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    The document outlines the generations of computers from the 1940s to the 1970s. First generation computers used vacuum tubes and relied on machine language. They were large, costly, consumed large amounts of energy, and had limited capabilities. Second generation computers replaced vacuum tubes with transistors, introduced symbolic languages like COBOL and FORTRAN, and were smaller and more efficient than previous models but still expensive. Third generation computers used integrated circuits, allowed timesharing through operating systems, and were smaller, more reliable, and could support high-level languages.

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    SKILL DEVELOPMENT

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    The document outlines the generations of computers from the 1940s to the 1970s. First generation computers used vacuum tubes and relied on machine language. They were large, costly, consumed large amounts of energy, and had limited capabilities. Second generation computers replaced vacuum tubes with transistors, introduced symbolic languages like COBOL and FORTRAN, and were smaller and more efficient than previous models but still expensive. Third generation computers used integrated circuits, allowed timesharing through operating systems, and were smaller, more reliable, and could support high-level languages.

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    4 views2 pages

    Skill Development

    Uploaded by

    Meer Haseeb
    The document outlines the generations of computers from the 1940s to the 1970s. First generation computers used vacuum tubes and relied on machine language. They were large, costly, consumed large amounts of energy, and had limited capabilities. Second generation computers replaced vacuum tubes with transistors, introduced symbolic languages like COBOL and FORTRAN, and were smaller and more efficient than previous models but still expensive. Third generation computers used integrated circuits, allowed timesharing through operating systems, and were smaller, more reliable, and could support high-level languages.

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    SKILL DEVELOPMENT

    OUTLINE: GENERATIONS OF COMPUTERS, ROM/RAM,


    HARDWARE, AND SOFTWARE.
    First-generation computers (1940-1956)
    Use vacuum tubes
    Relied on machine language
    ADVANTAGES: Made of vacuum tubes which are the only electronic
    component available during those days.
    The use of vacuum tube technology made it possible to make an electronic
    digital component.
    Calculate in milliseconds.
    DISADVANTAGE: Very larger in size. Very costly.
    Consumed large amount of energy. Slow speed.
    Heated very soon due to lot of vacuum tubes. Not portable.
    Not reliable. Used machine language. Punch card used.
    Constant maintenance required. Limited program capabilities.
    Used machine language.
    SECOND GENERATION (1956-1963)
    Transistors replaced vacuum tubes.
    Move Cryptic binary machine language to symbolic.
    Develop COBOL and FORTRAN develop at that time.
    Store their instruction in memory.
    Punch card used.
    MODELS EXAMPLES: IBM-1620 IBM-7094 CDC-1604 CDC-3600
    UNIVAC- 1108.
    ADVANTAGES: Use of transistors. Reliable more than first Gen.
    Smaller compare than first Gen. Generate less heat.
    Consume less electricity. Faster than first Gen.
    DISADVANTAGE: Still very costly. Ac required.
    Support Machine and Assembly language. Punch card used.
    THIRD GENERATION (1964-1971)
    Development of integrated circuit was the hallmark of third generation
    computer.
    Transistors were miniaturized and placed Siliconchips, called semiconductors.
    Instead of punch user interact with keyboard or monitor through operating
    system.
    Allowed to run different application at one time.
    MODELS EXAMPLE: IBM-360 SERIES HONEYWELL-6000 IBM-
    370/168 TDC – 316.
    ADVANTAGES: Smaller size compare to previous Gen. More reliable.
    Used less energy. Produced less heat as compare previous 2 Gen.
    Calculate in nenoseconds. Maintenance low because hardware fail is rare.
    Totally genuine purpose. Could be use for high language.
    High storage capacity. Less expensive.
    Used mouse and keyboard.
    DISADVANTAGE: air condition required.
    The highly sophisticated technology were required for the manufacturing IC
    chips.

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