Name: Aditya

Roll No.: 26
Subject: SBL
Aim:
Tools used for PCB Design
Some software tools are as follow:
1) Fusion 360.
2) Solidworks
3) Ansys RedHawk.
4) EAGLE
5) NI Multisim
6) Altium Circuit Maker
7) EasyEDA

PCB Design Rule Check (DRC)

PCB Design Rule Check, more commonly called as DRC in the PCB industry, is a design
process to determine if the layout satisfies a number of rules, and also a CAM process to
determine whether your production data meets PCB manufacturing capabilities provided by
the printed circuit board (PCB) manufacturer.
PCB DRC Rules

• Checking Proper Placement of Decoupling Capacitors with DRC: One of the many
challenges that engineers face on a regular basis is ensuring that their designs meet the
defined specifications for each component. Alternatively, the decoupling capacitor
placement rule in DRC will locate all improperly placed, and non-existent, decoupling
capacitors for a defined net or component.

• Vertical Plane Change Rule: Routing a trace from one layer to another is a common
design practice used to accommodate today’s densely packed PCB layouts; however,
care must be taken to reduce the risk of common-mode radiation. Frequently, stitching
capacitors or stitching vias are placed near the net when a plane change occurs to allow
for a continuous current return path

• Crosstalk Coupling Rule: The crosstalk coupling rule will help identify areas on a
design where unwanted crosstalk occurs on sensitive nets. Crosstalk can cause serious
timing and functionality errors, and can also be very difficult to manually diagnose on
a manufactured printed circuit board (PCB).

• Power/Ground Width Rule: The power/ground width rule checks for narrow trace
and ground traces are not designed to be wide enough, the resulting current on that net
can be insufficient. This may lead to a host of problems including, but not limited to, a
lack of adequate power supplied to components as well as unnecessary heat production.

• Signal Supply Rule: The signal supply rule checks for discontinuities between an
integrated component’s supply planes and its connected traces’ reference plane. These
types of violations can lead to potentially strong radiation, and as a result, EMI failures.

• Filer Placement Rule: The filter placement rule checks for the presence of filters
within a close enough proximity to a connector’s pins. To protect sensitive signals, as
well as prevent radiation, filters are used to suppress noise that may be present on a
connector. The absence, or misplacement, of filters on connectors can lead to serious
EMI issues and failures.

• Return Path Rule: The return path rule ensures that the tested signals have a
sufficiently low-impedance return path. With the increase in today’s high-speed circuit
design requirements, as well as the decrease in PCB size, adhering to proper return path
rules is incredibly important. If the return current on a trace not able to properly flow
underneath the conductor. It can instead take an unintended path through other areas of
your circuit, possibly resulting in EMI issues.

PCB Electronics Rule Check (ERC)

Electrical Rule Checks (ERC) are used at both the schematic and layout levels to ensure the
device satisfies electronic design rules such as floating devices, nets, and pins, power domain
crossing, and maximum allowed series pass gates
PCB E-test Capabilities and Types

Min Continuity Resistance 0.1 ohms

Max Test Voltage 1,000 volts

Max Isolated Resistance 25M – 2G ohms

Electrical Test Pitch (Fixture) 20mil (0.5mm)

Electrical Test Pitch (Flying Probe) 4mil (0.1mm)

Placement and layout of components in PCB:

The layout of printed circuit boards has become more and more complex, with an increasing
density of components. This complexity is due on the one hand by the market demand for
increasingly rich and advanced features, on the other by the need to create ultra-small PCBs as
required by the latest generation devices. The increase in the operating frequencies of the
signals requires high precision in the layout in order to avoid power and signal integrity issues.
Rules for the placement of components on the PCB:

1 - Group components by function

Components that have similar functions should be grouped together. For example, power
management ICs (PMICs) should be grouped in the same power management section, along
with converters, The power supply section should be kept separate from the analog and digital
parts, especially if they use signals with high switching frequencies. Also, components that
generate electromagnetic noise or radiation must be kept away from more sensitive signals. By
grouping components according to their function, it also allows for better control of the return
path.

2 - Use a standard orientation for the components

A good rule of thumb is to keep a space of at least 40mil between the components, and at least
100mil between each component and the edge of the PCB.

On the solder side of the PCB, also avoid placing components in close proximity to through-
hole terminals. All surface mount (SMT) components should be placed on the same side of the
board, while all through-hole components should be placed on the top side of the PCB to
simplify assembly.

3. Place Board-To-Wire Connectors near The Edge

System installers and technicians will appreciate if you keep board-to-wire connectors near the
edge of the board, especially if the wire needs to be screwed on. Not only it does look
organized, but keeping connectors near the edge prevent unwanted contact with other
components on the PCB.
4. Get the Components Orientation Standardize

All ICs, regardless of their footprint, have a pin 1 marker. If you don’t want your assembler to
grumble each time you submit a design, ensure they are all aligned in the same direction. This
increases the efficiency of the assembly process and reduces placement mistakes.

EMI/EMC issues in PCB design

What is EMI?

EMI is the interference caused by an electromagnetic disturbance that affects the performance
of a device. Sources of EMI can be environmental, such as electrical storms and solar radiation,
but more usually will be another electronic device or electrical system.
EMI can be caused by natural or human-made sources.

There are four types of EMI:

Conducted EMI-EMI that flows through wires and is caused by physical contact with the
source of EMI.
Common Mode EMI-A high-frequency EMI that flows in the same direction through one or
more conductors.
Differential Mode EMI -A low-frequency EMI that flows in an opposite direction through
adjacent wires.
Radiated EMI-The most common type of EMI, caused by radiating electromagnetic fields.
Common manifestations of radiated EMI include static noise on AM/FM radio receivers and
“snow” on TV monitors.
What is EMC?

EMC is a measure of a device's ability to operate as intended in its shared operating

environment while, at the same time, not affecting the ability of other equipment within the
same environment to operate as intended.
It can occur in any frequency range, say anything more than DC. It happends above 50 MHz.

Electromagnetic compatibility of an electrical, electronic, or RF device has two facets. The

ability to work properly in the presence of electromagnetic radiation.
The ability to not generate additional EMI that affects the operation of other devices in its
vicinity. Even though EMC testing can be expensive, it is essential to ensure that a design will
function properly and won’t generate disruptive electromagnetic interference.
There are several ways to address EMI and EMC issues in PCB design:

Grounding and shielding:

Proper grounding and shielding techniques can help prevent EMI from entering or leaving a
PCB. Ground planes, shielding cans, and conductive gaskets are some common techniques
used to reduce EMI.
Component placement:
Proper placement of components on the PCB can help reduce the emission of EMI. For
example, placing sensitive components away from sources of EMI can help reduce the
susceptibility to EMI.
Signal routing:
Proper signal routing can help reduce EMI by minimizing the loop area of signals and reducing
crosstalk between signals.
Proper PCB layout:
A good PCB layout can help reduce EMI by reducing the length of traces and keeping high-
speed signals away from sensitive components.
Compliance with regulations:
Compliance with regulatory standards such as FCC and CE can help ensure that the PCB meets
the required EMC standards.
In summary, to minimize EMI and ensure EMC in PCB design, it is important to consider
grounding and shielding techniques, proper component placement, signal routing, PCB layout,
and compliance with regulatory standards.