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MP9447GL Z
MP9447GL Z
DESCRIPTION FEATURES
The MP9447 is a fully-integrated, high- Wide 4.5V-to-36V Operating Input Range
frequency, synchronous, rectified, step-down, Guaranteed 5A, Continuous Output Current
switch-mode converter. It offers a very compact Internal 65mΩ High-Side, 30mΩ Low-Side
solution to achieve a 5A, continuous-output Power MOSFETs
current over a wide input-supply range with Proprietary Switching-Loss-Reduction
excellent load and line regulation. It also Technology
provides fast transient response and good 1.5% Reference Voltage
stability for wide input-supply and load range. Programmable Soft-Start Time
The MP9447 operates at high efficiency over a Low Drop-out Mode
wide output current load range.
200kHz-to-650kHz Switching Frequency
Full protection features include SCP, OCP, UVP, SCP, OCP, UVP, and Thermal Shutdown
and thermal shutdown. Output Adjustable from 0.8V to 0.9×VIN
The MP9447 requires a minimal number of Available in a 3×4mm 25-pin QFN Package
readily-available, standard, external components,
APPLICATIONS
and is available in a space-saving 3mm×4mm,
25-pin, QFN package. General Consumer
USB Power Supplies
Cigarette Lighter Adapters
Power Supply for Chargers
All MPS parts are lead-free and adhere to the RoHS directive. For MPS green
status, please visit MPS website under Quality Assurance.
“MPS” and “The Future of Analog IC Technology” are Registered Trademarks of
Monolithic Power Systems, Inc.
TYPICAL APPLICATION
ORDERING INFORMATION
Part Number* Package Top Marking
MP9447GL QFN-25 (3mm×4mm) See Below
TOP MARKING
PACKAGE REFERENCE
TOP VIEW
VCC IN SW SW
20 19 18 17
AGND 1 16 PGND
21
IN
FREQ 2 15 PGND
24
SW
FB 3 14 PGND
22
IN
SS 4 13 PGND
25
SW
EN 5 12 PGND
23
IN
NC 6 11 PGND
7 8 9 10
BST IN SW SW
EXPOSED PAD
ON BACKSIDE
QFN25 (3×4mm)
ELECTRICAL CHARACTERISTICS
VIN = 24V, VEN = 2V, TA = +25°C, unless otherwise noted.
Parameters Symbol Condition Min Typ Max Units
Supply Current (Shutdown) IIN VEN = 0V 10 200 nA
Supply Current (Quiescent) IIN VFB = 0.95V 500 600 μA
HS Switch On Resistance HSRDS-ON 65 75 mΩ
LS Switch On Resistance (5) LSRDS-ON 30 mΩ
VEN = 0V
Switch Leakage SWLKG 10 200 nA
VSW = 0V or 36V
Current Limit ILIMIT 6 8 A
VIN=12V,
One-Shot On Time tON 230 280 330 ns
RFREQ=30kΩ
Minimum Off Time(5) tOFF 100 ns
ILIM=1(HIGH),
Foldback Off Time(5) tFB 4.8 μs
VFB>50%VREF
ILIM=1(HIGH),
Foldback Off Time(5) tFB 16.8 μs
VFB<50%VREF
OCP Hold-Off Time(5) tOC ILIM=1(HIGH) 100 μs
Feedback Voltage VFB 803 815 827 mV
Feedback Current IFB VFB = 815mV 10 50 nA
Soft-Start Charging Current ISS VSS=0V 6 8.5 11 μA
EN Rising Threshold ENVth-Hi 1.0 1.25 1.4 V
EN Falling Threshold ENVth-Lo 0.7 0.86 0.92 V
EN Threshold Hysteresis ENVth-Hys 390 mV
EN Input Current IEN VEN = 2V 1.5 2 μA
VIN Under-Voltage Lockout
INUVVth 3.7 4.0 4.3 V
Threshold Rising
VIN Under-Voltage Lockout
INUVHYS 880 mV
Threshold Hysteresis
VCC Regulator VCC ICC=0 4.5 4.85 5.2 V
VCC Load Regulation ICC=10mA 1 %
Thermal Shutdown(5) TSD 165 °C
Thermal Shutdown Hysteresis(5) TSD-HYS 25 °C
Note:
5) Derived from bench characterization, not tested in production.
VO(AC)
VO(AC) 10mV/div.
VIN
10mV/div.
10V/div.
VO
2V/div.
SW IL
10V/div. 200mA/div.
SW
20V/div.
IL
500mA/div. SW
IL
10V/div.
1A/div.
4μ s/div. 1μ s/div.
SW SW SW
10V/div. 20V/div. 20V/div.
1μ s/div. 100μ s/div. 1μ s/div.
EN EN
EN
2V/div. 2V/div.
2V/div.
VO VO
2V/div. 2V/div.
VO
IL IL 2V/div.
500mA/div. 5A/div.
IL
2A/div.
SW SW SW
20V/div. 20V/div. 20V/div.
1μ s/div. 1μ s/div. 400μ s/div.
EN VO
VO
2V/div. 2V/div.
2V/div.
SS
SS 5V/div.
VO
5V/div.
2V/div. IL
IL IL 5A/div.
2A/div. 5A/div.
SW
SW SW
20V/div.
20V/div. 10V/div.
VO
500mV/div. VO VO
100mV/div. 2V/div.
IL SS
5A/div. 2V/div.
SS IL
5A/div.
500mV/div.
IL
2A/div. SW
SW 20V/div.
20V/div.
VO
2V/div.
SS
2V/div.
IL
5A/div.
SW
10V/div.
PIN FUNCTIONS
Pin # Name Description
1 AGND Analog Ground.
Frequency Set (for CCM). The input voltage and the frequency-set resistor
2 FREQ
connected to GND determine the ON period. Decouple with a 1nF capacitor.
Feedback. The tap of external resistor divider from the output to GND sets the
3 FB
output voltage.
Soft-Start. Connect an external capacitor to program the soft-start time for the
switch-mode regulator. When the EN pin goes HIGH, an internal current source
4 SS (8.5µA) charges up the capacitor and the SS voltage slowly and smoothly ramps
up from 0 to VFB. When the EN pin goes LOW, the internal current source
discharges the capacitor and the SS voltage slowly ramps down.
Enable. EN=1 to enable the MP9447. For automatic start-up, connect EN pin to IN
5 EN
with a 100kΩ resistor. It includes an internal 1MΩ pull-down resistor.
8, 19,
Supply Voltage. The MP9447 operates from a 4.5V-to-36V input rail. Requires CIN
Exposed pads IN
to decouple the input rail. Connect using wide PCB traces and multiple vias.
21, 22, 23
9, 10, 17, 18,
Exposed pads SW Switch Output. Connect using wide PCB traces and multiple vias.
24, 25
System Ground. This pin is the reference ground of the regulated output voltage.
11-16 PGND
For this reason care must be taken in PCB layout.
Internal Bias Supply. Decouple with a 1µF capacitor as close to the pin as
20 VCC
possible.
BLOCK DIAGRAM
NC
OPERATION
PWM Operation Light-Load Operation
The MP9447 is a fully-integrated, synchronous, At light-load or no-load conditions, the output
rectified, step-down, switch-mode converter. At drops very slowly and the MP9447 reduces the
the beginning of each cycle, the high-side switching frequency automatically to maintain
MOSFET (HS-FET) turns ON when the feedback high efficiency. Figure 3 shows the light-load
voltage (VFB) drops below the reference voltage operation. VFB does not reach VREF as the
(VREF), which indicates an insufficient output inductor current approaches zero. The LS-FET
voltage. The ON period is determined by the driver enters a tri-state (high Z) whenever the
input voltage and the frequency-set resistor as: inductor current reaches zero. A current
96 RFREQ k modulator takes control of the LS-FET and limits
t ON ns tDELAY (ns) (1) the inductor current to less than -1mA. Hence,
VIN the output capacitors discharge slowly to GND
After the ON period elapses, the HS-FET turns through the LS-FET to greatly improve the light-
OFF. It is turned ON again when VFB drops below load efficiency. At light loads, the HS-FET does
VREF. By repeating this operation, the converter not turn ON as frequently as at heavy loads. This
regulates the output voltage. The integrated low- is called skip mode.
side MOSFET (LS-FET) turns ON when the HS- tON
106 (3)
FSW (kHz)
96 RFREQ (k) V
[ tDELAY (ns)] IN
VIN VOUT
Figure 7 shows an equivalent circuit in PWM VREF, it continues ramping up while VREF takes
mode with the HS-FET OFF and without an over the PWM comparator. At this point, soft-start
external ramp circuit. The ESR ripple dominates finishes and the MP9447 enters steady-state.
the output ripple. The VFB downward slope is:
CSS is then:
ESR VREF t SS ms ISS A
VSLOPE1 (7) CSS nF (9)
L VREF V
From equation 7, the VFB downward slope is If the output capacitors have large capacitance
proportional to ESR/L. Therefore, it’s necessary values, avoid setting a short SS or risk hitting the
to know the minimum ESR value of the output current limit during SS. Select a minimum value
capacitors without an external ramp. There is of 4.7nF if the output capacitance value exceeds
also an inductance limit: A smaller inductance 330μF.
leads to more stability. Based on bench
experiments, keep VSLOPE1 around 15V/ms to Over-Current Protection (OCP) and Short-
30V/ms. Circuit Protection (SCP)
In skip mode, the external ramp does not affect The MP9447 has cycle-by-cycle over-current limit
the downward slope, and VFB ripple’s downward control. The inductor current is monitored during
slope is the same with or without the external the ON state. Once the inductor current exceeds
ramp. Figure 8 shows an equivalent circuit with the current limit, the HS-FET turns OFF. At the
the HS-FET off and the current modulator same time, the OCP timer starts. The OCP timer
regulating the LS-FET. is set at 100μs. Hitting the current limit during
each cycle during this 100μs time frame will
trigger hiccup SCP.
If a short circuit occurs, the MP9447 will
immediately hit its current limit and VFB will drop
below 50%×VREF (0.815V). The device considers
this an output dead short and will trigger hiccup
IMOD SCP immediately.
Under-Voltage Protection (UVP)
The MP9447 monitors the output voltage through
the tap of a resistor divider to the FB pin to detect
Figure 8: Simplified Circuit in Skip Mode output under-voltage conditions. A VFB drop
The VFB ripple’s downward slope is: below 50% ×VREF triggers UVP as well as a
current-limit that triggers SCP.
VREF (8)
VSLOPE2
R1 R2 COUT
To keep the system stable during light loads,
avoid large VFB resistors. Also, keep the VSLOPE2
value around 0.4V/ms to 0.8mV/ms. Note that
IMOD is excluded from the equation because it
does not impact the system’s light-load stability.
Soft-Start
The MP9447 employs soft start (SS) to ensure a
smooth output during power-up. When the EN
pin goes HIGH, an internal current source (8.5μA)
charges up the SS capacitor (CSS). The CSS
voltage takes over the REF voltage to the PWM
comparator. The output voltage smoothly ramps
up with VSS. Once VSS reaches the same level as
APPLICATION INFORMATION
Setting the Output Voltage Input Capacitor
A resistor divider from the output voltage to the The input current to the step-down converter is
FB pin set VOUT. discontinuous, and Therefore requires a
capacitor to supply the AC current to the step-
Without an external ramp employed, the
down converter while maintaining the DC input
feedback resistors (R1 and R2) set the output
voltage. Ceramic capacitors are recommended
voltage. To determine the values for the resistors,
for best performance. Be sure to place the input
first, choose R2 (typically 5kΩ-40kΩ). Then R1 is:
capacitors as close to the IN pin as possible.
VOUT VREF (10)
R1 R2 The capacitance varies significantly with
VREF temperature. Capacitors with X5R and X7R
When using a low-ESR ceramic capacitor on the ceramic dielectrics are fairly stable over
output, add an external voltage ramp to the FB temperature fluctuations.
pin through R4 and C4. The ramp voltage (VRAMP) The capacitors must also have a ripple-current
affects output voltage. Calculate VRAMP as per rating greater than the converter’s maximum
equation 19. Choose R2 between 5kΩ and 40kΩ. input-ripple current. The input ripple current can
Determine R1 as: be estimated as follows:
1
1 VOUT V
VREF VRAMP ICIN IOUT (1 OUT ) (12)
2 1
R1 (11) VIN VIN
1 R4
R 2 ( VOUT VREF VRAMP ) The worst-case condition occurs at VIN = 2VOUT,
2
where:
Using equation 11 to calculate the output voltage
can be complicated. Furthermore, as VRAMP IOUT
ICIN (13)
changes due to changes in VOUT and VIN, VFB also 2
varies. To improve the output voltage accuracy
For simplification, choose an input capacitor
and simplify the R2 calculation from equation 11,
whose RMS current rating is greater than half of
add a DC-blocking capacitor (CDC). Figure 9
the maximum load current. The input capacitance
shows a simplified circuit with external ramp
value determines the input voltage ripple of the
compensation and a DC-blocking capacitor.
converter. If there is an input-voltage-ripple
Equation 10 can then estimate R1)
requirement in the system design, choose an
Select a CDC value between 1µF and 4.7μF to input capacitor that meets the specification
improve DC-blocking performance.
The input voltage ripple can be estimated as
follows:
IOUT V V
VIN OUT (1 OUT ) (14)
FSW CIN VIN VIN
Cdc
The worst-case condition occurs at VIN = 2VOUT,
where:
1 I
VIN OUT (15)
4 FSW CIN
For ceramic capacitors, capacitance dominates Where ∆IL is the peak-to-peak inductor ripple
the impedance at the switching frequency, can is current.
the primary cause of the output-voltage ripple. Choose an inductor that will not saturate under
For simplification, estimate the output voltage the maximum inductor peak current. The peak
ripple as: inductor current can be calculated as:
VOUT V (17)
VOUT (1 OUT ) VOUT V
8 FSW 2 L COUT VIN ILP IOUT (1 OUT )
2FSW L VIN (22)
The output voltage ripple caused by ESR is very
small and therefore requires an external ramp to
stabilize the system. The voltage ramp is ~30mV. Typical Design Parameter Tables
The external ramp can be generated through R4 The following tables include recommended
and C4 using the following equation: component values for typical output voltages
(VIN VOUT ) TON (3.3V, 5V) and switching frequencies (300kHz,
VRAMP (18) 500kHz). Refer to Tables 1 through 2 for design
R4 C4 cases without external ramp compensation, and
Select C4 to meet the following condition: Tables 3 through 4 for design cases with external
ramp compensation. An external ramp is not
1 1 R1 R2 needed when using high-ESR capacitors, such
( ) (19) as electrolytic or POSCAPs. An external ramp is
2 FSW C4 5 R1 R2
needed when using low-ESR capacitors, such as
For POSCAP capacitors, the ESR dominates the ceramic capacitors. For cases not listed in this
impedance at the switching frequency. The ramp datasheet, an Excel spreadsheet available
voltage generated from the ESR is high enough through your local sales representative can
to stabilize the system. Therefore, an external calculate approximate component values.
ramp is not needed. A minimum ESR value of
Table 1—300kHz, 24VIN
12mΩ is required to ensure stable operation of
the converter. For simplification, the output ripple VOUT L R1 R2 RFREQ
can be approximated as: (V) (μH) (kΩ) (kΩ) (kΩ)
3.3 10 30.1 10 110
VOUT V
VOUT (1 OUT ) RESR (20) 5 10 51.1 10 169
FSW L VIN
Table 2—500kHz, 24VIN
Inductor
VOUT L R1 R2 RFREQ
The inductor is required to supply constant (V) (μH) (kΩ) (kΩ) (kΩ)
current to the output load while being driven by
3.3 10 30.1 10 63.4
the switching input voltage. A larger inductance
will result in less ripple current and a lower output 5 10 51.1 10 100
ripple voltage. However, a larger inductance
results in a larger inductor, which will physically
larger, and have a higher series resistance
and/or lower saturation current. A good rule for
LAYOUT RECOMMENDATION
1. Place high-current paths (GND, IN, and SW)
very close to the device with short, direct, and
wide traces.
2. Place input capacitors on both VIN sides
(PIN8 and PIN19) and as close to the IN and
GND pins as possible.
3. Place the decoupling capacitor as close to
the VCC and GND pins as possible.
4. Keep the switching node SW short and away
from the feedback network.
5. Place the external feedback resistors next to
the FB pin. Do not place vias on the FB trace. Inner1 Layer
6. Keep the BST voltage path (BST, C3, and
SW) as short as possible.
7. Connect the bottom IN and SW pads to a
large copper area to achieve better thermal
performance.
8. A Four-layer layout is strongly recommended
to achieve better thermal performance.
Inner2 Layer
C1B
C1C
C1A
C2A
C2B
Top Layer
Bottom Layer
Figure 10: PCB Layout
FB
VCC
C5 10k
1 SS AGND PGND
C6
33nF
PACKAGE INFORMATION
QFN-25 (3mm × 4mm)
NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third
party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not
assume any legal responsibility for any said applications.