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Neweditedseminarreport
Neweditedseminarreport
SEMINAR REPORT
ON
Submitted by
JAIMON THOMAS
REG.NO: 12131411
OCTOBER 2015
DEPARTMENT OF COMPUTER SCIENCE AND ENGINEERING
OCTOBER 2015
CERTIFICATE
Gracious help from many resources have contributed much to the success of this
seminar work. I express my sincere thanks to Dr. Roobin V Varghese, Princi-
pal College of Engineering Kidangoor, for providing moral support for this seminar.
I would like to express my sincere thanks to all other faculty members of the
Department of Computer Science and Engineering and the Department of Infor-
mation Technology for their support.
I would like to express my sincere thanks to my parents and friends for their
valuable support and contribution to my seminar.
Last but not the least I thank Almighty God for his abundant blessings upon
me in the completion this seminar work.
Jaimon Thomas
CONTENTS
Abstract . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iv
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v
1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 WHY PROJECT ARA??? . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3 WHAT IS PROJECT ARA??? . . . . . . . . . . . . . . . . . . . . . . . . 4
4 ENDOSKELTON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4.1 Parcelling Schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5 MODULES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6 CUSTOMISING ARA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.1 Inductive Coupling . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.2 Unipro 1.6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.3 Operating System . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.4 Operating System . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7 Advantages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8 CHALLENGES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
9 CURRENT SETUP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
10 CONCLUSION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
REFERENCES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
ABSTRACT
(ATAP) organization to create a modular smart phone platform, with the twin
cantly lowered barrier to entry into the mobile hardware ecosystem. The talk will
describe the philosophical underpinnings of Project Ara, its status and timeline,
will also talk about the origins of ATAP and its unique innovation model, inspired
create a modular smart phone platform, with the twin aims of delivering a deep
try into the mobile hardware ecosystem. The talk will describe the philosophical
underpinnings of Project Ara, its status and tim eline, and the opportunities it
creates in the mobile processor space as an example. We will also talk about the
origins of ATAP and its unique innovation model, inspired by that of the Defense
iv
LIST OF FIGURES
v
PROJECT ARA: GOOGLE WANTS YOUR PHONE GO TO PIECES 1
1 INTRODUCTION
The following survey represents the number of trashed electronic items back
in 2010 at US.From the figure it is evident that the number of trashed electronic
items is very high with respect to recycled electronic items
In the figure there represents most of the electronic items available in our
day today life.From the figure it is pretty much evident that the number of trashed
items is considerably high with respect to trashed items.This is due to
1)Life span of devices: The life span of electronic devices are considerably
low because of the quality of items used inside the item.The average life of an
average mobile phone is 2-3 years maximum
2)Repairing issues:After each repairing the quality of the devices decreases
and a matter of fact the devices become useless after some repairs.Also during
repairs huge amount of e-wastes are produced
3)Customisations:We cannot fit the devices into our life style or need.That
is it cannot fitted into something to our needs or the hardware could not support
the users needs.This is the reason why some people change our phones in every
year
4)Upgrades:In elctronic systems like android the operating systems gets up-
dated in several months such that only after this updation the device could exhibit
certain features or support some.
5)Implementation issues:Sometimes devices might come with some imple-
mentaton issues like software problem,screen cracks,mic problem,speaker problem
etc.So people need to change their devices imeadiately
Another reasons are First, your phone cannot take advantage of the steady
improvements to hardware that accrue from Moore Law and other factors. Second,
other than installing an app, you cannot modify your phone to fit your lifestyle or
temporary
Suppose you are finally going on that long dreamed of vacation to Indonesia
and want a better camera in your phone.Add ons can give you a new lens to work
with, and photo editing software can improve the resulting pictures, but these
tweaks wonâTM t make a dramatic difference in your photos. If you really want to
take better pictures with your phone, buying a new one is your only option
Project Ara is the codename for an initiative that aims to develop an open
hardware platform for creating highly modular smartphones. The platform will
include a structural frame or endoskeleton that holds smartphone modules of the
owner’s choice, such as a display, camera or an extra battery. It would allow users
to swap out malfunctioning modules or upgrade individual modules as innovations
emerge, providing longer lifetime cycles for the handset, and potentially reducing
electronic waste. Project Ara smartphone will begin pilot testing in Puerto Rico
later 2015 with a target bill of materials cost of 4000rs for a basic grey phone
It was designed of with the twin aims of delivering a deep customization
experience to users and enabling significantly lowered barrier to entry into the
mobile hardware ecosystem
4 ENDOSKELTON
The Ara endoskeleton is the frame and backplane of the device, determining
the size and layout of the phone. Ara modules slide in and attach to the endoâTM s
slots, which has a backplane to electrically and logically connect modules together.
There are currently three endo size variants: Mini, Medium, and Large, with
varying rib confgurations for each. Note that the Large endo variant and respective
modules will be defned in a future MDK release. Note also that the MDK only
details the specifcation of the endo to the extent that it is necessary for module
developers to develop modules. In the interest of maintaining the integrity of the
Ara platform specifcation, third-party endo development is not permitted.
Parceling schemes are rules that determine how and where modules can be
placed in the endo frame. The front parceling scheme only has a few possible
layouts, while the rear parceling scheme can have many diferent confgurations
depending on the location of the ribs and spine
1)Rear Parceling Scheme: The rear of the endo is parceled into 1x1 unit
squares. Each 1x1 square is approximately 20 mm. Note, however, that 1x2 and
2x2 modules are not exactly 20x40mm and 40x40mm due to the fact that the
thickness of the missing rib must be accounted for to conform to the overall grid
scheme. Refer to the computer-aided design (CAD) models and drawings for exact
dimensions. All three endo sizes use the same rear parceling scheme
Ara Rear Parceling Grid for Large, Medium, and Mini Confgurations As shown
in fig, a Medium endo variant is composed of a 3x6 parceled grid while the Mini and
Large variants are 2x5 and 4x7 (TBD) respectively. Furthermore, the following
design rules govern the placement of the spine and ribs on the rear of the endo:
The Medium variant spine must be at a 1:2 horizontal ofset from the centerline of
the device as viewed from the rear.
The Mini and Large (TBD) variant spine must be in the middle.
For the horizontal ribs, there must be at least 1 rib per 2 units (since modules
cannot be larger than 2x2).
Only a single cross is allowed in an endo (that is, only one rib can go straight
across the spine on both sides
2)Front Parceling Scheme:The following design rules govern the front parcel-
ing scheme
Vertical spines are not allowed - all modules must fill the complete horizontal width
MOD.jpg
5 MODULES
Modules are the building blocks of an Ara phone. They are the hardware
analogue to software apps. These are physical components that implement various
phone functions. There are currently two major classes of modules: Front modules,
which make up the front of the phone and generally provide user interaction or in-
terface afordance such as the display, speaker, microphone, etc., and rear modules,
which provide the bulk of the phoneâTM s back-end (non-user facing) functionality.
Front modules reach across the entire width of a particular endoskeleton frame,
while rear modules come in three standard sizes (1x1, 1x2, and 2x2) and can ft
into multiple frame size
To turn the framework into a functioning smartphone, you will plug every-
thing into an âœendoskeletonâ that has built in electronics to manage the flow of
data and distribute power among modules. This supporting framework will also
contain a tiny backup battery, which can keep the phone alive while you swap
a dead battery module charged one. While Google will build the endoskeleton,
the module design will be left to independent developers. Members of the design
team expect that a basic Ara phone could be built from materials and components
that cost between US 50and100.The retail cost of the phone could, ofcourse, be
more,depending on the specific modules the customer chooses
To turn the framework into a functioning smartphone, you will plug every-
thing into an âœendoskeletonâ that has built in electronics to manage the flow of
data and distribute power among modules. This supporting framework will also
contain a tiny backup battery, which can keep the phone alive while you swap
a dead battery module charged one. While Google will build the endoskeleton,
the module design will be left to independent developers. Members of the design
team expect that a basic Ara phone could be built from materials and components
that cost between US 50and100.The retail cost of the phone could, ofcourse, be
more,depending on the specific modules the customer chooses
: A Phonebloks( ARA phone) is better compared to the Smartphones available
in the market because
It is green.
A Modular Smartphone
Mobile flexibility.
It can be up-to-date
Green and sustainable product - The open modular platform has the ability
to upgrade with biodegradable Bloks that can reduce e-waste.
6 CUSTOMISING ARA
Every slot in the endoskeleton will have a pair of copper pins to convey power
and four single turn copper coils, each about 3 millimeters across. This layout is
mirrored in each right updates onattached module, with a tenth of a millimeter
between paired coils. Data is transferred across this small air gap by a technique
known as inductive couplingâ”sending a current through one coil to induce a volt-
age in its partner. Because the coils donâTM t make physical predictions) contact,
frequent swapping of modules wonâTM t wear them down.
Ara will run a specialized version of the newly released Android 5.0 Lollipop
operating system, which will allow for âœhot swappingâ of modules. With the
exception of the screen and the application processor module, users will be able to
remove a module and replace it with another without rebooting the phone. Want
to use an Ara phone to share photos with friends? Remove the camera, plug in a
pico projector module, and start the show without ever powering down.
The Ara team had to come up with a connection system to ensure that mod-
ules stay firmly coupled to the phone while in use but are easy to detach when you
want to swap them out. These engineers rejected mechanical latches, which would
have detracted from the phoneâTM s aesthetics and added more moving parts. At
the first Ara Developers Conference (http://www.projectara.com/ara developers
conference/) in April 2014, Google announced that it would use electropermanent
magnets to connect the endoskeleton and modules. Modules will be held in place
magnetically while in use. To remove one, youâTM ll use an app to send a brief surge
of electric current through the magnets that hold it, altering their magnetization
enough to free the module from the frame
7 Advantages
Users can make their own mobiles according to their need- The users
can change their phone according to their needs or profession for example if he
is a teacher then he could use the pico projector inorder to show immediately to
student with just one click from his phone
Modules would make easy for Ara users to swap , share , resell their
components-It would make the phone into a customer ruling society.They can
use the some modules by just swapping.
Even your cracked screen can be replaced- Most people change their screen
due to some crack in their screens and all.With Ara you can even change your
screens too
An average Ara kit would have a cost of 3000-4000 only-The basic version
of an ARA phone is just 3000-4000 r s only.So they could reach to common people
easily
Modules can be used outside the phones-With Ara module you can use them
outside the system.For example take an mp3 module.This can be used in the cars
dashboard or inside a music system
8 CHALLENGES
Getting such a phone accepted by users- This will be the main task. ie,
Such a phone accepted by users.People wont accept sudden changes in society.So
empowering them with the features of the mobiles will be a huge task.
Physical size -This is another problem.The physical size of the system is high
with respect to mobiles available nowadys. This is due to available block size and
module size.
9 CURRENT SETUP
Battery:2000mah
Storage:8gb
Network:4G
Camera:12MP Canon HD
10 CONCLUSION
REFERENCES
[1] : htp://projectara.com/mdk-license.txt
[3] : IEEE Spectrum paper by By Ian Chant Posted 29 Dec 2014 â” 20:00 GMT
[4] IEEE Spectrum paper by Jeremy Hsu Posted 15 Jan 2015 â” 18:30 GMT
[5] Google
[6] Wikepedia