Name: Subject: ECEP443

Section: ECE 4A Score:

I. Fill in the Blank (no erasure)

1. Early digital electronics systems were based on magnetically controlled ________________.

2. The era of the _________________ based computer culminated in the design of machines such as the
ENIAC (intended for computing artillery firing tables) and the UNIVAC I (the first successful commercial
computer).

3. _________________, the first microprocessors by Intel in 1972.

4. the plots the integration density of both logic IC’s and memory as a function of time. As can be
observed, integration complexity doubles approximately every 1 to 2 years. This prediction, later called
____________________.

5. The __________________ is independent of the sales volume, the number of products sold. An
important component of the fixed cost of an integrated circuit is the effort in time and manpower it
takes to produce the design.

6. wafer is chopped into ____________.

7. The ______________________ is the unwanted variations of voltages and currents at the logic nodes.

8. The ______________________ parameters of a gate measure how robust the circuit is with respect to
both variations in the manufacturing process and noise disturbances.

9. _________________ the ability of the system to process and transmit information correctly in the
presence of noise.

10. ________________ denotes the number of load gates N that are connected to the output of the
driving gate.

11. The ________________ of a gate is defined as the number of inputs to the gate.

12. ___________________ of a gate defines how quickly it responds to a change at its input.

13.The _____________________ of a design determines how much energy is consumed per operation,
and much heat the circuit dissipates.

14. This collection of constraints is called the _________________.

15. The _______________ material for the manufacturing process comes in the form of a single-
crystalline, lightly doped wafer.

II. Enumeration (no erasure)

1. Design Abstraction Levels (5)

2. different operations involved in a typical photolithographic process (8)

3. Design Metrics (4)

III. Draw the complete MOS transistor structure (3 pts)