Instructions to Candidates: Part—A: Short answer questions (up to 25 words) 6 x 3 marks = J marks. Candidates have to answer six questions out of ten. Part—B: Analytical/Problem solving questions 3 x 10 marks = 30 musrkx Candidates have to answer three questions out of seven. Part — C: Descriptive/Analytical/Problem Solving questions 3 x24 marks = 72 marta Candidates have to answer three questions out of five. Schematic diagrams must be shown wherever necessary, Amy dass pou fori missing may suitably be assumed and stated clearly. Unite of quancities used/calculated must be stated clearly. Use of following supporting material is permitted durmg examination. (Mentioned in form No. 205) 1 NIL 2 NL PART-A Q.1 Give any five applications of MEMS in various fields. Q2 List out different materials used for MEMS. Q3 Explain, why silicon is used as 2 substrate material Q4 Define the term scaling effect. Q5 Give the various applications of nano-seasors. {610706} Paze Lof2 “Scanned with CamScannerQo ‘What 1s your major criterion ih selecting the materials Yor the masks Wied i stehing. for example, in etching silicon substrate with mosterate cepa sl alse Yow deeper eutang’? Q Give one advantage and one disadvantage of using surface micromachining. 8 Descrite the phenomenon of stiction and possible ways to avuk! it in surface micromachining. Qs What are the advantages of MEMS and NEMS technology? Q10 Define MEMS system with suitable block diagram. PART-B Qi What do you mean by micro and nano sensors? Explain in detail with applications Q2 Explain oxidation and deposition techniques. Qa Qa Describe the role of sacrificial layers in surface micromachining QS. Explain water bonding Q6 Explain the principle of operation of MEMS based sensors and actuators Q7 Differentiate between MEMS and NEMS ‘with suitable diagram. PART~C Q.1 Explain the basic introduction and history of MEMS along with its applications Q2- Explain the overview of FEM (Finite Element Method) and hasic Principle also of FEM in MEMS, Explain the ‘engineering applications of FEM. Q3 Explain the term lithography in details with suitable diagram. Qa Discuss in detail the surface Micromachining process with suitable diagram, Q5 What is etching? Differentiate isotropic etching and anisotropic etching (610706) Page 2 of 2 Scanned wth CamScanner