Process Specification

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Z8K00071027,001,7 - new created -

APPLICABLE AREA
Corporation Infineon
Product Division SON
Cluster Front of Line
Location Melaka
Production Area/Business M1
Unit
Production Unit Die Bond

Title: Process Specification for Soft Solder Clip attach process.

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 Process Specification
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Title: Process Specification for Soft Solder Clip attach process.

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 Process Specification

1. Process Description :
To attach a Cu clip on chip top with TOLL matrix lead frame using the 2009 SSI Die Bonder,
applicable with Soft Solder Technology. The evaluation results and sample build data was compiled
under one report where can be find inside E-register.

2. F1 - and GK- Materials :

2.1 F1 material.

2.1.1 Chip Type : As per defined by production planner

2.1.2 Leadframe

a) Material minimum 99% copper

b) Plating area Selective Ag plated 2-6um

c) Lead frame type TOLL 5L(C66065-A6545-C008)

d) Clip part no 1. C66065-A6545-C020(3E3)
2.C66065-A6545-C009(2E3)

2.1.3 Soft solder

Pb base solder (Robust )

Composition PbSn2Ag2.5

20mil / 0.5mm diameter

2.1.4 Forming Gas : Composition - 12% Hydrogen 88% Nitrogen

2.2 GK Material.
Make sure collet used fulfill Design Rule requirement.
Soft Solder - Z8K00024666

2.2.1 Die Collet : 1.) Vespel Round Collet ( According to clip size)

Collet size Clip type Clip part no

V60 3E3 C66065-A6545-C020

V50 2E3 C66065-A6545-C009

Title: Process Specification for Soft Solder Clip attach process.

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 Process Specification

3. Equipment and Materials :

3.1 Machine Model : ESEC 2009.

3.2 Hand gloves and finger cots
3.3 Magazines Type : Pre-assembly Magazine
: Assembly Magazine

3.4 Stereoscope : V = 40X

3.5 Measurement Scope : V =200X

,
tools,
vessels with size labels,
protective clothing,
connections for media (l/m)

4. Caution / Safety :
Manufacturing Operation
4.1 Clip bonded units must be kept in the N2 cabinet.

4.2 Handle the lead frames and clip only with plastic gloves.

4.3 Clip must store inside N2 cabinet inside lead frame container pack with plastic bag.

4.4 Hold clip plastic bag at opening area/point.(refer to OJTI)

4.5 Place the clip inside bowl during production mode with minimum distances(as lowest )from
bowl base surface.

4.6 The lead frames left inside the indexer track (>2 minutes) during the machine stoppage has
to be cleared without bonding.

4.7 Clip leftover inside bowl has to be scrap to avoid mixing.

4.8 Any mishandling(packing box or plastic bag drop) clip must be scrap

4.9 Assembly cleans room specification (Z8K00050061).

Safety ,Health and Environment

4.10 Refer to Risk & Hazard Assessment (RHA) of process for identified risks & hazards, and
respective safety measures (Z8F80172729).

4.11 Refer to SHE Work Instruction (Z8K00002741, Die Bond Diffusion and Soft Solder) for related
safety & health risks and safety instructions.

Title: Process Specification for Soft Solder Clip attach process.

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 Process Specification

4.12 Exercise extreme caution in handling forming gas (88N12H, mixture of hydrogen) which is highly
flammable. Check forming gas pressure and flow rate. (RHA Z8F55491218 _ 4.0 Fire and
Explosion Risk)

5. Consignment / Arrival :
5.1 Clip transport to IFX in loose form in lead frame box/container with pack in plastic bag with
Estimated 5K quantity.
5.2 Open seal boxes must keep inside N2 cabinet.

6. Preparation:
6.1 Ensure that the correct bonding diagram / build sheet is displayed.

6.2 Ensure correct, clip and pick-up tool used are follow as stated in built sheet.

6.3 Check the bonding parameters are within specification.

6.4 Ensure the correct coding used at Die attach process.

6.5 Production Work Flow (Appendix 2)

6.6 Process Instruction for Clip Bond TOLL.

7. Process Procedure :
7.1 Machine Setting.

7.1.1 Frame coding in accordance to build sheet.

7.1.2 Clip bond in accordance to drawing / buildsheet.

7.1.3 Forming gas flow rates. (Applicable for both TOLL Diffusion Soldering and TOLL Soft
Solder)

Insert Diffusion Soldering

Insert 1 minimum 500 l/h
Insert 2- Pre minimum 1500 l/h
Insert 2- Post Minimum 1000 l/h
Insert 3 minimum 500 l/h

7.1.4 Solder feed length, L: (Applicable for all soft solder machines using writer only)
L=(X*Y*BLT)/ wire cross area.

Writing pattern: Spiral pattern.

Writing pattern size: Refer to bonding diagram.

Title: Process Specification for Soft Solder Clip attach process.

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 Process Specification

7.2 Operation Procedure. (Z8K00008570)

7.2.1 Switch on machine

- Switch on power supply by main Switch.
- Open valves for forming gas, compressed air, cooling water, N2 and vacuum.
- Check specified pressure and flow rates.
- Change frame alphanumeric code in accordance to characteristic chart.
7.2.2 Initialize
Press ‘INIT’ key to initialize the machine after switch on the machine.

7.2.3 Switch on heater

- Select the TEACH - NEW MATERIAL - LEADFRAME - HEATER CONTROL
TEMPERATURE menu and switch the ' zone state ' to on.
- Approximate to reach the working temperature is 30 minutes.

7.2.4 In / output
a) Put the pre-assembly magazine onto the input magazine handler (Check orientation)
b) Put the magazine handler with empty magazines; check the magazine orientation.

8. Checks:
8.1 Equipment Used
a) Stereo microscope : V = 40X
b) SAT

8.2 Control Plan & Failure Catalogue Specification

Control Plan for TO LinearFET : Z8K00045290

Reject as per failure catalogue : Z8K00050695

9. Measures :
Stop the machine for corrective actions if defective level is out of control limit. If problem cannot be
solved, inform the shift leader or production executive or the process engineer. Identify and
segregate affected material as DDM lot for PE engineer and QA for disposition.
Reference document : Spec no.
MAL PS Deviation Handling Procedure (DDM) Z8K00051541,(*)
Routine check to be recorded in the JHAM / conversion check sheet.

10. Fault Avoidance :

Always refer to process instruction and follow strictly the die bond process control plan.
(Appendix 1 - 4).
Reference document: Spec. no.

Title: Process Specification for Soft Solder Clip attach process.

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 Process Specification

1. Control Plan for TO LinearFET : Z8K00045290

2. Failure Catalogue : Z8K00050695

11. Entries:
11.1 Production and quality data must be recorded in CAMSTAR and SPC chart.

11.2 Corrective actions for out of control points must be recorded.

12. Transport :
All bonded material must be transported in magazines

13. Startup / Shutdown:

--- The machine must be switched on from standby temperature to working temperature 15 minutes
before production.

14. Storage:
If material is not able to wire bond immediately, the die+ clip bonded lead frame must be stored in
WIP cabinet.
15. Care and Maintenance:
Housekeeping on machine and work area to be done as per JHAM & TPM program.
16. Calibration:
Calibration Procedure

16.1.1 Temperature Calibration

a) Prepare the X-Y recorder, place the frame brazed with the thermocouple from X-Y
recorder on the input side of the heater block. Set the chart speed to 200mm/min and
temperature range from 0°C to 500°C with K type.
b) Select INSTALL – CALIBRATE – LEADFRAME HANDLER – HEATER
CONTROLLER and press the ‘ start calibrate ‘ key , the machine will calibrate the
temperature by dummy index the frame which is already brazed with the thermo
coupler .
c) Run the machine and activate the X-Y recorder simultaneously. The temperature
profile will be recorded on the chart.
d) Ensure the temperature is identified on the chart for solder dispensing and bonding
position.
e) Compare the recorded temperature to the specification.
f) If it is not within specification, make necessary adjustment on menu TECH – NEW
MATERIAL – LEADFRAME – HEATER CONTROLLER and repeat the step from b to
e

16.1.2 Over travel

a) Pick-up height

Title: Process Specification for Soft Solder Clip attach process.

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 Process Specification

- Move the collet to clip pick up station.

- Select TEACH - NEW MATERIAL - PICK & PLACE - PICK PROCESS menu, press
'Learn Z height' key, the bond tool will calibrate the Z height at pick position
Automatically (At least two times per measurement).
b) Bond tool height
- Select TEACH - NEW MATERIAL - PICK & PLACE - BOND PROCESS menu, press
' Learn Z height ' key, the bond tool will calibrate the bond height automatically on
the chip top.
- Check at least two times measurement.

16.1.3 Bond Head Perpendicular Alignment

a) X-axis
- Clear all leadframe from indexer assembly, remove the indexer centering plate.
- Fit the right -angle gauge into the bondhead toolholder , Select TEACH - NEW
MATERIAL - PICK & PLACE - BOND PROCESS menu , using the cursor key
- And bondhead up and down to move the bondhead to bond position and check
the gauge is exactly parallel with the indexer in X-axis .
- The alignment can be adjust by the X adjustment lock screw which is on the
bondhead.

b) Y-axis
- Clear all leadframe from indexer assembly, remove the indexer centering plate .
- Fit the right -angle gauge into the bondhead toolholder , Select TEACH - NEW
MATERIAL - PICK & PLACE - BOND PROCESS menu , using the cursor key
- And bondhead up and down to move the bondhead to bond position and check
the gauge is exactly parallel with the indexer in Y-axis.
- The alignment can be adjust by the Y adjustment lock screw which is on the
bondhead.

16.2 Calibration Frequency

a) Temperature Profile :1 x / month / machine
b) Bond head Perpendicular Check :1 x / week / machine
c) Bond Force calibration :1x /week / machine (Z8K00008415)
1x / conversion from Soft Solder to Diffusion
/machine
d) Track levelness : 1x / week / machine

17. Appendix:
1. Work Instruction for TO LinearFET
2. Process Handling Procedure for TOLL
3. SHE Safety Work Instruction for TOLL
4. Clip bond temperature profile
5. TO LinearFET Control plan
6. Conversion Procedure for Robust Packages
7. Production Work Flow for ESEC 2009 SSI Die Bonder
8. Process Work Instruction for soft solder Die Bonding TOLL

Title: Process Specification for Soft Solder Clip attach process.

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 Process Specification

18. Process Results:

All process results are base on criteria stated in item number 8.

19. Waste Disposable / Environment :

Waste metal / scrapped metal (lead frame ) is to be collected ( white bin ) and sent to waste store for
recycling.

a) Blue foil are to be collected in the scrapped “Wafer Foil bin” and scrapped weekly to store.

b) Used collets are to be collected in “Used Collet Box” and to be sent for scrap.

c) Used wafer ring are collected into the “Wafer ring bin”.

d) Contaminated finger cot or gloves are to be collected in ”Red Bin“ and scrapped weekly to store.

e) Refer to Instruction for Waste Management Ref.: Z8K00055500 if in doubt.

Appendix 1
Work Instruction for TO Linear FET.

Appendix 2
Process Handling Procedure for TOLL

Appendix 3
SHE Safety Work Instruction for TOLL.

Appendix 4

Title: Process Specification for Soft Solder Clip attach process.

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 Process Specification

Clip Bond Temperature Profile.

Zone Temperature Setting

Zone 1 320°C ± 10°C
Zone 2 340°C ± 10°C
Zone 3 340°C ± 10°C
Zone 4 340°C ± 10°C
Zone 5 340°C ± 10°C
Zone 6 340°C ± 10°C
Zone 7 370°C ± 10°C
Zone 8 340°C ± 10°C

TO LinearFET Control plan

Z8K00045290

Appendix 6

1. Conversion Procedure for Robust Packages

1.1 All Clip bond machine which is qualified for robust packages production must perform weekly
machine cleaning as standard practice of weekly JHAM activities.

1.2 Cleaning of machine should be carry out during morning shift by the machine owner and assist by PM
technician if any major breakdown.

1.3 Cleaning procedure and equipment needed should be followed as stated in robust cleaning OPL.

Appendix 7
Production Work Flow for ESEC 2009 Clip Bonder.
1.0 Start up
1.1 - Open valves for forming gas, compressed air cooling water, N2 and vacuum.
- Check specified pressures and flow rates.

1.2
- Align the collets against the clip positions.
- Feed the input handler with preassembly magazine with correct type of leadframe &
Title: Process Specification for Soft Solder Clip attach process.
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 Process Specification

orientation.
- Feed the magazine handler with empty magazines; check the magazine orientation.
- Pick up clip to check bond quality, orientation, placement and etc. according to
bonding diagram.

1.3 Ensure all the modules are switched on accordingly.

1.4 Start process with selection “RUN” mode on the MAIN menu.

2.0 End of production.

2.1 Select the ' Run complete ' KEY at MAIN menu.

2.2 Once the indexer is empty, stop the machine by pressing ' Stop ' key

2.3 Clear remaining clip inside bowl.

2.4 Switch “OFF” the modules if necessary

2.5 Close valve N2, forming gas, air and vacuum.

2.6 If you want to switch off the machine, follow the steps below.

- Make sure steps 2.1 and 2.2 is done.

- Select “SHUTDOWN” mode in ESEC menu.
- Switch off the main switch .
- Switch off the main power switch.

3.0 Pay attention to the following points during production :

3.1 Handle the leadframes only with plastic gloves of finger cots.

Appendix 8
Process Work Instruction for TO LinearFET

Esec 2009 SSIE Machine – Soft Solder Bonding

Title: Process Specification for Soft Solder Clip attach process.

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 Process Specification

Points to consider before start of production

1) Check lot tag against buildsheet for the following :
i) Correct device ii) Wafer type iii) Die orientation iv) Device code v) heatsink code
2) Check BOM on CAMSTAR versus actual :
i) Clip ii) Lead frame iii) Solder Wire
3) Check pick-up collet to clip position.
4) Ensure collet is clean. Correct placement of solder pick-up tool.
5) Ensure correct writing nozzle used.
6) Ensure good frames are loaded to the input handler.
7) Perform solder voiding check X-ray (Soft Solder).
Acceptance criteria – C/N = 0/12 (Z8K00051318).
8) Ensure solder spread is observed at all the chip perimeter.
If not, check solder amount and bond head perpendicularity
9) Note any remark for special requirement.
10) If there is staging more than 1 hour during setup or troubleshooting dispense and dispose the exposed
solder wire

Points to consider while running production

1) Self inspection (SPC) on bonding quality :
Visual inspection : 2x / magazine / machine C/N : 0/40 (Z8K00051318)
2) Data of self inspection / surveillance and solder voiding check to be recorded on the respective control
charts.
3) Problems encountered and the duration must be recorded on the downtime card.
4) The solder which is write on chip top (>2 minutes) during the machine stoppage has to be cleared
without bonding. (Soft solder only)

Points to consider when production completes

1) Check qty of frame versus actual.
2) Track out lot using CAMSTAR.
3) List clip bond reject if any.
4) Move out to next process.
5) Record production indices in the assembly production book

General
5) Housekeeping on machine and work area.
6) Calibration of machine :
i) Bond Force -1x / week / machine (Soft Solder),
-1x / conversion from Soft Solder to Diffusion /
Machine,
ii) Vespel Collet check/change (Robust) -1x / every 20k pick up / Conversion
iii) Temperature profile -1x / month / machine
v) Bond head perpendicular check -1x / week / machine (Soft Solder)

Title: Process Specification for Soft Solder Clip attach process.

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