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stb45n65m5 stf45n65m5 stp45n65m5 stw45n65m5
stb45n65m5 stf45n65m5 stp45n65m5 stw45n65m5
STW45N65M5
N-channel 650 V, 0.067 Ω typ., 35 A MDmesh™ V Power MOSFET
in D2PAK, TO-220FP, TO-220 and TO-247 packages
Datasheet — production data
Features TAB
VDSS @ RDS(on) 2
Order code ID 3
TJmax max 1
3
D2PAK 2
STB45N65M5 1
TO-220FP
STF45N65M5 TAB
710 V < 0.078 Ω 35 A
STP45N65M5
STW45N65M5
3
2
■ Worldwide best RDS(on) * area 1 2
3
1
■ Higher VDSS rating and high dv/dt capability TO-220 TO-247
■ Excellent switching performance
■ 100% avalanche tested
Figure 1. Internal schematic diagram
Applications
■ Switching applications $ 4!"
Description
These devices are N-channel MDmesh™ V
'
Power MOSFETs based on an innovative
proprietary vertical process technology, which is
combined with STMicroelectronics’ well-known
PowerMESH™ horizontal layout structure. The 3
resulting product has extremely low on-
resistance, which is unmatched among silicon-
!-V
based Power MOSFETs, making it especially
suitable for applications which require superior
power density and outstanding efficiency.
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) ............................ 6
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
1 Electrical ratings
2 Electrical characteristics
Drain-source
V(BR)DSS ID = 1 mA, VGS = 0 650 V
breakdown voltage
Zero gate voltage VDS = 650 V 1 µA
IDSS
drain current (VGS = 0) VDS = 650 V, TC=125 °C 100 µA
Gate-body leakage
IGSS VGS = ± 25 V ± 100 nA
current (VDS = 0)
VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µA 3 4 5 V
Static drain-source
RDS(on) VGS = 10 V, ID = 17.5 A 0.067 0.078 Ω
on-resistance
Table 6. Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
Input capacitance
Ciss 3470 pF
Output capacitance VDS = 100 V, f = 1 MHz,
Coss - 82 - pF
Reverse transfer VGS = 0
Crss 7 pF
capacitance
Equivalent
Co(tr)(1) capacitance time - 280 - pF
related
VDS = 0 to 520 V, VGS = 0
Equivalent
(2)
Co(er) capacitance energy - 79 - pF
related
Intrinsic gate
RG f = 1 MHz open drain - 2 - Ω
resistance
Qg Total gate charge VDD = 520 V, ID = 17.5 A, 82 nC
Qgs Gate-source charge VGS = 10 V - 18.5 - nC
Qgd Gate-drain charge (see Figure 20) 35 nC
1. Time related is defined as a constant equivalent capacitance giving the same charging time as Coss when
VDS increases from 0 to 80% VDSS
2. Energy related is defined as a constant equivalent capacitance giving the same stored energy as Coss
when VDS increases from 0 to 80% VDSS
1 10ms
0.1
0.1 1 10 100 VDS(V)
Figure 4. Safe operating area TO220FP Figure 5. Thermal impedance for TO-220FP
AM13078v1
ID
(A)
Tj=150°C
Tc=25°C
100
Single pulse
is
ea
s ar (on)
i S
th RD
in ax 10µs
10 ion y m
a t
er d b
Op mite 100µs
Li
1 1ms
10ms
0.1
0.01
0.1 1 10 100 VDS(V)
10µs
by n
d ni
ite tio
10 100µs
ra
pe
O
m
1ms
Li
10ms
1
0.1
0.1 1 10 100 VDS(V)
Figure 10. Gate charge vs gate-source voltage Figure 11. Static drain-source on-resistance
AM13082v1 AM13083v1
VGS RDS(on)
VDS
(V) (V) (Ω)
VDS VDD=520V VGS=10V
12 ID=17.5A 500 0.071
10
400 0.069
8
300 0.067
6
200 0.065
4
100 0.063
2
0 0 0.061
0 20 40 60 80 100 Qg(nC) 0 5 10 15 20 25 ID(A)
Figure 12. Capacitance variations Figure 13. Output capacitance stored energy
AM13084v1 AM13085v1
C Eoss (µJ)
(pF)
16
10000 14
Ciss
12
1000
10
8
100
Coss 6
10 4
Crss
2
1 0
0.1 1 10 100 VDS(V) 0 100 200 300 400 500 600 VDS(V)
Figure 14. Normalized gate threshold voltage Figure 15. Normalized on resistance vs.
vs. temperature temperature
VGS(th) AM05459v2 AM05460v2
RDS(on)
(norm) ID=250µA (norm) VGS=10V
1.10 2.1 ID=17.5V
1.9
1.00 1.7
1.5
0.90 1.3
1.1
0.80 0.9
0.7
0.70 0.5
-50 -25 0 25 50 75 100 TJ(°C) -50 -25 0 25 50 75 100 TJ(°C)
Figure 16. Drain-source diode forward Figure 17. Normalized VDS vs. temperature
characteristics
AM05461v1 AM10399v1
VSD VDS
(norm)
(V) TJ=-50°C
1.08
1.2 ID = 1mA
1.06
1.0
1.04
0.8 1.02
TJ=25°C
1.00
0.6
TJ=150°C 0.98
0.4
0.96
0.2
0.94
0 0.92
0 10 20 30 40 50 ISD(A) -50 -25 0 25 50 75 100 TJ(°C)
400 Eoff
300
200
100
0
0 10 20 30 40 RG(Ω)
1. Eon including reverse recovery of a SiC diode
3 Test circuits
Figure 19. Switching times test circuit for Figure 20. Gate charge test circuit
resistive load
VDD
12V 47kΩ
1kΩ
100nF
RL 2200 3.3
μF μF
VDD IG=CONST
VD Vi=20V=VGMAX 100Ω D.U.T.
VGS 2200
RG D.U.T. μF 2.7kΩ VG
PW
47kΩ
PW 1kΩ
AM01468v1 AM01469v1
Figure 21. Test circuit for inductive load Figure 22. Unclamped inductive load test
switching and diode recovery times circuit
L
A A A
D
FAST L=100μH VD
G D.U.T. DIODE 2200 3.3
μF μF VDD
S B 3.3 1000
B B μF μF
25 Ω VDD ID
D
RG S
Vi D.U.T.
Pw
AM01470v1 AM01471v1
Figure 23. Unclamped inductive waveform Figure 24. Switching time waveform
V(BR)DSS Id
Concept waveform for Inductive Load Turn-off
VD 90%Vds 90%Id
Tdelay-off
-off
IDM
Vgs
90%Vgs on
ID
Vgs(I(t))
))
Vds
Trise Tfall
Tcross --over
AM01472v1 AM05540v2
A 4.40 4.60
A1 0.03 0.23
b 0.70 0.93
b2 1.14 1.70
c 0.45 0.60
c2 1.23 1.36
D 8.95 9.35
D1 7.50
E 10 10.40
E1 8.50
e 2.54
e1 4.88 5.28
H 15 15.85
J1 2.49 2.69
L 2.29 2.79
L1 1.27 1.40
L2 1.30 1.75
R 0.4
V2 0° 8°
0079457_T
12.20 5.08
1.60
3.50
9.75
Footprint
A 4.4 4.6
B 2.5 2.7
D 2.5 2.75
E 0.45 0.7
F 0.75 1
F1 1.15 1.70
F2 1.15 1.70
G 4.95 5.2
G1 2.4 2.7
H 10 10.4
L2 16
L3 28.6 30.6
L4 9.8 10.6
L5 2.9 3.6
L6 15.9 16.4
L7 9 9.3
Dia 3 3.2
7012510_Rev_K_B
A 4.40 4.60
b 0.61 0.88
b1 1.14 1.70
c 0.48 0.70
D 15.25 15.75
D1 1.27
E 10 10.40
e 2.40 2.70
e1 4.95 5.15
F 1.23 1.32
H1 6.20 6.60
J1 2.40 2.72
L 13 14
L1 3.50 3.93
L20 16.40
L30 28.90
∅P 3.75 3.85
Q 2.65 2.95
0015988_typeA_Rev_S
A 4.85 5.15
A1 2.20 2.60
b 1.0 1.40
b1 2.0 2.40
b2 3.0 3.40
c 0.40 0.80
D 19.85 20.15
E 15.45 15.75
e 5.30 5.45 5.60
L 14.20 14.80
L1 3.70 4.30
L2 18.50
∅P 3.55 3.65
∅R 4.50 5.50
S 5.30 5.50 5.70
0075325_G
mm mm
Dim. Dim.
Min. Max. Min. Max.
10 pitches cumulative
tolerance on tape +/- 0.2 mm
Top cover P0 D P2
T tape
E
F
K0 W
B0
A0 P1 D1
Bending radius
User direction of feed
AM08852v2
40mm min.
Access hole
At sl ot location
A N
AM08851v2
6 Revision history
2
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