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R5F2127 Mabe
R5F2127 Mabe
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-
owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
R8C/35A Group
REJ03B0225-0100
RENESAS MCU Rev.1.00
Sep 10, 2009
1. Overview
1.1 Features
The R8C/35A Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions
for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high
speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are
designed to maximize EMI/EMS performance.
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of
system components.
The R8C/35A Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function.
1.1.1 Applications
Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.
1.1.2 Specifications
Tables 1.1 and 1.2 outline the Specifications for R8C/35A Group.
Table 1.3 Product List for R8C/35A Group Current of Sep. 2009
ROM Capacity RAM
Part No. Package Type Remarks
Program ROM Data flash Capacity
R5F21354ANFP 16 Kbytes 1 Kbyte × 4 1.5 Kbytes PLQP0052JA-A N version
R5F21355ANFP 24 Kbytes 1 Kbyte × 4 2 Kbytes PLQP0052JA-A
R5F21356ANFP 32 Kbytes 1 Kbyte × 4 2.5 Kbytes PLQP0052JA-A
R5F21357ANFP (D) 48 Kbytes 1 Kbyte × 4 4 Kbytes PLQP0052JA-A
R5F21358ANFP (D) 64 Kbytes 1 Kbyte × 4 6 Kbytes PLQP0052JA-A
R5F2135AANFP (D) 96 Kbytes 1 Kbyte × 4 8 Kbytes PLQP0052JA-A
R5F2135CANFP (D) 128 Kbytes 1 Kbyte × 4 10 Kbytes PLQP0052JA-A
R5F21354ADFP (P) 16 Kbytes 1 Kbyte × 4 1.5 Kbytes PLQP0052JA-A D version
R5F21355ADFP (P) 24 Kbytes 1 Kbyte × 4 2 Kbytes PLQP0052JA-A
R5F21356ADFP (P) 32 Kbytes 1 Kbyte × 4 2.5 Kbytes PLQP0052JA-A
R5F21357ADFP (P) 48 Kbytes 1 Kbyte × 4 4 Kbytes PLQP0052JA-A
R5F21358ADFP (P) 64 Kbytes 1 Kbyte × 4 6 Kbytes PLQP0052JA-A
R5F2135AADFP (P) 96 Kbytes 1 Kbyte × 4 8 Kbytes PLQP0052JA-A
R5F2135CADFP (P) 128 Kbytes 1 Kbyte × 4 10 Kbytes PLQP0052JA-A
(D): Under development
(P): Under planning
Part No. R 5 F 21 35 6 A N FP
Package type:
FP: PLQP0052JA-A (0.65 mm pin-pitch, 10 mm square body)
Classification
N: Operating ambient temperature -20°C to 85°C
D: Operating ambient temperature -40°C to 85°C
ROM capacity
4: 16 KB
5: 24 KB
6: 32 KB
7: 48 KB
8: 64 KB
A: 96 KB
C: 128 KB
R8C/35A Group
R8C/3x Series
Memory type
F: Flash memory
Renesas MCU
Renesas semiconductor
Figure 1.1 Part Number, Memory Size, and Package of R8C/35A Group
8 8 8 8 5 1 2 8
Peripheral functions
UART or
Timers clock synchronous serial I/O System clock generation
(8 bits × 3) circuit
Timer RA (8 bits × 1)
Timer RB (8 bits × 1) XIN-XOUT
Timer RC (16 bits × 1) I2C bus or SSU Low-speed on-chip oscillator
Timer RD (16 bits × 2) (8 bits × 1) XCIN-XCOUT
Timer RE (8 bits × 1)
LIN module
Low-speed on-chip oscillator
Watchdog timer for watchdog timer
(14 bits) Comparator B
Multiplier
Notes:
1. ROM size varies with MCU type.
2. RAM size varies with MCU type.
P1_1/AN9/LVCMP2/KI1(/TRCIOA/TRCTRG)
P1_3/AN11/LVCOUT1/Kl3/TRBO(/TRCIOC)
P1_0/AN8/LVCMP1/KI0(/TRCIOD)
P6_6/INT2(/TXD2/SDA2/TRCIOC)
P1_2/AN10/LVREF/Kl2(/TRCIOB)
P6_5/INT4(/CLK1/CLK2/TRCIOB)
P4_5/ADTRG/INT0(/RXD2/SCL2)
P1_6/LVCOUT2/IVREF1(/CLK0)
P1_7/IVCMP1/INT1(/TRAIO)
P1_5(/INT1/RXD0/TRAIO)
P0_7/AN0/DA1(/TRCIOC)
P1_4(/TXD0/TRCCLK)
P6_7(/INT3/TRCIOD)
39 38 37 36 35 34 33 32 31 30 29 28 27
P0_6/AN1/DA0(/TRCIOD) 40 26 P3_1(/TRBO)
P0_5/AN2(/TRCIOB) 41 25 P3_6(/INT1)
P0_4/AN3/TREO(/TRCIOB) 42 24 P2_0(/INT1/TRCIOB/TRDIOA0/TRDCLK)
P0_3/AN4(/CLK1/TRCIOB) 43 23 P2_1(/TRCIOC/TRDIOC0)
P0_2/AN5(/RXD1/TRCIOA/TRCTRG) 44 22 P2_2(/TRCIOD/TRDIOB0)
P0_1/AN6(/TXD1/TRCIOA/TRCTRG) 45 21 P2_3(/TRDIOD0)
P0_0/AN7(/TRCIOA/TRCTRG) 46 R8C/35A Group 20 P2_4(/TRDIOA1)
P6_4(/RXD1) 47 19 P2_5(/TRDIOB1)
P6_3(/TXD1) 48 18 P2_6(/TRDIOC1)
P6_2(/CLK1) 49 PLQP0052JA-A(52P6A-A) 17 P2_7(/TRDIOD1)
P6_1 50 (top view) 16 P3_3/IVCMP3/INT3/SCS(/CTS2/RTS2/TRCCLK)
P6_0(/TREO) 51 15 P3_4/IVREF3/SSI(/RXD2/SCL2/TXD2/SDA2/TRCIOC)
P5_7 52 14 P3_5/SCL/SSCK(/CLK2/TRCIOD)
1 2 3 4 5 6 7 8 9 10 11 12 13
P5_6(/TRAO)
P3_2(/INT1/INT2/TRAIO)
P3_0(/TRAO)
P4_3(/XCIN)
P4_4(/XCOUT)
P3_7/SDA/SSO/TRAO(/RXD2/SCL2/TXD2/SDA2)
P4_2/VREF
RESET
P4_7/XOUT
MODE
VSS/AVSS
P4_6/XIN
VCC/AVCC
Notes:
1. Can be assigned to the pin in parentheses by a program.
2. Confirm the pin 1 position on the package by referring to the package dimensions.
b19 b15 b0
PC Program counter
b15 b0
USP User stack pointer
b15 b0
b15 b8 b7 b0
IPL U I O B S Z D C
Carry flag
Debug flag
Zero flag
Sign flag
Register bank select flag
Overflow flag
Interrupt enable flag
Stack pointer select flag
Reserved bit
Processor interrupt priority level
Reserved bit
Note:
1. These registers comprise a register bank. There are two register banks.
2.6 User Stack Pointer (USP) and Interrupt Stack Pointer (ISP)
The stack pointers (SP), USP and ISP, are each 16 bits wide. The U flag of FLG is used to switch between
USP and ISP.
3. Memory
00000h SFR
(Refer to 4. Special
Function Registers
002FFh (SFRs))
00400h
Internal ROM
(program ROM)
ZZZZZh
FFFFFh
Notes:
1. Data flash indicates block A (1 Kbyte), block B (1 Kbyte), block C (1 Kbyte), and block D (1 Kbyte).
2. The blank areas are reserved and cannot be accessed by users.
5. Electrical Characteristics
P0
P1
P2 30 pF
P3
P4
P5
P6
Table 5.8 Flash Memory (Data flash Block A to Block D) Electrical Characteristics
Standard
Symbol Parameter Conditions Unit
Min. Typ. Max.
− Program/erase endurance (2) 10,000 (3) − − times
− Byte program time − 160 − µs
(program/erase endurance ≤ 1,000 times)
− Byte program time − 300 − µs
(program/erase endurance > 1,000 times)
− Block erase time − 0.2 − s
(program/erase endurance ≤ 1,000 times)
− Block erase time − 0.3 − s
(program/erase endurance > 1,000 times)
td(SR-SUS) Time delay from suspend request until − − 5+CPU clock ms
suspend × 3 cycles
− Interval from erase start/restart until 33 − − ms
following suspend request
− Suspend interval necessary for auto- 33 − − ms
erasure to complete
− Time from suspend until erase restart − − 30+CPU clock µs
× 1 cycle
− Program, erase voltage 2.7 − 5.5 V
− Read voltage 1.8 − 5.5 V
− Program, erase temperature −20 (7) − 85 °C
− Data hold time (8) Ambient temperature = 55°C 20 − − year
Notes:
1. VCC = 2.7 to 5.5 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
2. Definition of programming/erasure endurance
The programming and erasure endurance is defined on a per-block basis.
If the programming and erasure endurance is n (n = 10,000), each block can be erased n times. For example, if 1,024 1-byte
writes are performed to different addresses in block A, a 1 Kbyte block, and then the block is erased, the
programming/erasure endurance still stands at one.
However, the same address must not be programmed more than once per erase operation (overwriting prohibited).
3. Endurance to guarantee all electrical characteristics after program and erase. (1 to Min. value can be guaranteed).
4. In a system that executes multiple programming operations, the actual erasure count can be reduced by writing to sequential
addresses in turn so that as much of the block as possible is used up before performing an erase operation. For example,
when programming groups of 16 bytes, the effective number of rewrites can be minimized by programming up to 128 groups
before erasing them all in one operation. In addition, averaging the erasure endurance between blocks A to D can further
reduce the actual erasure endurance. It is also advisable to retain data on the erasure endurance of each block and limit the
number of erase operations to a certain number.
5. If an error occurs during block erase, attempt to execute the clear status register command, then execute the block erase
command at least three times until the erase error does not occur.
6. Customers desiring program/erase failure rate information should contact their Renesas technical support representative.
7. −40°C for D version.
8. The data hold time includes time that the power supply is off or the clock is not supplied.
Suspend request
(FMR21 bit)
FST6 bit
Clock-dependent
Fixed time time
Access restart
td(SR-SUS)
Internal
reset signal
1 1
× 32 × 32
fOCO-S fOCO-S
Notes:
1. Vdet0 indicates the voltage detection level of the voltage detection 0 circuit. Refer to 6. Voltage Detection
Circuit of Hardware Manual (REJ09B0407) for details.
2. tw(por) indicates the duration the external power VCC must be held below the valid voltage (0.5 V) to enable
a power-on reset. When turning on the power after it falls with voltage monitor 0 reset disabled, maintain
tw(por) for 1 ms or more.
Table 5.15 Timing Requirements of Synchronous Serial Communication Unit (SSU) (1)
Standard
Symbol Parameter Conditions Unit
Min. Typ. Max.
tSUCYC SSCK clock cycle time 4 − − tCYC (2)
tHI SSCK clock “H” width 0.4 − 0.6 tSUCYC
tLO SSCK clock “L” width 0.4 − 0.6 tSUCYC
tRISE SSCK clock rising Master − − 1 tCYC (2)
time Slave − − 1 µs
tFALL SSCK clock falling Master − − 1 tCYC (2)
time Slave − − 1 µs
tSU SSO, SSI data input setup time 100 − − ns
tH SSO, SSI data input hold time 1 − − tCYC (2)
tLEAD SCS setup time Slave 1tCYC + 50 − − ns
tLAG SCS hold time Slave 1tCYC + 50 − − ns
tOD SSO, SSI data output delay time − − 1 tCYC (2)
tSA SSI slave access time 2.7 V ≤ VCC ≤ 5.5 V − − 1.5tCYC + 100 ns
1.8 V ≤ VCC < 2.7 V − − 1.5tCYC + 200 ns
tOR SSI slave out open time 2.7 V ≤ VCC ≤ 5.5 V − − 1.5tCYC + 100 ns
1.8 V ≤ VCC < 2.7 V − − 1.5tCYC + 200 ns
Notes:
1. VCC = 1.8 to 5.5 V, VSS = 0 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
2. 1tCYC = 1/f1(s)
VIH or VOH
SCS (output)
VIL or VOL
SSCK (output)
(CPOS = 1)
tLO
tHI
SSCK (output)
(CPOS = 0)
tLO tSUCYC
SSO (output)
tOD
SSI (input)
tSU tH
VIH or VOH
SCS (output)
VIL or VOL
SSCK (output)
(CPOS = 1)
tLO
tHI
SSCK (output)
(CPOS = 0)
tLO tSUCYC
SSO (output)
tOD
SSI (input)
tSU tH
Figure 5.4 I/O Timing of Synchronous Serial Communication Unit (SSU) (Master)
VIH or VOH
SCS (input)
VIL or VOL
SSCK (input)
(CPOS = 1)
tLO
tHI
SSCK (input)
(CPOS = 0)
tLO tSUCYC
SSO (input)
tSU tH
SSI (output)
tSA tOD tOR
VIL or VOL
SSCK (input)
(CPOS = 1)
tLO
tHI
SSCK (input)
(CPOS = 0)
tLO tSUCYC
SSO (input)
tSU tH
SSI (output)
Figure 5.5 I/O Timing of Synchronous Serial Communication Unit (SSU) (Slave)
tHI
VIH or VOH
SSCK
VIL or VOL
tLO tSUCYC
SSO (output)
tOD
SSI (input)
tSU tH
Figure 5.6 I/O Timing of Synchronous Serial Communication Unit (SSU) (Clock Synchronous
Communication Mode)
VIH
SDA
VIL
tBUF
tSTAH tSCLH tSP tSTOP
tSTAS
SCL
P(2) S(1) Sr(3) P(2)
tSCLL
tsf tsr tSDAS
tSCL
tSDAH
Notes:
1. Start condition
2. Stop condition
3. Retransmit start condition
Timing Requirements
(Unless Otherwise Specified: VCC = 5 V, VSS = 0 V at Topr = 25°C)
tC(XIN) VCC = 5 V
tWH(XIN)
XIN input
tWL(XIN)
Figure 5.8 XIN Input and XCIN Input Timing Diagram when VCC = 5 V
tC(TRAIO) VCC = 5 V
tWH(TRAIO)
TRAIO input
tWL(TRAIO)
tC(CK) VCC = 5 V
tW(CKH)
CLKi
tW(CKL)
th(C-Q)
TXDi
td(C-Q) tsu(D-C) th(C-D)
RXDi
i = 0 to 2
Table 5.22 External Interrupt INTi (i = 0 to 4) Input, Key Input Interrupt KIi (i = 0 to 3)
Standard
Symbol Parameter Unit
Min. Max.
tW(INH) INTi input “H” width, KIi input “H” width 250 (1) − ns
tW(INL) INTi input “L” width, KIi input “L” width 250 (2) − ns
Notes:
1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
VCC = 5 V
INTi input tW(INL)
(i = 0 to 4)
KIi input
tW(INH)
(i = 0 to 3)
Figure 5.11 Input Timing for External Interrupt INTi and Key Input Interrupt KIi when Vcc = 5 V
Timing Requirements
(Unless Otherwise Specified: VCC = 3 V, VSS = 0 V at Topr = 25°C)
tC(XIN) VCC = 3 V
tWH(XIN)
XIN input
tWL(XIN)
Figure 5.12 XIN Input and XCIN Input Timing Diagram when VCC = 3 V
tC(TRAIO) VCC = 3 V
tWH(TRAIO)
TRAIO input
tWL(TRAIO)
tC(CK) VCC = 3 V
tW(CKH)
CLKi
tW(CKL)
th(C-Q)
TXDi
RXDi
i = 0 to 2
Table 5.28 External Interrupt INTi (i = 0 to 4) Input, Key Input Interrupt KIi (i = 0 to 3)
Standard
Symbol Parameter Unit
Min. Max.
tW(INH) INTi input “H” width, KIi input “H” width 380 (1) − ns
tW(INL) INTi input “L” width, KIi input “L” width 380 (2) − ns
Notes:
1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
VCC = 3 V
INTi input tW(INL)
(i = 0 to 4)
KIi input
tW(INH)
(i = 0 to 3)
Figure 5.15 Input Timing for External Interrupt INTi and Key Input Interrupt KIi when Vcc = 3 V
Timing Requirements
(Unless Otherwise Specified: VCC = 2.2 V, VSS = 0 V at Topr = 25°C)
tWL(XIN)
Figure 5.16 XIN Input and XCIN Input Timing Diagram when VCC = 2.2 V
TRAIO input
tWL(TRAIO)
CLKi
tW(CKL)
th(C-Q)
TXDi
RXDi
i = 0 to 2
Table 5.34 External Interrupt INTi (i = 0 to 4) Input, Key Input Interrupt KIi (i = 0 to 3)
Standard
Symbol Parameter Unit
Min. Max.
tW(INH) INTi input “H” width, KIi input “H” width 1000 (1) − ns
tW(INL) INTi input “L” width, KIi input “L” width 1000 (2) − ns
Notes:
1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
VCC = 2.2 V
INTi input tW(INL)
(i = 0 to 4)
KIi input
tW(INH)
(i = 0 to 3)
Figure 5.19 Input Timing for External Interrupt INTi and Key Input Interrupt KIi when Vcc = 2.2 V
Package Dimensions
Diagrams showing the latest package dimensions and mounting information are available in the “Packages” section of
the Renesas Technology website.
HD
*1
D
39 27
NOTE)
40 26 1. DIMENSIONS "*1" AND "*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION "*3" DOES NOT
bp INCLUDE TRIM OFFSET.
b1
HE
E
*2
c1
c
Reference Dimension in Millimeters
Symbol
Min Nom Max
52 Terminal cross section D 9.9 10.0 10.1
ZE
14
E 9.9 10.0 10.1
1 13 A2 1.4
ZD Index mark HD 11.8 12.0 12.2
HE 11.8 12.0 12.2
A 1.7
F A1 0.05 0.1 0.15
c
A2
A
y
L c1 0.125
*3
e bp
x L1 0° 8°
e 0.65
Detail F x 0.13
y 0.10
ZD 1.1
ZE 1.1
L 0.35 0.5 0.65
L1 1.0
Description
Rev. Date
Page Summary
0.01 Oct 26, 2007 − First Edition issued
0.10 Jan 16, 2008 2 Table 1.1 Interrupts: Specification “• Number of interrupt vectors: 69” →
“• Number of interrupt vectors: 69”
3 Table 1.2 Serial Interface: Specification revised, Note1 deleted
6 Figure 1.3 revised
7 Table 1.4 Pin Number: 13, 35 revised
9 Table 1.6 Table 1.6 XIN clock input, XIN clock output:
I/O Type, Description revised
Note2 added
14 Figure 3.1 “Expanded area” deleted, Note1 revised
27 to 53 5. Electrical Characteristics added
0.40 Dec 05, 2008 1 1.1 “These MCUs also use an .... are designed to withstand EMI.” →
“These MCUs are designed to maximize EMI/EMS performance.”
2 Table 1.1 revised
3 Table 1.2 revised
5 Figure 1.2 revised
6 Figure 1.3 “P4_6/XIN(/XCIN)” → “P4_6/XIN”
“P4_7/XOUT(/XCOUT)” → “P4_7/XOUT”
7 Table 1.4 revised
8 Table 1.5 revised
10 Table 1.7 Voltage detection circuit added
14 Figure 3.1 revised
15 Table 4.1 “0XXX00XXb” → “0XXXXXXXb”
Note2 revised
16 Table 4.2 004Fh, 0072h, 0073h: revised
18 Table 4.4 00C0h, 00D8h, 00D9h revised
21 Table 4.7 019Ah “00010000b /” added
27, 28, 30 Table 5.1 to Table 5.15, Table 5.17 to Table 5.19,
to 36, 38 Table 5.24 to Table 5.26, Table 5.30, Table 5.31 revised
to 43, 46 Figure 5.3 to Figure 5.6 revised
to 48, 50,
51
1.00 Sep 10, 2009 All pages “Preliminary” “Under development” “High-speed on-chip oscillator”
deleted
4 Table 1.3 revised
9 Table 1.6 Note 2 deleted
26 Table 4.12 revised, Table 4.13 added
28 Table 5.2 revised, Note 3 deleted
32, 33 Table 5.7, Table 5.8 revised
34 Table 5.9, Table 5.10 revised
C-1
REVISION HISTORY R8C/35A Group Datasheet
Description
Rev. Date
Page Summary
1.00 Sep 10, 2009 35 Table 5.11, Table 5.12 revised
36 Old Table 5.13 deleted
42, 46, 50 Table 5.17, Table 5.23, Table 5.29 revised
45 Table 5.21 revised
43, 47, 51 Table 5.18, Table 5.24, Table 5.30 revised
45, 49, 53 Table 5.22, Table 5.28, Table 5.34 INT0 → INTi
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C-2
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Notes:
1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes
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but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples.
3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass
destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws
and regulations, and procedures required by such laws and regulations.
4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this
document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document,
please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be
disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com )
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result of errors or omissions in the information included in this document.
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or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality
and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or
undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall
have no liability for damages arising out of the uses set forth above.
8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:
(1) artificial life support devices or systems
(2) surgical implantations
(3) healthcare intervention (e.g., excision, administration of medication, etc.)
(4) any other purposes that pose a direct threat to human life
Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing
applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all
damages arising out of such applications.
9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range,
movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages
arising out of the use of Renesas products beyond such specified ranges.
10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain
rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage
caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and
malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software
alone is very difficult, please evaluate the safety of the final products or system manufactured by you.
11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as
swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products.
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