VENDOR OPPORTUNITIES FACILITTIES REQUIRED FOR VENDOR

PCB Assembly,
Layout Design Bare PCB
Harnessing &
ECAD/Cadence Fabrication
Cabling

ESD CERTIFIED CLEAN ROOM

PROTECTION MANPOWER HI-REL TOOLS, MAGNIFICATION
AIDS FROM STANDARD/ WORLD
CLASS COMPANIES.

ESD CERTIFIED
CLEAN ROOM TOOLS
PROTECTION MANPOWER

Ground Hardware Yes Trained Manpower No, only Clean Area Yes
Looking for End to End Solution:
1. From Circuit Diagram to Assembled Packages Space Grade Hardware Yes Yes Yes Yes
2. From Design Specification to Tested Packages

LAYOUT DESIGN BARE PCB FABRICATION Qualification Standards: ISRO PAX-302-DSB

Qualification Standards: ISRO PAX-301-DSB
ISRO PAX-303-MLB ISRO PAX-304-MLB
THRUST AREAS THRUST AREAS
PCB Type: Rigid PCB, Flex PCB, Rigid Flex PCB, Hybrid PCB (Glass epoxy/PTFE) etc.
• Schematic Circuit Diagram Features: HDI, blind vias, buried vias, through hole vias upto 8:1 aspect ratio, thermal layer etc.
- Electrical Rule Check (ERC) Laminate Material: FR4 glass epoxy meeting IPC 4101/24 with Tg. ≥ 170C
PTFE Laminate – RT duroid 5880, 6002, 6010, TMM, CLTE-XT
- Signal Delay, Noise Budget, Impedance, Coupling Surface Finish: Solder coated Hot air levelled (Sn 63 : Pb37) meeting QQ-S-571
SMOBC with solder coated Hot air level (Sn63 : Pb37)
ENIG finish (3-5µ Nickel, 0.03-0.1µ Gold)
• PCB Layout and Design Solder Coating Thickness: 4 to 30 microns, <10 µ thickness variation for SMD pads, PCB layers: upto 16
- Impedance Controlled, High Speed Routing Track width/spacing: 3 / 3 mil minimum, Hole diameter: 0.2mm finish minimum
Pad annular ring: Internal 0.12 mm min, External 0.13 mm min., Controlled impedance:  10%
- PCB Parasitic, Placement Optimization
- Signal Integrity, Power Integrity, Timing, EMC and MLB Offloading to Industry: 86% DSB
100% MLB
Thermal Analysis
DSB
Cost: Apprx. Rs. 60 lacs
Area Fabricated: 11.79 Lakh Sq.cms.

PCB WIRING AND ASSEMBLY GROUND PCB CURRENT DEMAND THRUST AREAS
Ground Use PCB wiring: 600 Nos. • SMD, TH, Fine Pitch Component Assembly
Connectors/Harness: 1000/2000 m • Ceramic Grid Array
Coils/Transformers etc.: 400 • Packaging Activities (Conformal Coating, Potting, Encapsulation)
Cost utilized: Rs. 50 – 60 lacs p.a. • Connector Harnessing
Offloading to industry: 90% • Semi rigid (SR), MultiFlex-141 Cable processing
CLEAN ROOM in SAC CLEAN ROOM in INDUSTRY
ONBOARD PCB CURRENT DEMAND FUTURE
Space Use PCB wiring: 400 Nos. • 3D Packaging
Connectors/Harness: 1000/2000 m • Component Assembly on Flex rigid PCBs
Coils/Transformers etc.: 400 • Assembly on Hybrid PCB for DC & RF Applications
Cost utilized: Rs. 150 lacs p.a.
Offloading to industry: 80%
Qualification Standards: ISRO PAX-300

Advancements in Inspection Technology

Normal Microscope Advanced stereo microscope Computer attached 3D- Microscope 3D X-ray

Head, TTID/PPG Email: ttid@sac.isro.gov.in

SPACE APPLICATIONS CENTRE (ISRO)
3322, PLANNING AND PROJECTS GROUP
Web: www.sac.gov.in
JODHPUR TEKRA, AMBAWADI VISTAR Phone: +91 - 79 – 26913355
AHMEDABAD - 380015 Fax: +91 - 79 - 26915817