On
selection, the Option menu described in Table 9 displays.

Table 9 Edit Configuration Option 2, Condition Pts (Level 3)
1 List table(s) Enables all or specific condition pointer data

tables to be listed to either the display or the
printer.
2 Add table Creates a new condition pointer data table if the
table identity is unique.
3 Find table Finds the address for the given condition pointer
data table. If the condition pointer table cannot
be found, an address or 0 displays.
4 Edit pointer Changes the parameters of a given pointer
within a specified condition pointer table.
5 Add pointer Adds a pointer to a given condition pointer table.
The pointer is added only if the identity is unique
within the context of the selected table.
menu (level 2).
Option 3, Note Base Data Edit Configuration Page 2: Option 3, Note Base Data
This enables the note base data tables to be edited or created. On selec-
tion, the following options menu displays:
Table 10 Edit Configuration Option 3, Note Base Data (Level 3)
1 List table(s) Enables all or specific note base data tables to

be listed to either the display or the printer.
2 Add table Creates a new note base data table if the table
identity is unique.
3 Find table Finds the address for the given note base data
table. If the note base table cannot be found, an
4 Mod note offset Modifies the value of the note base offset.
5 Edit table text Not used.
menu (level 2).
Option 0, End Edit Configuration Page 2: Option 0, End

Select this to return to the Configuration menu (level 1).
6.4 Configuration Function Option 4, (Not Used)

This option is not used by the Cobra machine.
6.5 Configuration Function Option 5, ASCII Table


This provides an ASCII-to-hexadecimal look-up table.
6.6 Option 0, End

Select this to return to the Detector Processor menu (level 0).

FUNCTION 2: SYSTEM DIAGNOSTICS
This function provides access to the system diagnostic routines provided

for detector-processor orientated test and monitoring functions. The
options provided are split into several menu pages. Move between these
pages with the right and left arrow keys.
System Diagnostics Function 2, Page 1
System Diagnostics 1 (Level 1)

Display status 11
View memory 12
Change memory 13
End 00
Change menu ->

Show engineer’s log 21
Test a function 22
Print truth table 23
Show 1mm counter 24
End 00
<- Change menu ->

Configurator contents 31
Configurator details 32
Configurator self test 33
Configuration verify 34
End 00
<- Change menu ->

RAM test 41
EPROM checksum test 42
Engineers Printer toggle 43
End 00

<- Change menu ->

Security Key information 51
End 00
<- Change menu ->
Enter the two-digit option number to select a desired option from any
page. The flow chart in Figure 4 illustrates the system diagnostics.
7.1 Option 11 Display Status

This provides a list of miscellaneous software data, and is used during

software development. This list can be sent to the display or to the printer.
The following data is currently listed.

ramstrt : start address of data (ram) segment
_edata : end address of allocated ram
conbase : start address of configuration
authptr : address of note truth tables
Time_map : start address of scheduler timing map
ntask1 : start address of first note task
&datumt1 : address of datum time primary buffer
&datumt2 : address of datum time secondary buffer
trctb1 : address of trace table master table
histb1 : address of histogram data table
freeram : next free address in ram
lastram : ram top address
Procedure cksm addr : address of procedure checksum
Config cksm addr : configuration length (checksum)
Process code : current process code
Denomination code : current denomination code
Status flags : detector processor status flags
Run time error flags : run time error status
Fitness det mask : detectors used for grade 1 to 15
Auth. det mask : detectors used for grade 0
Det. reply ram strt : start of circular ram for detector bit replies
Det. reply ram pntr : pointer to circular ram
Control task table : address of table containing control tasks
Control table size : current number of tasks in control table
Cross ref table : address of detector cross reference table
Det. config. store : start address of criteria store for all detectors
Det. results store : start address of results store for all detectors

Bytes reserved for stack : stack allocation
Bytes required by stack : number of bytes used by the stack
Scheduler’s per second : number of level 2 interrupts/second
Send result time : send result time for selected process
Sensor B position : position of sensor B (mm) from sensor A
Sensor C position : position of sensor C (mm) from sensor A
Sensor E position : position of sensor E (mm) from sensor A
Slip at C : average slip (mm) at C
Slip at E : average slip (mm) at E
Data reduction time(max) : current max. data reduction time (mm)
Note trace time (max) : current max. note tracing time (mm)
Thickness exe.time (max) : current max. thickness execution time (mm)
H&T exe.time (max) : current max. holes + tears exection time (mm)
Length exe.time (max) : current max. length execution time (mm)
UVB exe. time (max) : current max. UV execution time (mm)
Twin mag exe. time (max) : current max. mag. execution time (mm)
Met. Thd.exe.time (max) : current max. metal thread execution time (mm)
7.2 Option 12, View Memory

This enables the operator to list the detector processor system memory,
to either the printer or the display.
If output to the printer has been selected, the operator is prompted for a
start and end address of the memory area of interest.
If output to the display has been selected the operator is prompted for a
start address only. The first six words, starting from the address specified,
then display on the screen. The operator then has the following options:
= Display next 6 locations
= Display previous 6 locations
CLEAR = End operation
In both cases (printer or display) the data is presented in hexadecimal,

decimal and ASCII formats.
7.3 Option 13, Change Memory


This enables the operator to modify the contents of the detector proces-
sor system memory. After selecting the required address, the operator
sees the following menu (in this example, address 20088 has been cho-
sen).
20088 18762 494A IJ
Table 11 Change Memory Option
Action Result
Press ENTER. Enables the operator to modify the contents of

the address shown. The new data must be
entered in hexadecimal format.
Press -> Increments the address to the next word.
Press <- Decrements the address to the previous word.
Press CLEAR. Ends the operation.
7.4 Option 21, Show Engineer’s Log

This enables you to print or display the contents of the engineer’s log. The
engineer’s log lists certain system faults resulting from illegal conditions
detected in the software or hardware. Each entry consists of 22 long
words and reflects the contents of the processor stack at the time the
error routine is called.
De La Rue Engineering uses this data to trace the history and origins of
fault conditions which may prove difficult to isolate by any other means.
7.5 Option 22, Test a Function

This enables a software function to be tested. It is intended for use as a

software development tool.
7.6 Option 23, Print Truth Table

This option is not available in this version of the machine.
7.7 Option 24, Show 1mm Counter

This displays the count value contained in the 1mm counter maintained
by the detector processor. The Cobra transport system provides the clock
signal which is synchronised each time the machine is started.

7.8 Option 31, Configurator Contents
7.9 Option 32, Configurator Details

This option is not applicable to the Cobra note sorter.
7.10 Option 33, Configurator Self Test

This option is not applicable to the Cobra note sorter.
7.11 Option 34, Configuration Verify

7.12 Option 41, RAM Test

This performs a non-destructive test on the detector processor RAM. The

start address of each 16k bytes block of memory displays as it is tested.
Success or failure is reported as appropriate.
7.13 Option 42, EPROM Checksum Test

This performs a checksum test on the detector processor program

EPROM. The actual EPROM checksum and the calculated checksum
display together with a success or failure message. Any difference in the
two checksum values implies EPROM failure.
7.14 Option 43, Printer Toggle

Access Authority required: 0
Switches serial printer on or off (3700 only).
7.15 Security Key Information

Access Authority required: 0
Displays security key code as fitted to machine and lists options from con-
figuration.

7.16 Option 00, End

SYSTEM DIAGNOSTICS
ACCESS AUTHORITY 0
para 7.1 7.2 7.3

11 12 13
Page 1 Display View Change

Status Memory Memory
Access
Authority 0 0 3
para 7.4 7.5 7.6 7.7

21 22 23 24
Page 2 Test a Function Print Truth 1mm

Show
Engineers Log Table Counter
Access
Authority 0 0 0 0
para 7.8 7.9 7.10 7.11

31 32 33 34
Page 3 Configurator Not Used

Configurator Configuration
Contents Details Verify
Access
Authority 0 0 0
para 7.12 7.13 7.15
41 42 43 00
EPROM Engineers END

Page 4
RAM Test Check Sum Printer
Test Toggle
Access
Authority 0 0
para 7.15
51 00
Page 5 Security
END
key
information
Figure 4 System Diagnostics Flow Chart

Figure 5 Detector Processor Decision Process

FUNCTION 3 ‘DETECTOR DIAGNOSTICS’
This function provides access to the detector diagnostic routines provided

for monitoring functions. The options provided are split into two menu
pages. Move between these pages with the right and left arrow keys.
Detector Diagnostics Function 3, Page 1
Det. Diagnostics 1 Level 1

List detector names 11
List trace measure codes 12
List cull text codes 13
List error codes 14
End 00
Change menu ->

Show algorithm data 21
List algorithm text codes 22
Show DAC settings 23
Show audio calibration 24
End 00
<- Change menu

Detector Controller 31
To select an option, enter the two-digit option numbers from any page.
Figure 6, “Detector Diagnostics Flow Chart,” on page 37 illustrates the
detector diagnostics.
8.1 Option 11, List Detector Names


This lists all detector numbers declared in the configuration file together
with the detector names.
8.2 Option 12, List Trace Measure Codes

8.3 Option 13, List Cull Text Codes

8.4 Option 14, List Error Codes

8.5 Option 21, Show Algorithm Data

This enables the operator to determine how a particular detector system

has been configured for the current selected process. Detector systems
may be configured in one of two ways, depending on the type of detector.
A. Type 0 (for example, Soil, Holes-and-Tears)

Each detector system is configured to perform certain process-dependent
tasks (algorithms). Each detector system task consists of an algorithm
number and a list of associated algorithm parameters. The algorithm
number defines the type of operation (for example, soil or tape). The
parameters are numerical constants which are accessed during the exe-
cution of the algorithm. The significance and number of the parameters
depends on the algorithm to which they relate.
The detector system produces a true or false reply, for each algorithm
and parameter combination. Each reply occupies a single bit in the reply
word associated with the detector in question. The significance of each bit
is determined by the time order in which the detector configuration is per-
formed. The first algorithm result is associated with the least significant
bit.
B. Type 1 (for example, Pattern)

For this type of detector, the system is simply sent a series of information
words that define a mode of operation. The detector reply is a 6-bit code
word that indicates the operation result. With the pattern detector, the
information words sent define the pattern sets to be used. The reply word
indicates the best pattern found for a given note.
This utility allows the detector system algorithm data to be examined. The
data is presented in the time sequence observed during detector configu-
ration. It is, therefore, an essential tool in detector reply interpretation.

8.6 Option 22, List Algorithm Text Codes
8.7 Option 23, Show DAC Settings

The detector system has 8 hardware D to A converters which set various

detector thresholds (for example, doubles threshold). The contents of the
DAC’s (8-bit) display when this option is selected.
8.8 Option 24, Show Audio Calibration

This provides information on the calibration documents used to set up the

audio gain on the Limpness detector. This information is used in the Limp-
ness setting up procedure.
8.9 Option 31, Detector Controller

The detector controller functions provide diagnostics for the detectors and
controllers interfaced to the detection system through a 5000-style detec-
tor controller.
A. Option 11, Controller Self Test

This enables a detector controller to be selected to perform its self-test

diagnostic routine. On selection the operator is prompted to enter the
detector number in question. The results of the self-test display on the
screen. If the controller logs any faults, the fault report menu is automati-
cally presented.
B. Option 12, Load Controller Errors

This enables any errors logged by the specified detector controller to dis-
play via the Fault Reporting menu.
C. Option 13, Test Controller Comms

This enables the specified detector controller to detector processor inter-

face to be tested. The following tests are performed:

A. Test output FIFO - checks the operation of the control lines on the
detector processor output FIFO.
B. Test input FIFO - checks the operation of the control lines on the
detector processor input FIFO.
C. Communication loop check - detector processor transmits the nib-

bles O - F, each of which is echoed by the controller. The transmit/
receive sequence is displayed as it occurs.
D. Option 14, Controller Echo Test

This enables the operator to send a single 16-bit data word to a detector
controller. On selection the operator is prompted for the controller
number, the data word to be sent and the allowed timeout. The detector
controller response displays on the screen.
Note: The data word sent to the controller is echoed only if it is a valid function
code. This may cause several errors to be logged depending on the data word
sent.
E. Option 21, Show Algorithm Data

This lets the operator determine how a particular detector controller has
been configured for the current selected process. Detector controllers
may be configured in one of two ways. The method of configuration is
determined by the type of detector.
Type 0 (for example, Soil, Holes and Tears): Each detector control-
ler performs certain process-dependent tasks (algorithms). Each detector
controller task consists of an algorithm number plus a list of associated
algorithm parameters. The algorithm number defines the type of opera-
tion (for example, soil, tape, etc.) The parameters are numerical con-
stants which are accessed during the algorithm execution. The
significance and number of the parameters is dependent upon the algo-
rithm to which they are associated.
The detector controller produces a true/false reply, for each algorithm/

parameter combination. Each reply occupies a single bit in the reply word
associated with the detector in question. The significance of each bit is
determined by the chronological order in which the detector configuration
is performed. The first algorithm result is associated with the least signifi-
cant bit.
Type 1 (for example, Pattern): For this type of detector, the controller
is simply sent a series of information words that define a mode of opera-
tion. The detector reply is a 14-bit code word that reflects the result of the
operation (with the pattern detector, the information words sent define the
pattern sets to be used. The reply word reflects the best pattern found for
a given note).
This utility allows the detector controller algorithm data to be examined.

The data is presented in the chronological sequence observed during

detector configuration. It is therefore an essential tool in detector reply
interpretation.
F. Option 22, Reset ALL Controllers

This forces all detector controllers to perform a hard reset. Any valuable
data held by the detector controllers will be lost.
This also resets some detector processor hardware; as a result, the trans-
port processor logs a detector processor communications fault and termi-
nates the direct communications mode. Such action will not corrupt data
in the detector processor, which should recover fully.
G. Option 23, Controller Memory

The memory contents of the detector controller specified are displayed.

The address from which memory examination is to commence is
requested, and may be any valid address within the memory map of the
detector controller concerned.
This allows the sampled response from a detector for the last note traced,
to display. For detailed information, refer to the relevant detector service
manual. The response can be displayed as numerical data or as graphi-
cal data.
The numerical format is byte-orientated, with an address and 8 bytes of

data per line. Press the right and left arrows, respectively, to increment
and decrement the address.
In graphical format, the memory contents display horizontally, an asterisk

representing the value of a location contents by its displacement from the
left margin. For printer display the Engineer is requested to provide a
scale factor.
H. Option 24, Select Data Capture Mode

This enables a detector controller to be specified for data capture. The

detector controller selected must have an emulator connected, with emu-
lator RAM enabled at address 20000.
I. Option 31, Show Engineer’s Log

This enables a detector controller’s engineer’s log to be examined. The

engineer’s log lists certain system faults resulting from illegal conditions
detected in the software/hardware. Each entry consists of 22 long words
and reflects the contents of the processor stack at the time of the error
routine being called.

If output to the printer is selected, the operator is requested for the
number of logs desired.
If output to the screen has been selected, data is output from the engi-
neer’s log start address and is formatted as an address followed by 8 data
bytes. The operator then has the following options:
-> = Display next 48 bytes

<- = Display previous 48 bytes
DELETE = End operation
J. Option 32, Set Controller Comms Log

This enables all communications between a detector controller and the

detector processor to be traced. On selection the operator is prompted for
the detector controller number and the communications ‘trace end’ word.
All communications between the selected controller and the detector
processor are then logged until the ‘trace end’ word is sent. The default
‘trace end’ communication word offered is the error function code.
K. Option 33, Show Controller Comms Log

This enables the controller’s communications log to be examined. Each

line of output is formatted as a suffix showing direction of communication,
the four individual nibbles which make up the word communication and
the decoded word. Tx implies data from detector processor to detector
controller, Rx implies the reverse.
L. Option 34, Controller A/D Conversion

This enables a specified detector controller A/D conversion results to con-

tinuously display. Data displays for both channel 1 and 2 in decimal and
hexadecimal formats. A counter showing the number of conversions per-
formed also displays to give an idea of the conversion rate (approximately
3 per second).
M. Option 41, List Trace Measure Codes

This lists all valid trace measure codes, together with the associated text
to either the screen or the printer.
N. Option 42, List Algorithm Text Codes


This lists all valid algorithm codes together with the associated text to
either the screen or the printer.
O. Option 43, List Cull Text Codes

This lists all valid cull codes, together with the associated text to either the
screen or the printer.
P. Option 44, List Error Codes

This lists all valid error codes, together with the associated text (long and
short) to either the screen or the printer.
Q. Option 51, List Detector Names

This provides a list of all detector numbers declared in the configuration

file together with the detector name.
8.10 Option 00, End


Figure 6 Detector Diagnostics Flow Chart

FUNCTION 4: TRACE DATA
This function provides access to the detector processor data trace rou-
tines. Specifically the trace facilities allow for the logging of data associ-
ated with notes being fed. The detector system trace facilities are
presented on two pages, movement between them being achieved by
using the right and left arrow keys. The first page is concerned with view-
ing trace data, the second with setting conditions for the trace system.
Trace Data Function 4 Page 1
Data trace menu (Level 1)

Examine note trace data 11
Examine histogram trace data 12
Examine trace measure table 13
End 00
Change menu ->
Trace Data Function 4 Page 2
Data trace menu 2 (Level 1)

Set note trace conditions 21
Set up histogram trace 22
End 00
<- Change menu
The flow chart in Figure 7, “Trace Data Flow Chart,” on page 46 illustrates
the trace data system.
9.1 Trace System General Details

The trace system, by default, logs all detector replies for all notes fed.
Each detector reply comprises two 16-bit words. The first word is the bit-
wise reply to the algorithm results. The second word is reserved for pass-
ing a measure code from the detector for tracing by the detector proces-
sor. The most significant bit of the reply data is reserved for detector
culling. If this bit is set the note concerned is culled, the remainder of the
reply is given over to a cull reason code. In addition to logging the detec-
tor replies, the following data is logged.
note datum time
note value (monetary value - for value balancing)
note destination
destination reason flags

The destination reason flags are used to store miscellaneous data about
conditions which have contributed to a note’s final destination. The signif-
icance of the bits is as follows.
0 Data reduction Detector processor ran out of time whilst result

over-run calculation was in progress
1 Detector cull A detector cull bit was set
2 Feed stop request The detector processor had requested a feed stop
bit pending and was waiting for the transport to comply
3 Suspect The note concerned was routed to a stacker
declared as a suspect stacker
4 Transport proces- The transport processor culled the note before it
sor cull reached sensor E.
In addition to the normal note-by-note trace, a frequency histogram of

traced measures is available. From this data, you can review the distribu-
tion of a population with respect to a particular measured attribute.
The trace buffer is cleared at each feed start and at process selection.
9.2 Option 11 ‘Examine Note Trace Data’

This allows the operator to display either all entries in the trace buffer or
only those with a specific destination.
After selecting which notes to display, the following menu appears.
Note 0 Datum time 20642

Destination 0 Note value 0000
Culled by detector 1
Det. reply data = ENTER exit = CLEAR
Change note <- -> Truth = DOWN
Note Defines the note position within the trace buffer. Note 0
is the latest note to be traced, with subsequent notes
numbered -1, -2, -3 and so on. The operator always
sees the latest note first. Selection of other notes in the
trace buffer is made using the left and right arrow keys
(less and more recent respectively).
Datum This is the note’s datum time with respect to sensor A. It
time may be used to cross-reference detector processor
trace data with transport processor trace data.
Destina- This defines the note destination as supplied to the
tion transport processor.
Note: Note - this may not correspond with the note’s final
destination, if for example the transport decides to cull the note
or use an alternative stacker.
Note value The note’s monetary value displays as a hexadecimal
number representing the mantissa and exponent (one
byte each).

The third and fourth lines explain the destination reason flags.
These lines are blank if no destination reason flags are set.
Pressing ENTER enables the detector replies and measures for the cur-
rent note to be examined. The data is formatted as follows.
do1 do2 do3 do4

PATT UV THIK HOLE
reply (HEX) 0004 0000 0000 0008
(DEC) 4 0 0 0
meas 0001 0000 0000 0096
(HEX)
1 0 0 150
A detector entry of xxxx implies that the corresponding detector is not

used for the selected process. Typing -> scrolls on to a second page of
detector reply, if there are more than four detectors in the system, or
return to the note selection level.
DOWN (shift keys) enables the truth tables results to be examined. This
functions in the same manner as the Show truth table option under Sys-
tem Diagnostics, except that the result of each algorithm is shown. For
example:
Note number: 6002

Grade: 3
Reduction AND, fail
Destination 2
d01 1111.0 PATT
d02 1 .0.0 THIK
The detector replies required to categorise a note for this grade are listed
as a bitwise representation of the detector response. Each bit of a reply is
the result of a single criterion. A “.” in any position implies that the reply
associated with that position is of no significance. A ‘1’ in any position
implies that the algorithm associated with that position passed the
required test, a ‘0’ implies a failure. The overall result for the note or grade
being examined is displayed after the data reduction type. Figure 5,
“Detector Processor Decision Process,” on page 29, illustrates this proc-
ess.
If a printed copy of the note trace data has been requested, the number of
trace entries to be output is requested. The printout shows the most
recent note entry in the buffer at the top of the list. Each note trace entry is
formatted to occupy four lines on the printout. Only those detectors in use
are included in the list. A typical note entry is listed as follows.

d01 d02 d03 d04
PATT UV THIK HOLE datum flag dest value
Reply (HEX 0001 0000 0002 0003 32398 0000 2 0000

(DEC) 1 0 2 3
Meas (HEX) 0000 0000 0000 0096
(DEC) 0 0 0 150
9.3 Option 12, Examine Histogram Trace Data

This enables the detector histogram data to display. The histogram must
previously have been defined, using the Set Up Histogram Trace option
(“Option 22, Set Up Histogram Trace” on page 46). A histogram display
begins with a data table. For example:
5 detector number
22 trace measure number
1000 notes traced
1 under range
0 over range
138 histogram median
The trace measure number reflects the selected measure which the
detector has been returning for tracing. The under and over range num-
bers define the total number of notes that were outside the defined range
of the histogram. The histogram median corresponds to that measure
which effectively splits the population into two equal totals. The option of
clearing down the accumulated histogram data (for example, after each
run) is offered.
The histogram itself displays as follows.
135 0 0%
136 15 1% *
137 45 6% ****
138 200 26% ********************
139 240 50% ************************
140 210 71% *********************
141 160 87% ****************
142 100 97% **********
143 20 99% **

144
145 9 100%
146
147
Table 12 Explanation of Histogram Data
Column Meaning
1 Measure value
2 Number of entries for the associated measure value
3 Percentage of the total number of notes traced has so far been
plotted, including the current row
A visual bar chart representation of the number of notes falling into each
measured category displays. The number of stars in each column is
scaled according to the requirements of the most populated category.
9.4 Option 13, Examine Trace Measure Table

This displays the trace measure table which holds all the trace measures
from all the detectors but only for the last note fed. Use the left and right
arrow keys to scroll through the table. Use the CLEAR key to exit the
table. The trace numbers display in the left column. Table 13 lists some of
the basic trace measures currently implemented.

9.5 Option 21, Set Note Trace Conditions
Table 13 Trace Measure Data
Measure Description Measure No. Page No.
THICKNESS
(not used) 1 Page 1

doubles channel 1 count 2
doubles channel 2 count 3
thickness prime error 4
HOLES AND TEARS
note length (h+t) 5

h+t prime error 6
U.V. BRIGHT
UV Bright count 7 Page 2
MAG INK
mag ink count 8
MAG THREAD
thread 1 start 9
thread 1 end 10
thread 2 start 11
thread 1 centre 12
METAL THREAD
thread 1 start 13 Page 3

thread 1 end 14
thread 2 start 15
thread 1 centre 16
ITALIAN MAG INK for 100K
Italy mag ink window samples 17

Italy mag ink other samples 18
Italy mag ink first sample 19 Page 4
LENGTH
note length 20
length prime error 21

Inboard singles average 23 Page 4

Inboard doubles average 24
Outboard singles average 25
Outboard doubles average 26

Result for thick setup 27 Page 5
Metal thread thread 1 start 28
Metal thread thread 1 end 29
Metal thread thread 2 start 30
Metal thread thread 1 centre 31
l.e. miss. corner size 32
t.e. miss. corner size 33 Page 6
Hole type 34
Diamond hole size 35
MRTA thread position 36
ENHANCED THICKNESS DETECTOR
Peak no-note level CH1 37

Peak no-note level CH2 38
Note level CH1 39 Page 7
Note level CH2 40
Rolling average level CH1 41
Rolling average level CH2 42
pk/pk no-note noise CH1 43
pk/pk no-note noise CH2 44
Computed singles threshold CH1 45 Page 8
Computed singles threshold CH2 46
Computed doubles threshold CH1 47
Computed doubles threshold CH2 48
Leading cornerfold size 49
Trailing cornerfold size 50
Tape size 51 Page 9
Cross tape size 52
Gap increase CH1 53
Gap increase CH2 54
Twin mag. ink count 55
H&T average lamp ref. level 56
H&T nominal width measure 57 Page 10
H&T length of missing leading corner 58
H&T length of missing trailing corner 59

H&T leading corner threshold 60

H&T trailing corner threshold 61
H&T mm of screw adjustment 62
SURF detector reply 63 Page 11
This enables the operator to define which type of notes to be traced. By

selecting this, the operator will view three sub-menus. Each sub-menu
offers the option to specify one or more conditions for a note to be traced.
A. Menu 1
Destination ? -
0006
0000000000000110
End ->
This menu enables the operator to define a bit mask corresponding to

those destinations whose notes are to be traced. The cull is denoted as
stacker 0 and occupies the least significant bit in the mask. The bit mask
as shown would trace only those notes whose destination was stacker 1
or 2.
B. Menu 2
Red’n over run 1: Detector cull 2

Feed stop req 3: Suspect 4
Transport cull 5:
08
01000
End ->
This menu enables the operator to define which type(s) of note to trace.
For example, the bit mask as shown would trace suspect notes only.
C. Menu 3
– Detector number 3
– Trace measure number? 0
This menu enables the operator to define the trace measure number for
each detector configured for the currently selected process. The detector
returns this measure as part of its reply. It will be traced, both in the note
trace buffer and in the histogram for this detector (if defined). Press
ENTER without changing the trace measure number or ‘->’ to move the
display on to the next detector number.

9.6 Option 22, Set Up Histogram Trace
This enables the operator to define the structure of a detector measure
histogram. The operator is prompted to enter the following information.
1. Detector number
2. Minimum measure value to be traced
3. Maximum measure to be traced
4. Resolution of the histogram (difference between adjacent histogram

columns)
5. Detector trace measure number to be traced
Figure 7 Trace Data Flow Chart


Section 2
Thickness Detector

Contents
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Principles of Operation . . . . . . . . . . . . . . . . . . . . 2
2.1 Detector Head . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.2 Detector Electronic System . . . . . . . . . . . . . . . . . . . . . . 3
2.3 Thickness Detection . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.4 Wiring Schedules . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Fault-Finding Guide . . . . . . . . . . . . . . . . . . . . . . . 8
3.1 Test Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4. Mechanical Adjustments . . . . . . . . . . . . . . . . . . . 10
4.1 Amplifier Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.2 Sensor Roller Gap . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.3 Thickness Clutch Adjustment . . . . . . . . . . . . . . . . . . . . . 10
5. Electrical Adjustments . . . . . . . . . . . . . . . . . . . . . 12
5.1 LVDT Coil Position . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.2 Preparing for Calibration . . . . . . . . . . . . . . . . . . . . . . . . 13
5.3 Initial Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.4 To Mask Out All Detectors Except the Thickness Detector . . . . . 15
5.5 Setting up a Thickness Detector Trace Measure . . . . . . . . . . 16
5.6 Viewing the Trace Measure Table . . . . . . . . . . . . . . . . . . 17
6. Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.1 Daily Maintenance by the Operator . . . . . . . . . . . . . . . . . . 18
7. Removal and Replacement . . . . . . . . . . . . . . . . . . 19
7.1 Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.2 Replacement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7.3 Adjusting the Pulley Clutch D/A . . . . . . . . . . . . . . . . . . . . 20
8. Illustrated Parts Lists . . . . . . . . . . . . . . . . . . . . . . 22
Figures
1 Thickness Detector . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Essential Elements of the Detector Head . . . . . . . . . . . . . . . 2
3 General Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . 3
4 Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . 5
5 Fault Diagnostic Routine . . . . . . . . . . . . . . . . . . . . . . . . 9
6 Example of Calibration Result Screen . . . . . . . . . . . . . . . . . 14
7 Thickness Detector Front-End Board . . . . . . . . . . . . . . . . . 19
8 Thickness Detector Drive Belt . . . . . . . . . . . . . . . . . . . . . 20
9 Pulley Clutch D/A . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

10 Thickness Detector Illustrated Parts . . . . . . . . . . . . . . . . . . 22
11 Thickness Detector Illustrated Parts . . . . . . . . . . . . . . . . . . 23
Tables
1 Wiring Schedule B - Thickness Detector Cable . . . . . . . . . . . . 6

2 Wiring Schedule C - LVDT Lead Cables . . . . . . . . . . . . . . . 7
3 Wiring Schedule I - J1 Motherboard Connections . . . . . . . . . . 7
4 Initial Checks for the Thickness Detector . . . . . . . . . . . . . . . 8
5 Test Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6 Calibration Results . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
7 Trace Measures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
8 Parts List: Thickness Detector . . . . . . . . . . . . . . . . . . . . . 22
9 Detector Replies . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
10 Detector Cull Codes . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Procedures
1 Adjusting the Thickness Clutch . . . . . . . . . . . . . . . . . . . . 10

2 Adjusting the LVDT Coil Position . . . . . . . . . . . . . . . . . . . 12
3 Preparing for Calibration . . . . . . . . . . . . . . . . . . . . . . . . 13
4 Performing Initial Settings . . . . . . . . . . . . . . . . . . . . . . . 15
5 Masking Out All Detectors Except the Thickness Detector . . . . . 15
6 Setting Up a Thickness Detector Trace Measure . . . . . . . . . . . 16
7 Viewing the Trace Measure Table . . . . . . . . . . . . . . . . . . . 17
8 Removing the Thickness Detector . . . . . . . . . . . . . . . . . . . 19
9 Replacing the Thickness Detector . . . . . . . . . . . . . . . . . . . 20
10 Adjusting the Pulley Clutch D/A . . . . . . . . . . . . . . . . . . . . 20

1. INTRODUCTION
The Thickness detector detects where notes are of greater thickness than
would normally be expected of a perfect note. Typical thickness variations
are caused by corner or other folds, or by tape applied to the note.
Figure 1 Thickness Detector

2. PRINCIPLES OF OPERATION
2.1 Detector Head
Figure 2 Essential Elements of the Detector Head
Figure 2 shows the general operating principle of the Thickness detector.

The note is transported between two full width rollers. The upper roller is
free to move up or down with the thickness of the note as it passes under.
This vertical movement is transmitted through bearing shoes to the arma-

ture assemblies of two inductive sensors (Linear Variable Differential
Transformers, or LVDTs), one at each end of the upper roller.
An LVDT is essentially a transformer made variable by a movable arma-

ture. The armature is moved by the raising and lowering of the upper
roller as a note passes under the roller. The primary winding is energised
by an AC signal which is generated on the front-end board. Two second-
ary windings provide equal and opposite signals when the armature is
central (or removed); otherwise, the signal balance is disturbed in propor-
tion to the armature displacement.
The lower roller is driven directly by the main drive belt, and the upper
roller is driven by the lower roller via a pair of geared wheels.

2.2 Detector Electronic System
The Thickness detector electronic system comprises:
The LVDTs of the detector head
The Thickness detector front-end board
Part of the detector interface board
Part of the detector processor board (to generate the control signal)
Figure 3 shows a block diagram of the electronic system together with

connector and wiring schedule identification.
SIGNALS
SUPPLIES
SK3 SK4
PL3 PL4
SCHEDULE 8 Front-end board
PL1 PL2
SCHEDULE C SK1 SK1 SCHEDULE
Outboard LVDT Inboard LVDT
START TRACKING
SCHEDULE 1
SK1
J1
Detector
processor J4
PL17 SK17
Power supply
J5
Detector interface
board Mother/distribution
board
Figure 3 General Block Diagram

2.3 Thickness Detection
Figure 4 shows a functional block diagram of the thickness detection sys-
tem and details the relevant devices. Two identical circuits are included,
one for the outboard LVDT (channel 1), and one for the inboard LVDT
(channel 2). As both circuits are identical, only that for channel 1 is
described, and the devices directly referred to relate to that channel. The
corresponding devices for channel 2 are shown in parentheses.
The primary signal to the LVDT, and the secondary signals from the
LVDT pass between the signal conditioner, U8 (U5), on the Front-end
board and the LVDT via connector PL1 (PL2) on the board. Linearisation
circuitry ensures that each incremental displacement of the armature
position causes a proportional change in the differential output of the sec-
ondary windings. This output is amplified by U7 (U4) by a factor depend-
ant on the setting of RV1 (RV2).
Filtering is performed by U7 (U4) to demodulate the signal / remove the

primary oscillator frequency.
Devices U1, U2, U3 and U7 (U2, U3, U4 and U6) form a signal offset con-
trol which strives to maintain a steady DC signal offset of 1.0V at TP20
(TP7). A feedback circuit in this loop incorporates a counter and DAC
(Digital to Analogue Converter). The value of the counter (corresponding
to the amount of feedback) displays on LEDs LD1 – LD8 (LD9-LD16).
LD8 (LD16) is the MSB (Most Significant Bit).

Figure 4 Functional Block Diagram

L ink, LK1, controls the action of both offset control circuits as follows:
A. LK1 in Track position: the detector processor controls the circuit

when an offset adjustment is carried out, by issuing a /START
TRACKING pulse (one-shot mode).
B. LK1 Removed: the offset control circuit is continuously active (free-

run mode).
C. LK1 In NO TRACK position: the offset control circuit is disabled.
During normal operation, a /START TRACKING command is issued on

each feedstart by the detector processor. If there is any drift in the no-
note level during running, circuitry on the detector interface board main-
tains the offset at +1.0V thereafter.
The primary use of the LED arrays on the front-end board is to indicate
when pad replacement is necessary. As the pads wear, the no-note level
reduces and is compensated for by increased offset control. When all the
LEDs are ON (corresponding to the maximum limit of offset control), the
pads must be replaced.
A secondary use of the LED arrays is as a diagnostic tool. With LK1

removed (free-run mode), a displacement of the rollers causes a change
in the LED array state. A change of the LSB (Least Significant Bit) only
corresponds to approximately 0.01mm change.
If both LVDTs are connected to the front-end board, a /READY signal is

generated by the Front-end board and passed to the detector processor.
If the /READY signal is missing, the detector processor issues a CHECK
DT message. DT is the system’s abbreviation for the Thickness detector.
2.4 Wiring Schedules

Table 1 Wiring Schedule B - Thickness Detector Cable
Wire No. Colour From To Function
1 Brown SK1 / 10 SK3 / 5 +15V

2 Red SK1 / 6 SK3 / 3 + 5V
3 Orange SK1 / 11 SK4 / 3 CH2 HI
4 Yellow SK1 / 12 SK4 / 4 CH2 LO
5 Green SK1 / 14 SK4 / 5 /START TRACKING
6 Blue SK1 / 5 SK4 / 6 /READY
7 Violet SK1 / 13 SK3 / 6 -15V
8 Grey SK1 / 9 SK4 / 2 CH1 LO
9 White SK1 / 8 SK4 / 1 CH1 HI
10 Black SK1 / 3 SK3 / 2 0V
11 black SCREEN SK1 / 1 Drain

Table 2 Wiring Schedule C - LVDT Lead Cables
Wire No. Colour From To Function
1 Red/Yellow SKT1 / 1 LVDT Osc. (primary)

2 Red SKT1 / 2 LVDT LVDT sig. (secondary)
3 Blue SKT1 / 3 LVDT Centre tap (secondary)
4 Black SKT1 / 4 LVDT /LVDT sig. (secondary)
5 Black/Yellow SKT1 / 5 LVDT /OSC. (primary)
6 Green SKT1 / 6 LVDT Centre tap (secondary)
7 Grey SKT1 / 7 SKT1 / 8 /READY LINK
Table 3 Wiring Schedule I - J1 Motherboard Connections
J1 To Function
1
2
3
4
5 Sk3 / 24C
6
7
8 Sk3 / 23C
9 Sk3 / 22C
10 PL17 / 9
11 Sk3 / 21C
12 Sk3 / 20C
13 PL17 / 8
14 Sk4 / 16B

First, verify that the fault is repeatable and is a detector fault, not a trans-
port fault. If the fault is repeatable, carry out the initial checks detailed in
Table 4. If the fault persists, follow the diagnostic flow chart in Figure 5.
Table 4 Initial Checks for the Thickness Detector
Fault Action
Drive belt is incorrectly adjusted. Check the tension of the transport/detector drive
belt, and adjust if necessary.
LVDT armature does not move freely in LVDT Adjust the positioning of the armature if possi-
bore. ble. Otherwise renew the armature and the
LVDT.
LVDT armature bearing pad is worn out (high Renew the armature bearing pads of both
LED count). LVDTs.
Front-end board is not connected to the Mother/ Make positive connections from the Front-end
distribution board. board to the Mother/distribution board.
Gap does not open when the adjustment screw The grub screw clamping the sensor roller collar
is undone. is too tight.
The pad is jammed.
Inboard gap opens when the outboard gap is The sensor roller is rocking on the entry guide.
closed
3.1 Test Points

The test points which provide an aid to servicing are given in Table 5:
Table 5 Test Points
Test point Test point

Function
(Channel 1) (Channel 2)
TP21 TP8 Pre-amp and filter output

TP39 TP41 Analogue counter offset
TP20 TP7 Analogue of note thickness
TP1 TP1 0V

START
Repeat Setting-up
procedure
Temporarilly remove LK1 and

Yes Is Fault No observe Front-end board LED's.
repaired? Move upper roller by winding a note
through the transport
END
Yes Any change in LED

readings?
No
Yes Is upper roller

moveable?
Yes No
Is LVDT armature free to
move in bore?
Check condition of
No suspension rollers
and renew if
necessary
Renew armature
and LVDT if
necessary
No
Is fault repaired?
Yes
Is fault repaired?
Yes
No
START
Renew Front-end
board
START
Yes
Is fault repaired? START
No
Renew Interface board, and

then Detector processor board.
Consult Technical Services if
Fault persists.
Figure 5 Fault Diagnostic Routine

4. MECHANICAL ADJUSTMENTS
This section describes settings and adjustments for the following:
Amplifier gain
Sensor roller gap
Inboard and outboard note entry guides
Entry rollers
LVDT coil position
4.1 Amplifier Gain

Always set the gain adjusters before the gap screws. The displayed
number represents the gain error in bits, where 1 bit equates to approxi-
mately 15mV. A negative value indicates the gain is less than the required
target of 10mV/ìm; a positive value indicates a value greater than
required.
One turn of the adjuster equates to approximately 6 bits, and therefore in

the example given in Figure 6, “Example of Calibration Result Screen,” on
page 14, RV2 should be turned approximately two-thirds of a turn clock-
wise.
4.2 Sensor Roller Gap

The gap settings should only be adjusted when the results for the gain
adjusters, RV1 and RV2 are both set.
Turning the screw clockwise reduces the gap between the sensor and the
reference roller. A positive number indicates that the gap is too large, and
1 bit represents about 1.5µm (or 15mV if the gain is set correctly). A gap
of approximately 25 µm is required to give a reading of zero.
In the example given in Figure 6, the outboard (Key 1) adjustment screw

needs to be turned just a few degrees counter-clockwise to increase the
gap.
4.3 Thickness Clutch Adjustment

Factory setting.
Procedure 1 Adjusting the Thickness Clutch
Step Procedure
1. Ensure that the Thickness detector drive belt is correctly tensioned.
2. Ensure that the Thickness detector rollers are set to the correct gap.
(Ref 1.5 thou using feeler gauge as per spec PS1950-101-41 sec-
tion 5.2.1).

3. Ensure that the clutch clamp bolts are tightened to the correct
torque.
This prevents the clutch from slipping. The recommended torque is
1Nm.
4. Rotate the adjustment ring anticlockwise to reduce the clutch torque
to a low value.
5. Put three banknotes together to create a single test document
0.3mm thick.
6. Feed the 0.3mm test document into the transport manually and wind
it through the thickness detector.
The document should stall at the thickness detector as the clutch
will slip.
7. Rotate the adjustment ring clockwise to increase the clutch torque
until the test document passes through the thickness detector.
8. Put four banknotes together to create a single test document 0.5mm
thick.
9. Feed the 0.5mm test document into the transport manually and wind
it through the thickness detector.
will slip.
9.1 If the document goes through the thickness detector, reduce
the clutch torque until slipping occurs.
10. Re check that the 0.3mm test document passes through the detec-
tor.
The setting is now complete.

5. ELECTRICAL ADJUSTMENTS
5.1 LVDT Coil Position

This adjustment should ONLY be made if the LVDT bearing pad is being
replaced, or if the LVDT coil is being replaced (in which case the pad
should also be replaced, unless it is known to be nearly new).
This adjustment is NOT REQUIRED as part of the normal setting of the

detector adjustments.
The purpose of this adjustment is to set the LEDs on the front of the front-
end board to an initial value so they show a uniform value (a value of 240
– right hand 4 LEDs ON) when the bearing pad is worn sufficiently to
need replacement.
For this reason, if you intend to re-use the existing bearing pad, be sure to
note the LEDs that are illuminated before any adjustment is made. This
ensures that the same value is reinstated on completion – thus preserving
the integrity of the wear indicator.
To adjust the LVDT coil position after replacement of the bearing pad or
coil proceed as follows:
Procedure 2 Adjusting the LVDT Coil Position
Step Procedure
1. Remove LK1 on the front-end board.
2. If the existing pads are to be re-used, note the LEDs that are cur-
rently illuminated.
3. If a new bearing pad is to be used, adjust the coil up or down to
achieve an LED count of 128 ±5 on the corresponding LEDs. The
LEDs count in binary, and the value should be calculated by adding
the values of the LEDs that are illuminated, as follows:
LSB MSB
1 2 4 8 16 32 64 128 Value
ON ON ON ON ON ON 123
ON ON ON ON ON 124
ON ON ON ON ON ON ON 127
ON 128
ON ON 129
ON ON 130
ON ON ON 131

ON ON 132
ON ON ON 133
3.1 If the existing bearing pad is being re-used, then the coil
should be moved to a position which re-establishes the LED
state that existed at step 2. above.
3.2 Tighten the screw securing the coil to the housing.
3.3 Replace LK1 on the front-end board in the TRACK position.
3.4 Calibrate the amplifier gain and roller gap as described in
“Amplifier Gain” and “Sensor Roller Gap” on page 10.
5.2 Preparing for Calibration

Note: If any part of the procedures described in “LVDT Coil Position” on page 12
fails, set the links, amplifier adjusters and roller gaps in accordance with the
instructions in “To Mask Out All Detectors Except the Thickness Detector” on
page 15. On completion repeat the procedures described in “LVDT Coil Position”
on page 12.
Prepare to calibrate the Thickness detector as follows.
Procedure 3 Preparing for Calibration
Step Procedure
Note: Calibration document is De 1. Program the machine for Thickness calibration process 3347 using
La Rue part number 3739113101. the Set-Up menu.
2. Enter the thickness values of the Calibration Test Note (Part No.
3739113101) using detector diagnostic function F8 (left).
3. Orientate the Calibration Test Note so that it will feed into the
machine grey (single thickness) end first. Use Thickness calibration
process 3347 to feed the note through the thickness detector.
4. Observe the display and note the result. See Figure 6, “Example of
Calibration Result Screen,” on page 14.

Figure 6 Example of Calibration Result Screen
RV1 and RV2 refer to the gain adjusters on the thickness detector front-
end board. RV1 adjusts the gain for channel 1 (outboard sensor), and
RV2 adjusts the gain for channel 2 (inboard sensor).
Outer gap and inner gap refer to the gap adjustment screws. Outer gap,
which is accessible at the front of the detector, adjusts the front-end of the
sensor roller (channel 1). Inner gap, accessible through a hole in the
backplate, adjusts the rear end of the sensor roller (channel 2).
The Calibration Measurement values represent the values calculated by

the calibration run. A value of zero is the optimum value, and the calcu-
lated value displayed may be either positive or negative dependent on
whether it is larger or smaller.
The Calibration Result values show the action that should be taken for
each of the adjustments, as follows:
Table 6 Calibration Results
Calibration result Description
set The adjustment for the channel is within the

required tolerance.
cw The adjustment must be made in a clockwise
direction
ccw The adjustment must be made in a counter-
clockwise direction

5.3 Initial Settings
Perform the following settings only if the procedures detailed in “LVDT
Coil Position” on page 12 could not be completed.
To set the amplifier gain and roller gap to an initial setting before calibra-
tion, follow the steps in Procedure 4.
Procedure 4 Performing Initial Settings
Step Procedure
1. Confirm that LK1 on the front-end board is in the TRACK position.
2. Confirm that LK2 and LK3 are on the right pins (when viewed from
the front).
3. Turn RV1 and RV2 adjusters fully counter-clockwise (to the mini-
mum gain position), and then turn them 10 complete turns clockwise
(to the mid-position).
4. Ensure that the entry guides are not preventing the correct move-
ment of the sensor roller, and use a 50µm (0.05mm, 0.002”) feeler
gauge to adjust the gap between the rollers at each end, with the
front and rear screws, until the gap is approximately 50µm.
5.4 To Mask Out All Detectors Except the Thickness Detector

Procedure 5 Masking Out All Detectors Except the Thickness Detector
Step Procedure
1. Go into the GCC.
2. From the Run the Machine page, select F3-F4-F8-F11 to enter

machine configuration.
3. If the detector number of the Thickness detector is not known:
3.1 Select DETECTOR DIAGNOSTICS (03).

3.2 Select LIST DETECTOR NAMES (11).
3.3 Note the number for the Thickness detector, and exit.
4. Select CONFIGURATION (01).
5. Select EDIT CONFIG (Edit configuration 3).
6. Select MASTER TABLE (2).
7. Select MOD. DET. MASK (Modify Detector Mask 7).
8. Enter the detector identity (process number currently being used).
9. The second row of 1’s and 0’s represents the state of each detector,
enabled (1) or disabled (0), detector 1 first on the right hand side.
Note the current form of this detector mask so that it can be re-
established later. To disable an enabled detector, and vice-versa,
enter the detector number. Ensure that the Thickness detector is the
only detector enabled.
10. Return to the Accounting menu.

11. Select and re-run the Set-up menu.
The machine is now ready to run with all detectors masked out,
except the Thickness detector.
When the detector set-up has been completed, re-establish the original
detector mask.
5.5 Setting up a Thickness Detector Trace Measure

To set up a Trace measure, follow the steps in Procedure 6 Setting Up a
Thickness Detector Trace Measure.
Procedure 6 Setting Up a Thickness Detector Trace Measure
Step Procedure
1. Go into the GCC.

3. Select TRACE DATA (04).
4. Page forward by pressing →

5. Select NOTE TRACE CONDITIONS (21).
6. The display then prompts Destination? This provides the facility

to be selective about which pockets notes are traced into. The
default is ALL pockets.
7. To proceed, press →
The display then shows the detector number and prompts Trace
Measure Number?
8. Select a trace measure from Table 7 and press ENTER.
9. The display then re-prompts with the same question to confirm the
trace measure.
10. Press ENTER again.
Table 7 Trace Measures
Trace Measure Number Description
2 Total doubles count CH1 (non-contiguous) (mm)

3 Total doubles count CH2 (non-contiguous) (mm)
4 Priming error (see Note 1)
37 Peak no-note level CH1
38 Peak no-note level CH2
39 Actual note level CH1
40 Actual note level CH2
41 Rolling average level CH1
42 Rolling average level CH2
43 Pk-Pk ‘run-out’ CH1 (see note 2)

Trace Measure Number Description
44 Pk-Pk ‘run-out’ CH2 (see note 2)

45 Computed singles threshold CH1
46 Computed singles threshold CH2
47 Computed doubles threshold CH1
48 Computed doubles threshold CH2
49 Leading corner fold size (mm)
50 Trailing corner fold size (mm)
51 Tape size (mm)
52 Cross tape size (mm)
53 Gap increase CH1 (see note 2)
54 Gap increase CH2 (see note 2)
Note 1: The priming error is the difference between the detected note leading
edge position and the position based on priming. This error is a signed byte, e.g 2
=+2, 1 = +1, FF = -1, FE = -2 etc.
A positive priming error means that the actual note position is late with respect to
the priming. Should the priming error exceed +12, the note is culled (8000 or
8001) and no trace measures are recorded.
Note 2: To convert to microns, divide by 0.64.
5.6 Viewing the Trace Measure Table

This allows viewing of all detector trace measures for the last note fed.
To view the trace measure table, follow the steps in Procedure 7 Viewing
the Trace Measure Table.
Procedure 7 Viewing the Trace Measure Table
1. Go into the GCC.

4. Select EXAMINE TRACE MEASURE TABLE (13). The display then requests
whether screen or printer output is required.
5. Type 0 for screen, or 1 for printer.
6. The start of the Trace measure table then displays. Use the follow-
ing keys to get to the required trace measure(s):
z → to page forwards
z ← to back backwards
z CLEAR to exit

6. MAINTENANCE
6.1 Daily Maintenance by the Operator

The operator should perform daily the maintenance described in
Procedure 8.
Procedure 8 Daily Operator Maintenance
Step Procedure
Using a dry, lint-free cloth, clean off any dust and dirt from the external
optical faces of the detector.

7. REMOVAL AND REPLACEMENT
7.1 Removal
To remove the Thickness detector, follow the steps in
Procedure 9 Removing the Thickness Detector:
Procedure 9 Removing the Thickness Detector
1. Switch off the power to the machine.
2. Open the front cover and remove the right side panel and the rear
panel.
Remove the two signal leads from the thickness detector front-end board,
and carefully thread these two leads through the frame so that they
appear at the front of the machine.
The thickness detector front-end board is mounted in the right-hand end

of the machine, and can be recognised by the row of sixteen LEDs on the
edge of the board (see Figure 7).
Front-End Board
Figure 7 Thickness Detector Front-End Board
3. At the rear of the machine, loosen the thickness detector drive belt
(see Figure 8), and remove it from the detector pulley.
4. At the front of the machine, remove the three bolts securing the
detector to the backplate, and remove it from the machine.

Thickness
Detector
Drive
Belt
Figure 8 Thickness Detector Drive Belt
7.2 Replacement
To replace the Thickness detector, follow the steps in
Procedure 10 Replacing the Thickness Detector:
Procedure 10 Replacing the Thickness Detector
Step Procedure
1. Position the detector on the back plate, and secure with the three
screws.
2. Thread the two signal leads through the machine frame and plug
them into the front-end board.
3. Fit the detector drive belt, and tension it in accordance with the
instructions in Section 3 of the Service Manual, TP01311011.
4. Carry out the setting procedure for the Pulley Clutch D/A, refer to
7.3.
5. Refit the covers.
7.3 Adjusting the Pulley Clutch D/A

Follow the steps in Procedure 11 to adjust the Pulley Clutch D/A.
Procedure 11 Adjusting the Pulley Clutch D/A
1. Ensure that the Thickness detector drive belt is correctly tensioned.
2. Ensure that the sensor roller gap is set correctly (refer to “Sensor
Roller Gap” on page 10).
3. Ensure that the clutch clamp bolts are tightened to prevent the
clutch from slipping on the drive shaft, the recommended torque is
1Nm.

4. Rotate the adjustment ring anticlockwise (as viewed from the rear of
the machine) to reduce the clutch torque to a low value (see Figure
9).
5. Put three banknotes together to create a single test document
0.3mm thick.
6. Manually wind the 0.3mm test document into the transport into the
thickness detector.
The document should stall at the Thickness detector as the clutch
will slip.
7. Rotate the adjustment ring clockwise to increase the clutch torque
until the test document passes through the thickness detector.
8. Put five banknotes together to create a single test document 0.5mm
thick.
9. Manually wind the 0.5mm test document into the Thickness detec-
tor.
will slip.
9.1 If the document goes through the Thickness detector, reduce
the clutch torque until slipping occurs.
10. Re-check that the 0.3mm test document passes through the detec-
tor.
The setting is now complete.
Clutch Clamp
Adjustment Ring
Figure 9 Pulley Clutch D/A

8. ILLUSTRATED PARTS LISTS
Table 8 Parts List: Thickness Detector
Part number Description
3703000603 Sensor Roller Assembly

4003008501 Reference Roller Assembly
3106003401 CBLFM,LVDT Leads (xz)
4002023101 Pulley Clutch D/A
4016007202 Stripper, Thickness Entry (xz)
4016001901 Blade Scrapper (xz)
3102012802 Spring LVDT D/A
3109530706 PCBP Thickness Front-End
3739113101 Test Note Doubles set-up
CBLFM, LVDT Leads

Pulley Clutch D/A (xz)
Sensor Roller
Assy
Reference
Roller Assy
Stripper, Thickness
Entry (xz)
Figure 10 Thickness Detector Illustrated Parts

Spring LVDT
Blade Scrapper (xz)
Figure 11 Thickness Detector Illustrated Parts

APPENDIX 1 - DETECTOR REPLY CODES
Detector Name:Operator = “DT”
Engineer= “THIK”
This detector has several possible replies depending upon which feature
is found on any given note. The features that are detected are:
Doubles
Leading edge corner-fold
Trailing edge corner-fold
Tape
Cross tape
If any of these features is above the set size/area, then the corresponding
binary bit is set.
If a double is found, then no further algorithms are run, and the notes are
culled.
The possible detector replies are shown in Table 9:
Table 9 Detector Replies
Binary Code Detector Reply Result
Hex Dec
Single note, no damage 00000 0000 0 Good note

Double detected 00001 0001 1 Note culled
Leading edge c/fold 00010 0002 2 Damage
detected
Trailing edge c/fold 00100 0004 4 Damage
detected
Tape 01000 0008 8 Damage
detected
Cross tape 10000 0010 16 Damage
detected
The above replies are cumulative - that is, if a note has a leading edge
and a trailing edge corner-fold as well as tape - then its reply would be
000E (hex), 14 (decimal).

APPENDIX 2 - DETECTOR CULL CODES
There are some detector cull codes associated with this detector:
Table 10 Detector Cull Codes
Code Definition
8000 Note priming value too early wrt true leading edge
8001 Note priming value too late wrt true leading edge
8002 Note too thick
8003 Notes culled because of a gulp feed
8006 Unable to find note trailing edge
8007 Note trailing edge already present


Section 3
Solid-State Holes and Tears

Contents
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Principles of operation . . . . . . . . . . . . . . . . . . . . . 2
2.1 Illumination Head . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.2 Detection Head (photo-detector) . . . . . . . . . . . . . . . . . . . 2
2.3 Signal Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3. Fault-finding guide . . . . . . . . . . . . . . . . . . . . . . . . 4
3.1 Waveforms In Controller Memory . . . . . . . . . . . . . . . . . . . 4
3.2 Trace Measures . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4. Mechanical Setup . . . . . . . . . . . . . . . . . . . . . . . . 7
5. Electrical Setup . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.1 System Setup Procedure . . . . . . . . . . . . . . . . . . . . . . . 8
5.2 Width Calibration Procedure . . . . . . . . . . . . . . . . . . . . . 9
6. Routine Maintenance . . . . . . . . . . . . . . . . . . . . . . 12
6.2 Routine Maintenance by the Service Engineer . . . . . . . . . . . 12
7. Removal and replacement . . . . . . . . . . . . . . . . . . 13
7.1 Illumination Head . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7.2 Detection Head . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8. Illustrated parts list . . . . . . . . . . . . . . . . . . . . . . . 14
Figures
1 SSHT Detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Detector System Block Diagram . . . . . . . . . . . . . . . . . . . . 2
3 Head Alignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4 Linearity Document . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5 Width Calibration Document . . . . . . . . . . . . . . . . . . . . . . 10
6 Front-End PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7 Solid-State Holes and Tears Illustrated Parts . . . . . . . . . . . . . 14
Tables
1 PL4 Illumination Head . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2 PL3 Detection Head . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3 Algorithm Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4 SSHT Detector Buffers . . . . . . . . . . . . . . . . . . . . . . . . . 4
5 Fit/Unfit Reasons and Values . . . . . . . . . . . . . . . . . . . . . . 5
6 Trace Measures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

7 Illustrated Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Procedures
1 Setting up the System . . . . . . . . . . . . . . . . . . . . . . . . . 8

2 Performing the Width Calibration . . . . . . . . . . . . . . . . . . . 10
3 Performing Maintenance . . . . . . . . . . . . . . . . . . . . . . . . 12
4 Removing the Illumination Head . . . . . . . . . . . . . . . . . . . . 13
5 Removing the Detection Head . . . . . . . . . . . . . . . . . . . . . 13

1. INTRODUCTION
The solid-state holes and tears detector detects holes and missing corner
damage as a banknote passes between an illumination head and a detec-
tion head. The detector is also capable of determining the banknote
length and width.
SSHT Detector
Figure 1 SSHT Detector

The principal components of the detector are:
Illumination head
Detection head
Signal processing electronics
A system block diagram is shown in Figure 2.
2.1 Illumination Head

This provides a curtain of infrared illumination across the full width of the
banknote. A row of infrared LEDs inside the illumination head provides
the source of light, which then passes through an optical slit near the light
exit window.
2.2 Detection Head (photo-detector)

This is a photodiode detector which receives all the transmitted light from
the illumination head. The detector spans the full width of the document
path, and is sectioned into three equal-length (34mm) channels, inboard,
centre and outboard.
2.3 Signal Processing

The output from the detection head is processed on am MK3 front-end
board and a 5000 detector controller board.
Illumination
Head
Detection
Head
Figure 2 Detector System Block Diagram

Table 1 PL4 Illumination Head
Pin Wire Colour Description
1 Grey (ident red) +15V Head supply

2
3 Grey (ident brown) 0V Head supply
Table 2 PL3 Detection Head
Pin Wire Colour Description
1 White Outboard channel

2 Black Centre channel (outboard segment)
3 Black (screen) 0V
4 Green Centre channel (inboard segment)
5 Red Inboard Channel

If poor performance is suspected, or there is a high cull rate associated
with the detector, there are some diagnostic tools available which may be
used to examine the problem.
3.1 Waveforms In Controller Memory

The suite of algorithms are listed below. All algorithms have a lead delay
of 16mm and operate on 1mm sampled data.
Table 3 Algorithm Parameters
Algo No. of parame-

Description Buffers used
No ters
160 Holes 11 Average

161 Accumulative holes 11 Average
162 Leading missing corners 11 Average
163 Trailing missing corners 11 Average
164 Length 6 Opacity, Average
102 Width 14 Inner, Outer, Opacity and
width frequency
The buffers for the SSHT detector (4-channel system set-up) are:
Table 4 SSHT Detector Buffers
Controller
Buffer Comment
memory
100400 Outer Signal from outboard channel of sensor head

100500 Inner Signal from inboard channel of sensor head
100600 Dirt monitor Record of outer, inner and opacity no-note levels
(in cyclic order) for dirt monitoring in run-time.
100700 Opacity Signal from centre channel of sensor head
100800 Average (Outer + Inner + Opacity) / 3
that is, full width
100900 Width frequency Created by width algorithm – frequency log of
width readings taken over the note
100A00 Cull Copy of average buffer for the last culled note.
Also stored at the end of this buffer is:
100AF6 = Cull code word (for example, 80xx)
100AF8 = Outer no-note level
100AF9 = Inner no-note level
100AFA = Opacity no-note level
100AFB = Average no-note level
100AFC = Early note start index
100AFD = Note start index
100AFE = Note end index
100AFF = Early note end index
(depending on the cull code, not all these variables
may be set)

Table 4 SSHT Detector Buffers
100B00 Fit/Unfit Copy of average buffer for the last culled note.
Also stored at the end of this buffer is:
See Table 5 for reasons
100C00 Processed outer Used by auxiliary holes processing
100D00 Processed inner Used by auxiliary holes processing
100E00 Processed opacity Used by auxiliary holes processing
Values recorded for the various fit/unfit reasons:
Table 5 Fit/Unfit Reasons and Values
100BF6 1. LMC 2. TMC 3. Holes 4. Acc. Holes
100BF7 Note start 0 Hole search start Hole search start

index
100BF8 0 Note end index Hole search end Hole search end
100BF9 0 0 Hole datum 0
100BFA LMC size TMC size Hole diameter No. of holes
100BFB 0 0 Aux. Hole diameter Aux. No. of holes
100BFC LMC area TMC area Hole area Acc. Area
100BFE 0 0 Aux. Hole area Aux. Acc. area
3.2 Trace Measures

Trace measure
Description Units
number
145 Note start position (wrt buffer start) mm

290 Note end position (wrt buffer start) mm
285 Area of largest individual hole mm2
286 Equivalent round hole diameter of largest individual mm
hole
148 Number of holes
287 Accumulated area of holes mm2
31 Leading missing corner length mm
288 Leading missing corner area mm2
33 Trailing missing corner length mm
289 Trailing missing corner area mm2
146 Note length mm
144 Note width 1/2mm
200 Frequency of width winner
303 Auxiliary, area of largest hole mm2
304 Auxiliary, equivalent round hole diameter of largest mm
individual hole

305 Auxiliary, accumulated area of holes mm2

306 Auxiliary, number of holes

The alignment of the illumination head and the detection head is critical.
Even the smallest deviation can reduce the effectiveness of the detector
(refer to Figure 3).
To adjust the alignment of the two halves of the detector, use a straight
edged tool, for example a short steel ruler, against the bodies of the two
halves to test for alignment. If necessary, loosen the mounting for one half
and adjust.
Figure 3 Head Alignment

The full electrical setup procedure must be carried out if any of the follow-
ing items are replaced:
Illumination head
Detection head
Front-end board
Prior to performing the electrical setup procedure, ensure that:
A. Link LK1 is fitted (shorted out) on the front-end board.
B. The optical faces of the illumination head and the detection head are
entirely clean, and not obscured by any debris.
C. The illumination head is properly clipped into its operating position.
D. The Cobra 4004 has been powered ON for at least 60 seconds; this
allows the light from the illumination head to stabilise.
The electrical setup procedure comprises
System setup procedure
Width calibration procedure
The procedures must be carried out in their entirety, and must be per-
formed in the order specified.
5.1 System Setup Procedure

The setup of the system is controlled via parameters in the Setup algo-
rithm. The purpose of the process is to:
Set up the channel gains on the front-end board, so that a given no-
note voltage is obtained on the inboard, centre and outboard chan-
nels. This is done automatically on FEEDSTART when the machine
is running and there is no document under the head.
Test that the linearity of the system is acceptable, by feeding a line-

arity document.
To set up the system, perform the steps in Procedure 1 Setting up the

System:
Procedure 1 Setting up the System
Step Procedure
1. From the Cobra process select page, select SSHT Setup.
2. From the detector diagnostics page, select Trace Measure number

277. Return to the Run the Machine page.

3. Feed a brand new linearity document (see Figure 4). Take care to
feed it centrally and unskewed. The document should be fed such
that the printed part number is trailing and inboard.
4. The document should be fed to the PASS stacker on the first pass if
all is well.
Figure 4 Linearity Document
5. Press STOP to save all the setup data into the memory (on the
front-end board) when the note enters the PASS stacker.
The document may enter the FAIL stacker for two reasons:
i. The attempt to set up the gains failed. This is indicated by both the
detector reply and trace measure being set to zero. If this happens, sus-
pect the front-end board hardware.
ii. The measured linearity of the head did not meet the requirement. This
is indicated by a detector reply set to zero, and trace measure being set
to non-zero (the trace value will be seen to be larger than the limit -
that is, greater than P13 of the setup algorithm). If this is the case, sus-
pect either a misalignment of the two heads, or defective illumination
and/or detection heads.
5.2 Width Calibration Procedure

The width calibration is controlled via parameters in the width calibration
algorithm.
The purpose of the process is to create a width lookup table for subse-
quent use by the width algorithm. The calibration algorithm does this by
measuring and recording the width characteristics of the SSHT head. In
this way, the width accuracy is repeatable across different machines.
To calibrate the width, proceed as follows:

Procedure 2 Performing the Width Calibration
Step Procedure
1. From the Cobra process select page, select process Width calibra-
tion.
2. Feed a brand new width calibration document (see Figure 5) taking
care to feed it centrally and unskewed. The document should be fed
such that the printed part number is trailing and inboard.
3. The document is fed to the PASS stacker on the first pass if all is
well.
4. Press STOP to save all the width setup data (on the front-end
board).
Figure 5 Width Calibration Document

If the document enters the FAIL stacker, then it was deemed to be
too skewed to take safe width calibration data.
4.1 If necessary, re-feed the note and try again.
More fundamental errors may result in the document being culled. These
errors result if the algorithm cannot detect specific zones on the calibra-
tion document.

Figure 6 Front-End PCB

6. ROUTINE MAINTENANCE

Clean dust and debris from the illumination head and the detection head
windows.
6.2 Routine Maintenance by the Service Engineer

The following routine maintenance should be performed by a Service
Engineer.
Only a trained, qualified Service Engineer should perform this mainte-

nance.
Procedure 3 Performing Maintenance
Step Procedure
1. Inspect the detector heads and renew any damaged items.
2. Check for correct belt tension. Renew belts that are worn or dam-
aged.
3. Inspect the condition of all PCBs, cables and connectors. Renew or
repair damaged items.
4. Check that the detector is set up in accordance with the setting pro-
cedures detailed in “Mechanical Adjustments” on page 7 and “Elec-
trical Adjustments” on page 8.

If either unit is disturbed, perform the set-up routines described in
“Mechanical Adjustments” on page 7 and “Electrical Adjustments” on
page 8.
7.1 Illumination Head

To remove the illumination head, proceed as follows:
Procedure 4 Removing the Illumination Head
Step Procedure
1. Remove the plug from PL4 of the SSHT front-end board.
2. Remove the bolt at the rear of the SSHT illumination head, which
secures the unit to the frame.
3. Pull the front of the SSHT illumination head away from the clip
securing it to the SSHT detection head.
4. Carefully pull the unit away from the machine, taking care to guide
the cable through the framework.
5. To replace the SSHT illumination head, reverse the above proce-
dure.
7.2 Detection Head

To remove the detection head proceed as follows:
Procedure 5 Removing the Detection Head
Step Procedure
1. Remove the plug from PL3 of the SSHT front-end board.
2. Remove the bolt at the rear of the SSHT detection head, which
secures the unit to the frame.
3. Pull the front of the SSHT illumination head away from the clip
securing it to the SSHT detection head.
4. Carefully pull the unit away from the machine, taking care to guide
the cable through the framework.
5. To replace the SSHT detection head, reverse the above procedure.

8. ILLUSTRATED PARTS LIST
Table 7 Illustrated Parts List
4002011501 Illumination Head Assembly

4002011601 Detector Head Assembly
5009510804 Kit, SSHT FE PCB + FK
Detection Head Assembly Illumination Head Assembly
Figure 7 Solid-State Holes and Tears Illustrated Parts

Section 4
Vision Detector

Contents
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.1 Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.2 Detector Head . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.3 ISA Interface Card . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.4 PC Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.5 System PSU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
5.1 Adding/Replacing a Captured Note Image . . . . . . . . . . . . . . 7
5.2 Masking Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.3 To Add a Note . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.4 Links, Switches, Connectors and Configuration . . . . . . . . . . . 9
5.5 Pattern Controller PCB . . . . . . . . . . . . . . . . . . . . . . . . 9
5.6 Vision System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6.2 Semi-Annual Maintenance by the Service Engineer . . . . . . . . 14
6.3 Calibrating the Vision Detector . . . . . . . . . . . . . . . . . . . . 15
6.4 Off–site Service . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.1 Detector Head . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.2 Vision PC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
8. Illustrated Parts List . . . . . . . . . . . . . . . . . . . . . . . 24
Figures
1 Vision Detector in Cobra 4004 Chassis . . . . . . . . . . . . . . . . 1

2 Vision System - Block Diagram . . . . . . . . . . . . . . . . . . . . . 2
3 Vision Detector Head . . . . . . . . . . . . . . . . . . . . . . . . . . 3
4 Pattern Controller Configuration . . . . . . . . . . . . . . . . . . . . 9
5 Note Images Captured Before (left) and After (right) Calibration (for illustra-
tive purposes only) 15
6 VISION Captured Image of the Calibration Document . . . . . . . . 17
7 Code 0x000/0x4000 Calibration Successful . . . . . . . . . . . . . . 19
8 Code 0x0001/0x4001 – Minimum Amplitude Error Detected . . . . . 20
9 Code 0x0002/0x4002 – Maximum Amplitude Error Detected . . . . 20
10 Code 0x0003/0x4003 – Maximum Deviation Error Detected . . . . . 21
11 Vision Head Location . . . . . . . . . . . . . . . . . . . . . . . . . . 22

12 Vision PC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
13 Vision Detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Tables
1 Fault Finding Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2 BNoteDAQ.ini File Parameters . . . . . . . . . . . . . . . . . . . . . 10
3 Result Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4 Illustrated Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Procedures
1 Adding a Note to the Pattern Set . . . . . . . . . . . . . . . . . . . 7

2 Masking Out Areas of the Note . . . . . . . . . . . . . . . . . . . . 8
3 Performing Daily Operator Maintenance . . . . . . . . . . . . . . . 14
4 Performing Semi-Annual Maintenance . . . . . . . . . . . . . . . . 14
5 Calibrating the Vision Detector . . . . . . . . . . . . . . . . . . . . . 16
6 Performing Off-Site Service . . . . . . . . . . . . . . . . . . . . . . 21
7 Removing the Vision Head . . . . . . . . . . . . . . . . . . . . . . . 22
8 Removing the Vision PC . . . . . . . . . . . . . . . . . . . . . . . . 23

1. INTRODUCTION
Vision Detector
Figure 1 Vision Detector in Cobra 4004 Chassis
The Vision detector provides a range of note detection functions. The

standard functions are sorting by denomination, facing, and orientation,
and outsorting suspect or unrecognized notes. Vision utilises the visible
reflected light from an illuminated banknote to build a two-dimensional
image of the document. This image is processed and compared with a
range of pre–captured sample notes held in the Vision system database
to provide a best match answer as to the type of document passing under
the detector head.
The best match figure is a value representing features which correlate

between the live note and the database image. If this value does not
exceed a pre–determined threshold, then no match is found and the note
is culled.
Additional detection functions are available after appropriate hardware

and software changes. The additional functions are graffiti detection, and
a range of detection specifically intended for newly printed pre–issue doc-
uments. The range includes accurate print position detection, missing and
smudged print detection, serial number positional detection, and visual
thread positional detection.
The additional positional functions are achieved by performing searches

of the captured image for correlation with reference templates. Graffiti,
missing and smudge print detection is achieved by comparing the cap-
tured image to reference images. These additional functions are normally
performed at reduced pixel resolution, due to processing time restrictions.

2.1 Structure
The Vision detector comprises five main hardware elements:
Head CCD Array PCB
Head Motherboard
ISA Interface Card
PC Card
System PSU
A block diagram of the Vision system appears in Figure 2 which shows

the elements of the Vision system and their relationship to the DLRS Pat-
tern Card running the Third Party Detector (TPD) interface algorithm.
The Vision detector is isolated from the system into which it is integrated
by means of optical isolation for the Note Present and Transport Clock
interface signals. The detector also has a separate floating DC power
supply.
The Vision detector comprises the following main assemblies:
Detector Head
PC Chassis
Figure 2 Vision System - Block Diagram

2.2 Detector Head
The detector head comprises:
A machined enclosure, length 192.95mm (219.95 including connec-

tor at rear), width 113.2mm, height 96mm (see Figure 2).
A line scan CCD array plus interface electronics together with its
mounting system, adjustment mechanisms and lens assembly.
A light source.
An optical prism.
An optical filter.
Figure 3 Vision Detector Head
A. Enclosure
The enclosure is painted black to minimise internal reflected light and is

sealed to provide dust–proofing. Separate electrical connections are pro-
vided for:
z Head power – circular multi-pole connector
z CCD data – 50-way SCSI2 connector
B. CCD Array
The CCD array comprises a linear group of headdiodes or sensing ele-

ments. Each photodiode produces a charge proportional to the light inci-
dent upon it.
C. Visible Light Source

The light source uses two miniature 12-volt halogen lamps wired in paral-
lel. The 12V supply for the lamps is provided by the PC switch mode PSU
and distributed via the ISA card fitted to the Vision system PC chassis.
The lamps are fitted immediately above the glass prism and are focused
onto the nominal centre line of the sensing elements of the CCD array.
D. Optical Prism
The optical prism is a conduit for the light illuminating the passing ban-
knote. The prism also carries the light reflected from the document.
E. Head Motherboard
The head motherboard provides an interface to the CCD array and an A/

D converter which digitises the CCD information captured for transmis-
sion to the system ISA interface card. The head motherboard communi-
cates with the ISA interface card through the 50-way SCSI2 connector.
2.3 ISA Interface Card

The ISA Interface card buffers the data from the head. The card also
interfaces to the PC via the ISA bus.
Communication with the head is via a 50-way SCSI 2 connector. Data

transfer to the PC card is over the ISA bus at 8MHz.
2.4 PC Card
The PC card is a complete PC system with serial and parallel I/O, VGA
output and disk interfaces. The applications software uses the data from
the ISA interface card. All software runs under the Windows 95 operating
system.
The PC has one serial port (COM2) dedicated to the third-party detector
interface, which is a conduit for detection setup instructions to the PC and
for detection results in the other direction. A higher specification PC card
is required for the additional detection functions listed in “Introduction” on
page 1.
2.5 System PSU

One 150W switch mode PSU provides DC power for all the Vision system
components. The input is 85–135V/180–265V AC and the output pro-
duced is ±5V and ±12V.

Table 1 Fault Finding Guide
Sorter
Fault Fault name Description Possible causes
Code
X067 TPDE_TIMEOUT VISION did not supply an 1. VISION RS232 connection to sorter
expected status message. disconnected.
X068 TPDE_NO_RESULT VISION did not supply an 1. VISION RS232 connection to sorter
expected note result. disconnected.
2. Pattern controller expecting
VISION response too early
(Calculate P26 parameter in VISION
criteria).
All other faults must be referred, in the first instance, to the DLR service
department. Detector processor faults (those formatted X9XX) are not
covered here.

This section does not apply to the Vision detector.

5.1 Adding/Replacing a Captured Note Image

Note: After capturing or recapturing notes, all files with extensions .nfl, .512
and .bdb, together with the BNoteDAQ.ini file should be sent to: The Pattern
Capture Dept, De La Rue Ltd, Walton Road, Portsmouth.
The BNoteDAQ.ini file is found in the windows directory, the other files are in
the Country directory in c:/databases.
Procedure 1 Adding a Note to the Pattern Set
Step Procedure
Note: The configurator requires a change for the machine to be able to recog-
nise and process the note. The new note must be evaluated for any features that
other detectors are expected to detect.
1. Connect a PS2 keyboard and mouse to the VISION computer.
2. Connect a VGA monitor to the VISION computer.
3. Power up the host machine and VISION.
4. Close down BnoteDaq (cntrl C).
5. To recover from any possible problems, carry out the following:
5.1 Use Windows Explorer to create a directory called Old in the

following directory, where *** equals the country directory.
C:\databases\ ***
5.2 Go to the country directory and click the right mouse button to
select all of the files. Hold down the mouse button and place
the pointer above the Old directory and release the mouse
button.
5.3 Of the several available options, select COPY.
Duplicate files are added to the new directory.
5.4 If there is a problem, you can recover by repeating copying
the files from the Old directory back into the country direc-
tory.
6. Open the VISION test program (on screen icon).
7. Enter E0 process on the host machine.
8. Click the GO button on the tool bar in the Vision test program.
9. Feed the note through the host machine in face A.
10. Confirm that the captured image of the note does not have any irreg-
ularities or defects and that there are green lines on all four edges.
Also check that it is possible to zoom in and out of the image using
the mouse buttons.

11. Save the file (all text in bold must be entered as shown). The path
should take the format C:\databases\***\****
where *** =the country directory (find name using Windows
Explorer)
and **** = description of the captured note
value_description_date or issue number_face
ie 10_poundUK_99_front
The term _back or _front must be used at the end,
for example C:\databases\England\10_poundUK_99_front
12. Repeat with face C of the note (back).
13. Minimise the test program window.
5.2 Masking Out

Masking out enables areas of the note to be ignored by the Vision detec-
tor. This reduces the impact of areas that change from one note to
another (serial numbers, signatures, and so on). To mask out areas, pro-
ceed as follows:
Procedure 2 Masking Out Areas of the Note
Step Procedure
1. Open the TEST program.
2. Select the FILE menu and go to the file to be masked and open it.
Use the mouse buttons to zoom in and out of the note image.
3. Select MR from the top menu bar.
4. Place the mouse pointer over the area to be masked and hold down
the left mouse button whilst dragging over the area to be masked.
The area will go purple, although some areas may look as though
they have been missed.
5. To unmask areas, use the right mouse button.
6. When the desired result is achieved, save the file and forward a
copy of the file to the Pattern Capture Department.
5.3 To Add a Note

If a note is to be added to the Vision detector, Walton Road processes the
request and returns the files along with an updated configurator. The
addition of a note to the configurator requires a configurator rewrite.
If the note has not been evaluated before (security features, sort levels),
DLR Walton Road must evaluate it, unless it is purely for out-sorting on its
pattern.
On receipt of the files, they should be copied to the correct directories and
the new configurator can be installed.

5.4 Links, Switches, Connectors and Configuration
Both the Pattern Controller PCB and the VISION detector require configu-
ration. This is done when the system is set up/commissioned on a ban-
knote sorting machine. Some of the settings depend upon machine
fitment. The following section describes these.
In addition, some of the connections on the VISION detector are used

solely in the process of capturing images for database creation and for
fault finding on the system.
5.5 Pattern Controller PCB

Refer to Figure 4 for correct configuration of the Pattern Controller, when
used with the VISION detector:
K1 Left hand = 1Mbit PROM, Right hand = 2 or 4 Mbit PROM

K2, LK3, LK5, LK6 Does not need to be fitted
K4, LK8, LK12,-15 Set links to left hand position
K7 Set links to right hand position
K9, LK10 Ensure these links are set for the appropriate machine
SW1, SW2 Board address, set to suit configurated address of detector
U22,U23, U33, U38 No devices fitted
Figure 4 Pattern Controller Configuration

5.6 Vision System
There are no links/switches on any VISION system PCBs that are used in
the setting up of the detector.
All settings are made either by mechanical adjustment of the head itself,
or by parameters within the BNoteDAQ.ini file in the c:\WINDOWS
directory of the VISION system PC. The following section describes the
function of the BNoteDAQ.ini file parameters.
Table 2 BNoteDAQ.ini File Parameters
Default
Parameter Name Function Comments
Setting
ExpositionTime – Synchronises VISION scan Typical settings:–

rate with the linear transport 1.85m/s (3700) = 196
speed of the sorting machine. 2.4m/s (3200) = 130
If set incorrectly, the greyscale 2.4m/s (Cobra) = 130
and processed images will 5.3m/s (6000) = 23
appear to be different lengths 7.2m/s (5000) = 1
Blacklevel – Image intensity threshold for: Will need to be set lower for darker
a. Initiation of image capture. images; that is, (darker notes/ faster
b. Finding note edges against transport)
background. Typical setting:–
Bank of England / 6000 = 40.
Ensure that note edges are being found
correctly, but also that
premature triggering does not occur.
DSPregister – Configures operation mode of 8 Bit test value with functions as follows:–
detector head. This setting Bits 0..2 set output from head.
need only be changed for test- Bit 3 selects head input.
ing purposes. Bit 4 selects o/p blanking.
Bits 5..7 set non–classification functions –
keep set to 0.
Bit #SettingFunction
0..20 Entire ADC scale
11:2 ADC scale
21:4 ADC scale
3 Saw tooth output
4 10101010 output
5 01010101 output
6 High Z output
7 ROM image
30 CCD Array
1 Digi–pot o/p
40 Blanks output
1 Normal output
Normal setting = 16.

Default
Setting
BLANKregister – Sets the number of blank/ iso- Fixed settings:–

lation pixels to ignore at the Reticon array = 5.
start of each scan. Dalsa array = 10.
CoarseGain – Sets analog system gain at the Gain setting should be made to use entire
front end of the head. Coarse dynamic range of VISION system o/p
adjustment where possible. Darker notes/higher
transport speeds will require higher set-
tings.
Typical settings:–
Bank of England / 6000 = 90.
Vietnam / 3700 = 195.
FineGain – As above, but fine adjustment. Typical setting = 128.
1clock – Size in millimetres of one 5xxx approx. = 0.5
Transport Clock cycle. 37xx/32xx/6000 approx. = 1.0
Direction – Direction of note travel relative Typical settings:–
to head and CCD array orien- Fitting Setting
tation. 3700 l/h (Dalsa) –1
3700 r/h (Dalsa) 1
3200 r/h (Dalsa) 1
6000 l/h (Reticon/PerkinElmer –1
5000 r/h (Reticon/PerkinElmer) –1
Cobra (Reticon/PerkinElmer) --1
Cobra (Dalsa) 1
CheckNotePresent – Use/Don’t use external note Settings:–
priming signal. 0 – Only use internal threshold test to initi-
ate capture of note image.
1 (normal setting) – Use note prime signal
+ internal threshold test to initiate image
capture.
NotePresentLevel – Sets polarity of Note present 0 – Asserted low.
signal. 1 – Asserted high.
GhostNoteDelay_mm – Max. distance after Note Mechanism to overcome invisible batch
Present asserted with no note separators/other media causing No/
image capture initiated before late note response from the
timeout and responding Not Vision detector.
Recognised. Typical setting = 20.
Dbpath – Directory on VISION system Typical setting = C:\Databases.
PC containing Database info.

Default
Setting
Dbnumber –1 VISION database number. Examples:–

Dbnumber=2 would force
selection of file BN0002.bdb as the data-
base.
Dbnumber=–1 (default) forces VISION to
use the database selected in the sorter
configuration.
12Distance 10 Sets minimum permissible Typical setting = 5.
separation between first and
second note match contend-
ers.
If their scores come within this
threshold the note will be
reported as Not Recog-
nised: 12 distance.
The purpose of this mecha-
nism is to reduce the probabil-
ity of crossovers occurring.
TraceResults – Enables/Disables note result Typical settings:–
information being saved to TraceResults = 1 (Enabled).
disk. If enabled, results are TraceResults = 0 (Disabled).
saved from memory to disk Example filename:–
(VISION applications s/w Csi19990914.csv
directory) at FEED STOP/ (Note data recorded on the
when exiting from the VISION 14/09/99).
applications program.
The data is saved in Comma
Separated Value file format.
This is readily imported into
most spreadsheet packages.
The filename contains the date
and is in the following format :–
Csi<yyyy><mm><dd>.csv
EnableAllNotes 0 Enabled – Makes all notes in Typical settings:–
the database live. EnableAllNotes = 1 (Enabled)
Disabled – Only note numbers EnableAllNotes = 0 (Disabled).
specified by the banknote sort-
ing machine are live.

Default
Setting
LogFile – Destination of VISION system Examples:–

operational dialogue. This LogFile=
information can be sent to the CONOUT$ sends all messages to the
console or to a file for system console (DOS window).
diagnostic purposes. LogFile=
C:\Diagnostic\Dialog. txt sends
all messages to the specified file/
directory for later analysis.
FirstThreshold – Highest pattern match score Typical Setting = 970.
above this threshold leads to Changes to this parameter are NOT rec-
note classification. ommended and are possible ONLY after a
thorough assessment of the live currency
performance against the VISION data-
base.
SecondThreshold – If no pattern match scores fall Typical Setting = 960.
above the first threshold then Changes to this setting are NOT recom-
the highest pattern match mended and are possible ONLY after a
score between the first and thorough assessment of the live currency
second threshold also passing performance against the VISION data-
the graffiti test (below) leads to base.
classification.
GraffitiForSecond – Graffiti as measured by the Typical Setting = 60.
Threshold VISION detector must be
below this threshold, if a note
is to be recognised when note
recognition score is between
first and second threshold.
Note: All other parameters within the BNoteDAQ.ini file either do not con-
cern the operation of the classification system or are not intended to be altered
within the current system specification. No attempt should be made to change
these.


The Operator should perform the following daily checks.
Procedure 3 Performing Daily Operator Maintenance
Step Procedure
1. Clean off any dirt/dust from the external optical faces of the detector.
2. Visually inspect the external surfaces of the detector head, prism

and associated guiding, in particular the Melinex, for mechanical
damage.
2.1 Replace any defective or worn Melinex as required.
3. Check that the lamps are illuminated by inspecting the external opti-
cal face as indicated on Figure 3.
4. Replace any lamps that are defective. Replace lamps every 2000
hours.
6.2 Semi-Annual Maintenance by the Service Engineer

The following semi-annual checks should be performed by the Service
Engineer.
Only a trained, qualified Service Engineer should perform this mainte-

nance.
Procedure 4 Performing Semi-Annual Maintenance
1. Visually inspect the external surfaces of the detector head, prism

and associated guides, in particular the Melinex, for mechanical
damage. Replace any defective or worn Melinex as required.
2. Check that all lamps are illuminated by inspecting the external opti-
cal face as indicated on Figure 3. Replace any lamps that are defec-
tive:
2.1 Remove the head from the backplate.
2.2 Undo and withdraw two screws and remove the heatsink.
2.3 Access to the lamps can be gained through the apertures.
Watch out when replacing lamps as they may still be hot. After lamps
have been allowed to cool down, handle the lamps with a clean cotton

cloth. The fitment of the lamps are similar to that of a plug and socket.
Firm gentle force on the lamps will remove or replace them.
3. Perform the calibration procedure as detailed in 6.3 Calibrating the

Vision Detector.
4. Check the belts for correct tension. Replace any belts that are worn
or damaged.
5. Inspect the condition of all cables and connectors.
6. Clean the external optical face of the detector.
6.3 Calibrating the Vision Detector

Note: This calibration routine is required only when Vision is used for functions
in addition to Note Classification; that is, graffiti.
The purpose of the calibration procedure is as follows:
A. To set the system gain, so that a note of fixed reflectivity will, upon
capture, produce an image of a specified amplitude.
B. To normalise the output of the detector head, such that the effects of
an uneven illumination profile and of note presentation due to the
main transport belt and O–rings, are removed.
To do this requires feeding and capturing the image of a calibration docu-

ment. This image is then processed and a correction factor for each used
pixel of the detectors line scan array is calculated. These coefficients are
then stored on the VISION system PC and downloaded to the head at
process selection time. To facilitate this calibration process, the head
FPGA software fitted to the head motherboard in position U9, should be
V1.14 or later.
Figure 5 illustrates the effect that this process has on a typical captured
image.
Figure 5 Note Images Captured Before (left) and After (right) Calibration
(for illustrative purposes only)
6.3.1 Determining When to Calibrate

Calibrate the VISION detector at the following times:

A. As part of routine maintenance.
B. If a VISION detector head has been re–fitted for any reason. For
example, after repair, firmware upgrade, and so on.
C. A new VISION detector head has been fitted.
D. If either or both halogen lamps in the VISION detector head have

been replaced.
E. If either the main transport belt or any of the VISION detector

assembly O–rings have been changed or renewed. Ensure that the
head is set up so that the O–rings do not mark the prism surface. If a
mark is observed it can be removed with a soft, lint-free cloth.
Note: If a replacement transport belt has white identification marks on it that
would be positioned against the detector’s prism glass, these marks should be
masked by writing over in black permanent marker pen. Allow the ink to dry before
use.
6.3.2 Items required for Calibration

Have the following items on hand before calibrating:
DLR Part Number 02390250 A. A supply of the VISION calibration document (DLR part number
02390250). If the document becomes damaged or marked and can-
not be cleaned, it must be replaced. It is recommended that several
calibration documents are kept available.
B. Dry, lint-free soft cloth to clean the VISION detector head prism.
C. Alcohol-based cleaning fluid and cloth or towel for cleaning the

feeder stripper wheel and contra roller.
6.3.3 Performing the Vision Detector Calibration

To calibrate the VISION detector, proceed as follows:
Procedure 5 Calibrating the Vision Detector
Step Procedure
1. Obtain a VISION detector calibration document (DLR part number

02390250).
Note: With the exception of the diagonal line on one face, this document should
be free from defect, marks, stains, scratches etc. The purpose of this document is
to present a uniformly reflective surface to the VISION detector as any mark or
damage will degrade the effectiveness of the calibration process. The typical
appearance of the calibration document post–capture by the VISION detector is
shown in Figure 6.
This image is for information purposes only and cannot be observed in normal
operation.
To observe the image:

2. Connect monitor, keyboard and mouse to vision PC.
3. Close BnoteDaq.exe using Ctrl-C.
4. Start Test.exe.
5. Click on Scanner.
6. Click Re Read Image.
Figure 6 VISION Captured Image of the Calibration Document
7. Using a soft, lint-free cloth, clean the prism of the VISION detector
head to be calibrated.
8. Using cleaning fluid and a cloth or towel, clean the feeder surfaces
that come into contact with the document and are liable to mark it;
for example, contra–roller. Ensure that both are dry when cleaning is
finished.
9. Adjust the feeder so that the centre–line of the calibration document
is in line with the centre–line of the transport belt.
10. Ensure that the BNote DAQ program is open on the Vision PC.
11. Select the appropriate VISION calibration process and denomina-

tion:
Upper head – Process number = d63. Denomination = d63.
Lower head – Process number = d64. Denomination = d64.
12. Place the calibration document in the feeder.
Facing of the document should be such that the black diagonal line
is not on the side that is presented to the detectors prism. When the
calibration document is fed, check that the long edges of the docu-
ment are contained within the width of the detector prism.
13. Press START and ensure that the document feeds with the minimum
amount of skew.

14. Re–feed the note until it enters the Pass pocket.
Note that the document is always routed to the Cull pocket on the
first feed. If, after five re–feeds, the note has still not entered the
Pass pocket, refer to Table 3.
Note: If the calibration document becomes marked on any pass then clean it
before the next pass, (a pencil eraser can be used). Similarly, if it becomes dam-
aged then it must be replaced before re–feeding.
15. End the calibration process and enter a sorting process that uses
the VISION detector to confirm that it is performing correctly.
6.3.4 Understanding the Results Codes

The calibration algorithm can return one of the result codes listed in
Table 3, after having processed the image of the calibration document. If
required, these can be examined in the detector processor trace data
buffer.
Table 3 Result Codes
Calibration
Meaning Possible Causes Corrective Action
Result Code
0x8000/ Calibration note culled by transport / VISION If not the first pass – Check the Transport
0xc000 detector. Note that on the first pass, the docu- Damage to the docu- system diagnostics for
ment is always sent to the CULL pocket by the ment/ Poor feed. CULL reason and rem-
VISION detector. This is due to the time edy.
required to perform the calibration algorithm –
the Nth pass result is returned on the N+1th
feed of the document.
0x0000 Passed Calibration. In this instance the document is routed to the pass pocket.
0x4000/
0x0001/ Image breached the Minimum Amplitude Lamp failure. Check/replace lamps.
0x4001 threshold. In this instance, the document is
routed to the fail pocket. The minimum ampli-
tude threshold prevents too small a dynamic
range being used in the note image.
Dirt on prism. Check/clean prism.
Dirt on/damaged cali- Check/clean/ replace
bration document. calibration document.
Wrong calibration Check/replace calibra-
document. tion document.
Poor presentation of Check note guiding (o–
note. rings etc.) and renew if
necessary.
Edge of calibration Check/adjust feeding
document not within position.
detector prism.
Gain set too low. Check/increase gain.
0x0002/ Image breached the Maximum Amplitude System gain set too Check/reduce gain.
0x4002 threshold. In this instance, the document is high.
routed to the fail pocket. The maximum ampli-
tude threshold prevents possible image satu-
ration and consequent non–linear effects after
normalisation.
Aperture open too Check/close down aper-
wide. ture.

0x0003/ Image breached the Maximum Deviation One lamp failed. Check/replace lamps.
0x4003 threshold. In this instance the document is
routed to the fail pocket.
Dirt on prism. Check/clean prism.
Dirt on/damaged cali- Check/clean/ replace
bration document. calibration document.
Wrong calibration Check/replace calibra-
document. tion document.
Bad rotational/ verti- Check and adjust on a
cal alignment of the setting up jig (off-site).
array.
The following figures show examples of Lupa single line scans that would
qualify for the categories described in Table 3. It is not necessary to enter
Lupa program, Figures 7 through 10 show reflected light conditions that
may affect calibration.
Figure 7 Code 0x000/0x4000 Calibration Successful

Figure 8 Code 0x0001/0x4001 – Minimum Amplitude Error Detected
Figure 9 Code 0x0002/0x4002 – Maximum Amplitude Error Detected

Figure 10 Code 0x0003/0x4003 – Maximum Deviation Error Detected
6.4 Off–site Service

Internal servicing of the detector head is carried out off–site due to the
sensitive nature of the internal CCD array and the possible contamination
of any internal optical surfaces. A qualified service engineer should per-
form the steps in Procedure 6 Performing Off-Site Service.
Procedure 6 Performing Off-Site Service
Step Procedure
1. Inspect the condition of all PCBs, cable-forms and connectors.
2. Check all the internal and external optical faces of the detector.
3. Check and replace lamps as required.
4. Check that the Vision system is setup correctly in accordance with

the production setup and test procedure.
Replacement units are set up on a jig prior to shipment.

7.1 Detector Head

This section describes how to remove and replace the Vision Detector.
Disconnect power from machine whilst removing or fitting detector

head.
Warning!
Fixing
bolts
Figure 11 Vision Head Location
To remove the Vision Head, follow the steps in Procedure 7 Removing

the Vision Head.
Procedure 7 Removing the Vision Head
Step Procedure
1. Remove the three bolts (Figure 11) securing the detector head to
the back plate.
2. Remove the plug from the base of the unit.
3. Remove the ribbon cable and connector from the side of the unit.
4. Lift the detector head away from the back plate.
5. To replace the Vision head, reverse the above procedure.
6. Line up the optical head with the transport belts before finally tight-
ening the fixing bolts.

7.2 Vision PC
Figure 12 Vision PC
To remove the Vision PC proceed as follows:
Procedure 8 Removing the Vision PC
Step Procedure
1. Remove the four cables and connectors from the rear of the PC.
2. Remove the power supply cables from the side of the PC.
3. Unfasten all P-clips securing cables to the metalwork of the PC.
4. Remove the four bolts securing the PC to the base plate.
5. Lift the PC out of the machine.
6. To replace the Vision PC, reverse the above procedure.

Table 4 Illustrated Parts List
3702033701 Guide - Melinex Assembly

02580056 2 x Lamp Quartz Hal 12v 10w l6415
3202422603* RH Vision Head
5003063101 Kit PCBP detector Controller
4002019001 Vision PC
Lamp Quartz
Guide
Melinex Assembly
RH Vision Head
Figure 13 Vision Detector
Note: This part number is for a Vision detector fitted with a PerkinElmer array.
Machines supplied before August 2002 may have a different array fitted and con-
version is required. Contact the De La Rue World-Wide Support for details.

Section 5
Optical Pattern Detector

Contents
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3.1 Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.2 Preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.3 Testing Transport Integrity . . . . . . . . . . . . . . . . . . . . . . 5
3.4 Fault Finding Procedure . . . . . . . . . . . . . . . . . . . . . . . . 6
3.5 Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.6 To Detect Note Profile . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1 Setting Up the Detector Head . . . . . . . . . . . . . . . . . . . . . 9
4.2 Adjusting the Detector Head . . . . . . . . . . . . . . . . . . . . . 9
5.1 Head Amplifier Board . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.2 Optical Trigger Board . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.3 To Mask Out All Detectors Except The Optical Pattern Detector . . 13
7.1 Detector Head Lens . . . . . . . . . . . . . . . . . . . . . . . . . . 15
8. Illustrated Parts List . . . . . . . . . . . . . . . . . . . . . . . 21
Figures
1 Optical Pattern Detector - General Block Diagram . . . . . . . . . . 3

2 Optical Pattern Detector - Detailed Block Diagram . . . . . . . . . . 4
3 Fault Diagnostic Flowchart . . . . . . . . . . . . . . . . . . . . . . . 7
4 Example Pattern and Trigger Waveforms . . . . . . . . . . . . . . . 8
5 Test Document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6 Pattern Detector Head . . . . . . . . . . . . . . . . . . . . . . . . . 16
7 Light Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
8 Melinex Guide Setting . . . . . . . . . . . . . . . . . . . . . . . . . . 18
9 Head Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
10 Head Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
11 Pattern Head Setting . . . . . . . . . . . . . . . . . . . . . . . . . . 20
12 Optical Pattern Detector Kit . . . . . . . . . . . . . . . . . . . . . . . 23
13 Optical Pattern Detector, Assembled Views . . . . . . . . . . . . . . 24
14 Optical Pattern Detector Detail: Phototransistor . . . . . . . . . . . . 25
15 Optical Pattern Detector Detail: Position in the Machine . . . . . . . 26

16 Optical Pattern Detector Detail: Light Source Position . . . . . . . . 26
Tables
1 Internal Error Codes and Actions to Resolve . . . . . . . . . . . . . 6

2 To Detect Note Profile . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Board Power Voltages . . . . . . . . . . . . . . . . . . . . . . . . . 11
4 Optical Pattern Detector Kit . . . . . . . . . . . . . . . . . . . . . . 21
Procedures
1 Checking Note Transport System Operation . . . . . . . . . . . . . 5

2 Finding Faults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Setting up the Detector Head . . . . . . . . . . . . . . . . . . . . . 9
4 Checking the Detector Head and Transport Belt Setting . . . . . . . 9
5 Preparing a test document . . . . . . . . . . . . . . . . . . . . . . . 11
6 Setting up the Head Amplifier Board . . . . . . . . . . . . . . . . . 12
7 Setting up the Optical Trigger Board . . . . . . . . . . . . . . . . . 13
8 Masking Out All Detectors Except the OPD . . . . . . . . . . . . . . 13
9 Performing Daily Maintenance . . . . . . . . . . . . . . . . . . . . . 14
11 Repairing the Detector Head Lens . . . . . . . . . . . . . . . . . . . 15

1. INTRODUCTION
The Optical Pattern Detector discriminates the reflective patterns from
banknotes as they pass through the detector.

Light from an optical ‘fishtail’ shines on the banknote as it passes the
detector head and creates a reflection of varying magnitude, determined
by the pattern on the note. This reflected light is converted into a current
output by a photodiode fitted to the optical fibre termination on top of the
detector head.
The current output from the photodiode is converted into an analogue

voltage, which is then filtered on the reflective head amplifier board. The
filtered output is then sampled on the sliding correlator board.
As the banknote approaches the detector, two phototransistors (in the

Trigger Block beneath the detector) detect the leading edge and provide
the sliding correlator with a trigger signal. The sliding correlator uses this
signal to determine the accurate position of the note.
A block diagram of the detector system is shown in Figure 1. A more

detailed block diagram of the system is shown in Figure 2.
The current output from the photodiode is applied to the head amplifier
board via pins 1 and 2 of PL2. The signal is converted to a0 negative volt-
age and amplified by the pre-amplifier U1, the gain of which is set by RV2.
A positive DC level, also applied to the pre-amplifier input, can be
adjusted by RV1 to offset the signal and prevent saturation occurring.
The output of the pre-amplifier is fed to an analogue to digital converter

on the sliding correlator board via a low-pass filter. The analogue input
voltage, representing the note pattern, is sampled and correlated with
stored references for nominal note alignment positions, and for a number
of slide positions either side of the nominal. The advantage of this tech-
nique is such that for any pattern mis-registration, or small positional inac-
curacy, automatic compensation is efficiently achieved.
The optical trigger board comprises two identical channels, and therefore
only one is described with references to the second in parentheses. Light
emission from the detector head causes the photo-transistor to conduct,
and its output go high. The high voltage threshold level is set by RV1
(RV2), and applied to the non-inverting input of U1/1 (U1/2). The output of
U1/1 (U1/2) is also high and is applied to PL1 pin 1.
When a note passes the detector head, the level of light received by the
phototransistor is greatly reduced, causing it to conduct less. This
reduces the voltage level to U1/1 (U1/2), and switches the output of U1/1
(U1/2) to low.
The negative-going output from U1/1 (U1/2) changes the high level on
PL1 pin 1 to a low and becomes the TRIGGER signal on the sliding corre-
lator board. The leading edge of the note informs the Correlator that a
note is present at the detector head.
The high level (no note) at the input of U1/1 (U1/2) is also used to provide
an input to U1/3 (U1/4). The output of this device is high and provides a
trigger READY signal (active high).

The READY signal will go low if a note remains under the detector head
for longer than expected, if the diodes are obscured, or if the lamp fails.
Head Photodiode Trigger Sensor
SK3
Head Amplifier Board Optical Trigger Board
SK1 SK2
SCHEDULE 3
SCHEDULE 12
SCHEDULE 5
SK12
J21
J3
Sliding Correlator Board
Buffer and Source

Select Circuit Power Supply Unit
PL17 SK17
Detector Processor Board

J4
Mother/Distribution Board
Figure 1 Optical Pattern Detector - General Block Diagram

Figure 2 Optical Pattern Detector - Detailed Block Diagram

3.1 Error Messages

A Check DA detector error message indicates that the detector is not
ready. This message can occur if there is a fault with the auto-trigger unit.
3.2 Preliminary
The performance of the transport system affects the performance of the
detectors. Therefore, before investigating specific detector faults, check
for correct operation of the transport system, as described in Testing
Transport Integrity, below.
Ensure that, if any part of the detector system is renewed, the adjustment
procedures described in paragraphs 4. Mechanical Adjustments on
Page 5-9 and 5.1 Head Amplifier Board on Page 5-13 are subsequently
carried out.
3.3 Testing Transport Integrity

Before performing diagnostic work on the detector, make sure the trans-
port system works correctly. To do this, carry out the following checks.
Procedure 1 Checking Note Transport System Operation
Step Procedure
Cleanliness 1. Check that all transport sensors and the detector are clean.
1.1 If any item is dirty, remind the supervisor or operator of the

importance of thorough daily cleaning.
Note feeder 2. Check that the Note Feeder adjustments are correct.
2.1 Observe whether the feeder gives any multiple feeds.

2.2 Identify these by counting the number of notes in the Cull
pocket and comparing the cull event count in the machine
performance report.
If there are no multiple feeds the two counts will be the same.
3. If the number of multiple feeds is excessive, check whether the
notes are badly degraded, poorly prepared, or incorrectly loaded
into the hopper.
3.1 If they are not, check that the separator roller and nudger rub-
bers are clean.
3.2 Check that all parts are correctly fitted, undamaged and not
excessively worn.
Belt slip 4. Confirm that all of the note transport belts and roller assemblies are
in good working order.

Culls 5. Confirm that the Optical Pattern Detector is culling the notes in the
Detector Trace Data menu in the detector system diagnostics.
5.1 If the cull rate is still excessive, investigate specific detector
faults.
Service report In your service report, include a statement verifying:
That the test for system integrity is completed
Details of all corrective actions taken
3.4 Fault Finding Procedure

If the fault persists, proceed as follows:
Procedure 2 Finding Faults
Step Procedure
1. Carry out the full maintenance checks as detailed in “Semi-Annual

Maintenance by the Service Engineer” on page 16. This may iden-
tify errors in the following areas:
z Mechanical
z Light source input
z Good connection of boards and connectors
z System set-up
2. Check that the power supply to the head amplifier board is in
accordance with “Head Amplifier Board” on page 13.
Some machine-reported error messages indicate a fault with the
pattern system. See paragraph 3.5, below.
3. If these steps fail to identify the fault, follow the diagnostic flowchart
shown in Figure 3.
3.5 Error Codes

The system reports the occurrence of internal errors, as listed below:
Table 1 Internal Error Codes and Actions to Resolve
Error Code Error Type Action
40306 Unable to find pattern set Push sliding correlator PCB

firmly home.
Replace sliding correlator

PCB

Figure 3 Fault Diagnostic Flowchart

3.6 To Detect Note Profile
The following waveforms may be monitored:
Table 2 Detecting Note Profile
Waveform Monitor on Board At point
Pattern waveform Reflective Head Amplifier Board TP1

Trigger pulse Optical Trigger Board PL1 pin 1
Example waveforms are shown in Figure 4.
Figure 4 Example Pattern and Trigger Waveforms

4.1 Setting Up the Detector Head

There should be no need to re-adjust the detector head (Figure 13) once
it has been set correctly. However, if any component parts of the detector
head are replaced, then set up the head as follows:
Procedure 3 Setting up the Detector Head
Step Procedure
1. Remove the retaining circlip, the M6 crinkle washer and the plain
washer from the end of the pivot arm, and place to one side.
2. Slacken the two M3x5 set screws in the detector head and withdraw
the pivot pin from the support bracket, taking care with the nylon
washer.
3. Assemble the head, using new components as appropriate (see Fig-
ure 5 and Figure 6) but do not tighten the set screws.
Figure 5 Head Components

Face X
Face Y
Figure 6 Head Assembly
4. When the head is assembled (see Figure 6) squeeze the faces X

and Y together until the nylon washer is held tight between the inner
faces of the head and support bracket.
5. Tighten the two set screws to lock the head to the pivot pin. Replace
the two M6 washers and the circlip, renewing as necessary.
4.2 Adjusting the Detector Head

The following procedure ensures the correct setting of the pattern detec-
tor head in relation to the transport belt, and must be carried out before
attempting any electrical setting or adjustment.

Procedure 4 Checking the Detector Head and Transport Belt Setting
Step Procedure
1. Check that the detector head is at 90º to the machine backplate (see
Figure 7).
Zero Gap
Pattern
Head
Locking
Clip
90° Transport
Belt
Mounting
Block
90°
Figure 7 Pattern Head Setting

2. The gap between the head and the belt should be zero; that is, with
the transport running, the belt should just contact the head without
being deflected.
3. To obtain the head set position, slacken the latch and support
bracket securing screws to friction tightness, and position the com-
ponents accordingly.
4. Tighten the screws on completion.
5. Check that the Melinex guide is parallel to the head at the point
where they make contact.
5.1 To adjust the guide, loosen to friction tightness, the two
adjustment screws and the clamp screw (see Figure 11).
5.2 Tighten the screws on completion.
6. Run the transport system to ensure the notes lie flat when passing
beneath the head.

Carry out the following procedures whenever these components are
replaced or adjusted:
Light source
Optical fibre light pipes
Pattern detector head
Take EXTREME CARE when replacing or removing the diode housing.
Before attempting to adjust any settings on the head amplifier or optical

trigger boards, check that the power supplies to the sliding correlator and
head amplifier boards are as follows:
Table 3 Board Power Voltages
Board Measure voltage between: Voltage
Sliding Correlator U1 pin 16 with respect to U1 pin 8 +5V

Head Amplifier U1 pin 4 with respect to TP2 +5V
U1 pin 11 with respect to TP2 -5V
5.1 Head Amplifier Board

To set up the head amplifier board, prepare a test document as follows:
5.1.1 Preparing to Set up the Head Amplifier Board
Procedure 5 Preparing a test document
Step Procedure
1. Cut a piece of Polyart 2 (DLRS 01001589) to the dimensions of the

WIDEST note in the relevant currency.

Approx 12mm
dimensions of the widest note

relevant to the given currency
Cut the document to the

Black drafting
Polyart 2
tape (matt)
(DLRS 01001589)
(DLRS 02340016)
Figure 8 Test Document
2. Place a strip of matte black drafting tape (DLRS 02340016) on one

face of the test document (see Figure 8).
3. Use a Cobra Spray Brush to ensure that the light emitting surface of
the head is clean of dirt and ink.
5.1.2 Setting up the Head Amplifier board

To set up the head amplifier board, perform the procedures in
Procedure 6 Setting up the Head Amplifier Board.
Procedure 6 Setting up the Head Amplifier Board
Step Procedure
1. Connect a digital voltmeter between TP1 and TP2 (0V). TP2 is near-
est to the potentiometers.
2. Manually wind the test document through the transport until the
black area is directly beneath the head.
3. Adjust RV1 (Offset) to achieve a voltage of 0.13V ±30mV.
4. Manually wind the test document through the transport until a white
area is directly beneath the head.
5. Adjust RV2 (Gain) to achieve a voltage of 2.38V ±30mV.
Note: RV1 and RV2 interact with each other, and therefore continued fine
adjustment of both may be necessary to achieve the above voltages.

5.2 Optical Trigger Board
To set up the optical trigger board follow these procedures:
Procedure 7 Setting up the Optical Trigger Board
Step Procedure
1. Remove any document that is beneath the head.
2. Connect a digital voltmeter between TP1 and TP3 (0V).
3. Adjust RV1 to give a positive voltage of between 7.5V and 8.0V.
4. Disconnect the DVM from TP1 and connect it to TP2.
5. Adjust RV2 to give a positive voltage of between 7.5V and 8.0V.
5.3 To Mask Out All Detectors Except The Optical Pattern Detector
Procedure 8 Masking Out All Detectors Except the OPD
Step Procedure
1. Select the Diagnostics Menu.
2. Select DETECTOR SYSTEM ENGINEERS FUNCTION.
3. Enter the engineer’s access code.
4. If the detector number of the Optical Pattern Detector is not known:
4.1 Select DETECTOR DIAGNOSTICS.

4.2 Select LIST DETECTOR NAMES.
4.3 Note the number for the Optical Pattern Detector, and exit.
5. Select CONFIGURATION.
6. Select EDIT CONFIG (edit configuration).

7. Select PROCESS DATA.
8. Select MOD. DET. MASK (Modify Detector Mask).

9. Enter the process table Identity (process number currently in use).
10. The second row of 1’s and 0’s represents the state of each detector,
enabled (1) or disabled (0), detector 1 first on the right hand side.
established later. To disable an enabled detector, and vice-versa,
enter the detector number. Ensure that the Optical Pattern Detector
is the only detector enabled.
The machine is now ready to run with all detectors masked out, except
the optical pattern detector.
When the setting up of the detector has been completed, re-estab-
lish the original detector mask.


The operator should perform the following routine maintenance on a daily
basis.
Procedure 9 Performing Daily Maintenance
Step Procedure
1. Clean dirt and ink from the pattern head lens.
2. Clean debris and dust from the trigger optical sensors.
3. Inspect the Melinex note guide, and renew if damaged (see Figure
6).
6.2 Semi-Annual Maintenance by the Service Engineer

The service engineer should perform the following routine maintenance
semi-annually.
Only a trained, qualified service engineer should perform this mainte-

nance.
Procedure 10 Performing Semi-Annual Maintenance
Step Procedure
1. Visually inspect the pattern head, Melinex note guide and trigger
assembly for mechanical damage. Renew defective parts.
2. Check the lamp source and light pipes.
De La Rue Part No. 02580048 3. Renew the lamp. Part No.02580048 lamp halogen 12v 20w.
lamp halogen 12v 20w
4. Check the belts for correct tension. Renew if they are worn or dam-
aged.
5. Inspect the condition of all boards, cableforms and connectors.
Renew or repair defective items.
6. Clean the pattern head and the trigger sensors.
7. Ensure the system is set up as described in paragraph
4. Mechanical Adjustments.

7.1 Detector Head Lens

If the lens on the underside of the detector head becomes displaced,
repair it with Kit Number 02360198 as follows.
Procedure 11 Repairing the Detector Head Lens
Step Procedure
De La Rue Part 02360198 1. Remove all remnants of the old lens.

Detector Head Repair Kit
2. Place 320 grit abrasive paper on a flat surface.
3. Hold the optical face of the pattern head squarely on the paper and
rub back and forth until the surface is even in appearance.
4. Repeat the above step with 600 grit paper.
5. Wipe off all residue with a damp cloth.
6. Wet the felt pad with water and place on a flat surface.
7. Apply half the contents of the polish sachet evenly to the felt pad.
8. Rub the optical face along the felt pad until high lustre is achieved
evenly along the face (add more polish if necessary).
9. Clean off any residue with a damp cloth.
The surface is now ready for the new lens.
10. Empty the contents of both syringes into the mixing cup and mix
thoroughly.
11. Apply a layer of epoxy to the newly polished face of the pattern
head.
12. Position the lens onto the pattern head, apply pressure to remove
air bubbles, and hold in position using elastic bands.
13. Wipe off excess epoxy and cure at 20º for 24 hours.

Figure 9 Pattern Detector Head

Figure 10 Light Path

Figure 11 Melinex Guide Setting

This is the parts list for the Optical Pattern Detector kit. Detail drawings
and assembled views follow the list and its illustration.
Table 4 Optical Pattern Detector Kit
ITEM DESCRIPTION PART NUMBER QTY

1 ADHESIVE LOCTITE 00340402 1
2 SOLDER 60/40 18 SWG 500 GM 00340901 1
3 KNOBLET M5 BLACK KNURLED 00410143 1
4 WASHER M3 FORMA MS ZCEP 00460304 2
5 WASHER M4 PLN FM C MS ZCEP 00460315 4
6 SCREW M3X12 PAN SLTD NYN 00461021 2
7 WASHER, M6X13X1.5, NYLON 00461754 2
8 WASHER M3 SFTY SPNG STL 00462072 6
9 WASHER M4 SFTY SPNG STL 00462073 12
10 SCREW M3X6 CAP SKT HTS BLKOX 00462403 6
12 SCREW M4X12 CAP SKT HTX BLKOX 00462415 2
15 SCREW M3X8 CSK SKT HTS BLKOX 00464401 2
16 PIN SPL HVYDY 3X8LG 00480713 1
17 PIN DOWELL PLL 5X12LG 00480932 1
18 SPRING COMP 9.2500 X 15.0LG X 1 02430126 1
19 WASHER M3 EXT FAN DISC MS ZCEP 02460259 1
20 SCREW M6X75 SKT CAP GRADE 12.9 02460429 1
21 PHOTOTRANSISTOR OP5938 02680068 2
22 CBLFM FIBRE OPTIC LAMP DRIVE 3106003701 1
23 PCBP OPTICAL TRIGGER 3109533103 1
24 COVER, TRIGGER 3112001601 1
25 BRACKET LAMP MOUNTING 3116004301 1
26 PATTERN HEAD ASSY TYPE A 3202309501 1
27 HOLDER LAMP (H&T) D/A 3202310803 1
28 LIGHT PIPE HOLDER (H&T) D/A 3202310901 1
29 WASHER - SPECIAL 3220466501 1
30 KIT SL CORR PCB MK2 + RAMS + FPGAS 3704015103 1
31 BRACKET DIFFUSER ASSY MTG 3716019902 1
32 GUIDE MELINEX D/A 4002020101 1
33 CBLFM - REFLECTIVE PATIN DETR 4006003501 1

Table 4 Optical Pattern Detector Kit
ITEM DESCRIPTION PART NUMBER QTY

34 CBLFM - PHOTODIODE ASSY 4006003601 1
35 CBLFM OPTICAL PATTN LAMP 4006006401 1
36 GUIDE OPTIC PATTN DTR 4012000602 1
37 PLATE RETNG OPT PATT DTR 4016006401 1
38 GUIDE OPT PATTN DETR ENTRY 4016011401 1
39 ROD, FLEX GDE SUPPORT, VSN DETR 4020008501 1
40 SPACER, ROLLER VISION DETECTOR 4020009901 1
41 BRACKET, GUIDE VISION ENTRY 4020010003 1
42 BLOCK MYLAR OPTIC PATTN DETR 4020014301 1
43 PLATE GUIDE PATTN DETR. 4020014401 1
44 LATCH OPT PATTN DETR 4020014502 1
45 BLOCK PIVOT OPT PATT DTR 4020014601 1
46 BLOCK MNTG OPT PATT DTR 4020014701 1
47 ROLLER CROWNED, DBL SHIELDED DA 5002039601 1
48 PIVOT PIN PATTERN DETECTOR 5020051401 1
49 EARTH WIRE D/A BB06162201 1
50 PCBP, SLIDING CORR. REF HD. AM BB09528605 1
51 SPACER - TRIGGER PATTERN BB20422601 2
52 STANDOFF - TRIGGER PATTERN BB20422701 2
53 F/W SLIDING CORRELATOR FK002430_07 1

Figure 12 Optical Pattern Detector Kit
Notes 1. Make sure phototransistors (item 21) are pushed fully into the
mounting block (item 46) before soldering using item 2 and trimming
off the legs.
2. Earth tail goes on existing earth stud in the machine.
3. Adhesives to be used in accordance with De La Rue specification

ES 0100-104-00 method No. 2.
4. For assembly and detail drawings, please see Figure 13 through

Figure 16.

Position of PCBP sliding
corr ref HD Amp
Figure 13 Optical Pattern Detector, Assembled Views

Phototransistor
PCB
Figure 14 Optical Pattern Detector Detail: Phototransistor
Regarding phototransistors, see also Note 1 in Figure 12.
Thickness Detector (for positioning ref only)
Figure 15 Optical Pattern Detector Detail: Position in the Machine

Figure 16 Optical Pattern Detector Detail: Light Source Position
Figure 16 shows the position of light source components in the rear of the
machine on the base tray.

APPENDIX 1 - DETECTOR REPLY CODES
The detector reply codes which may be viewed from the Diagnostics
menu are:
Detector Name: Operator= DA Engineer= PATT
The specific Detector Replies from the pattern detector will depend upon
the pattern set installed, and the notes being fed. The replies can only be
checked by referring to the pattern set installed. Each face and orientation
of each denomination/issue of note is assigned a pattern code number.
The pattern detector can cull notes if it cannot classify the note. In this
instance, a pattern suspect code of 3F (hexadecimal) is returned.
Note: The detector can only output a pattern code relevant to the patterns in the
pattern set. Therefore whether the Detector Reply matches that of the correct
denomination in the pattern set can only be checked by referring to the installed
pattern set itself.

Section 6
UV Bright Detector

Contents
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Principles of operation . . . . . . . . . . . . . . . . . . . . . 2
2.1 UV Bright Detection . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.2 Test Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3.1 Fault-Finding Procedure . . . . . . . . . . . . . . . . . . . . . . . . 7
3.2 How To Set Up UV Trace Measure . . . . . . . . . . . . . . . . . . 7
3.3 How To View the Trace Measure Table . . . . . . . . . . . . . . . 8
3.4 Detector Reply Codes . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.1 To Mask Out All Detectors Except The UV Bright Detector . . . . . 12
7.1 Detector Head Removal . . . . . . . . . . . . . . . . . . . . . . . . 14
7.2 Detector Head Replacement . . . . . . . . . . . . . . . . . . . . . 14
8. Illustrated parts list . . . . . . . . . . . . . . . . . . . . . . . 15
Figures
1 Optical Pattern Detector - General Block Diagram . . . . . . . . . . 3

2 Optical Pattern Detector - Detailed Block Diagram . . . . . . . . . . 4
3 Fault Diagnostic Flowchart . . . . . . . . . . . . . . . . . . . . . . . 7
4 Example Pattern and Trigger Waveforms . . . . . . . . . . . . . . . 8
5 Test Document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6 Pattern Detector Head . . . . . . . . . . . . . . . . . . . . . . . . . 16
7 Light Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
8 Melinex Guide Setting . . . . . . . . . . . . . . . . . . . . . . . . . . 18
9 Head Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
10 Head Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
11 Pattern Head Setting . . . . . . . . . . . . . . . . . . . . . . . . . . 20
12 Optical Pattern Detector Kit . . . . . . . . . . . . . . . . . . . . . . . 23
13 Optical Pattern Detector, Assembled Views . . . . . . . . . . . . . . 24
14 Optical Pattern Detector Detail: Phototransistor . . . . . . . . . . . . 25
15 Optical Pattern Detector Detail: Position in the Machine . . . . . . . 26
16 Optical Pattern Detector Detail: Light Source Position . . . . . . . . 26

Tables
1 Internal Error Codes and Actions to Resolve . . . . . . . . . . . . . 6

2 To Detect Note Profile . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Board Power Voltages . . . . . . . . . . . . . . . . . . . . . . . . . 11
4 Optical Pattern Detector Kit . . . . . . . . . . . . . . . . . . . . . . 21
Procedures
1 Checking Note Transport System Operation . . . . . . . . . . . . . 5

2 Finding Faults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Setting up the Detector Head . . . . . . . . . . . . . . . . . . . . . 9
4 Checking the Detector Head and Transport Belt Setting . . . . . . . 9
5 Preparing a test document . . . . . . . . . . . . . . . . . . . . . . . 11
6 Setting up the Head Amplifier Board . . . . . . . . . . . . . . . . . 12
7 Setting up the Optical Trigger Board . . . . . . . . . . . . . . . . . 13
8 Masking Out All Detectors Except the OPD . . . . . . . . . . . . . . 13
9 Performing Daily Maintenance . . . . . . . . . . . . . . . . . . . . . 14
11 Repairing the Detector Head Lens . . . . . . . . . . . . . . . . . . . 15

1. INTRODUCTION
Figure 1 UV Bright Detector
The UV Bright detector identifies banknotes with abnormally high fluores-

cent responses to ultra-violet light.
Figure 2 Elements of the Detector Head

Figure 3 shows a functional block diagram of the UV Bright detector
board. The banknote passes in front of an ultraviolet light source, and the
resultant blue fluorescence is sensed by the adjacent photodiode, which
is shielded from the direct rays of the light source.
A second photodiode monitors the intensity of the light source. The output
signals from the two photodiodes are processed and then indicate the
degree of fluorescence of each banknote.
The detector system comprises:
The photodiodes of the detector head
The UV lamp of the detector head
The UV Bright board of the detector head
The UV lamp driver assembly
A part of the detector interface board.
The location of the detector system components, together with the identi-
fication of the associated connectors and wiring schedules, are shown in
the general block diagram of Figure 3.
UV Bright Board UV Lamp Board
SK1 SCHEDULE 32
SK2
SCHEDULE 27
SK5 SCHEDULE 5
J16
Detector Interface J5 PL17 SK1 UV Lamp Driver

Board Power Supply Unit Transform Board
Mother / Distribution
B d UV Lamp Driver Assembly
MAINS
2.1 UV Bright Detection

A more detailed block diagram of the system is shown in Figure 4.

From the AC mains supply at the terminal block, a constant current supply
for the UV lamp is derived on the UV lamp driver board of the UV lamp
driver assembly, by a rectifier and current sink TR1. This supply is routed
through pins 3 and 4 of the board and pins 1 and 4 of the UV Lamp board
of the detector head, and thence to the lamp. Lamp starter components
are on the UV lamp board.
The output of the lamp sensor is routed through PL1 pins 3 and 4 of the
UV Bright board to pre-amplifier U1, filter U2, buffer/comparator U3 and
thence to the green LED2. The comparator reference is fixed, but the pre-
amplifier gain is pre-set by potentiometer RV2. When the lamp intensity
exceeds the lowest useful level, as determined by RV2, LED2 is ener-
gised and a UV Bright Ready signal is asserted. This signal is routed
through PL2 pin4 of the board and J16 pin 5 of the Mother/distribution
board to buffer U5 of the detector interface board.
The output of the fluorescence sensor is similarly processed through

another channel of the same devices, but the pre-amplifier gain is fixed,
and the comparator reference is a fraction of the processed lamp sensor
signal, determined by RV1. When the intensity of fluorescence exceeds a
level determined by RV1, the red LED1 is energised and the UVB. signal
is asserted. This signal is routed to buffer U7 of the detector interface
board.
2.2 Test Points

A summary of the test points included to assist servicing is shown in
Table 1.
Table 1 Test Points
Test point of
Test point of lamp sen-
fluorescence Function
sor channel
sensor channel
TP2 TP2 Signal return level (0 volt)

TP1 TP3 Pre-amplifier output
TP4 - Preset comparator reference
- TP5 Buffer output

Table 2 Schedule 27: UV Bright Detector Cable
1 Brown SK2 / 2 J16 / 7 +5V

2 Red SK2 / 1 J16 / 6 + 5V
3 Green SK2 / 6 J16 / 4 0V
4 Blue SK2 / 4 J16 / 5 UVB READY
5 White SK2 / 3 J16 / 8 UVB

6 Black SK2 / 5 J16 / 3 0V
7 Black Screen J16 / 1 Drain
Table 3 Schedule 32: UV Lamp Driver Cable
Wire no. Colour From To Function
1 Brown SK1 / 1 CN2 / 1

2 Blue SK1 / 4 CN2 / 4
Table 4 Schedule 5: J16 (Motherboard) Connections
J16 pin To Function
1 OV
2 0V
3 0V
4 0V
5 SK3 / 24b UVB READY
6 +5V
7 +5V
8 SK3 / 23b UVB INPUT
9 SK3 / 22b SPARE INPUT
10 PL17 / 9 +15V
11
12
13 PL17 / 8 -15V
14

Figure 4 UV Bright Detector System - Detailed Block Diagram

Figure 5 Fault Diagnostic Routine

3.1 Fault-Finding Procedure

If a fault exists, proceed as follows:
Procedure 1 Finding a Fault
Step Procedure
1. Remove the three screws securing the head cover and remove the
cover.
2. Check all connections between the detector head and the Mother/
distribution board and the UV Lamp Drive board.
3. Run the machine without any notes in the transport, and observe the
state of the red and green LEDs on the UV Bright board.
Table 5 shows the action to take in response to the LED status.
Table 5 LED Status (with cover closed)
RED LED1 GREEN LED2 Action to take
OFF ON System functional (but may need to be made more sen-

sitive), see “Mechanical Adjustments” on page 10.
ON ON Sensitivity too high. RV1 needs adjusting clockwise to
de-sensitise. Check and re-adjust circuit as described in
“Mechanical Adjustments” on page 10.
OFF UV Lamp circuit not functioning, or lamp unserviceable.
This gives a Check DU Detector message when trying
to feed-start.
4. Follow the fault diagnosis routine of Figure 5.
5. Re-fit and re-secure the detector head cover.
3.2 How To Set Up UV Trace Measure

To set up the trace measures proceed as follows:
Procedure 2 Setting up UV Trace Measure
Step Procedure
1. In the GCC, from the Run the Machine page, select F3-F4-F8-F11 to
enter machine configuration.
3. Press SHIFT and > to page forward.
4. Select SET NOTE TRACE CONDITIONS (21).

The display then prompts Destination? This provides the facility
to be selective about which pockets notes are traced into – the
default is ALL.

5. Press SHIFT and > to move forward.
The display then requests which category of note is to be traced –
default is ALL.
6. Press SHIFT and > to move forward.
The display shows the detector number and prompts TRACE MEASURE
NUMBER?
7. Select a specific trace measure shown below, and press ENTER.
Quantity (units of mms) Trace measure number
UV bright count (non-contiguous)a 7
a. This is the total number of mm samples – along the length of

the note – that were above the UV Bright threshold (as set by
RV1). Note that if a UV pointer (Sort Levels menu) is availa-
ble, this will be scaled in percentage of note length. Remem-
ber therefore to convert the pointer setting to actual
measurements when assessing trace measure results.
The display re-prompts with the same question to confirm the trace
measure.
8. Press ENTER again.
3.3 How To View the Trace Measure Table

The function described is a single-shot facility, and permits the viewing of
all detector trace measures for the last note fed.
To view the trace measures proceed as follows:
Procedure 3 Viewing Trace Measures
Step Procedure
1. In the GCC from the Run the Machine page select F3-F4-F8-F11 to
3. Select EXAMINE TRACE MEASURE TABLE (13).
The display then requests if screen or printer output is required.
4. Enter 0 for screen, or 1 for printer.
The start of the Trace Measure table displays. Use the following
keys to view the required trace measure:
4A. Press SHIFT and > to page forward.
4B. Press SHIFT and < to page backward.
4C. Press CLEAR to exit.

3.4 Detector Reply Codes
The detector reply codes which may be viewed from the Diagnostics
menu are:
Detector Name: Operator = DU

Engineer = UV
This detector has a simple Yes/No response depending upon whether it

detects a UV Bright note or not. The Detector Reply is a four-digit hex
reply, of which the right-hand digit is the most relevant. The possible
replies are:
Note is
UV Dull (Good note) UV Bright (Note culled)

0000 (Hex) 0 (Dec) 0001 (Hex) 1 (Dec

Check that the detector head housing (front end) is separated from the
transport belt by 3±1mm.
Procedure 4 Adjusting the Separation of the Detector Head Housing and

Transport Belt
Step Procedure
cover.
2. Loosen the two screws holding the head assembly, to friction tight-
ness.
3. Move the head assembly to achieve the required separation.
4. Re-tighten the two securing screws holding the head assembly.
5. Do not replace the cover at this stage as access is required for the
electrical adjustments.

To do the procedures in this section, have on hand these items:
A digital voltmeter (DVM)
A trimpot adjuster
250 genuine (UV dull) banknotes for each denomination that the
machine will sort.
A photocopy of one banknote for each denomination of the above

banknotes (alternatively a sheet of photocopy or plain writing paper
cut to banknote size).
WARNING: HIGH VOLTAGE D.C. (330V) IS PRESENT AT THE LAMP

DRIVER BOARD OUTPUT, AND AT THE LAMP BOARD INPUT.
The electrical settings are made on the UV Bright board. To perform the
electrical set-up proceed as follows:
Procedure 5 Performing Electrical Set-up
Step Procedure
1. If the head cover is not already removed, remove the three screws
securing the cover, and remove the cover to expose the board.
2. Power up the Cobra 4004, and ensure that the UV lamp is ON.
3. Allow the UV Bright detector a period of two minutes to warm up

before proceeding.
4. Connect the DVM to TP1 and TP2 (0 Volt) and check for a reading
of 1.6V ±0.1V. Adjust RV2 if necessary to satisfy the check.
5. Adjust RV1 counter-clockwise until the red LED just extinguishes.
6. Turn RV1 clockwise until the red LED is illuminated.
7. Turn RV1 a six more full turns clockwise.
8. Follow the instructions in paragraph 5.1 to mask out all detectors

except the UV Bright detector.
9. Close the front cover.
10. Run 250 notes of one denomination through the machine.
11. If any notes are rejected, re-adjust RV1 half a turn clockwise, and
repeat the run.
If a small number of notes are repeatedly rejected, manually hold
them under the UV detector head to check for an obvious denomi-
nation – if such notes are found, remove them from the pack.
12. Repeat the above two steps for each denomination.
13. Run a photocopy of each denomination and ensure that all are
rejected.
14. If any detectors were masked out, then mask them back in.
15. Re-fit and re-secure the head cover.

5.1 To Mask Out All Detectors Except The UV Bright Detector
Procedure 6 Masking out All Detectors Except UVB
1. In the GCC from the Run the Machine page select F3-F4-F8-F11 to
2. If the detector number of the UV Bright detector is not known:
2.1 Select DETECTOR DIAGNOSTICS (03).

2.2 Select LIST DETECTOR NAMES (11).
2.3 Note the number for the UV Bright detector, and exit.
3. Select CONFIGURATION (01).
4. Select EDIT CONFIG (Edit configuration 3).
5. Select MASTER TABLE (2).
6. Select MOD. DET. MASK (Modify Detector Mask 7).
7. Enter the detector identity (process number currently being used).
8. The second row of 1s and 0s represents the state of each detector,

enabled (1) or disabled (0), detector 1 is first on the right hand side.
established later.
9. To disable an enabled detector, and vice-versa, enter the detector
number. Ensure that the UV Bright detector is the only detector ena-
bled.
The machine is now ready to run with all detectors masked out, except
the UV Bright detector.
When the setting up of the detector has been completed, re-establish the
original detector mask.

The UVB detector requires no maintenance.

7.1 Detector Head Removal

To remove the detector head proceed as follows:
Procedure 7 Removing the Detector Head
Step Procedure
cover.
2. Disconnect the connector SK2 from the UV Bright board, and the
connector SK1 from the UV lamp board.
3. Support the detector head assembly, and remove the two screws
securing the assembly to the machine back-plate.
4. Withdraw the assembly.
7.2 Detector Head Replacement

To replace the detector head proceed as follows:
Procedure 8 Replacing the Detector Head
Step Procedure
1. Position the detector head assembly on the machine back-plate.
2. Loosely secure the assembly to the back-plate by the two screws.
3. Connect SK2 to PL2 on the UV Bright board.
4. Connect SK1 with PL1 on the UV lamp board.
5. Carry out the mechanical adjustments as described in paragraph

4. Mechanical Adjustments on Page 6-10.

01003520 Photodiode BPW21

01003860 Photodiode OSD 1.5
3709533402 PCB UV Lamp
BB09530302 PCB UV Bright
PCB UV Bright
PCB UV
Lamp
Photodiode OSD 1.5 Photodiode BPW21
Figure 6 UV Bright Detector Illustrated Parts


Section 7
Limpness Detector

Contents
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3.1 Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.2 Preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.3 Fault-Finding Procedure . . . . . . . . . . . . . . . . . . . . . . . . 5
3.4 Microphone Faults . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.5 Test Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.1 Microphone Alignment . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.1 Pre-amp Gain - Adjustment (Calibrating the Detector) . . . . . . . 10
8. Illustrated Parts list . . . . . . . . . . . . . . . . . . . . . . . 13
Figures
1 Limpness Detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 General Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . 2
3 Detailed Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . 3
4 Fault Diagnosis Procedure . . . . . . . . . . . . . . . . . . . . . . . 6
5 Front-End Board - Test Point and Adjustment Positions . . . . . . . 7
6 Test Note: ‘De La Rue Systems.’ £10 size (Part Number 01004778) 8
7 Microphone Alignment . . . . . . . . . . . . . . . . . . . . . . . . . 9
8 Limpness Detector Illustrated Parts List . . . . . . . . . . . . . . . . 13
Tables
1 Test Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Procedures
1 Finding a Fault in the Limpness Detector . . . . . . . . . . . . . . . 5

2 Checking for a Microphone Fault . . . . . . . . . . . . . . . . . . . . 5

3 Adjusting the Microphone Position . . . . . . . . . . . . . . . . . . . 9
4 Adjusting the Pre-Amp Gain . . . . . . . . . . . . . . . . . . . . . . 10
5 Removing the Microphone Module . . . . . . . . . . . . . . . . . . 12

1. INTRODUCTION
The Limpness detector, shown in Figure 1, assesses the audible
response to bending a banknote passing through a crackle roller. The
microphone, mounted above the roller, detects the consequent note
crackle.
Microphone
Pinch Roller
Crackle
Roller
Figure 1 Limpness Detector
Draft
The Limpness detector system comprises:
The microphone and crackle roller
The Limpness detector front-end board
A part of the detector interface board.
SCHEDULE P
SK 2
PL 2
Front-end Board
SCHEDULE 3 SK 1
SK12
J12
Microphone
Detector Interface J5 PL17 SK17
Power Supply Unit
Board
Mother / Distribution Board
Figure 2 shows the location of the components of the detector system,

together with the identification of the associated connectors and wiring
schedules.
Figure 3 is a more detailed block diagram of the system.
The microphone is of the electret (electrostatic) type and is coupled to a

high-impedance buffer within the microphone capsule. The capsule is
part of the microphone cableform.
A +15V power supply is routed to the microphone via PL17 pins 8 and 9,
J12 pins 10 and 3 of the Mother/Distribution board, PL2 pins 1 and 3 and
PL1 pins 1 and 3 of the front-end board.
The output of the microphone capsule is routed via PL1 pin 2 of the front-
end board to pre-amp U1. The gain of the pre-amp is set by RV1. The
amplified signal is filtered by U1 and U2, and thence routed via PL2 pin 2,
J12 pin 8 of the Mother/distribution board and PL1 pin 29c of the detector
interface board to the integrating cirtuit U15, U16, U23 and U10, where
the signal is processed further to determine whether the banknote crackle
indicates a fit note. The result is forwarded to the detector processor.
Draft
Provided that the microphone cable and all associated boards are inter-
connected, a /READY signal (logic level 0) is routed to buffer U5 of the
detector interface board, and thence to the detector processor. Other-
wise, the processor issues a detector fault message.
Figure 3 Detailed Block Diagram
Draft
Schedule P - Audio Detector Cable
Wire no Colour From To Function
1 Brown SK2/4 J12/5 /READY

2 Red SK2/1 J12/10 +15V
3 Green SK2/6 J12/12 spare
4 Blue SK2/5 J12/13 -15V
5 White SK2/2 J12/8 AUDIO
6 Black SK2/3 J12/3 0V
Black SCREEN J12/1 DRAIN
Schedule 3 - J12 (Limpness Detector) Connections
Pin No To Function
J12/1 0V
J12/2 0V
J12/3 0V
J12/4 OV
J12/5 SK3/30C I/O 1
J12/6 +5V
J12/7 +5V
J12/8 SK3/29C I/O 2
J12/9
J12/10 PL17/9 +15V
J12/11
J12/12
J12/13 PL17/8 -15V
J12/14
Draft
3.1 Error Messages

A Check DL detector message indicates that the detector is not
ready. This indication may be caused by a disconnected connector in the
system.
3.2 Preliminary
The performance of the note transport system affects the performance of
the detector. Before investigating specific detector faults, confirm correct
operation of the note transport system.
If any part of the detector system is renewed, perform the corresponding

set-up procedure.
3.3 Fault-Finding Procedure

To find faults in the Limpness director, follow the steps in Procedure 1.
Procedure 1 Finding a Fault in the Limpness Detector
Step Procedure
1. Visually check all connections between boards.
2. Inspect connections between the front-end board and the micro-

phone.
3. Check the power to the front-end board.
4. If the fault persists, follow the fault-finding procedure detailed in Fig-

ure 4.
3.4 Microphone Faults

To check for a microphone fault proceed as follows:
Procedure 2 Checking for a Microphone Fault
Step Procedure
1. Using a digital voltmeter or an oscilloscope, observe the filtered sig-

nal at TP4 on the front-end board with respect to 0V at TP1.
2. Observe the signal level, and whistle into the microphone.
If the microphone is serviceable, you should see a change in signal
level.
3. If you detect no change, connect the spare microphone to the front-
end board instead of the original microphone.
Draft
4. Repeat the above whistle test.
If you see a change in signal level, then the original microphone is
faulty and needs to be renewed, and then set-up in accordance with
the instructions in “Pre-amp Gain - Adjustment (Calibrating the
Detector)” on page 10.
Figure 4 Fault Diagnosis Procedure
Draft
3.5 Test Points
A summary of the test points that aid servicing appears in Table 1.
Table 1 Test Points
Test point Function
TP1 Signal return level (0V)

TP2 Pre-amp output
TP4 Filter output
Figure 5 Front-End Board - Test Point and Adjustment Positions
Draft
The following tools/aids are required:
1 small inspection mirror (dental type)
1 trimpot adjuster
A suitable test note appears in Figure 6.
Figure 6 Test Note: ‘De La Rue Systems.’ £10 size

(Part Number 01004778)
4.1 Microphone Alignment

Use the inspection mirror to check that the microphone capsule is posi-
tioned in the housing such that:
It is fully visible
It is facing in the same direction as the opening in the microphone

bracket
It is not touching any part of the metal housing (see Figure 7).
Draft
MICROPHONE
CAPSULE
MICROPHONE
HOUSING
FOAM
MICROPHONE CABLE
MACHINE
BACK-PLATE
CABLE CLAMP
Figure 7 Microphone Alignment
To adjust the microphone position proceed as follows.
Procedure 3 Adjusting the Microphone Position
Step Procedure
1. Unclamp the microphone cable immediately behind the machine

back plate.
2. Reposition the microphone by rotation or sliding the cable in or out
at the rear of the machine.
3. Re-clamp the cable.
Draft
5.1 Pre-amp Gain - Adjustment (Calibrating the Detector)

This procedure describes how to calibrate the detector. Once the detector
is calibrated, all sort levels must be adjusted by use of the pointer value.
Note: MINT test notes (see Figure 6) must be used to calibrate all machines.
To adjust the pre-amp gain proceed as follows:
Procedure 4 Adjusting the Pre-Amp Gain
Step Procedure
1. Verify that all belt tensions are set to specification.
2. Check that the microphone is positioned correctly.

3. Turn the potentiometer RV1 on the front-end board fully clockwise
(maximum gain).
4. Select LIMPNESS SETUP process.
5. SORT LEVEL will automatically adjust POINTER VALUE to 250.
6. Start feeding the notes, and turn potentiometer RV1 down slowly
until the mint notes just start going.
7. After completing the above step, turn RV1 clockwise for two com-
plete turns.
Draft
The Limpness detector requires no maintenance.
Draft
To remove the microphone module proceed as follows.
Procedure 5 Removing the Microphone Module
Step Procedure
1. Disconnect the microphone cable from the front-end board.
2. Remove the clamps securing the cable to the frame.
3. Remove the bolt securing the microphone module to the back plate.
4. Carefully pull the microphone away, and the cable through the back
plate.
5. To replace the microphone reverse the above procedure.
6. Set up the microphone as described in “Microphone Alignment” on

page 8.
Draft
3106002603 CBLFM - Microphone - SK1

3109532403 PCB Audio Front End
4020026801 Crackle Roller
CBLFM - Microphone - SK1
Crackle Roller
Figure 8 Limpness Detector Illustrated Parts List
Draft
Draft
Index
Numerics calibration (Vision), 4-18 to 4-21

12Distance (CIS parameter), 16-14 data, show (detector
12Distance (Vision parameter), 4-12 diagnostics), 1-30
1clock (CIS parameter), 16-13 radio metric (central magnetic
1clock (Vision parameter), 4-11 ink), 11-9 to 11-10
shadow thread, 12-2
solid-state holes and tears, 3-4
A text codes, listing (detector
adding a note to the system diagnostics), 1-31
CIS, 16-11 to 16-12 amplifier gain, 2-10
Vision, 4-8 audio calibration (detector
adjustments diagnostics), 1-31
electrical authentication
CIS, 16-10 to 16-15 note, 1-1 to 1-3
infrared, 10-10 to 10-17 averaging windows
limpness, 7-10 low remanence magnetic ink, 13-7
low remanence magnetic
ink, 13-12 to 13-16
optical pattern, 5-11 to 5-13
B
SDIII, 14-11 to 14-14 barcode watermark algorithm, 12-2
soil, 8-10 to 8-14 belt carrier assembly
solid-state holes and tears, 3-8 replacing (CIS), 16-25
transmissive optical, 12-7 to blacklevel
12-9 CIS parameter, 16-13
twin magnetic ink, 9-13 to 9-16 Vision parameter, 4-10
UVB, 6-11 to 6-12 BLANKregister (Vision
Vision, 4-7 to 4-13 parameter), 4-11
horizontal (CIS), 16-9 BNoteDAQ.ini file
mechanical, 3-7 CIS, 16-13
CIS, 16-7 to 16-9 Vision, 4-10
infrared, 10-9 buffer
limpness, 7-8 to 7-9 capture, 11-10
low remanence ink, 13-10 to memory (infrared detector), 10-15
13-11 to 10-17
optical pattern, 5-9 to 5-10 solid-state holes and tears, 3-4
soil, 8-9 bus
solid-state holes and tears, 3-7 ISA, 4-4
thickness, 2-10 to 2-11
twin magnetic ink, 9-11 to 9-12 C
UVB, 6-10 calibration
Vision, 4-6 algorithm (Vision), 4-18 to 4-21
pre-amp gain audio (detector diagnostics), 1-31
limpness, 7-10 CIS, 16-16 to 16-23
receiver gain infrared detector, 10-10 to 10-11
infrared detector, 10-11 items required (Vision), 4-16
vertical (CIS), 16-7 limpness, 7-10
algorithm non-US dollar processing (central
barcode watermark, 12-2 magnetic ink), 11-7 to 11-8
Detector Service Manual TP09311011 Rev 04 December 2003 Index-1

reference channel (transmissive controller, detector (detector
optical detector), 12-7 diagnostics), 1-31 to 1-35
results codes (Vision), 4-18 to 4-21 Cover PCB Cent Mag Ink Detr
SDIII, 14-13 (4012001301), 11-14
signal channel (transmissive optical Cover, Trigger (3112001601), 5-21
detector), 12-7 Crackle Roller (4020026801), 7-13
thickness detector, 2-13 to 2-14
US dollars, 11-9 to 11-10
Vision, 4-15 to 4-21
D
Vision, when to calibrate, 4-15 DAC settings, show (detector
width, solid-state holes and diagnostics), 1-31
tears, 3-9 Daily, 2-18, 3-12, 4-14, 5-14, 6-13, 8-15,
capture buffer, 11-10 9-17, 12-10, 14-15
central magnetic ink detector dbnumber
introduction, 11-1 CIS parameter, 16-14
Check DY message Vision parameter, 4-12
twin magnetic ink detector, 9-7 dbpath
CheckNote Present CIS parameter, 16-14
CIS parameter, 16-13 Vision parameter, 4-11
CheckNotePresent detector controller
Vision parameter, 4-11 detector diagnostics, 1-31 to 1-35
CoarseGain (Vision parameter), 4-11 detector controller board
codes soil, 8-3
cull (central magnetic ink detector diagnostics
detector), 11-17 algorithm
detector reply, 10-12 list text codes, 1-31
detector reply (optical detector controller, 1-31 to 1-35
pattern), 5-27 list cull text codes, 1-30
detector reply (soil), 8-13 list detector names, 1-29
detector reply (transmissive optical list error codes, 1-30
detector), 12-14 list trace measure codes, 1-30
detector reply (twin magnetic show algorithm data, 1-30
ink), 9-10 show audio calibration, 1-31
detector reply (UVB), 6-9 show DAC settings, 1-31
error, 1-12 system diagnostics configuration
configuration function 1, 1-13 to 1-21
detector system diagnostics, 1-13 to detector head, 8-12
1-21 adjusting optical pattern, 5-9
edit, 1-15 to 1-21 lens, optical pattern detector
list, 1-15 (02360198), replacing, 5-15
load, 1-15 removing and replacing
masking out areas of the note (CIS), 16-24
CIS, 16-11 removing and replacing (IR), 10-19
Vision, 4-8 removing and replacing (UV
master table, 1-16 Bright), 6-14
configurator contents, 1-25 SDIII, 14-10
system diagnostics, 1-26 setting up optical pattern, 5-9
connector, setting up soil, 8-2, 8-16
central magnetic ink, 11-7 to 11-8 twin magnetic ink (removing and
low remanence magnetic ink, 13-12 replacing), 9-18
to 13-15 detector interface board, 1-4 to 1-5
controller memory, 3-4, 11-10 detector processor
functions, 1-2 to 1-3
Index-2 Cobra Banknote Sorting Machine

menu, 1-12 encoding and decoding systems, 10-3
detector ready sense engineer’s log, show (system
transmissive optical detector, 12-3 diagnostics), 1-25
detector reply codes entering text, 1-11
infrared detector, 10-12 EPROM
optical pattern detector, 5-27 checksum test (system
soil, 8-13 diagnostics), 1-26
transmissive optical detector, 12-14 Error, 5-5 to 5-6, 11-16, 13-8
twin magnetic ink detector, 9-10 ExpositionTime (Vision
UVB, 6-9 parameter), 4-10
detectors
standard, 1-1
diagnostics
F
detector, 1-29 to 1-36 F/W Sliding Correlator
detector system, 1-9, 1-45 (FK002430_07), 5-22
detector system, configuration Fault, 1-7, 1-12, 2-8
function 1, 1-13 to 1-21 fault-finding
infrared detector, 10-8 CIS, 16-6
limpness detector, 7-6 general, 1-7 to 1-8
optical pattern, 5-7 infrared, 10-4 to 10-8
soil detector, 8-8 limpness, 7-5 to 7-7
system, 1-22 to 1-28 low remanence magnetic ink, 13-8
trace data, 1-37 to 1-45 to 13-9
twin magnetic ink detector, 9-9 luminescence, 15-11
UVB detector, 6-6 optical pattern, 5-5, 5-7 to 5-8
Direction process (optical pattern), 5-6
CIS parameter, 16-13 soil, 8-7 to 8-8
Vision parameter, 4-11 solid-state holes and tears
DSPregister (Vision parameter), 4-10 detector, 3-4 to 3-5
transmissive optical detector, 12-5
E twin magnetic ink, 9-7
edit UVB, 6-6 to 6-9
configuration, 1-15 to 1-21 Vision, 4-5
configuration (detector system finding faults
diagnostics), 1-15 CIS, 16-6
electrical adjustments general, 1-7 to 1-8
CIS, 16-10 to 16-15 infrared, 10-4 to 10-8
infrared, 10-10 to 10-17 limpness, 7-5 to 7-7
limpness, 7-10 low remanence magnetic ink, 13-8
low remanence magnetic ink, 13-12 to 13-9
to 13-16 luminescence, 15-11
optical pattern, 5-11 to 5-13 optical pattern, 5-5 to 5-8
SDIII, 14-11 to 14-14 soil, 8-7 to 8-8
soil, 8-10 to 8-14 solid-state holes and tears, 3-4 to
solid-state holes and tears, 3-8 3-5
transmissive optical, 12-7 to 12-9 thickness detector, 2-8 to 2-9
twin magnetic ink, 9-13 to 9-16 transmissive optical detector, 12-5
UVB, 6-11 to 6-12 twin magnetic ink, 9-7
Vision, 4-7 to 4-13 UVB, 6-6 to 6-9
EnableAllNotes Vision, 4-5
CIS parameter, 16-14 FineGain (Vision parameter), 4-11
Vision parameter, 4-12 FirstThreshold

CIS parameter, 16-15 thickness detector, 2-22
Vision parameter, 4-13 transmissive optical detector, 12-12
front-end twin magnetic ink, 9-19
PCB UVB, 6-15
soil, 8-3 Vision, 4-24
front-end PCB image
central magnetic ink, 11-7 to 11-8 adding a captured note
SDIII, 14-18 CIS, 16-10 to 16-11
soil, 8-12 Vision, 4-7 to 4-8
solid-state holes and tears, 3-11 infrared detector
front-end PCB (SDIII), 14-13 introduction, 10-1
internal service
CSI, 16-9
G Vision, 4-21
gain interrogation windows
adjusters, 2-10 low remanence magnetic ink, 13-7
adjustments, pre-amp Introduction, 3-1, 4-1, 5-1, 6-1, 7-1, 8-1
limpness, 7-10 ISA interface card, 4-4
receiver, adjustments
infrared detector, 10-11
gap, sensor roller, 2-10 K
general, 1-7 keyboard operation, 1-10
GhostNoteDelay_mm (CIS
parameter), 16-14
GhostNoteDelay_mm (Vision
L
parameter), 4-11 lamp quartz, Vision (02580056), 4-24
GraffitiforSecondThreshold links
CIS parameter, 16-15 PCB
GraffitiForSecondThreshold (Vision CIS, 16-12
parameter), 4-13 Vision, 4-9
list
configuration, 1-15
H cull text codes (detector
head amplifier board diagnostics), 1-30
setting up (optical pattern), 5-11 to detector names (detector
5-12 diagnostics), 1-30
error codes (detector
diagnostics), 1-30
I trace measure codes (detector
ignoring areas of the note diagnostics), 1-30
Vision, 4-8 load configuration, 1-15
illumination head LogFile (CIS parameter), 16-14
solid-state holes and tears LogFile (Vision parameter), 4-13
detector, 3-2 low remanence magnetic ink
illustrated parts list introduction, 13-5
central magnetic ink, 11-14 luminescence
CIS, 16-26 introduction, 15-1
infrared, 10-20 LVDT coil position adjustment
limpness, 7-13 thickness detector, 2-12 to 2-13
low remanence magnetic ink, 13-19
optical pattern, 5-21
soil, 8-17 M
solid-state holes and tears, 3-14 magnetic

field strength (low remanence microphone module, removing and
magnetic ink), 13-7 replacing (limpness), 7-12
signature (low remanence magnetic
ink), 13-7
maintenance
N
central magnetic ink, 11-12 navigating the system, 1-10
CIS, 16-16 to 16-23 non-US dollar processing, 11-7 to 11-8
general detector, 1-6 note
infrared detector, 10-18 adding
limpness, 7-11 CIS, 16-11 to 16-12
low remanence magnetic ink, 13-17 adding to the system
optical pattern detector, 5-14 Vision, 4-8
SDIII, 14-15 authentication, 1-1 to 1-3
solid-state holes and tears, 3-12 image, adding a
thickness, 2-18 CIS, 16-10 to 16-11
transmissive optical detector, 12-10 Vision, 4-7 to 4-8
twin magnetic ink, 9-17 masking out areas
UV Bright detector, 6-13 CIS, 16-11
Vision, 4-14 Vision, 4-8
masking out all detectors except processing, overview, 1-1
infrared detector, 10-11 profile, detecting (infrared
optical pattern detector, 5-13 detector), 10-14
soil detector, 8-14 profile, detecting (optical
thickness detector, 2-15 to 2-16 pattern), 5-8
twin magnetic ink, 9-16 NotePresentLevel
UV Bright detector, 6-12 CIS parameter, 16-13
masking out areas of a note Vision parameter, 4-11
CIS, 16-11
Vision, 4-8 O
master table configuration, 1-16 off-site service, 16-9
mechanical adjustments Vision detector, 4-21
amplifier gain (thickness operation
detector), 2-10 central magnetic ink detector, 11-2
CIS, 16-7 to 16-9 infrared detector, 10-3
infrared, 10-9 limpness detector, 7-2 to 7-4
limpness, 7-8 to 7-9 low remanence magnetic ink
low remanence ink, 13-10 to 13-11 detector, 13-7
optical pattern, 5-9 to 5-10 luminescence, 15-2 to 15-10
SDIII adjustments optical pattern, 5-2 to 5-4
mechanical soil detector, 8-2 to 8-6
SDIII, 14-10 solid-state holes and tears, 3-2
soil, 8-9 thickness detector, 2-2 to 2-9
solid-state holes and tears, 3-7 transmissive optical detector, 12-2
thickness detector, 2-10 to 2-11 to 12-4
twin magnetic ink, 9-11 to 9-12 twin magnetic ink detector, 9-2 to
UVB, 6-10 9-6
Vision, 4-6 UVB, 6-2 to 6-6
memory optical trigger board, 5-13
buffer (infrared detector), 10-15 to Option, 1-25, 1-30 to 1-31, 1-41
10-17 output
capture buffer, 11-10 printing, 1-10
waveforms in, 3-4 screen, 1-10

P detector, 3-2
parameters power supply
BNoteDAQ.ini Vision, 4-4
Vision, 4-10 to 4-13 pre-amp gain adjustment, 7-10
CIS print truth table, 1-25
BNoteDAQ.ini file (CIS printer toggle (system diagnostics), 1-26
parameter), 16-13 printing, 1-10
parts problem-solving
central magnetic ink, 11-14 CIS, 16-6
CIS, 16-26 general, 1-7 to 1-8
infrared, 10-20 infrared, 10-4 to 10-8
limpness, 7-13 limpness, 7-5 to 7-7
low remanence magnetic ink, 13-19 low remanence magnetic ink, 13-8
soil, 8-17 luminescence, 15-11
solid-state holes and tears, 3-14 optical pattern, 5-5 to 5-8
thickness detector, 2-22 soil, 8-7 to 8-8
transmissive optical detector, 12-12 solid-state holes and tears, 3-4 to
twin magnetic ink, 9-19 3-5
UVB, 6-15 thickness detector, 2-8 to 2-9
Vision, 4-24 transmissive optical detector, 12-5
Vision detector, 4-24 twin magnetic ink, 9-7
parts list UVB, 6-6 to 6-9
thickness detector, 2-22 Vision, 4-5
pattern controller PCB processing
CIS, 16-12 notes
Vision, 4-9 overview, 1-1
PCB protocol
configuring pattern controller PCB keyboard, 1-10
Vision, 4-9 pulley clutch
detector controller board (soil), 8-3 adjusting, 2-20 to 2-21
detector interface board, 1-4 to 1-5
front-end, 14-13 Q
central magnetic ink, 11-7 to Quarterly, 12-10
11-8
SDIII, 14-18
soil, 8-3, 8-12 R
solid-state holes and tears, 3-11 radio metric algorithm, 11-9 to 11-10
ISA interface card, 4-4 reference tile, 10-3, 10-9
links (CIS), 16-13 adjusting, 10-9
pattern controller assembly (soil), 8-16
CIS, 16-12 removing and replacing (IR), 10-19
PC card (CIS), 16-5 soil, 8-2, 8-12
PC card (Vision), 4-4 result codes
soft start lamp supply board, 8-3 CIS, 16-20
Vision system, 4-10 Vision, 4-18 to 4-21
Performing, 4-16 RV1, 2-10
PerkinElmer array RV2, 2-10
Vision detector, 4-24
PGA0 (CIS parameter), 16-13
photo-detector, 3-2, 10-3 S
photodiode scan cycle (CIS parameter), 16-13

Second Threshold (Vision T
parameter), 4-13 testing transport system integrity, 1-7 to
SecondThreshold 1-8, 9-7, 10-6
CIS parameter, 16-15 text, entering, 1-11
security key information (system thickness detector
diagnostics), 1-26 detector head, 2-2
sensor roller gap, 2-10 functional block diagram, 2-5
service mechanical adjustments, 2-10 to
off-site, 16-9 2-11
setting up connector operation, 2-4
central magnetic ink, 11-7 to 11-8 test points, 2-8
low remanence magnetic ink, 13-12 wiring schedules, 2-6
to 13-15 thread, shadow thread algorithm, 12-2
shadow thread algorithm, 12-2 tile
signal reference, 10-3
processing, 3-2 reference (soil), 8-2, 8-12
soft start lamp supply board (soil), 8-3 reference, adjusting, 10-9
solid-state holes and tears detector, 3-1 reference, assembly (soil), 8-16
spares reference, removing and replacing
central magnetic ink, 11-14 (IR), 10-19
CIS, 16-26 tile, reference, 10-9
infrared, 10-20 trace data
limpness, 7-13 diagnostics, 1-37 to 1-45
low remanence magnetic ink, 13-19 examine histogram trace data, 1-40
soil, 8-17 examine note trace data, 1-38 to
solid-state holes and tears, 3-14 1-40
thickness detector, 2-22 examine trace measure table, 1-41
transmissive optical detector, 12-12 overview, 1-37
twin magnetic ink, 9-19 set note trace conditions, 1-42 to
UVB, 6-15 1-44
Vision, 4-24 setting up a thickness detector trace
standard detectors, 1-1 measure, 2-16 to 2-17
start trace measure (transmissive optical
configuration, 1-15 detector), 12-15
system diagnostics trace measures (central magnetic ink
change memory, 1-24 to 1-25 detector), 11-18
configurator details, 1-26 trace measures (SDIII), 14-20
detector processor decision trace measures, solid-state holes and
process, 1-28 tears, 3-5
display status, 1-23 to 1-24 UV trace measures, setting up, 6-7
EPROM checksum test, 1-26 TraceResults
flow chart, 1-26 to 1-27 CIS parameter, 16-14
print truth table, 1-25 Vision parameter, 4-12
printer toggle, 1-26 tracing infrared detector reply
security key information, 1-26 codes, 10-13
show 1mm counter, 1-25 transmissive optical detector
show engineer’s log, 1-25 introduction, 12-1
test a function, 1-25 transport, 9-7
view memory, 1-24 operation, testing, 5-5
testing note feeder, 5-5

testing system integrity, 1-7 to 1-8,
10-6
general, 1-7 to 1-8
troubleshooting
CIS, 16-6
general, 1-7 to 1-8
infrared, 10-4 to 10-8
limpness, 7-5 to 7-7
low remanence magnetic ink, 13-8
to 13-9
luminescence, 15-11
soil, 8-7 to 8-8
solid-state holes and tears, 3-4 to
3-5
transmissive optical detector, 12-5
twin magnetic ink, 9-7
UVB, 6-6 to 6-9
Vision, 4-5
twin magnetic ink
introduction, 9-1
setting up, 9-13
U
UVB trace measures, setting up, 6-7
V
viewing UV trace measures, 6-8
visible light source, 10-3
Vision
detector head, 4-3
power supply, 4-4
system block diagram, 4-2
W
watermark
barcode watermark algorithm, 12-2
waveform buffers
SDIII, 14-19
solid-state holes and tears, 3-4
wiring schedules
central magnetic ink
detector, 11-11
soil detector, 8-4
solid-state holes and tears
detector, 3-3
twin magnetic ink detector, 9-6

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Detector Manual - Part1

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Cobra®

Banknote Sorting Machine

TP09311011 Rev 04 December 2003

Trademarks Cobra® is a trademark of De La Rue International Ltd.

© December 2003 De La Rue International Ltd.

Walton Road, Farlington

Rev Level Issue Date Reason for Reissue

001 Initial Release

002 August 2002 Various updates in functionality.

003 June 2003 Addition of Section 16, Contact Image Sensor.

004 December 2003 Product functionality revisions:

 Section 16, Contact Image Sensor, addition of section “Loading White

 Revision of Section 16 Parts List to add Thickness “B” document

Usability revisions (unrelated to product functionality), for example:

 Standardisation of information organisation

 Consistent heading usage

 File size optimisation

 Revisions to the front matter including copyright statements

 Change of document category to service manual

Detector Service Manual TP09311011 Rev 04 December 2003 Page i

Page ii Cobra Banknote Sorting Machine

Operators should have accreditation by authorised De La Rue personnel

General Precautions  Always turn power off before servicing.

 Always remove keys from the sorter doors to prevent unauthorised

 Never smoke while operating the equipment.

 Always secure long hair with bands or clips.

 Remove neckties, scarves, and jewelry when operating the sorter. If

 Press the Emergency Stop button to disable the transport motors

Transport System  Open the sorter covers only when necessary.

 Turn the sorter off before opening any covers.

 Always keep strapper covers on during processing.

Detector Service Manual TP09311011 Rev 04 December 2003 Page iii

Moving Parts  Always keep hands clear of any moving mechanisms.

 Never wrap cleaning cloths around your fingers or hands when

 Always keep strapper covers on during processing.

 Always keep the strapper interlocks enabled while running the

 Keep hands and fingers clear of the strapper while operating.

 Do not use cable or wire color as an indicator of the voltage or polar-

 Install wall isolation switchgear in accordance with local regulations

 Always turn the main breaker Off unless troubleshooting electrical

 Always turn power Off before doing the following:

z Opening any power box doors

z Removing safety guards

z Touching any wire

z Removing connector inserts

z Disengaging or attempting to engage connectors

z Wear a personal grounding device, such as an ESD heel or

z Work on MOS components in an antistatic workstation

z Avoid contact with the MOS device pins.

Page iv Cobra Banknote Sorting Machine

z Place Printed Circuit Boards (PCBs) on/in an antistatic bag or

z Do not wear clothing made of nylon or other synthetic material.

 Always return shielding, such as covers and boxes, to their desig-

 Verify that the air supply is removed, disconnected, or shut off

 Exercise caution when troubleshooting the machine requires the

 Wear earplugs or other protection against sustained high-noise lev-

 Never look into any of the system lights.

 Follow the safety precautions provided in relevant detector manuals

 Exercise care when lifting equipment items weighing over 44

Primary Symbol Description

Danger, High Voltage

Detector Service Manual TP09311011 Rev 04 December 2003 Page v

Warning, Laser Light

Pinch Point Warning

Section 16, Contact Image Sensor, addition of section “Loading White

Revision of Section 16 Parts List to add Thickness “B” document

Standardisation of information organisation

Consistent heading usage

File size optimisation

Revisions to the front matter including copyright statements

Change of document category to service manual

General Precautions Always turn power off before servicing.

Always remove keys from the sorter doors to prevent unauthorised

Never smoke while operating the equipment.

Always secure long hair with bands or clips.

Remove neckties, scarves, and jewelry when operating the sorter. If

Press the Emergency Stop button to disable the transport motors

Transport System Open the sorter covers only when necessary.

Turn the sorter off before opening any covers.

Always keep strapper covers on during processing.

Moving Parts Always keep hands clear of any moving mechanisms.

Never wrap cleaning cloths around your fingers or hands when

Always keep strapper covers on during processing.

Always keep the strapper interlocks enabled while running the

Keep hands and fingers clear of the strapper while operating.

Do not use cable or wire color as an indicator of the voltage or polar-

Install wall isolation switchgear in accordance with local regulations

Always turn the main breaker Off unless troubleshooting electrical

Always turn power Off before doing the following:

Always return shielding, such as covers and boxes, to their desig-

Verify that the air supply is removed, disconnected, or shut off

Exercise caution when troubleshooting the machine requires the

Wear earplugs or other protection against sustained high-noise lev-

Never look into any of the system lights.

Follow the safety precautions provided in relevant detector manuals

Exercise care when lifting equipment items weighing over 44

Topic headings within a chapter are presented as follows:

Procedures have numbered steps. Sometimes a step has two or

Any keyboard keys that you need to press appear as follows:

Information that you need to type into the system is in a typewriter

Information or a system prompt displays on screen as follows:

Section 1 provides a high-level overview of the Cobra Detector note

Section 2 describes the Thickness detector, which detects notes

Section 4 describes the Vision detector, which reads illuminated

Section 5 describes the Optical Pattern detector, which discrimi-

Section 6 describes the Ultraviolet (UV) Bright detector, which iden-

Section 7 describes the Limpness detector, a fitness detector which

Section 8 describes the Soil detector, another fitness detector

Section 9 describes the Twin Magnetic Ink detector. This detector

Section 10 explains the operation of the infrared detector, which

Section 11 describes the Central Magnetic Ink detector, which

Section 12 describes the Transmissive Optical detector, which you

Section 13 describes the Low Remanence Magnetic Ink detector,

Section 14 describes the SDIII detector, which measures certain

Section 15 describes the Luminescence detector, which detects UV

Section 16 describes the Contact Image Sensor detector, which

Cobra® Service Manual (TP01311011)

Cobra® User Guide (TML400)